CN101010758A - 叠层型电子部件的制造方法 - Google Patents

叠层型电子部件的制造方法 Download PDF

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Publication number
CN101010758A
CN101010758A CNA2005800292278A CN200580029227A CN101010758A CN 101010758 A CN101010758 A CN 101010758A CN A2005800292278 A CNA2005800292278 A CN A2005800292278A CN 200580029227 A CN200580029227 A CN 200580029227A CN 101010758 A CN101010758 A CN 101010758A
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CN
China
Prior art keywords
mentioned
electrode layer
raw cook
layer
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005800292278A
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English (en)
Chinese (zh)
Inventor
佐藤茂树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of CN101010758A publication Critical patent/CN101010758A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CNA2005800292278A 2004-06-28 2005-06-24 叠层型电子部件的制造方法 Pending CN101010758A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004190242 2004-06-28
JP190242/2004 2004-06-28

Publications (1)

Publication Number Publication Date
CN101010758A true CN101010758A (zh) 2007-08-01

Family

ID=35781808

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005800292278A Pending CN101010758A (zh) 2004-06-28 2005-06-24 叠层型电子部件的制造方法

Country Status (5)

Country Link
US (1) US20080053593A1 (fr)
JP (1) JP4354993B2 (fr)
CN (1) CN101010758A (fr)
TW (1) TWI260030B (fr)
WO (1) WO2006001358A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103107110A (zh) * 2011-11-10 2013-05-15 北大方正集团有限公司 一种芯片观察样品制作方法及系统
CN115196978A (zh) * 2022-08-09 2022-10-18 广东环波新材料有限责任公司 基于ltcc基片等静压叠层的陶瓷制备方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100755231B1 (ko) * 2003-03-31 2007-09-04 티디케이가부시기가이샤 적층 세라믹 전자부품의 제조방법
KR100853278B1 (ko) * 2003-09-30 2008-08-20 티디케이가부시기가이샤 적층 세라믹 전자 부품용 유전체 페이스트의 제조 방법
JP4487542B2 (ja) * 2003-11-27 2010-06-23 Ｔｄｋ株式会社 積層セラミック電子部品用の導電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法
JP4662298B2 (ja) * 2003-12-15 2011-03-30 Ｔｄｋ株式会社 積層セラミック電子部品のスペーサ層用の誘電体ペースト
JP4487596B2 (ja) * 2004-02-27 2010-06-23 Ｔｄｋ株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4487595B2 (ja) * 2004-02-27 2010-06-23 Ｔｄｋ株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4412013B2 (ja) * 2004-03-16 2010-02-10 Ｔｄｋ株式会社 積層セラミック電子部品用の誘電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05217797A (ja) * 1992-02-03 1993-08-27 Nitto Denko Corp 積層コンデンサー部品の製造方法
EP0732735B1 (fr) * 1995-03-16 2005-12-14 Murata Manufacturing Co., Ltd. Dispositif céramique et méthode de fabrication associée
TW512653B (en) * 1999-11-26 2002-12-01 Ibiden Co Ltd Multilayer circuit board and semiconductor device
JP2002127117A (ja) * 2000-10-30 2002-05-08 Kyocera Corp グリーンシートの製法および電子部品の製法
TW543052B (en) * 2001-03-05 2003-07-21 Nitto Denko Corp Manufacturing method of ceramic green sheet, manufacturing method of multilayer ceramic electronic components, and carrier sheet for ceramic green sheets
DE10113361A1 (de) * 2001-03-20 2002-09-26 Andreas Roosen Verfahren zur Verbindung keramischer Grünkörper unter Verwendung eines Transfertapes und Überführung dieser verklebten Grünkörper in einen Keramikkörper
US7014725B2 (en) * 2001-10-25 2006-03-21 Matsushita Electric Industrial Co., Ltd. Multilayer ceramic electronic component manufacturing method including a sintered adhesive layer with a resin and inorganic powder
JP4035988B2 (ja) * 2001-12-06 2008-01-23 株式会社デンソー セラミック積層体及びその製造方法
JP4305808B2 (ja) * 2002-07-03 2009-07-29 太陽誘電株式会社 積層コンデンサ
JP4261854B2 (ja) * 2002-09-18 2009-04-30 日本特殊陶業株式会社 積層セラミックコンデンサ製造方法及びセラミックシート積層装置
JP4116854B2 (ja) * 2002-09-30 2008-07-09 京セラ株式会社 セラミック積層体の製造方法
JP2004179348A (ja) * 2002-11-26 2004-06-24 Kyocera Corp セラミック積層体の製法
US7491283B2 (en) * 2002-12-27 2009-02-17 Tdk Corporation Production method of multilayer electronic device
KR20060058675A (ko) * 2003-07-09 2006-05-30 티디케이가부시기가이샤 적층세라믹 부품 및 그 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103107110A (zh) * 2011-11-10 2013-05-15 北大方正集团有限公司 一种芯片观察样品制作方法及系统
CN115196978A (zh) * 2022-08-09 2022-10-18 广东环波新材料有限责任公司 基于ltcc基片等静压叠层的陶瓷制备方法

Also Published As

Publication number Publication date
TWI260030B (en) 2006-08-11
JPWO2006001358A1 (ja) 2008-04-17
TW200606968A (en) 2006-02-16
JP4354993B2 (ja) 2009-10-28
WO2006001358A1 (fr) 2006-01-05
US20080053593A1 (en) 2008-03-06

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Open date: 20070801