CN101086980A - Heat radiation device of thermal conduction tube - Google Patents
Heat radiation device of thermal conduction tube Download PDFInfo
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- CN101086980A CN101086980A CN 200610083579 CN200610083579A CN101086980A CN 101086980 A CN101086980 A CN 101086980A CN 200610083579 CN200610083579 CN 200610083579 CN 200610083579 A CN200610083579 A CN 200610083579A CN 101086980 A CN101086980 A CN 101086980A
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Abstract
The invention disclose a heat guiding tube radiating device which comprises a heat guiding tube whose inner fills with working liquid, it is contacted with central processing unit and shell, the shell is made of material with high heat-guiding degree, and transfers heat generated by the central processing unit to the heat guiding tube, then transfers to shell for giving out. The heat guiding tube radiating device can includes several tappets, ends of the tappets are fixed to the main board of the object, the heat guiding tube is fixed to the upper cover of the shell, the upper cover is fixed to top of the tappets. The heat guiding tube possesses a flat lower end surface and an upper end surface for contacting with the central processing unit and upper shell; it also includes a inner tube, and a outer tube which winds the inner tube, the outer tube possesses flat lower surface and upper surface for contacting with the central processing unit and upper cover, and a smoke circling loop is bounded between the inner tube and the outer tube.
Description
Technical field
The present invention relates to a kind of heat radiation device of thermal conduction tube, refer to especially a kind ofly heat be passed to the device that the shell of its mounting object distributes there by heat pipe.
Background technology
Utilize heat abstractor to get rid of heat, in case machinery, device, utensil is overheated and damage, and is the important outfit of many tasks industry products such as engine, computer etc.Now the heat abstractor that uses with brain one central processing unit (CPU) of PC is example, and it is mainly by a fin that is held on the central processing unit, and a fan that is locked on the fin is formed.The heat that central processing unit work produces, distribute at fin via conduction of heat, fan then causes one strong wind by fin there, to continue removing heat from fin, avoid central processing unit overheated and reduce service behaviour or life-span, even damage and bring disaster to other computer part.
Yet along with the high development of semiconductor technology, the speed of central processing unit is more and more faster, and the heat of generation is also more and more surprising.Therefore, radiating efficiency must be along with lifting, otherwise the too high problem of computer temperature occurs immediately.
In order to increase cooling surface area, improve radiating efficiency, so fin again with heat pipe (heat pipe) and shell cooperation, distribute heat is passed to shell by heat pipe there.Fig. 1 shows that one commonly uses heat abstractor 95 by what fin 91 and heat pipe 92 and shell 93 were formed, is used for the example of central processing unit 90 heat radiations.The casing pack of this heat pipe 92 is heated and is easily evaporated the hydraulic fluid of catching a cold and easily condensing, and wherein an end is connected on the fin 91, and opposite end then is connected with shell 93.So, the heat that central processing unit 90 work produces, a part is distributed in fin 91 theres, and a part passes to shell 93 via the tube wall of heat pipe 92 and is lost to finally in the air of outside and goes.
Because this fin 91 is configured in the shell 93 of essence sealing, make the heat that distributes in fin 91 theres can't discharge and be trapped in the shell 93, cause shell 93 temperature inside high.
Summary of the invention
The purpose of this invention is to provide a kind of heat radiation device of thermal conduction tube, it can pass to heat pipe with the heat that central processing unit produces, pass to shell from heat pipe again, heat energy and a large amount of air are contacted with each other and be lost to very soon and go in the air of outside, significantly improve radiating efficiency.
Another object of the present invention is to provide a kind of heat radiation device of thermal conduction tube, its heat that central processing unit is produced is dispersed into the outside of shell, avoids the enclosure temperature to raise.
For achieving the above object, the present invention takes following design:
A kind of heat radiation device of thermal conduction tube, the heat pipe that comprises an inner filling hydraulic fluid, its respectively with the central processing unit and the housing contacts of this heat radiation device of thermal conduction tube mounting object, this shell is the high made of heat conductivity, pass to heat pipe with the heat that central processing unit work is produced, pass to shell from heat pipe again and distribute there.
In another embodiment, this heat radiation device of thermal conduction tube comprises two tappets at least, and the end of this tappet is fixed on the motherboard of this mounting object, and this heat pipe is fixed on the upper shell cover of this shell, and this upper shell cover is fixed on the top of this tappet.
In another embodiment, this heat pipe has a smooth lower surface and a upper surface, to contact with the upper shell cover of this central processing unit and this shell respectively.
In another embodiment, this heat pipe comprises pipe fitting in, reaches one and is looped around interior pipe fitting outer tube member on every side, and this outer tube member has smooth lower surface and upper surface, contacting with the upper shell cover of this central processing unit and this shell respectively, and define a steam circulation circuit between this inside and outside pipe fitting.
In another embodiment, this heat pipe comprises at least one curved sections of pipe of illegally occupying at the upper shell cover of this shell, and this curved sections of pipe constitutes a steam circulation circuit.
In another embodiment, by end cap sealing, this bottom end cover contacts with this central processing unit two end openings of this heat pipe respectively, and this upper end cover contacts with the upper shell cover of this shell.
Advantage of the present invention is: good heat dissipation effect, the radiating efficiency height can avoid the enclosure temperature to raise simultaneously.
Description of drawings
Fig. 1 commonly uses heat pipe to cooperate fin to be used for the profile of central processing unit heat radiation.
The heat radiation device of thermal conduction tube profile of Fig. 2 for forming according to a preferred embodiment of the present invention.
Fig. 3 is the heat radiation device of thermal conduction tube plane exploded view of Fig. 2.
Fig. 4 is the embodiment plane exploded view that is similar to Fig. 3.
Fig. 5 is an of the present invention embodiment profile.
Fig. 6 is the embodiment profile that is similar to Fig. 5.
Fig. 7 be the another embodiment of the present invention profile (wherein arrow is represented the flow of vapor direction, below graphic also with).
Fig. 7 A is the profile along A-A line among Fig. 7.
Fig. 8 advances an embodiment profile for of the present invention.
Fig. 9 is an embodiment profile more of the present invention.
Figure 10 is the embodiment profile that is similar to Fig. 9.
Figure 10 A is the part assembly three-dimensional exploded view of the 10th figure.
Figure 11 is the another embodiment of the present invention profile.
Figure 11 A is the profile along B-B line among Figure 11.
Embodiment
The present invention shows the interior shape of a heat radiation device of thermal conduction tube 10 in Fig. 2, Fig. 3 is its decomposing state, so that technology contents of the present invention to be described.This heat radiation device of thermal conduction tube 10 is by a heat pipe 20, and the shell 30 of mounting object combines the central processing unit 90 heat radiation need usefulness of this mounting object of confession.So-called mounting object includes, but are not limited to computer, and other electronic installation with central processing unit is also included.Described heat pipe 20 is to make cylinder, square column or other suitable shape by copper or brass, because thermal conductivity well concerns, therefore can promote heat transmission.The lower surface 21 of this heat pipe 20 is a smooth surface with upper surface 22, and contact with central processing unit 90 and shell 30 respectively, and inner filling hydraulic fluid (working fluid, figure does not show), this liquid has to be heated and easily evaporates the characteristic of catching a cold and easily condensing.Because the operation principle of heat pipe 20 is known, so further specify real unnecessaryly, the present invention simultaneously disengages behind the latent heat (latent heat) and the state that is condensed into liquid will not be stated for steam in the following description.
On the terminal quarter of the outer wall position of heat pipe 20, utilize welding or other proper method to connect a support 40 respectively, this support 40 is generally L-shaped, and its horizontal segment has screw hole 41; On the motherboard 80 of this mounting object also correspondence be provided with four screw holes 81, successively pass for screw 42 in the screwed hole 51 of back screw-in one tappet 50 ends, so on the one hand heat pipe 20 is fixed on above the central processing unit 90, simultaneously tappet 50 is locked on the motherboard 80, supply the usefulness of the upper shell cover 31 of fixed housing 30, its details is stayed aftermentioned, shows for the time being.
Described shell 30 is the high material of the coefficient of heat conduction, for example aluminium alloy manufacturing.Because thermal conductivity well concerns, therefore can promote heat transmission, surface area is big simultaneously, and the enough and a large amount of air of heat energy that make tube wall via heat pipe 20 pass to shell 30 contact with each other and are lost to very soon in the air of outside and go.In preferred embodiment, the outer surface of this shell 30 has plural groove 35, to increase the cooling surface area of shell 30, improves radiating efficiency.The upper shell cover 31 of shell 30 has four installing holes 33 that are arranged, each installing hole 33 corresponding tappet 50, make screw 36 can pass upper shell cover 31 and screw in the screwed hole 52 on tappet 50 tops, upper shell cover 32 is locked on the tappet 50, so on the one hand upper shell cover 31 is agreed with mutually with lower cover 32, form described shell 30, on the one hand upper shell cover 31 is contacted with the upper surface 22 of heat pipe 20.Can smear heat-conducting cream between heat pipe 20 and central processing unit 90 and the upper shell cover 31 and fill up space between its contact-making surface, reduce thermal resistance.Need know that the number of tappet 50 is not limited by the foregoing description, but needs two at least, and is diagonal configuration; Number as for support 40 is preferably identical with the number of tappet 50.
The operation principle of heat radiation device of thermal conduction tube 10 is: the lower surface 21 of heat pipe 20 contacts with the central processing unit 90 of this mounting object, upper surface 22 contacts with upper shell cover 31, this upper shell cover 31 has good thermal conductivity, so the heat that central processing unit 90 work can be produced is passed to heat pipe 20, tube wall from heat pipe 20 passes to upper shell cover 31 again, make heat energy and a large amount of air contact with each other and be lost to very soon and go in the air of outside, significantly improve radiating efficiency, prevent that simultaneously shell 30 internal temperatures from raising.
The present invention also can have other different variation, and it can be the foregoing description or anyly knows the modification that this operator does.Therefore, with identical part embodiment illustrated in fig. 2 all with identical symbology, and before also be applicable to the following examples for explanation embodiment illustrated in fig. 2, repeat no more.
Fig. 4 shows a heat radiation device of thermal conduction tube 10a who is similar to Fig. 2.Heat pipe 20 embodiment illustrated in fig. 2 is fixed on the motherboard 80, the embodiment of Fig. 4 then is fixed on upper shell cover 31 with heat pipe 20, then upper shell cover 31 is locked on the tappet 50, upper shell cover 31 is agreed with mutually with lower cover 32, also make lower surface 21 these central processing units 90 of contact of heat pipe 20 simultaneously.In the present embodiment, because heat pipe 20 is fixed on upper shell cover 31, so the support 40 of the foregoing description no longer needs.Again, tappet 50 only is fixed on beginning under the situation of upper shell cover 31 at heat pipe 20 necessity of setting; In other words, when heat pipe 20 was fixed on the motherboard 80, tappet 50 can omit need not.
Fig. 5 shows the heat radiation device of thermal conduction tube 10b of another different types of the present invention.Present embodiment and difference embodiment illustrated in fig. 2 are the profile of heat pipe, in this example, this heat pipe 20a is by an interior pipe fitting 23a, and one be looped around in outer tube member 23b around the pipe fitting 23a constitute, this outer tube member 23b has smooth lower surface 23c and upper surface 23d, to contact with the upper shell cover 31 of central processing unit 90 and shell 30 respectively.Should between pipe fitting 23a and the outer tube member 23b and define a steam circulation circuit 23e.In the embodiment of the 5th figure, the section configuration of this heat pipe 20a generally is " returns " font; Certainly, the section of heat pipe 20a also can be " ◎ " shape.Heat pipe that Fig. 2 discloses 20 is made of single pipe fitting, and its section is circle or quadrangle.Present embodiment also can be the same with the embodiment of Fig. 4, and the upper surface 23d of heat pipe 20b is fixed in upper shell cover 31.
Fig. 6 is the heat radiation device of thermal conduction tube 10c that is similar to Fig. 5.Present embodiment and difference embodiment illustrated in fig. 5 are, has heat-conducting seat 45 between the lower surface 23c of this heat pipe 20a and the central processing unit 90, between upper surface 23d and the upper shell cover 31 on one heat-conducting seat 46, the heat that central processing unit 90 work produce is passed to heat pipe 20a via following heat-conducting seat 45, passes to upper shell cover 31 by last heat-conducting seat 46 again.
Fig. 7 is the heat radiation device of thermal conduction tube 10d of another different types, and Fig. 7 A shows its steam loop.In the present embodiment, this heat pipe 20b comprises a profile and is pipe portion 24 under tetragonal haply, it links up pipe portion 26 on via two pipe component 25a and 25b, should go up pipe portion 26 contacts with upper shell cover 31, inside is divided into two chamber 26a and 26b by a dividing plate 26c, the first chamber 26a links up the first pipe component 25a, the second chamber 26b links up the second pipe component 25b, two sides of last pipe portion 26 also outwards connect curved sections of pipe 27a and the 27b that illegally occupies at upper shell 31 inner surfaces respectively, the first side wall 26d of pipe portion 26 in the inflow entrance 27c connection of the first curved sections of pipe 27a wherein, and link up the first chamber 26a, the second sidewall 26e of pipe portion 26 in the flow export 27d connection, and link up the second chamber 26b, form one first steam circulation circuit 27g; The first side wall 26d of pipe portion 26 in the inflow entrance 27e connection of the second curved sections of pipe 27b, and link up the first chamber 26a, the second sidewall 26e of pipe portion 26 in the flow export 27f connection, and link up the second chamber 26b, form one second steam circulation circuit 27h.In view of the above, when the following pipe portion 22 of heat pipe 20b is heated, hydraulic fluid in it flashes to gas because temperature raises, the second chamber 26b of this steam pipe portion 26 from the second pipe component 25b inflow, and flow into the first chamber 26a via the first curved sections of pipe 27a and the second curved sections of pipe 27b respectively, following the first pipe component 25a then and flowing back to down pipe portion 24, so going round and beginning again, circulation endlessly.Need know that steam is not necessarily fully according to above-mentioned path flow, illustration and explanation are intended in this mobile path.
The similar Fig. 7 of Fig. 8, heat pipe 20c wherein has the tube body 28 that without exception takes the shape of the letter U, its two side outwards connects curved sections of pipe 27a and the 27b that illegally occupies at upper shell 31 inner surfaces respectively, the inflow entrance of this two curved sections of pipe 27a and 27b is a side of tube connector body 28 respectively, and flow export is the opposite side of tube connector body 28 separately; So, also can form heat radiation device of thermal conduction tube 10e with identical steam circulation circuit with Fig. 8.
The present invention also can have other different variation.Heat radiation device of thermal conduction tube 10f as shown in Figure 9, heat pipe 20d wherein is the pipe component that one two end has opening, its lower end is supported on the good bottom end cover 60 of a thermal conductivity, this bottom end cover 60 has smooth surface, can keep desirable contacting with central processing unit 90, and comprise an annular ditch groove 61 identical with heat pipe 20d section configuration, the lower end of heat supply conduit 20d embeds the location, combine with solder technology again, with the lower ending opening of sealing heat pipe 20d.The upper end open of heat pipe 20d is then by a upper end cover 70 sealings, this upper end cover 70 is similarly the material of high-termal conductivity, for example copper coin punch forming, it has smooth surface equally, can produce desirable contacting with the upper shell cover 31 of shell 30, and have an annular ditch groove 71 identical with heat pipe 20d section configuration, the upper end of heat supply conduit 20d embeds, combine with solder technology again, upper end cover 70 is combined with heat pipe 20d, seal its upper end open simultaneously.
Figure 10 is the heat radiation device of thermal conduction tube 10g that is similar to Fig. 9, and Figure 10 A is its part assembly decomposing state.In the present embodiment, bottom end cover 60a comprises the foot rest 62 that is located at its four corners, and it can be high with bottom end cover 60a appropriateness holder, and this foot rest 62 also has screw hole 63 and is locked in jointly on the motherboard 80 for the end of screws 42 with bottom end cover 60a and tappet 50.Upper end cover 70a has the screw hole 72 that is located at its four corners equally and passes for screw 36, in order to do locking together with upper shell cover 31, so can omit the tappet 50 among Fig. 9.In other words, by the design that upper end cover 70a fixes with upper shell cover 31, can not need lean on tappet 50 to realize the location.
For prevent heat from the tube wall loss of heat pipe to shell 30, in preferred embodiment, as shown in figure 10, one heat shield 88 can be installed around heat pipe 20d, reach heat insulation purpose by this, prevent in the heat that heat pipe 20d distributes there spills into shell 30, avoid shell 30 internal temperatures to raise.Above-mentioned heat shield 88 also is fit to the heat pipe cooperation use extremely embodiment illustrated in fig. 9 with Fig. 2.
The embodiment of Figure 10 also can have other different variation.Heat radiation device of thermal conduction tube 10h shown in Figure 11 and Figure 11 A, have a fin 85 be installed in heat pipe 20d around, and have a fan 86 be located at heat pipe 20d above, reach one and be installed in fin 85 fan housing 87 on every side, to improve the air-supply efficient of fan 86, the wind that makes fan 86 be inhaled must be earlier by fin 85, with the heat absorption that fin 85 is distributed.According to present embodiment, should have enough gaps 89 between fan 86 and the shell 30a, in order to fan 86 air draughts, then needn't have heat sinking function as for shell 30a, can use the plastic material manufacturing; In other words, present embodiment system cooperates fan 86 to realize heat sinking function by fin 85.
In addition, as shown in figure 11, be formed at the annular ditch groove 61 of bottom end cover 60 or 60a, and the annular ditch groove 71 that is formed at upper end cover 70 or 70a also can be replaced as respectively one with the identical recess of heat pipe 20d section configuration, lower end and the upper end of heat supply conduit 20d are inserted in the location respectively.The loam cake 70b of Figure 11 shows the thin portion that cooperate this recess 73 and heat pipe 20d upper end.
The present invention compares with existing heat radiation device of thermal conduction tube technology, and its radiating effect is actively with tangible.The present invention contacts with the direct of central processing unit and shell via heat pipe, the heat that central processing unit work produces can be passed to shell rapidly via heat pipe, make heat energy and a large amount of air contact with each other and be lost to very soon and go in the air of outside, significantly improve radiating efficiency, avoid the enclosure temperature to raise simultaneously.
Certainly, the foregoing description can not depart from the scope of the present invention down in addition some variations, thus more than explanation comprise and accompanying drawing shown in whole items should be considered as exemplary, but not in order to limit claim scope of the present invention.
Claims (21)
1, a kind of heat radiation device of thermal conduction tube is characterized in that it comprises:
One heat pipe, its inner filling are heated and easily evaporate the hydraulic fluid of catching a cold and easily condensing, and contact with the central processing unit of this heat radiation device of thermal conduction tube mounting object; And
One shell, it is the made of high-termal conductivity, and contacts with this heat pipe.
2, heat radiation device of thermal conduction tube according to claim 1, it is characterized in that: wherein comprise at least two tappets again, the end of this tappet is fixed on the motherboard of this mounting object, and this heat pipe is fixed on the upper shell cover of this shell, and this upper shell cover is fixed on the top of this tappet.
3, heat radiation device of thermal conduction tube according to claim 1 is characterized in that: wherein the outer wall of this heat pipe connects at least two supports, and this support is fixed on the motherboard of this mounting object.
4, heat radiation device of thermal conduction tube according to claim 3 is characterized in that: wherein comprise at least two tappets again, the end of each tappet and a support are fixed on the motherboard of this mounting object jointly.
5, according to claim 1 or 2,3,4 described heat radiation device of thermal conduction tube, it is characterized in that: wherein this heat pipe has a smooth lower surface and a upper surface, to contact with the upper shell cover of this central processing unit and this shell respectively.
6, according to claim 1 or 2,3,4 described heat radiation device of thermal conduction tube, it is characterized in that: wherein this heat pipe comprises pipe fitting in, reach one and be looped around interior pipe fitting outer tube member on every side, this outer tube member has smooth lower surface and upper surface, contacting with the upper shell cover of this central processing unit and this shell respectively, and define a steam circulation circuit between this inside and outside pipe fitting.
7, heat radiation device of thermal conduction tube according to claim 6 is characterized in that: wherein have heat-conducting seat between this heat pipe and this central processing unit.
8, heat radiation device of thermal conduction tube according to claim 6 is characterized in that: wherein have heat-conducting seat between the upper shell cover of this heat pipe and this shell.
9, heat radiation device of thermal conduction tube according to claim 6 is characterized in that: wherein have heat-conducting seat between this heat pipe and this central processing unit, have heat-conducting seat between the upper shell cover of this heat pipe and this shell.
10, according to claim 1 or 2,3,4 described heat radiation device of thermal conduction tube, it is characterized in that: wherein this heat pipe comprises at least one curved sections of pipe of illegally occupying at the upper shell cover of this shell, and this curved sections of pipe constitutes a steam circulation circuit.
11, according to claim 1 or 2,3,4 described heat radiation device of thermal conduction tube, it is characterized in that: wherein this heat pipe comprises pipe portion, it links up pipe portion on via two pipe components, should go up pipe portion contacts with the upper shell cover of this shell, inside defines two chambers, first chamber is linked up first pipe component, second chamber is linked up second pipe component, two sides of last pipe portion also outwards connect the curved sections of pipe of illegally occupying at this upper shell cover respectively, the inflow entrance of this two curved sections of pipe is linked up first chamber respectively, flow export is linked up second chamber separately, and constitutes two steam circulation circuits.
12, according to claim 1 or 2,3,4 described heat radiation device of thermal conduction tube, it is characterized in that: wherein this heat pipe comprises the tube body of a U-shaped, its two side outwards connects the curved sections of pipe of illegally occupying at the upper shell cover of this shell respectively, the inflow entrance of this two curved sections of pipe connects a side of this tube body respectively, flow export connects the opposite side of this tube body separately, and constitutes two steam circulation circuits.
13, a kind of heat radiation device of thermal conduction tube is characterized in that it comprises:
One shell, it is the made of high-termal conductivity;
One heat pipe, its two end has opening;
One bottom end cover, it is the high made of the coefficient of heat conduction, sealing the lower ending opening of this heat pipe, and contacts with the central processing unit of this heat radiation device of thermal conduction tube mounting object;
One upper end cover, it is the made of high-termal conductivity, and is fixed on the upper shell cover of this shell, sealing the upper end open of this heat pipe, and at the heat pipe inner filling that this two end the is closed hydraulic fluid that easily evaporation catches a cold and easily condense that is heated; And
At least two tappets, its end are fixed on the motherboard of this mounting object, and the upper shell cover of this shell is fixed on the top of this tappet.
14, a kind of heat radiation device of thermal conduction tube is characterized in that it comprises:
One shell, it is the made of high-termal conductivity;
One heat pipe, its two end has opening;
One bottom end cover, it is the high made of the coefficient of heat conduction, sealing the lower ending opening of this heat pipe, and is fixed on the motherboard of this heat abstractor mounting object, and contacts with central processing unit on this motherboard; And
One upper end cover, it is the made of high-termal conductivity, and is fixed on the upper shell cover of this shell, sealing the upper end open of this heat pipe, and at the heat pipe inner filling that this two end the is closed hydraulic fluid that easily evaporation catches a cold and easily condense that is heated.
15, a kind of heat radiation device of thermal conduction tube is characterized in that it comprises:
One shell;
One heat pipe, its two end has opening;
One bottom end cover, it is the high made of the coefficient of heat conduction, sealing the lower ending opening of this heat pipe, and is fixed on the motherboard of this heat radiation device of thermal conduction tube mounting object, and contacts with central processing unit on this motherboard;
One upper end cover, it is the made of high-termal conductivity, sealing the upper end open of this heat pipe, and at the heat pipe inner filling that this two end the is closed hydraulic fluid that easily evaporation catches a cold and easily condense that is heated;
One fin, its be installed in this heat pipe around;
One fan, its be arranged on this upper end cover above, have a gap between the upper shell cover of this fan and this shell; And
One fan housing, its be installed in this fin around, to improve the air-supply efficient of this fan.
16, according to claim 13 or 14,15 described heat radiation device of thermal conduction tube, it is characterized in that: wherein this bottom end cover and upper end cover respectively have an annular ditch groove identical with this heat pipe section configuration, and lower end and the upper end that can distinguish the heat supply conduit embed the location.
17, according to claim 13 or 14,15 described heat radiation device of thermal conduction tube, it is characterized in that: wherein this bottom end cover and upper end cover respectively have a recess identical with this heat pipe section configuration, and the location is inserted in the lower end of heat supply conduit and upper end respectively.
18, according to claim 14 or 15 described heat radiation device of thermal conduction tube, it is characterized in that: wherein this bottom end cover is by bipod holder height at least, and the free end of this foot rest is fixed on this motherboard.
19, according to claim 1 or 13,14 described heat radiation device of thermal conduction tube, it is characterized in that: wherein comprise again a heat shield be installed in this heat pipe around.
20, according to claim 1 or 13,14,15 described heat radiation device of thermal conduction tube, it is characterized in that: wherein this shell has the plural groove that is formed at outer surface.
21, according to claim 1 or 13,14,15 described heat radiation device of thermal conduction tube, it is characterized in that: wherein this mounting object includes, but are not limited to computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610083579 CN101086980A (en) | 2006-06-07 | 2006-06-07 | Heat radiation device of thermal conduction tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610083579 CN101086980A (en) | 2006-06-07 | 2006-06-07 | Heat radiation device of thermal conduction tube |
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|---|---|
| CN101086980A true CN101086980A (en) | 2007-12-12 |
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|---|---|---|---|
| CN 200610083579 Pending CN101086980A (en) | 2006-06-07 | 2006-06-07 | Heat radiation device of thermal conduction tube |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102474997A (en) * | 2009-07-20 | 2012-05-23 | 辛维特有限公司 | Local thermal management |
| CN104602486A (en) * | 2014-12-22 | 2015-05-06 | 曙光信息产业(北京)有限公司 | Liquid-cooled server |
| CN111022168A (en) * | 2019-12-27 | 2020-04-17 | 东风汽车集团有限公司 | Oxygen sensor heat insulation protection device |
-
2006
- 2006-06-07 CN CN 200610083579 patent/CN101086980A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102474997A (en) * | 2009-07-20 | 2012-05-23 | 辛维特有限公司 | Local thermal management |
| CN102474997B (en) * | 2009-07-20 | 2014-12-03 | 辛维特有限公司 | Local thermal management |
| CN104602486A (en) * | 2014-12-22 | 2015-05-06 | 曙光信息产业(北京)有限公司 | Liquid-cooled server |
| CN111022168A (en) * | 2019-12-27 | 2020-04-17 | 东风汽车集团有限公司 | Oxygen sensor heat insulation protection device |
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