CN101030095B - Heat quantity control method and computer - Google Patents
Heat quantity control method and computer Download PDFInfo
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- CN101030095B CN101030095B CN2007100847728A CN200710084772A CN101030095B CN 101030095 B CN101030095 B CN 101030095B CN 2007100847728 A CN2007100847728 A CN 2007100847728A CN 200710084772 A CN200710084772 A CN 200710084772A CN 101030095 B CN101030095 B CN 101030095B
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Abstract
The invention restrains heat generation of a heat generation device, and restrains performance reduction in a low degree. For a heat generation device provided with a built-in processor having an alterable maximal power consumption value, power consumption values and a temperature value are measured termly. When a value representing a gather of the measured power consumption values exceeds a predetermined threshold value, and the temperature value exceeds a predetermined threshold value, the processor is detected that being in a high heat generation amount state for a long time, the maximal power consumption value of the processor is reduced.
Description
Technical field
The present invention relates to the technology of the thermal value of a kind of control computer inside, in more detail, relate to a kind of heating that suppresses processor, and the technology of rejection decline.
Background technology
Personal computer (hereinafter referred to as PC) is equipped with multiple arrangements such as CPU, display card in casing inside.Each device generates heat in the process of continuous firing, and temperature rises.In main device, thermal value is bigger, can exert an influence to work when rising so high on the temperature, and the worst situation can produce and burn (below, this type of device is referred to as the heat generation device).Therefore, as device such as CPU, display card, as the heat generation device of the integrated circuit of built-in processor, in the chip (die) of generally temperature sensor being packed into integratedly.Then, PC carries out heat management according to the built-in measured temperature of temperature sensor in these heat generation devices, so that the temperature of this device does not rise so high on not understanding.Be used to suppress the heat management that temperature rises and roughly be divided into two kinds of controls.A kind of is as cooling fan etc., the control to the mechanism of the outside heat extraction of casing.Another kind is the control that the performance of reduction heat generation device reduces thermal value.
Wherein, as the technology of the cpu performance of controlling PC, the known technology that is called SpeedStep (registered trademark).SpeedStep is the technology that Intel exploitation, the voltage when CPU is worked and frequency of operation are switched.Among the extended edition SpeedStep that in existing P C, generally uses, preparation has several grades～tens grades the voltage and the setting of frequency of operation, load that can corresponding CPU changes its voltage and frequency of operation (below, so-called SpeedStep comprises the implication of extended edition SpeedStep).By specify the frequency of operation of the maximum that is allowed this moment by the outside, can reduce the frequency of operation of actual CPU.In addition, the reduction of corresponding frequency of operation, voltage also is lowered.If reduce voltage and the frequency of operation of CPU, then the power consumption of CPU and thermal value also are lowered.Minimum maximum operation frequency is approximately about half of the highest maximum operation frequency.Maximum operation frequency when processor is worked is set at and is lower than the highest frequency of operation that this processor can reach, and this is referred to as restriction (clip) below processing.
In addition, as the standard of control PC power source, known ACPI (Advanced Configuration andPower Interface).This standard is that formulate at the center by Intel, MS and Toshiba Corporation, be to be used for the uniform way that the collaborative BIOS of OS manages the power consumption of each parts of constituting PC, can be the center with OS to control of the ON/OFF of power supply, time-out/restart, fan etc., detailed setting, management be carried out in various functions and the action relevant with the power consumption control of each parts.Since the version 2 .0 of 2000 issues, ACPI is formally corresponding with the action of the restriction of SpeedStep.
In addition, as the voltage of control CPU and the technology of frequency of operation, for example has following document.Patent documentation 1 is the patented claim of Intel, discloses the voltage of controlling this CPU according to temperature or the power consumption of CPU and the technology of frequency of operation.Patent documentation 2 disclosed technology are: measure the power that offers CPU all the time, control voltage and the frequency of operation of this CPU according to detected power.Patent documentation 3 disclosed technology are: temporarily CPU switched to high performance mode of operation, switch to the mode of operation of low performance then, thus, even used the PC of the less battery of discharge power also can obtain higher performance.
[patent documentation 1] special table 2002-529806 communique
[patent documentation 2] spy opens the 2004-133646 communique
[patent documentation 3] spy opens the 2005-182522 communique
Notebook type PC (to call notebook PC in the following text) therefore compares with Desktop PC because the more little casing volume inside of size of its casing is more little, and the heat that can be discharged to the casing outside by cooling fan is strictly limited.Therefore need be corresponding to the heat-sinking capability of casing, selection can built-in heat generation device.Ratings in heat-sinking capability is in the casing of 20W, and the CPU that TDP (Thermal DesignPower) surpasses 20W can't be installed usually, and described TDP is the desired value of the maximum heat of expression CPU generation.Particularly in notebook PC, become the heat-sinking capability of casing and the approaching state of TDP of CPU easily.
Wherein, it is especially poor to be called notebook PC heat-sinking capability sub-notebook (subnote) type etc., that have extra small casing, and therefore more situation is installed the less low-power consumption type of TDP or the CPU of super low-power consumption type.But it is higher that low-power consumption type CPU and common type CPU compare price, and performance is limited lowlyer.For example, as CPU towards notebook PC, one of them mainstream product is Pentium (registered trademark) the M processor of Intel, is 2.26GHz with respect to the frequency of operation of common type, and its low-power consumption type is up to 1.6GHz, the super low-power consumption type is up to 1.3GHz.That is, the more little performance of the size of casing is low more, and cost raises on the contrary.
Yet the heat that is produced by CPU depends on load size and the duration of this CPU to a great extent.Therefore, even TDP is the CPU of 30W, in fact neither produce the heat of 30W all the time.Observe the heating of about 30W when this CPU has been applied maximum load, thermal value is below 1W when hanging down load on the other hand.Under the behaviour in service of general office or the PC in the family, it is temporary mostly that CPU is applied high capacity, and the situation that is continuously applied high capacity for a long time is less.Therefore, suppress heating, then the heat generation device that has above the TDP of this heat-sinking capability can be installed in the lower casing of heat-sinking capability if can limit the heat generation device by described SpeedStep.At this moment, if utilize temperature sensor built-in in this device, the then temperature of the device in the mensuration work easily.
But the problem of this moment is, begins to have some time-delays between temperature descends from the heat generation device is limited.In existing method, in by this device built-in temperature sensor measurement to temperature value when having surpassed specific threshold value, suppress heating by this device is limited.At this moment, beginning begins to descend to temperature needs the some time from limiting.Therefore, in fact, need will judge that the threshold setting that whether limits must be lower than this temperature in order to be no more than the temperature that the work that makes notebook PC is subjected to bad influence.Thus, in the conventional method, the performance of this device is lowered the above degree of degree of required reduction.
In addition, in existing method, do not consider influence between the device in the temperature measuring.For example also have following situation: though CPU is applied higher load, thermal value continues in higher state, and lower to the load that display chip applies, thermal value is lower.But because it is more to be that small-sized casing and particularly being adjacent to disposes the situation of CPU and display chip, if the therefore thermal value height of CPU, then since the temperature of the heat display chip of this CPU generation also rise.And, only by by the built-in temperature sensor measurement of display chip to temperature, can't distinguish that this temperature rises is because the heat that display chip self work produces, still from the influence of the heat of device around the CPU etc.Therefore, though in fact do not need to suppress the heating of display chip, in existing method, still reduced the performance of display chip.
In addition, in existing method, do not consider the influence of PC environment temperature on every side yet.To work under 25 ℃～28 ℃ environment temperature is prerequisite, the ratings of design casing heat-sinking capability.For example when environment temperature is higher than these temperature, even the thermal value of heat generation device is less, the temperature of this device also can reach sometimes and judge whether the threshold value that limits.At this moment, though in fact do not need to suppress the heating of this device, still reduced the performance of this device in the conventional method.
Therefore, the object of the present invention is to provide a kind of control method and computing machine of thermal value of heat generation device, it can suppress the heating of the heat generation device of PC, and can suppress performance decrease lower.
Summary of the invention
The control method of thermal value of the present invention is: the thermal value of the variable processor of maximum power dissipation value built-in in the computer control heat generation device of heat generation device is installed, the integrated circuit of the processor that maximum power dissipation value that described heat generation device is built-in is variable.In this control method, make this processor work on one side, measure the power consumption number and the temperature value of this processor on one side termly, the value of the set of a plurality of power consumption numbers that are measured in representative has surpassed the threshold value of regulation, and when temperature value has surpassed the threshold value of regulation, reduce the maximum power dissipation value of this processor.The value of the set of said here representative power consumption number for example is mean value, maximal value, intermediate value of a plurality of power consumption numbers continuous in certain time range etc.By using such typical value to judge, to compare with situation about only judging according to the change of power consumption number, the interference that can get rid of the generations such as change of following load more suitably reduces the maximum power dissipation value of this processor.
If the higher state of the thermal value of heat generation device finishes at short notice, then directly the heat that produces is discharged to outside the casing by cooling fan etc., therefore the influence that the temperature of this heat generation device is risen is less.The situation of certain hour that the influence that the temperature of heat generation device is risen has been meant state continuance that thermal value is higher.On the other hand, there is close relevance in the thermal value of the power consumption number of processor and this heat generation device, and with the temperature of this device compare with the relation between the thermal value time-delay less.Therefore, so-called represent results of regular determination to the value of set of a plurality of power consumption numbers surpassed the threshold value of stipulating, the certain hour of having represented state continuance that the thermal value of this processor is higher.If when detecting this state, reduce the maximum power dissipation value of this processor, then can reduce thermal value in the more appropriate moment, the temperature that suppresses this device rises.And, by using power consumption number and temperature value simultaneously, can detect the heating of this device self definitely, therefore be difficult to be subjected to the influence of peripheral device and environment temperature.
At this moment, in order to reduce the maximum power dissipation value of this processor, effectively: this processor limited suppress maximum operation frequency.In addition, if get moving average from the typical value of the time per unit of a plurality of power consumptions of being measured to, then in this moving average when the number of times of regulation surpasses threshold value continuously, the certain hour that can more properly detect the higher state continuance of the thermal value of this processor.Therefore, the preferred mean value that uses the value of the sampling that current value to easy mensuration carried out stipulated number calculates the typical value of the time per unit of employed power consumption.
In processor, prepare to have several grades～tens grades maximum operation frequency as mentioned above.Therefore, if can make maximum operation frequency reduction one-level suppress the temperature rising by this processor is limited, then can under such state, work on, even if maximum operation frequency is reduced one-level, the temperature of this processor still continues to rise, and then can further reduce maximum operation frequency and no longer rise up to temperature.When a processor has reached minimum maximum operation frequency, in the time of can't further reducing maximum operation frequency again, can other processor be limited.For example, in the time can't reducing the maximum operation frequency of CPU again, can limit display chip and suppress heating.
The unit interval that the power consumption number of above-described processor and the mensuration of temperature value can will be measured when the temperature of this processor is hanged down is set longlyer, temperature at this processor begins to rise, and will set the unit interval shortlyer when the temperature value that is measured to surpasses setting.Temperature value when certainly, the unit interval that will measure is set more in short-term temperature value and is lower than this processor limited.
In addition, when the continuous stipulated number of the moving average of the power consumption that is measured to is lower than setting, can judge that the bigger state of this processor thermal value is disengaged, therefore remove the restriction state of this processor fully, the maximum operation frequency in the time of can making the work of this processor returns to maximum operation frequency possible in this processor.Like this, also suppress performance decrease less.
Above-described feature has more than the method as the thermal value of a kind of control computer inside, also provides as a kind of computing machine that can carry out this control method.Frequency control setting power value and frequency control set temperature value as the threshold value of the maximum operation frequency that is used for processor controls when work are stored in computer-internal as heat effect (thermal action) table.Heat generation device as the object of this control has CPU, display chip etc., but might not be defined in these.In addition, in order to measure the temperature of these heat generation devices,, then can more properly measure temperature, and need not to install outside additional temp sensor from this if use the temperature sensor in the integrated chip of packing into (die) when making integrated circuit.In addition, in this computing machine, cooling fan is installed, can controls the velocity of rotation of cooling fan and the maximum operation frequency of processor respectively.
According to the present invention, a kind of control method and computing machine of thermal value of heat generation device can be provided, it can suppress the heating of the heat generation device of PC, and suppresses the reduction of performance less.
Description of drawings
Fig. 1 is the outside drawing of notebook PC.
Fig. 2 is the schematic block diagram of notebook PC.
Fig. 3 is the block diagram of the structure of the expression device for switching that realizes CPU and display chip frequency of operation and voltage.
Fig. 4 is the process flow diagram of the program relevant with the control of thermal value.
Fig. 5 is the process flow diagram of relevant with the control of thermal value [Thermal Caution Mode] program.
Fig. 6 is the chart of the variation of temperature when representing not carry out thermal value control, CPU and display chip and power consumption.
Fig. 7 is the process flow diagram of the program relevant with the control of the thermal value of prior art.
Fig. 8 is the chart of the variation of expression temperature when carrying out the control of thermal value of prior art, CPU and display chip and power consumption.
Fig. 9 is the chart of the variation of expression temperature when carrying out thermal value of the present invention control, CPU and display chip and power consumption.
Figure 10 is about above represented various situations, the chart of the comparison of expression performance.
Embodiment
Fig. 1 is the outside drawing of the notebook PC10 of embodiments of the present invention, and Fig. 2 is the schematic block diagram of its system architecture of expression.Notebook PC10 is made of casing 13 and LCD (LCD) 11, and described casing 13 profiles are held multiple arrangement in mounted on surface keyboard to be arranged in inside.In casing 13 inside various devices shown in Figure 2 are installed.CPU15 is an arithmetic processing apparatus of being responsible for the maincenter function of notebook 10, carries out OS, BIOS, device driving or application program etc.CPU15 via as the FSB (Front Side Bus) 17 of system bus, be used to carry out between CPU15 and the peripheral device the PCI that communicates by letter (Peripheral Component Interconnect) bus 19 and as three grades bus of LPC (the Low Pin Count) bus 20 of the interface that replaces isa bus, be connected the transmitting-receiving of carrying out signal with each device.In addition, as the embedded temperature sensor 53a that monitors CPU15 that in the chip of CPU15, formed.Be connected with the A/D input of embedded controller 47 described later from the signal of temperature sensor 53a output.
FSB17 and PIC bus 19 are got in touch with by the CPU bridge 21 that is called storer/PCI chip.CPU bridge 21 comprises following function: be used for the storer control function that the visit action of subtend primary memory is controlled; Be used to absorb the data buffering function etc. of the difference of the data rate between FSB17 and the pci bus 19.Primary memory 23 is reading the zone, writing the operating area of deal with data and the scratch pad memory that uses of the program carried out as CPU15.The drawing command that display chip 25 receives from CPU15 generates the image that should draw and writes VRAM (not shown), and reads from VRAM, sends to display 11 as draw data.In addition, identical with CPU15, as having formed the temperature sensor 53b that monitors display chip 25 in the embedded chip (die) at display chip 25.Also be connected from the signal of temperature sensor 53b output with the A/D input of embedded controller 47 described later.
On pci bus 19, be connected with I/O bridge 27, CardBus controller 29, miniPCI groove 35, Ethernet (registered trademark) controller 39 respectively.CardBus controller 29 is controllers of the data transmission of control pci bus 19 and PC card 33.On CardBus controller 29, connect CardBus groove 31, PC card 33 is installed on CardBus groove 31.On miniPCI groove 35, for example installed the miniPCI card 37 of wireless LAN module built-in.Ethernet controller 39 is to be used for controller that notebook PC10 is connected with LAN.
I/O bridge 27 possesses the bridging functionality of pci bus 19 and lpc bus 20.In addition, I/O bridge 27 has IDE (Integrated Device Electronics) interface function, connects hard disk drive (HDD) 43 and optical drive 45 (CD driver, DVD driver etc.).In addition, on I/O bridge 27, be connected with USB connector 41.On lpc bus 20, be connected with embedded controller 47, the quick ROM57 of BIOS, I/O controller 59.On I/O controller 59, be connected with I/O connector 60.
Embedded controller 47 is the microcomputers that are made of CPU, ROM, RAM etc., also has multichannel A/D input terminal, D/A lead-out terminal and digital input and output terminal.On embedded controller 47,, be connected with cooling fan 49, temperature sensor 53a～53c and supply unit 55 via these input and output terminals.For the temperature that monitors each device is provided with temperature sensor 53 to each main device, can be used as the peripheral hardware type and be configured in, or in the chip of this device, form as embedded as near the device of monitored object.As mentioned above, monitor that the temperature sensor 53a of CPU15 and the temperature sensor 53b of supervision display chip 25 are embedded.In addition the temperature sensor 53c that device and casing inside are monitored is configured in as near each device of temperature monitoring object.
Embedded controller 47 can be controlled cooling fan 49 and supply unit 55 respectively according to the detected temperature value of temperature sensor 53a～53c.Control signal Be Controlled ON/OFF and rotating speed that cooling fan 49 sends according to embedded controller 47 suck extraneous air to casing 13, and discharge inner heat, in the air blast cooling mode notebook PC are cooled off thus.The control of the cooling fan 49 by embedded controller 47 and the frequency of operation and the Control of Voltage of CPU15 described later and display chip 25 are to carry out independently all.In addition, supply unit 55 contains AC adapter (not shown), battery (not shown), DC-DC converter and regulator (regulator).Be described in the back for DC-DC converter and regulator.
Fig. 3 is illustrated among the notebook PC10 of embodiment of the present invention, realizes the block scheme as the structure of the switching of the frequency of operation of the CPU15 of the heat generation device of thermal value controlling object and display chip 25 and voltage.DC-DC converter 61 is the direct current of assigned voltage with the power conversions that AC adapter or battery (all not shown) provide, and offers each device in the notebook PC10.The electric power that offers CPU15 from DC-DC converter 61 carries out pulse-length modulation by regulator 63a, offers CPU15 behind decision frequency of operation and voltage.Equally, the electric power that offers display chip 25 from DC-DC converter 61 carries out pulse-length modulation by regulator 63b, offers CPU15 behind decision frequency of operation and voltage.In addition, for example open 2003-88110 communique etc., the known technology that decides frequency of operation and voltage by pulse-length modulation according to the spy.
Embedded controller 47 passes through the frequency of operation of the CPU15 of regulator 63a decision and voltage are sent the control signal of specifying maximum operation frequency, can limit CPU15.In addition, embedded controller 47 passes through the frequency of operation of the display chip 25 of regulator 63b decision and voltage are sent the control signal of specifying maximum power frequency, can limit display chip 25.
And, read resistance 65a and 65b being connected with respectively between regulator 63a and the CPU15 and between regulator 63b and the display chip 25.The voltage of respectively reading resistance 65a and 65b two ends is transfused to the A/D input terminal of embedded controller 47, and thus, embedded controller 47 can be measured the current value that offers CPU15 and display chip 25 respectively independently.Voltage is the certain value by regulator 63a and 63b decision, therefore, if can measure current value then can grasp the power that consumes by CPU15 and display chip 25 in real time.And, from the temperature sensor 53a that monitors described CPU15 and monitor that the voltage of the temperature sensor 53b output of display chip 25 also is imported into the A/D input terminal of embedded controller 47, thus, embedded controller 47 can be distinguished the temperature of measuring CPU15 and display chip 25 independently.
Each device of notebook PC10 shown in more than constituting and the OS (operating system) that moves in this notebook PC and BIOS (Basic Input/Output System) are corresponding with ACPI and SpeedStep.OS is read out from HDD43, and in addition, BIOS is read out from the quick ROM57 of BIOS, moves in each CPU15.In BIOS, comprise the heat effect table that stores the threshold value of in program described later, using.On the other hand, the firmware (firmware) to each CPU15 and display chip 25 mensuration temperature and power consumption moves in embedded controller 47.For the temperature and the power consumption of embedded controller 47 detected CPU15 and display chip 25, carry out calculating described later and judgement by BIOS, request limits CPU15 and display chip 25 to OS according to this result of determination BIOS.OS, limits via 47 couples of CPU15 of embedded controller and display chip 25 according to the standard method of ACPI according to the request from BIOS.
Promptly, if have PC with ACPI and the corresponding hardware of SpeedStep, OS and BIOS, then only need partly change the firmware of BIOS and embedded controller 47, and the present invention just can be implemented with low cost in the unit of reading resistance 65 such mensuration power consumption additional shown in Figure 3 to each CPU15 and display chip 25.In addition, the work of sharing by OS, BIOS and flush bonding processor is the project that operating personnel can select arbitrarily, and above-mentioned embodiment only is an example wherein.For example, can also be the embodiment of only measuring, calculating and judge by flush bonding processor.
In addition, Fig. 2 and Fig. 3 have simply described the main hardware configuration and the figure of annexation only for present embodiment is described.In order to constitute notebook PC10, use multiple arrangement in addition, but this is known to those skilled in the art, therefore at length do not narrate.Certainly, a plurality of square frames of recording and narrating among Fig. 2 and Fig. 3 as 1 integrated circuit, perhaps are divided into 1 square frame situation that a plurality of integrated circuit constitute all in those skilled in the art can optional scope, within the scope of the present invention on the contrary.
Fig. 4 represents the relevant program of the control with thermal value carried out by BIOS with process flow diagram.This program starts (frame 101) immediately when notebook PC10 starts working, and moves with the cycle about 4～5 seconds.Embedded controller 47 is measured the temperature (frame 103) of CPU15 by temperature sensor 53a built-in among the CPU15.And embedded controller 47 is measured the power consumption (frame 105) of CPU15 by reading the voltage at resistance 65a two ends.At this, judge whether the temperature of current CPU15 has surpassed threshold value T1 (frame 107).If the temperature of CPU15 has surpassed threshold value T1, then finish (frame 111) in program (frame 109) back that has started the described Thermal Caution of Fig. 5 Mode.If the temperature of CPU15 surpasses threshold value T1 in frame 105, then continue to carry out this program with the identical cycle afterwards.
Fig. 5 is a program of representing the ThermalCaution Mode that the control with thermal value carried out by BIOS is relevant with the process flow diagram form.This program is early than the program of Fig. 4, carries out (frame 201) with the cycle about 1 second.Mensuration (frame 205) about the temperature (frame 203) of CPU15 and power consumption is identical with the program of Fig. 4.But, calculate x moving average second according to the power consumption that is measured to.Here, x moving average second of at first judging power consumption whether continuously y1 time less than Z1 (frame 207).Z1 is the threshold value that is used to judge whether into low-power consumption.This judgement is to judge whether CPU15 has continued the above lower state of power consumption of certain hour.If continued the above lower state of power consumption of certain hour, then thermal value is less, and temperature does not rise, and therefore removes the unrestricted model described later (frame 209) of CPU15 and display chip 25, finish the program (frame 210) of Thermal Caution Mode, return the program (frame 249) of Fig. 4.
Here, will limit the state of CPU15, promptly the state that maximum operation frequency is set at the value that is lower than the highest frequency that this CPU can work calls unrestricted model.The what is called modal representation that lifts restrictions makes maximum operation frequency turn back to the highest frequency that this CPU can work.And, in several grades～tens grades the maximum operation frequency of in this CPU, preparing, maximum operation frequency is called 1 grade of restriction of increase from the value that currency is set at next stage, maximum operation frequency is called 1 grade of restriction of releasing from the value that currency is set at upper level.
In frame 207, when judging CPU15 and do not have the lower state of power consumption more than the certain time, judge whether CPU15 is current unrestricted model (frame 211).Whether if not current unrestricted model, then judging needs to make CPU15 become unrestricted model.The condition of judging has surpassed threshold value T2 (frame 213) for the temperature of this CPU, and x moving average second of power consumption surpasses Z2 (frame 215) continuous y2 time.Here, T2＞T1, Z2＞Z1.Under the situation that the condition both of temperature and power consumption is satisfied, power consumption height, state continuance that thermal value is big more than the certain hour, satisfied the condition of the temperature rising of CPU15, therefore made CPU15 become unrestricted model (frame 217), increase by 1 grade of restriction (frame 223).At this moment, current temperature is stored (frame 225) as variable T3, and carry out this program with identical cycle continuation.When not satisfying for one in temperature and the power consumption condition or two, judging does not need to make CPU15 become unrestricted model, carries out this program with identical cycle continuation.
When in frame 211, judging that CPU15 is current unrestricted model, judge and compare that the temperature of this current CPU is to rise by (frame 227) with the temperature T 3 of last this CPU of cycle, (frame 229) still descends.If temperature descends, then this CPU or display chip 25 are removed 1 grade of restriction (frame 231), and current temperature is stored (frame 225) as variable T3, carry out this program with identical cycle continuation.If temperature rises, at first judging whether to increase by 1 grade of restriction (frame 219) in this CPU, if possible then increases by 1 grade of restriction (frame 223), and current temperature is stored (frame 225) as variable T3, carries out this program with identical cycle continuation.In addition, the Current Temperatures as variable T3 storage used in following one-period.Handle by this, when in CPU15, only increasing the not enough so that temperature of this CPU of 1 grade of restriction and descend, can increase restriction repeatedly till the temperature of this CPU descends.
In frame 219, become minimum in the probable value of this CPU in the current maximum operation frequency of judging CPU15, can't on this, increase again under the situation of restriction, judging whether to increase by 1 grade of restriction (frame 241) to display chip 25.Can in this display chip, increase by 1 grade of restriction if be judged as, then increase by 1 grade of restriction (frame 243), Current Temperatures is stored (frame 245) as variable T3, and carry out this program with identical cycle continuation.In addition, the parameter that sets in above flow process is for example measured the threshold value etc. of number second, time and power consumption of interval, the moving average of temperature and power consumption, and those skilled in the art can set value arbitrarily according to experiment or experience.
As mentioned above, because can in CPU15 and display chip 25, carry out the mensuration of power consumption independently, so can in this CPU and this display chip, judge whether satisfied the condition that temperature rises, the processing that can also increase restriction respectively independently or lift restrictions respectively independently.But in fact, the power consumption height of CPU15, the state low in energy consumption of display chip 25 are comparatively common, relative therewith, and the power consumption height of display chip 25, the state low in energy consumption of CPU15 are comparatively rare.Therefore, in the present embodiment,, then at first make CPU15 preferentially become unrestricted model, when the restriction by CPU15 only can not suppress temperature and rises, make display chip 25 become unrestricted model if the temperature of CPU15 rises.When in frame 209, removing the unrestricted model of CPU15, also remove the unrestricted model of display chip 25 simultaneously.
In frame 241, even be the minimum in this display chip probable value being judged as the current maximum operation frequencies of display chip 25, can't on this, increase restriction, but the temperature of CPU15 rises under the still non-stop situation, might take place in this device or cooling fan 49 etc. that certain is unusual, therefore carrying out abnormality processing (frame 247) comes termination routine (frame 249).Abnormality processing is following processing: show alarm on the display 11 of notebook PC10, by the adjusting as known technology, the maximum operation frequency of CPU is suppressed to be peaked about 1/3rd; Or be kept at the OS of current operation among this notebook PC and the data of application software, close the power supply of this notebook PC etc. then.
Fig. 6 is illustrated in to be equipped with among the notebook PC of CPU that maximum operation frequency is 1.60GHz, maximum operation frequency is fixed as 1.60GHz, the chart of the variation of temperature when not controlling ground operative norm scrutiny program, CPU and display chip and power consumption for thermal value.This benchmark is carried out the processing that hypothesis is used the PC in the general office in PC, be the program that the performance of PC must be able to be broken up.
According to the chart of Fig. 6, the temperature 301 of CPU and the temperature 303 of display chip all rise to about 62 degree Celsius, and these temperature roughly rise and descend in the identical moment.But wherein the value of the power consumption 305 of CPU is bigger as can be known, and change tempestuously, and relative therewith, the value of the power consumption 307 of display chip is less, and only changes a little.That is, the rising of the temperature of display chip mainly is that the heating of display chip self is less owing to the influence of CPU heating as can be known.In addition, when the state continuance higher to the power consumption of CPU more than to a certain degree moment 311a～311d and the temperature of CPU rise the moment, 313a～313d compared the time, a little lingeringly become the state of 313a from the state of 311a.More identical about 311b～311d and 313b～313d.On the other hand, when the higher state of CPU power consumption became the state that only takes place discretely, the temperature of CPU a little lingeringly descended since then.Afterwards, target is that temperature with CPU and display chip is suppressed at about 55 degree Celsius.
Fig. 7 and Fig. 8 are illustrated among the notebook PC identical with Fig. 6, the result who carries out the restriction of CPU by prior art.Employed program when Fig. 7 uses process flow diagram to be described in by prior art CPU to be limited.Compare with the program of describing among Fig. 5 of when being in Thermal Caution Mode, carrying out in the present embodiment, have following difference by BIOS.Do not carry out the mensuration of the power consumption of CPU and display chip in the prior art, therefore also do not use power consumption to judge certainly.In addition, mxm. and the minimum two-stage of in the unrestricted model of CPU, having only maximum operation frequency.And, do not make display chip become unrestricted model yet.The temperature (frame 201 '～203 ') of CPU is measured in the beginning back, if the temperature that is measured to is less than temperature T 1 (frame 207 ') then the pattern that lifts restrictions (frame 209 ') finishes ThermalCaution Mode (frame 210 ', 249 ') be unrestricted model (minimum of maximum operation frequency) (frame 217 '), if exceed temperature T 2 (frame 213 ') then make CPU.That is, do not use power consumption here, only judge the action that CPU is limited by temperature.Here T2=Celsius 5 spends.In addition, the program of moving when not being ThermalCaution Mode is identical with Fig. 4.
Fig. 8 is the control that is illustrated in the thermal value of the prior art shown in Figure 7 of application among the notebook PC identical with Fig. 6, the chart of the variation of the variation of the CPU when having carried out the benchmark identical with Fig. 6 and the temperature of display chip and power consumption and the maximum operation frequency of CPU.According to the temperature shown in Fig. 8 (A) and the variation of power consumption, reached temperature 403 with the temperature 401 of CPU and display chip and be suppressed at target about 55 degree Celsius.In addition, the power consumption 405 of CPU is compared with power consumption 305 shown in Figure 6, and change has been carried out inhibition.In addition, the less point of the power consumption 407 of display chip change is identical with power consumption 307 shown in Figure 6.But, according to the variation 409 of the maximum operation frequency of the CPU shown in Fig. 8 (B), the time less of under the situation of the mxm. 1.60GHz of maximum operation frequency, working, the time of working below the maximum operation frequency 1.33GHz below it is more.
Fig. 9 is the control that is illustrated in the CPU thermal value of the present embodiment shown in Figure 5 of application among the notebook PC identical with Fig. 6, the chart of the variation of the variation of the CPU when carrying out the benchmark identical with Fig. 6 and the temperature of display chip and power consumption and the maximum operation frequency of CPU.In ThermalCaution Mode, by temperature and the power consumption of measuring CPU and display chip in 1 second at interval.Surpass 55 degree Celsius in temperature, and average continuous three moment above 8W of moving averages in 2 seconds of CPU power consumption, this CPU begins the work under the unrestricted model.That is, be T2=55 degree Celsius, x=2 second, y2=3 time (6 seconds), Z2=8W in Fig. 5.According to the temperature shown in Fig. 9 (A) and the variation of power consumption, roughly reached temperature 503 with the temperature 501 of CPU and display chip and be suppressed at target about 55 degree Celsius.In addition, about the power consumption 505 of CPU and the power consumption 507 of display chip, also similar with the tendency shown in Fig. 8 (A).But according to the variation 509 of the maximum operation frequency of the CPU shown in Fig. 9 (B), the time of working under the situation of the mxm. 1.60GHz of maximum operation frequency is compared elongated with the situation of the prior art shown in Fig. 8 (B).On the other hand, maximum operation frequency time of working below 1.33GHz is compared with Fig. 8 (B) and becomes shorter.
Figure 10 represents table by the comparison of carrying out the performance that described benchmark obtains respectively for the situation (Fig. 9) of situation about maximum operation frequency not being controlled (Fig. 6), the situation of only maximum operation frequency being controlled according to the temperature of prior art (Fig. 8) and present embodiment.In the figure, for two-dimensional graphics (2D), three-dimensional drawing (3D) and web page browsing score separately, these are carried out score (comprehensively) after comprehensive, the temperature of time that CPU works under each maximum operation frequency (%) and CPU is represented.Certainly, the fast more score of execution speed is high more.Be expressed as in Figure 10 under the situation about not controlling for maximum operation frequency of (A) (Fig. 6), the maximum operation frequency of CPU is fixed on the 1.60GHz of mxm., and therefore natural score is higher.But the temperature that does not suppress CPU and display chip as mentioned above rises.
On the other hand, in to Figure 10, be expressed as the situation (Fig. 8) of only carrying out the control of CPU maximum operation frequency of (B) according to the temperature of prior art, with the carrying out that is expressed as (C) situation of control of CPU maximum operation frequency of present embodiment when comparing, can reach as mentioned above temperature with CPU and display chip and be suppressed at target about 55 degree Celsius, these 55 degree Celsius are the standards of temperature of casing of can packing into.But, and only judge whether the prior art that CPU limits is compared according to temperature, judge whether that according to temperature and power consumption the present embodiment that CPU is limited can confirm significantly that score improves.Particularly the 2D score in expression two-dimensional graphics processing power has improved 5 fens, has improved 7 fens in the 3D score of representing the three-dimensional drawing processing power.In addition, can confirm that CPU carries out the time increase by 5% of work under the mxm. 1.60GHz of maximum operation frequency.According to above the present invention as can be known compared with prior art, the effect of inhibition heat generation device performance decline is obvious.
As mentioned above, heat generation device for PC inside, the present invention suppresses its performance and descends, and the effect that suppresses its temperature rising is obvious, therefore being beneficial to especially provides a kind of higher CPU and the display chip of TDP is installed, low price and high performance notebook PC in the relatively poor casing of heat-sinking capability.Certainly be not notebook PC, the present invention helps having desktop PC, dull and stereotyped PC, the PDA etc. that save the spatial mode casing too.In addition,, except CPU and display chip, estimate needing to occur the device of control thermal value in the future, also can be suitable for for such device control method of the present invention along with the improvement of the various devices that constitute PC.
So far, describe the present invention by specific embodiment shown in the drawings, but the present invention is not only limited to embodiment shown in the drawings, as long as realize effect of the present invention, any known structure at present can adopt.
[the use possibility on the industry]
Can be for the electronic equipment of the heat generation device that internal processor has been installed.
Claims (12)
1. the control method of a thermal value, it is that the method that the computing machine of the variable processor of maximum power dissipation value is controlled the thermal value of described processor is installed, and it is characterized in that having:
Make the step of described processor work;
Measure the step of the power consumption number of described processor termly;
Measure the step of the temperature value of described processor; And
Surpass the threshold value of regulation in the value of the set of a plurality of described power consumption numbers of representative, and described temperature value reduces the maximum power dissipation value of described processor when having surpassed the threshold value of regulation.
2. the control method of a thermal value, it is that the method that the computing machine that carries out the processor of work under can the some frequencies in a plurality of maximum operation frequencies is controlled the thermal value of described processor is installed, and it is characterized in that having:
The step that described processor is worked under first maximum operation frequency;
Measure the typical value of described power consumption of processing unit time per unit, calculate the step of the moving average of this typical value continuously;
Measure the step of the temperature value of described processor;
The frequency control setting power value of described processor and the step of frequency control set temperature value are provided; And
Surpass described frequency control setting power value at the continuous stipulated number of described moving average, and when described temperature value surpasses described frequency control set temperature value, the maximum operation frequency of described processor is reduced to second maximum operation frequency that is lower than first maximum operation frequency.
3. the control method of thermal value according to claim 2 is characterized in that,
The typical value of described time per unit is the mean value of the value that the current value that is input to described processor is sampled of number of times in accordance with regulations.
4. heat output controling method according to claim 2 is characterized in that having:
The step that the temperature value of the described processor the when maximum operation frequency of described processor is reduced to second maximum operation frequency is stored as first temperature value;
After the maximum operation frequency with described processor is reduced to second maximum operation frequency, the step that the temperature value and described first temperature value of described processor compared;
When the temperature value of judging described processor is higher than described first temperature value, the maximum operation frequency of described processor is reduced to the 3rd maximum operation frequency that is lower than second maximum operation frequency.
5. the control method of thermal value according to claim 2 is characterized in that, has:
The step that makes other processors of working under can the some frequencies in a plurality of maximum operation frequencies carry out work;
After the maximum operation frequency of the described processor that maximum operation frequency is lowered is reduced to boundary, reduce the maximum operation frequency of described other processors.
6. the control method of thermal value according to claim 2 is characterized in that, when described temperature value has surpassed the temperature value of the regulation lower than described frequency control set temperature value, shortens the described unit interval.
7. the control method of thermal value according to claim 2 is characterized in that, has:
The step of the frequency control releasing performance number of described processor is provided;
When the continuous stipulated number of described moving average is removed performance number less than described frequency control, described processor is worked under the highest maximum operation frequency.
8. computing machine is characterized in that having:
The processor of working under can the some frequencies in a plurality of maximum operation frequencies;
Change the frequency control portion of the maximum operation frequency of described processor;
Measure the temperature sensor of the temperature of described processor; And
Control part, it possesses the heat effect table of having stored frequency control setting power value and frequency control set temperature value, the typical value of measuring the time per unit of described power consumption of processing unit is calculated the moving average of this typical value continuously, surpass described frequency control setting power value at the continuous stipulated number of described moving average, and when the temperature value of described processor surpasses described frequency control set temperature value, reduce the maximum operation frequency of described processor.
9. computing machine according to claim 8 is characterized in that, described processor is a display chip.
10. computing machine according to claim 8 is characterized in that, described temperature sensor is packed in the chip of described processor integratedly.
11. computing machine according to claim 8 is characterized in that,
Have the cooling fan of the casing of the described computing machine of cooling, described control part is controlled the work of described cooling fan independently according to the temperature value of described temperature sensor according to the maximum operation frequency of described processor.
12. a computing machine is characterized in that having:
The treatment state power consumption of corresponding informance changes, and can carry out the electronic unit of the setting of maximum power dissipation;
Measure the temperature sensor of the temperature of described electronic unit;
Control part, it possesses the heat effect table of having stored power consumption control setting power value and power consumption control set temperature value, the typical value of measuring the time per unit of described electronic unit power consumption is calculated the moving average of this typical value continuously, surpass described power consumption control setting power value at the continuous stipulated number of described moving average, and when the temperature value of described electronic unit surpasses described power consumption control set temperature value, reduce the maximum power dissipation of described electronic unit.
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| JP2006-055688 | 2006-03-02 | ||
| JP2006055688A JP2007233782A (en) | 2006-03-02 | 2006-03-02 | Control method for heating value, and computer |
| JP2006055688 | 2006-03-02 |
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