CN101038949A - 发光二极管封装件 - Google Patents
发光二极管封装件 Download PDFInfo
- Publication number
- CN101038949A CN101038949A CNA2007100873686A CN200710087368A CN101038949A CN 101038949 A CN101038949 A CN 101038949A CN A2007100873686 A CNA2007100873686 A CN A2007100873686A CN 200710087368 A CN200710087368 A CN 200710087368A CN 101038949 A CN101038949 A CN 101038949A
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- China
- Prior art keywords
- substrate
- electrode
- light
- light emission
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 134
- 230000005855 radiation Effects 0.000 abstract description 16
- 238000004806 packaging method and process Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 230000003068 static effect Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000021384 green leafy vegetables Nutrition 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60P—VEHICLES ADAPTED FOR LOAD TRANSPORTATION OR TO TRANSPORT, TO CARRY, OR TO COMPRISE SPECIAL LOADS OR OBJECTS
- B60P3/00—Vehicles adapted to transport, to carry or to comprise special loads or objects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R15/00—Arrangements or adaptations of sanitation devices
- B60R15/02—Washing facilities
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47K—SANITARY EQUIPMENT NOT OTHERWISE PROVIDED FOR; TOILET ACCESSORIES
- A47K3/00—Baths; Douches; Appurtenances therefor
- A47K3/02—Baths
- A47K3/06—Collapsible baths, e.g. inflatable; Movable baths
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
- B60Y2200/00—Type of vehicle
- B60Y2200/10—Road Vehicles
- B60Y2200/14—Trucks; Load vehicles, Busses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
- F24H1/54—Water heaters for bathtubs or pools; Water heaters for reheating the water in bathtubs or pools
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Transportation (AREA)
- Epidemiology (AREA)
- General Health & Medical Sciences (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060023519 | 2006-03-14 | ||
KR1020060023519A KR100703218B1 (ko) | 2006-03-14 | 2006-03-14 | 발광다이오드 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101038949A true CN101038949A (zh) | 2007-09-19 |
CN100517785C CN100517785C (zh) | 2009-07-22 |
Family
ID=38160782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2007100873686A Active CN100517785C (zh) | 2006-03-14 | 2007-03-14 | 发光二极管封装件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7566912B2 (zh) |
JP (1) | JP4674221B2 (zh) |
KR (1) | KR100703218B1 (zh) |
CN (1) | CN100517785C (zh) |
TW (1) | TWI338956B (zh) |
Cited By (11)
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CN102185089A (zh) * | 2010-01-15 | 2011-09-14 | Lg伊诺特有限公司 | 发光装置及照明系统 |
CN102185091A (zh) * | 2011-03-29 | 2011-09-14 | 晶科电子(广州)有限公司 | 一种发光二极管器件及其制造方法 |
CN102244178A (zh) * | 2010-05-14 | 2011-11-16 | 展晶科技(深圳)有限公司 | 发光二极管的封装结构 |
CN102770978A (zh) * | 2010-01-25 | 2012-11-07 | 维莎斯普拉格公司 | 基于金属的电子部件封装及其制造方法 |
CN102820411A (zh) * | 2009-02-19 | 2012-12-12 | 旭丽电子(广州)有限公司 | 发光二极管芯片、制法及封装方法 |
CN103155185A (zh) * | 2010-08-20 | 2013-06-12 | 奥斯兰姆奥普托半导体有限责任公司 | 光电子半导体器件 |
CN104106122A (zh) * | 2011-12-14 | 2014-10-15 | 万斯创新公司 | 发光系统 |
CN105428511A (zh) * | 2014-09-12 | 2016-03-23 | 株式会社东芝 | 半导体发光装置及导线架 |
CN105938866A (zh) * | 2016-06-13 | 2016-09-14 | 开发晶照明(厦门)有限公司 | Led支架和led封装结构 |
CN106574749A (zh) * | 2014-07-23 | 2017-04-19 | Lg伊诺特有限公司 | 光源模块及配备有光源模块的显示模块、配件和镜子 |
CN110582848A (zh) * | 2017-05-02 | 2019-12-17 | 奥斯兰姆奥普托半导体有限责任公司 | 芯片模块的生产 |
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US9070850B2 (en) * | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
WO2007023807A1 (ja) * | 2005-08-23 | 2007-03-01 | Kabushiki Kaisha Toshiba | 発光装置とそれを用いたバックライトおよび液晶表示装置 |
US20070080360A1 (en) * | 2005-10-06 | 2007-04-12 | Url Mirsky | Microelectronic interconnect substrate and packaging techniques |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
WO2008123764A2 (en) * | 2007-04-05 | 2008-10-16 | Kia Kuang Tan | Pre-stamped matrix metal substrate with matrix electrical testing capability |
WO2008123765A1 (en) * | 2007-04-05 | 2008-10-16 | Kia Kuang Tan | Solid state light source mounted directly on aluminum substrate for better thermal performance and method of manufacturing the same |
DE102008019667A1 (de) * | 2008-04-18 | 2009-10-22 | Ledon Lighting Jennersdorf Gmbh | LED-Modul mit einer Plattform mit einer Zentralausnehmung |
KR100958024B1 (ko) * | 2008-08-05 | 2010-05-17 | 삼성엘이디 주식회사 | 발광 다이오드 패키지 및 그 제조방법 |
KR101077887B1 (ko) | 2008-12-16 | 2011-10-31 | (주)웨이브닉스이에스피 | 단자 일체형 금속베이스 패키지 모듈 및 금속베이스 패키지 모듈을 위한 단자 일체형 패키지방법 |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
KR100914859B1 (ko) * | 2009-02-16 | 2009-09-02 | 유트로닉스주식회사 | 방열 기능을 갖는 엘이디 모듈 |
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Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS62200776A (ja) | 1986-02-28 | 1987-09-04 | Alps Electric Co Ltd | 発光ダイオ−ドアレ−基板 |
US7019335B2 (en) | 2001-04-17 | 2006-03-28 | Nichia Corporation | Light-emitting apparatus |
KR20040092512A (ko) * | 2003-04-24 | 2004-11-04 | (주)그래픽테크노재팬 | 방열 기능을 갖는 반사판이 구비된 반도체 발광장치 |
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JP2005210057A (ja) | 2003-12-24 | 2005-08-04 | Kyocera Corp | 発光素子収納用パッケージ、発光装置および照明装置 |
KR100593152B1 (ko) * | 2004-07-01 | 2006-06-26 | 서울반도체 주식회사 | 방열효율이 향상된 단색 고출력 발광다이오드 패키지 |
JP4467402B2 (ja) * | 2004-10-22 | 2010-05-26 | 富士通株式会社 | センサ装置 |
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2006
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- 2007-03-12 JP JP2007061825A patent/JP4674221B2/ja active Active
- 2007-03-13 US US11/717,154 patent/US7566912B2/en active Active
- 2007-03-14 CN CNB2007100873686A patent/CN100517785C/zh active Active
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Also Published As
Publication number | Publication date |
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JP2007251167A (ja) | 2007-09-27 |
KR100703218B1 (ko) | 2007-04-09 |
TWI338956B (en) | 2011-03-11 |
TW200742135A (en) | 2007-11-01 |
US20070221928A1 (en) | 2007-09-27 |
CN100517785C (zh) | 2009-07-22 |
US7566912B2 (en) | 2009-07-28 |
JP4674221B2 (ja) | 2011-04-20 |
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