CN101144980B - Photosensitive resin plate support and process for preparing the same - Google Patents
Photosensitive resin plate support and process for preparing the same Download PDFInfo
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- CN101144980B CN101144980B CN2006101070577A CN200610107057A CN101144980B CN 101144980 B CN101144980 B CN 101144980B CN 2006101070577 A CN2006101070577 A CN 2006101070577A CN 200610107057 A CN200610107057 A CN 200610107057A CN 101144980 B CN101144980 B CN 101144980B
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Abstract
The present invention discloses a supporter for photosensitive resin plates and the preparation method, and from top to bottom comprises a substrate, a bottom layer and a bonding layer in turn; and the preparation method is as follows: the bottom layer and the bonding layer are prepared in solution in advanced; firstly, the bottom layer is coated on a polyester film or a foil, and forms the substrate; after the bottom layer is dried, the banding layer is coated on the bottom layer; after the banding layer is dried, the present invention is achieved after being rolled up; after exposing and developing, the present invention strengthens the bonding force between the rear supporter and a photosensitive layer significantly, and can keep the relief image for a long time; when the photosensitive resin plate exposed to present the relief image, the photosensitive resin plate is crossed and connected with the bonding layer of the supporter, so that the relief layer and the bonding layer are integrated into a whole; for the bonding layer and the bottom layer are also integrated into a whole, the bonding force of the relief layer and the bottom layer is very strong so as to keep the resin plate from falling down and peeling off for a long time.
Description
Technical field
The present invention relates to a kind ofly about the surface design at base material the photographic layer resin plate support of adhesive linkage is arranged, and especially relates to a kind of photosensitive resin plate support and preparation method thereof.
Background technology
At present, flexible photosensitive resin plate is widely used in the printing of easy deformation such as carton, flexible packaging, label or softer stock.External this technology is ripe, and domestic still do not have a tame mass ratio plate manufacturer preferably.The flexo plate exploitation that restricts domestic flexographic printing is the urgent hope of printing producer always.Along with the quick increase and the environmental requirement of China Exports are more and more stricter, flexographic printing will be fast-developing at home, and the demand of flexo plate is also with increasing.
Usually, the film that will have pattern or literal is placed on the unexposed flexographic plate that contains the photosensitive elastomer body, ultraviolet exposure, and the place that film is transparent sees through ultraviolet light, decomposition of initiator in the photosensitive elastomer body becomes free radical, and the initiation crosslinkable monomers is reacted and solidified.Seeing through ultraviolet zone can not cross-linking reaction, utilizes the difference of their solubleness in developer solution, and flushing is developed and obtained containing the relief image of character pattern.Plate drying after the development goes to glue, and the complete polymerization of photographic layer is guaranteed in post-exposure.The plate that makes is fixed on the cylinder of flexible printing press, can prepare printing.
In the past, the photopolymer plate that flexographic plates etc. use is at the surface coated following layer of plastic sheetings such as polyester resin film, form photosensitive resin layer in the above, during plate-making, the exposure position of exposure photosensitive resin layer makes it crosslinked sclerosis, and the not crosslinked sclerosis of unexposed portion is removed the formation relief image with developer.
During the printing of above-mentioned photopolymer plate between embossment and the support since the effect embossment of strong shearing force and peeling force peel off easily and come off.In order to prevent that embossment from peeling off and come off, between embossment and the base material strong following layer must be arranged.
Especially under the occasion of flexographic printing, generally be repeatedly back and forth to use, and majority re-use after being to use once long-time the preservation.Between embossed layer and the base material strong bonding force is arranged after the requirement long preservation.But, peel off this problem because the adhesive linkage moisture absorption produces embossment during the photopolymer plate long preservation in past.
Te Kaiping 1-283557 has introduced the bonding force that solves between embossment and the support with three layers, and it is pretty troublesome to operate.U.S. Pat 4917990 discloses and be coated with the adhesive linkage that contains chlorosulfonated polyethylene on ethylene glycol terephthalate base materials such as (PET), to improve the bonding force of support and photographic layer, but the method is when exposure adhesive linkage and photographic layer, along with the increase of exposure, bonding force has downtrending.The spy opens and introduced a kind of adhesive bonding method among the 2000-155410 is wet-cured type, the industrialization difficulty.European patent EP 1209524A1 discloses the preparation method of flexographic plate support, and it is coated with the solution that contains polyvalent alcohol and diisocyanate on base materials such as PET, 80 ℃ of dryings 2 minutes, and 40 ℃ of dryings are 3 days again, obtain containing the support of adhesive linkage, the industrial implementation difficulty.
Summary of the invention
Purpose of the present invention just is to provide photosensitive resin plate support that a kind of long preservation relief image also can not peel off and preparation method thereof.
Purpose of the present invention can realize by following measure:
The present invention includes and be followed successively by base material, bottom and adhesive linkage from bottom to top.
The present invention also is attached with diaphragm on adhesive linkage, certainly, and also can non-cohesive diaphragm.The polymkeric substance that contains the chlorine element in the bottom perhaps, contains polymkeric substance or potpourri based on the vinylidene chloride structural unit in the described bottom.The amount of vinylidene chloride structural unit accounts for more than 30% of polymkeric substance integral molar quantity.The weight ratio that the amount that contains the polymer material of vinylidene chloride structural unit accounts for bottom material total solid is more than 50%.Contain the acrylate urethane resin in the adhesive linkage.The acrylate urethane resin that contains Photocrosslinkable in the adhesive linkage.The softening point of acrylate urethane resin is between 80-150 ℃.To account for the weight ratio of adhesive linkage material total solid be 30%～98% to the amount of the acrylate urethane resin of Photocrosslinkable in the adhesive linkage.Include photosensitizer, Photocrosslinkable resin in the adhesive linkage simultaneously, have one and an above unsaturated vinyl monomer.
The preparation method of photosensitive resin plate support of the present invention is as follows: bottom, adhesive linkage are mixed with solution in advance, and elder generation is barrier coating on mylar that constitutes base material or sheet metal formerly, after the drying, is coated with adhesive linkage again on bottom, and dry back rolling forms.
Mylar comprises among the present invention: in polyethylene terephthalate, polybutylene terephthalate, Polyvinylchloride, poly-ethylene naphthalene-2.6-two carbonic esters any; Described sheet metal comprises in aluminium plate, stainless steel substrates, the copper sheet any.Certainly, also can adopt other suitable mylars or sheet metal etc.Be that rolling forms after being covered with diaphragm on the dried adhesive linkage among the preparation method.After the adhesive linkage drying, directly overlay on the photopolymer plate among the preparation method, 20～130 ℃ of temperature, under the pressure 0.15-14MPa, photopolymer plate is directly made in hot pressing.
The present invention significantly strengthens the bonding force between exposure plate-making back support and the photographic layer owing to adopt said structure and preparation method, and relief image can long preservation.Above-mentioned photopolymer plate is crosslinked with the adhesive linkage of support in the exposure formation matrix when plate-making, adhesive linkage and embossed layer are integrated, because adhesive linkage and bottom are also integrated, so the bonding force of embossed layer and support is splendid, consequently the resin plate long preservation is not peeled off, is not come off.The BLD-200S electron detachment testing machine that uses Labthink Instruments Co., Ltd. to produce is measured peeling force, and its peeling force reaches more than the 1kg/cm.
Description of drawings
Accompanying drawing is the cross section structure synoptic diagram of photosensitive resin plate support of the present invention;
Embodiment
The present invention does with detailed description below in conjunction with drawings and Examples:
Embodiment first
Among the present invention, the construction features of photosensitive resin plate support as shown in drawings.In the accompanying drawing: (1) is base material; (2) be the acrylate copolymer bottom (abbreviation bottom) that contains the vinylidene chloride structural unit; (3) be the crosslinked resin adhesive linkage (abbreviation adhesive linkage) that contains the urethane acrylate structural unit; (4) be diaphragm.
The present invention in use, base material can be plastic sheetings such as polyester, polypropylene, triacetate.The most handy twin-screw is extruded polyester resin film, and there is no particular limitation for the thickness of these base materials, generally is that 0.05-0.3mm is thick.
Contain the bottom (2) of the acrylic copolymer resin of vinylidene chloride structural unit in the coating of above-mentioned substrate surface, this copolymer resin is water-soluble type or organic solvent type.The used copolymer resin of the present invention is the underfill resin layer NPR-4 of Lekai group, this resin uses alcohol or aqueous solvent, the present invention also can use other solvents such as ketones solvent, amide solvent, ether solvent, varsol, such solvent can be methyl alcohol, ethanol, propyl alcohol, butanols, ethylene glycol, acetone, butanone, cyclohexanone, pyrrolidone, N-Methyl pyrrolidone, N, dinethylformamide, N,N-dimethylacetamide, methylene chloride, chloroform, benzene, toluene etc.Adopt known coating method such as dip-coating, blade coating, extrusion coated etc. with the film forming matter solution coat on base materials such as the polyethylene terephthalate (PET) of 80-150 μ m, polypropylene, triacetate, coating weight is generally at 1-50g/m
2, thickness is generally at 0.1-5 μ m.
On above-mentioned bottom, be coated with adhesive linkage (3) again, adhesive linkage contains the Photocrosslinkable resin, its resin can be urethane acrylate multipolymer, polyurethane vinyl acetate co-polymer, polyvinyl acetate (PVA)/acrylate copolymer or their potpourri, acrylate urethane resin preferably, 60-170 ℃ more fortunately of its softening point, optimum at 80-150 ℃.
Adhesive linkage contains photoinitiator as required.Sneer ketone, 4-acetoxyl group-4 '-diethylamide benzophenone, benzoin ethyl ether, Alpha-hydroxy cumene ketone, Alpha-hydroxy cyclohexyl benzene ketone, 2-phenyl-2 as benzophenone, rice; 2-dimethoxy acetyl benzophenone, 2-tertiary butyl anthraquinone, isopropyl thia anthraquinone, (morpholinyl benzoyl) 1-six bases 1; 1 (dimethylamino) propane, benzil, benzoin etc.; trade names have 184,369,651,819,907,1173, BP, ITX, TPO etc., and addition accounts for more than 0.2% of solid amount.
Adhesive linkage also contains acryloyl-oxy ester group or the two polymerisable monomers of key of methacryloxypropyl ester group, and this monomer can be single functionality, two functionality or polyfunctionality.Above-mentioned monomer boiling point is preferably in more than 100 ℃, and mutual solubility is good.Such monomer has (methyl) acrylic acid-2-hydroxyl ethyl ester, (methyl) acrylic acid-2-hydroxypropyl acrylate, butyl acrylate, 2-ethyl hexyl acrylate, the ethoxyethyl group acrylate, the 2-phenoxyethyl acrylate, 1, ammediol two (methyl) acrylate, 1,4-butylene glycol two (methyl) acrylate, 1,5-pentanediol two (methyl) acrylate, 1,6-hexanediol two (methyl) acrylate, triethylene Glycol two (methyl) acrylate, four condensed ethandiol two (methyl) acrylate, five condensed ethandiol two (methyl) acrylate, propylene glycol diacrylate, tripropylene glycol two (methyl) acrylate, four propylene glycol two (methyl) acrylate that contract, neopentylglycol diacrylate, PDDA, ethoxylated bisphenol a diacrylate, ethoxylated trimethylolpropane triacrylate, the glycerol propoxylate triacrylate, 2,2-two (p-hydroxybenzene)-propane two (methyl) acrylate, dihydroxy methylpropane two (methyl) acrylate, trimethylolpropane tris (methyl) acrylate, pentaerythrite two (methyl) acrylate, pentaerythrite three (methyl) acrylate, pentaerythrite four (methyl) acrylate or the like.
Adhesive linkage solvent for use among the present invention can be alcohols solvent, ketones solvent, varsol, amide solvent, ether solvent etc., as methyl alcohol, ethanol, propyl alcohol, butanols, ethylene glycol, acetone, butanone, cyclohexanone, pyrrolidone, N-Methyl pyrrolidone, N, dinethylformamide, N,N-dimethylacetamide, methylene chloride, chloroform, benzene, toluene etc.，
If necessary, adhesive linkage also can add hot inhibitor, antiozonant, also can add other auxiliary agents, as dyestuff, pigment, ultraviolet absorber etc.
Aforesaid propylene acid esters urethane resin, photosensitizer, polymerizable vinyl unsaturated monomer etc. dissolve in appropriate solvent, and amount of solid accounts for more than 1% of quantity of solvent, be coated on the bottom, and after the drying, thickness 0.1-5 μ m.
The gross thickness of above bottom and adhesive linkage is 0.2-10 μ m.
On dried adhesive linkage (3), be covered with diaphragm (4).
By the photosensitive resin plate support of the present invention's preparation and the plate thickness of E.I.Du Pont Company's production is that the plate thickness that 3.94mm flexographic plate photosensitive resin layer or Lekai group produce is 3.94mm flexographic plate photosensitive resin layer, at 20-150 ℃, the compound photopolymer plate that gets under the pressure 0.15-14MPa.
Above-mentioned photopolymer plate is crosslinked with the adhesive linkage of support in the exposure formation matrix when plate-making, adhesive linkage and embossed layer are integrated, because adhesive linkage and bottom are also integrated, so the bonding force of embossed layer and support is splendid, consequently the resin plate long preservation is not peeled off, is not come off.The BLD-200S electron detachment testing machine that uses Labthink Instruments Co., Ltd. to produce is measured peeling force, and its peeling force reaches more than the 1kg/cm.
Following examples are to specify of the present invention, but content of the present invention does not limit so.In an embodiment, all components all by weight.
Embodiment 1
Bottom: pure water 230g, NPR-4# (production of Lekai company) 20g, 10% potassium hydroxide 1.4g, surfactant Fc-4430# (production of 3M company) 0.1g, normal temperature stirred 30 minutes down, obtained aqueous solution.Be coated on the mylar that thickness is 100 μ m (production of Lekai company) with the speed of this aqueous solution with 30m/min.Drying is 5 minutes under 100 ℃, obtains the bottom of thickness less than 1 μ m.
Adhesive linkage: acetone 100g, toluene 50g, polyurethane vinyl acetate R-317 (production of Lekai company) 20g, dissolved separating.Add 1 then, ammediol diacrylate 2g, initiating agent (184) 0.5g, 2,6-d-tert-butyl-p-cresol 0.2g, Fc-4430# (production of 3M company) 0.1g under yellow safety lamp, stirred 1 hour in closed container, obtained second layer coating fluid.Be coated on the above-mentioned underlying membrane with the speed of this aqueous solution with 30m/min.Drying is 5 minutes under 50 ℃, obtains the adhesive linkage that thickness is 1 μ m.
Embodiment 2
Bottom: with embodiment 1
Adhesive linkage: acetone 100g, toluene 50g, polyurethane acroleic acid alkene ester (production of Lekai company) 15g, dissolved separating.Add 1 then, ammediol diacrylate 7g, initiating agent (184) 0.5g, 2,6-d-tert-butyl-p-cresol 0.2g, Fc-4430# (production of 3M company) 0.1g.Method of operating obtains the adhesive linkage that thickness is 1 μ m with the adhesive linkage rubbing method among the embodiment 1.
Embodiment 3
Bottom: with embodiment 1
Adhesive linkage: acetone 100g, toluene 50g, polyurethane acroleic acid alkene ester (production of Lekai company) 10g, dissolved separating.Add 1 then, ammediol diacrylate 12g, initiating agent (184) 0.5g, 2,6-d-tert-butyl-p-cresol 0.2g, Fc-4430# (production of 3M company) 0.1g.Method of operating obtains the adhesive linkage that thickness is 1 μ m with the adhesive linkage rubbing method among the embodiment 1.
Comparative example 1
Priming operation directly is not coated with the adhesive linkage among the embodiment 2 on mylar, and method of operating obtains the adhesive linkage that thickness is 1 μ m with the adhesive linkage rubbing method among the embodiment 1.
Comparative example 2
Bottom: with embodiment 1
Adhesive linkage: acetone 100g, toluene 50g, polyurethane acroleic acid alkene ester (production of Lekai company) 25g, dissolved separating.Add initiating agent (184) 0.5g, 2 then, 6-d-tert-butyl-p-cresol 0.2g, Fc-4430# (production of 3M company) 0.1g.Method of operating obtains the adhesive linkage that thickness is 1 μ m with the adhesive linkage rubbing method among the embodiment 1.
Comparative example 3
Bottom: with embodiment 1
Adhesive linkage: acetone 100g, toluene 50g, polyurethane acroleic acid alkene ester (production of Lekai company) 2g, dissolved separating.Add 1 then, ammediol diacrylate 20g, initiating agent (184) 0.5g, 2,6-d-tert-butyl-p-cresol 0.2g, Fc-4430# (production of 3M company) 0.1g.Method of operating obtains the adhesive linkage that thickness is 1 μ m with the adhesive linkage rubbing method among the embodiment 1.
The support coat side of above embodiment 1-3 and comparative example 1-3 is alignd with photosensitive resin layer, at 20-150 ℃, pressure 0.15-14MPa kept 20 seconds down, exposed 30 seconds from support base material (1) towards photographic layer with ZR650C flexible plate making machine (the safe instrument in Jiangsu group company makes), make sample.These samples detect result such as table 1 with BLD-200S electron detachment testing machine (manufacturing of blue streak mechanical ﹠ electrical technology centre of development, Jinan).
Table 1 embodiment and comparative example peeling force situation
Stripping conditions, with 150mm/min at the uniform velocity 180 ° peel off.
The standard peeling force requires to be not less than 1000g/cm, as known from Table 1, uses embodiments of the invention 1,2 and 3, and its peeling force all reaches more than the 1500g/cm, and the peeling force of comparative example is far below standard.
The embodiment second portion
The present invention includes and be followed successively by base material (1), bottom (2) and adhesive linkage (3) from bottom to top.On adhesive linkage (3), also be attached with diaphragm (4).The polymkeric substance that contains the chlorine element in the bottom (2) perhaps, contains polymkeric substance or potpourri based on the vinylidene chloride structural unit in the described bottom (2).The amount of vinylidene chloride structural unit accounts for more than 30% of polymkeric substance integral molar quantity, specifically can be 30%, 40%, 50%, 60%, 70%, 80%, 90% equivalence, as required also each point value arbitrarily more than 30%.The weight ratio that the amount that contains the polymer material of vinylidene chloride structural unit accounts for bottom material total solid is more than 50%, specifically can be 50%, 60%, 70%, 80%, 90% equivalence, as required also each point value arbitrarily more than 50%.Adhesive linkage contains the acrylate urethane resin in (3).The acrylate urethane resin that contains Photocrosslinkable specifically in the adhesive linkage (3).The softening point of acrylate urethane resin can be 80,90,100,110,120,130,140,150 ℃ etc. between 80-150 ℃, also other point values between 80-150 ℃.The weight ratio that the amount of the acrylate urethane resin of the middle Photocrosslinkable of adhesive linkage (3) accounts for adhesive linkage material total solid is 30%～98%, can be 30%, 40%, 50%, 60%, 70%, 80%, 98% etc., also can be other point values in 30%～98% scope.Include photosensitizer, Photocrosslinkable resin in the adhesive linkage (3) simultaneously, have one and an above unsaturated vinyl monomer.
The preparation method of photosensitive resin plate support of the present invention is as follows: bottom (2), adhesive linkage (3) are mixed with solution in advance, elder generation is barrier coating (2) on mylar that constitutes base material or sheet metal, after the drying, go up coating adhesive linkage (3) at bottom (2) again, dry back rolling forms.
Mylar comprises among the preparation method: in polyethylene terephthalate, polybutylene terephthalate, Polyvinylchloride, poly-ethylene naphthalene-2.6-two carbonic esters any; Described sheet metal comprises in aluminium plate, stainless steel substrates, the copper sheet any.Being covered with diaphragm (4) back rolling among the preparation method on dried adhesive linkage (3) forms.After adhesive linkage among the preparation method (3) drying, directly overlay on the photopolymer plate, 20～130 ℃ of temperature, under the pressure 0.15-14MPa, photopolymer plate is directly made in hot pressing.Wherein, temperature can be point values such as 20,30,40,50,60,70,80,90,100,110,120,130 ℃, also other point values in 20～130 ℃ of scopes.Point values such as pressure can be 0.15,0.5,1,3,5,7,9,11,12,14MPa, also other point values in the 0.15-14MPa scope down.
The present invention is coated with the acrylic copolymer resin of the vinylidene chloride structural unit that contains water-soluble type or organic solvent type as bottom on plastic film substrates such as polyester, polypropylene, triacetate; be coated with the adhesive linkage of the cross-linked type polyurethane acrylate resin that contains Photoepolymerizationinitiater initiater on bottom again, rolling forms after being covered with diaphragm on the adhesive linkage then.With photosensitive resin layer compound before, throw off diaphragm, at 20-150 ℃, pressure 0.15-14MPa down and photosensitive resin layer compound.Bonding force between exposure plate-making back support and the photographic layer is significantly strengthened, and relief image can long preservation.
Claims (7)
1. photosensitive resin plate support, it is characterized in that: it comprises and is followed successively by base material (1), bottom (2) and adhesive linkage (3) and diaphragm (4) from bottom to top, contain the polymkeric substance based on the vinylidene chloride structural unit in the described bottom (2), described adhesive linkage contains the acrylate urethane resin in (3); The amount of described vinylidene chloride structural unit accounts for more than 30% of polymkeric substance integral molar quantity; The weight ratio that the described amount that contains the polymer material of vinylidene chloride structural unit accounts for bottom material total solid is more than 50%; The weight ratio that the amount of the acrylate urethane resin of the middle Photocrosslinkable of described adhesive linkage (3) accounts for adhesive linkage material total solid is 30%～98%.
2. photosensitive resin plate support according to claim 1 is characterized in that: the acrylate urethane resin that contains Photocrosslinkable in the described adhesive linkage (3).
3. photosensitive resin plate support according to claim 1 is characterized in that: the softening point of described acrylate urethane resin is between 80-150 ℃.
4. photosensitive resin plate support according to claim 1 is characterized in that: include photosensitizer, Photocrosslinkable resin in the described adhesive linkage (3) simultaneously, have the unsaturated monomer of one and one above vinyl.
5. the preparation method of a photosensitive resin plate support as claimed in claim 1; it is characterized in that: coating contains the acrylic copolymer resin of vinylidene chloride structural unit as bottom (2) on mylar that constitutes base material (1) or sheet metal; on bottom (2) again coating contain Photoepolymerizationinitiater initiater the cross-linked type polyurethane acrylate resin as adhesive linkage (3), on dried adhesive linkage (3), be covered with the rolling of diaphragm (4) back and form.
6. the preparation method of photosensitive resin plate support according to claim 5, it is characterized in that: mylar comprises among the described preparation method: in polyethylene terephthalate, polybutylene terephthalate, Polyvinylchloride, poly-ethylene naphthalene-2.6-two carbonic esters any; Described sheet metal comprises in aluminium plate, stainless steel substrates, the copper sheet any.
7. according to the preparation method of claim 5 or 6 described photosensitive resin plate supports, it is characterized in that: after adhesive linkage among the described preparation method (3) drying, directly overlay on the photopolymer plate, 20～130 ℃ of temperature, under the pressure 0.15-14MPa, photopolymer plate is directly made in hot pressing.
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| CN2006101070577A CN101144980B (en) | 2006-09-15 | 2006-09-15 | Photosensitive resin plate support and process for preparing the same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111319372A (en) * | 2018-12-14 | 2020-06-23 | 乐凯华光印刷科技有限公司 | Water-washing flexographic plate support body and preparation method thereof |
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| CN103698979B (en) * | 2012-09-28 | 2017-04-12 | 乐凯华光印刷科技有限公司 | Water-washable flexible resin plate and making method thereof |
| CN104723717B (en) * | 2013-12-19 | 2017-08-25 | 乐凯华光印刷科技有限公司 | A kind of flexographic plate of CTP and preparation method thereof |
| CN104494324A (en) * | 2014-12-04 | 2015-04-08 | 管叶明 | Flexible printing resin plate and preparation method thereof |
| CN105702155B (en) * | 2016-04-13 | 2019-04-26 | 广盟（广州）包装有限公司 | A kind of compound label and its production technology |
| CN108215560B (en) * | 2016-12-14 | 2021-02-02 | 乐凯华光印刷科技有限公司 | Metal-based photosensitive resin plate support and preparation method thereof |
| CN114089603A (en) * | 2020-08-24 | 2022-02-25 | 乐凯华光印刷科技有限公司 | Flexographic plate support body and preparation method and using method thereof |
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| US3620812A (en) * | 1967-08-24 | 1971-11-16 | Bexford Ltd | Film material for lithographic plates |
| CN1135049A (en) * | 1995-05-03 | 1996-11-06 | 李三保 | Polyester precoated photosensitive plate and mfg. method thereof |
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| US3620812A (en) * | 1967-08-24 | 1971-11-16 | Bexford Ltd | Film material for lithographic plates |
| CN1135049A (en) * | 1995-05-03 | 1996-11-06 | 李三保 | Polyester precoated photosensitive plate and mfg. method thereof |
| CN1752117A (en) * | 2004-09-20 | 2006-03-29 | 乐凯集团第二胶片厂 | Vinyl polymer and light sensitivity lithographic plate containing said polymer |
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| CN111319372A (en) * | 2018-12-14 | 2020-06-23 | 乐凯华光印刷科技有限公司 | Water-washing flexographic plate support body and preparation method thereof |
| CN111319372B (en) * | 2018-12-14 | 2021-10-15 | 乐凯华光印刷科技有限公司 | Water-washing flexographic plate support body and preparation method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: LUCKY HUAGUANG GRAPHICS CO., LTD. Free format text: FORMER NAME: THE SECOND FILM FACTORY OF LUCKY GROUP |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 473003 technical department, 718 Station Road, Nanyang, Henan Patentee after: Lucky Huaguang Graphics Co., Ltd. Address before: 473003 technical department, 718 Station Road, Nanyang, Henan Patentee before: The Second Film Factory of Lucky Group |