CN100586256C - Ceramic substrate, electronic apparatus, and method for producing ceramic substrate - Google Patents
Ceramic substrate, electronic apparatus, and method for producing ceramic substrate Download PDFInfo
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- CN100586256C CN100586256C CN200680001364A CN200680001364A CN100586256C CN 100586256 C CN100586256 C CN 100586256C CN 200680001364 A CN200680001364 A CN 200680001364A CN 200680001364 A CN200680001364 A CN 200680001364A CN 100586256 C CN100586256 C CN 100586256C
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- ceramic substrate
- glassy layer
- glass material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Abstract
This invention provides a highly reliable ceramic substrate, which is free from heat cycle-derived stress concentration on an electric conduction part and is provided with a glass layer, for covering a part of the electric conduction part, having excellent adhesion to a ceramic substrate body and plating resistance, and an electronic device and a process for producing a ceramic substrate. A glass layer is provided so as to astride a part from a part of an electric conduction part provided on one main face of the ceramic substrate body to one main face of the ceramic substrate body. The glass layer is a glass layer (13) having a double layer structure of a first glass layer (11) formed of a first glass material and a second glass layer (12) provided on the first glass layer and formed of a second glass material different from the first glass material constituting the first glass layer. The first glass material has better adhesion to the ceramic substrate body than the second glass material, and the second glass material has better plating resistance than the first glass material.
Description
Technical field
The present application relates to the manufacture method of ceramic substrate, electronic device and ceramic substrate, specifically, relate to the conductor portion that to form on the first type surface and be connected with terminal pad with installation on the installation base plate, by the manufacture method of ceramic substrate, electronic device and the ceramic substrate installed like this by scolding tin.
Background technology
Ceramic substrate constitutes the conductor portion that forms on the first type surface with ceramic substrate 50 and is terminal pad electrode 51 and be connected with terminal pad 54 with installation on the installation base plate 53 by scolding tin 52, by installing so usually as shown in Figure 10.
But, as shown in figure 10, the size of the terminal pad electrode 51 of ceramic substrate 50 and the installation of installation base plate 53 are with under the identical in fact situation of the size of terminal pad 54, for example when product carries out thermal cycling test, the stress that produces because of the difference of ceramic substrate 50 and the thermal coefficient of expansion of installation base plate 53, concentrate on the end of terminal pad electrode 51, the problem of existence is that ceramic substrate 50 will produce be full of cracks or crackle C under the situation about having.
Therefore, a kind of method is proposed as shown in figure 11, this method utilize glassy layer 55 cover terminal pad electrodes 51 around, stress in the time of can relaxing thermal cycling test is concentrated, prevent from ceramic substrate 50 is produced be full of cracks or crackle, or prevent that terminal pad electrode 51 from producing mobile bad etc. (with reference to patent documentation 1).
In addition, in patent documentation 1, as glassy layer 55 employed glass materials, according to improving the close-burning viewpoint of glassy layer 55 with ceramic substrate 50, expression wishes to use the glass material that mixes with the ceramic material (media ceramic layer) with formation ceramic substrate 50 glass material as main component.
But, manufacture method according to common ceramic substrate, because after forming glassy layer 55, form the plating Au film etc. that prevents that scolding tin from biting the plating Ni film of usefulness, improving the plating Sn film that the scolding tin tack uses and improve usefulness such as connection reliability on the surface of terminal pad electrode 51, apply various coating, therefore the problem that exists is to depend on the kind of glass material for this reason, the anti-plating of some glassy layer 55 is not enough easily, because of bath corrosion causes producing pin hole.
Have again, in viewpoint according to the cementability that improves glassy layer 55 and ceramic substrate 50, when using with the glass material that mixes with the ceramic layer (dielectric layer) that constitutes ceramic substrate 50 to the glass material of main component to glassy layer 55, owing to the glass that mixes with ceramic layer is normally paid attention to the glass that electrical characteristics are selected, particularly do not consider anti-plating etc., therefore the problem that exists is, the anti-plating of glassy layer 55 is not enough easily, because of the corrosion of plating bath is easy to generate serious problems.
Patent documentation 1: the spy opens the 2002-231860 communique
Summary of the invention
The present application is in order to address the above problem, its purpose is to provide a kind of ceramic substrate, uses the manufacture method of the electronic device and the aforementioned ceramic substrate of this ceramic substrate, this ceramic substrate is owing to cover the part of conductor portion with glass material, therefore the stress that conductor portion produces is not concentrated because of thermal cycle, and the tack and the anti-plating of the glassy layer of the part of covering conductor portion and ceramic substrate body are good, the reliability height.
In order to address the above problem, the ceramic substrate of the application the 1st aspect has:
The ceramic substrate body; And
The part of the conductor portion that forms from a first type surface of aforementioned ceramic substrate body, cross over the aforementioned glassy layer that first type surface disposes like that of aforementioned ceramic substrate body,
Aforementioned glassy layer has:
Cross over the 1st glassy layer that the aforementioned first type surface of aforementioned ceramic substrate body disposes like that, that constitute by the 1st glass material from the part of aforementioned conductor portion; And
The 2nd glassy layer that on aforementioned the 1st glassy layer, forms, constitute by the 2nd glass material different with the 1st glass material that constitutes aforementioned the 1st glassy layer,
Aforementioned the 1st glass material is compared with aforementioned the 2nd glass material, is the material good with the tack of aforementioned ceramic substrate body, and aforementioned the 2nd glass material is compared with aforementioned the 1st glass material, is the good material of anti-plating.
In addition, the ceramic substrate of the 2nd aspect is in the formation of the invention aspect the 1st,
The pottery that constitutes aforementioned ceramic substrate body contains glass, and
Aforementioned the 1st glass material be with the pottery that constitutes aforementioned ceramic substrate body in the glass that contains for a series of glass materials,
Aforementioned the 2nd glass material is compared with aforementioned the 1st glass material simultaneously, is to be difficult to dissolve the glass material of separating out in plating bath.
In addition, the ceramic substrate of the 3rd aspect is in the formation of the invention aspect the 1st or 2, forms aforementioned glassy layer, makes it cover the periphery of the aforementioned conductor portion that forms on the first type surface of aforementioned ceramic substrate body.
In addition, the ceramic substrate of the 4th aspect is in the formation of each invention aspect the 1st～3, forms aforementioned the 2nd glassy layer, makes it cover whole aforementioned the 1st glassy layer.
In addition, the ceramic substrate of the 5th aspect is in the formation of each invention aspect the 1st～4, and aforementioned the 1st glass material is to contain the material that borosilicic acid is a glass, aforementioned the 2nd glass material be contain with Si, B, and Zn be the material of the glass of main component.
In addition, the ceramic substrate of the 6th aspect is in the formation of each invention aspect the 1st～5, forms plated film on the surface of aforementioned conductor portion.
In addition, the electronic device of the application aspect 7 is connected by scolding tin the aforementioned conductor portion of each described ceramic substrate of the 1st～6 aspect with installation base plate.
In addition, the manufacture method of the ceramic substrate of the application the 8th aspect has following operation:
Form the operation of the ceramic duplexer that does not burn till, this pottery duplexer has such structure, promptly on a first type surface of the duplexer that a plurality of ceramic green sheets are stacked, form conductor portion, an aforementioned first type surface of crossing over aforementioned duplexer from the part of aforementioned conductor portion forms the 1st glassy layer that is made of the 1st glass material like that, on aforementioned the 1st glassy layer, the 2nd glassy layer that formation is made of the 2nd glass material different with aforementioned the 1st glass material that constitutes aforementioned the 1st glassy layer, aforementioned the 1st glass material will be made of by good material than aforementioned the 2nd glass material the tack with aforementioned ceramic substrate body, and aforementioned the 2nd glass material will be made of by good material than aforementioned the 1st glass material anti-plating; And
The operation that the aforementioned ceramic duplexer that does not burn till is burnt till.
In addition, the manufacture method of the ceramic substrate of the 9th aspect is in the formation of the invention aspect the 8th, forms the 1st glassy layer, makes it cover the periphery of aforementioned conductor portion.
In addition, the manufacture method of the ceramic substrate of the 10th aspect is in the formation of the invention aspect the 8th or 9, forms aforementioned the 2nd glassy layer, makes it cover whole aforementioned the 1st glassy layer.
In addition, the manufacture method of the ceramic substrate of the 11st aspect, be in the formation of each invention aspect the 8th to 10, in burning till the operation of aforementioned ceramic duplexer, on at least one first type surface of aforementioned ceramic duplexer, configuration is by suppressing to use raw cook burning till under the temperature of aforementioned ceramic duplexer in fact the contraction that the ceramic material of sintering not constitutes, and carries out burning till of aforementioned ceramic duplexer under this state.
In addition, the manufacture method of the ceramic substrate of the 12nd aspect is in the formation of each invention aspect the 8th to 11, after burning till the operation of aforementioned ceramic duplexer, has the operation that forms plated film on the surface of aforementioned conductor portion.
The ceramic substrate of the application the 1st aspect, because the part of the conductor portion that forms from a first type surface of ceramic substrate body, a first type surface crossing over the ceramic substrate body dispose glassy layer like that, constitute simultaneously like this glassy layer, have: cross over the 1st glassy layer that a first type surface of ceramic substrate body disposes like that, that constitute by the 1st glass material from the part of conductor portion; And on the 1st glassy layer, form, the 2nd glassy layer that constitutes by the 2nd glass material different with the 1st glass material that constitutes the 1st glassy layer, the 1st glass material is compared with the 2nd glass material, be the material good with the tack of ceramic substrate body, the 2nd glass material is compared with the 1st glass material, it is the good material of anti-plating, therefore for example, as the 1st glassy layer, form the good glassy layer of tack with the ceramic substrate body, on the 1st glassy layer, as the 2nd glassy layer, forming anti-plating will good glassy layer than the 1st glassy layer, by like this, can obtain a kind of ceramic substrate really, this ceramic substrate is owing to a part that covers conductor portion with glass material, and is therefore unconcentrated to the stress that conductor portion produces because of thermal cycle, and the tack and the anti-plating of the glassy layer of the part of covering conductor portion and ceramic substrate body are good, the reliability height.
In addition, as the ceramic substrate of the 2nd aspect, be in the formation of the invention aspect the 1st, when the pottery that constitutes the ceramic substrate body contains glass, as the 1st glass material, be that the glass that contains in the pottery of employing and formation ceramic substrate body is with a series of glass materials, as the 2nd glass material, be to adopt when being difficult to dissolve the glass material of separating out in plating bath, the tack and the anti-plating that can obtain covering glassy layer that the part of conductor portion disposes like that and ceramic substrate body more really are good, the ceramic substrate that reliability is high can make the present application more effective.
In addition, as the 2nd glass material, promptly be difficult to dissolve the glass material of separating out in plating bath, can adopt the content of Zn many, for example contain the glass material of Zn with the ratio more than the 10 weight %; The glass material that contains the above Sr of 7 weight %; Perhaps Zn-Al-Ba-Si-Sr-Zr-Ca-Mg-Ti is a glass.Anti-plating during the special property plating bath in use of these glass materials is good.
In addition, as the ceramic substrate of the 3rd aspect, be in the formation of the invention aspect the 1st or 2, when the periphery that makes glassy layer cover the conductor portion that forms on the first type surface of ceramic substrate body forms like that, utilize glassy layer to cover the stress periphery of concentrated conductor portion especially easily, can suppress effectively, prevent that stress is concentrated, can make the present application effective.
In addition, as the ceramic substrate of the 4th aspect, be in the formation of each invention aspect the 1st to 3, when making the 2nd glassy layer cover whole the 1st glassy layer to form like that, can be formed in the structure that surface the 2nd good glassy layer of only anti-plating exposes, can access no corrosion of coating, ceramic substrate that reliability is higher.
In addition, as the ceramic substrate of the 5th aspect, be in the formation of each invention aspect the 1st to 4, as the 1st glass material, be to adopt to contain the material that borosilicic acid is a glass, make the 2nd glass material, be adopt contain with Si, B, and Zn be the material of the glass of main component, can access tack and the ceramic substrate better glassy layer of anti-plating, that reliability is higher that has with the ceramic substrate body by such.
In addition, as the ceramic substrate of the 6th aspect, be in the formation of each invention aspect the 1st to 5, when the surface of adopting conductor portion forms the structure of plated film, for example owing to utilize plated film can improve characteristics such as weldability and reliability of electrical connection, therefore the ceramic substrate that can obtain having desirable characteristic more really is significant.
In addition, the electronic device of the application the 7th aspect, because the conductor portion of each described ceramic substrate of the 1st to 6 aspect is connected with installation base plate really by scolding tin, and utilize double-deck glassy layer to cover the part of the conductor portion of ceramic substrate, therefore good with the tack and the anti-plating of ceramic substrate body, so can access the high electronic device of the reliability of the ceramic substrate that installation reliability is high on installation base plate.
In addition, the manufacture method of the ceramic substrate of the application the 8th aspect, owing to have following operation: the operation that forms the ceramic duplexer that does not burn till, this pottery duplexer has such structure, promptly on a first type surface of the duplexer that a plurality of ceramic green sheets are stacked, form conductor portion, a first type surface crossing over duplexer from the part of conductor portion forms the 1st glassy layer that is made of the 1st glass material like that, on the 1st glassy layer, the 2nd glassy layer that formation is made of the 2nd glass material different with the 1st glass material that constitutes the 1st glassy layer, the 1st glass material will be made of by good material than the 2nd glass material the tack with the ceramic substrate body, and the 2nd glass material will be made of by good material than the 1st glass material anti-plating; And the ceramic duplexer that will the not burn till operation of burning till, therefore can be effectively and make a kind of ceramic substrate really, this ceramic substrate has: the ceramic substrate body; And the part of the conductor portion that forms from a first type surface of ceramic substrate body is crossed over a first type surface double-deck glassy layer that dispose like that, that have the 1st glassy layer and the 2nd glassy layer of ceramic substrate body, the glassy layer of the part of covering conductor portion and the tack and the anti-plating of ceramic substrate body are good, the reliability height.
In addition, utilize the manufacture method of the ceramic substrate of this application the 8th aspect, can make the ceramic substrate of the application the 1st to 6 aspect effectively.
In addition, as the manufacture method of the ceramic substrate of the 9th aspect, be in the formation of the invention aspect the 8th, when the periphery that covers conductor portion forms the 1st glassy layer like that, utilize glassy layer to cover the stress periphery of concentrated conductor portion especially easily, can suppress effectively, prevent that stress is concentrated, can make the present application effective.
In addition, as the manufacture method of the ceramic substrate of the 10th aspect, be in the formation of the invention aspect the 8th or 9, when whole the 1st glassy layer of covering forms the 2nd glassy layer like that, can be formed in the structure that surface only anti-plating 2nd glassy layer better than the 1st glassy layer exposes, can access no corrosion of coating, ceramic substrate that reliability is higher.
In addition, as the manufacture method of the ceramic substrate of the 11st aspect, be in the formation of each invention aspect the 8th～10, in the operation of Low fire ceramic duplexer, on at least one first type surface of ceramic duplexer, configuration by under the temperature of Low fire ceramic duplexer in fact not the contraction that constitutes of the ceramic material of sintering suppress to use raw cook, and under this state, carry out burning till of ceramic duplexer, at this moment in firing process, can suppress, prevent to shrink along the direction of the first type surface that is parallel to ceramic duplexer, simultaneously ceramic duplexer is burnt till the high ceramic substrate of reliability that can more certain manufacturing has desirable characteristic.
In addition, as the manufacture method of the ceramic substrate of the 12nd aspect, be in the formation of each invention aspect the 8th to 11, after the operation of Low fire ceramic duplexer, has the operation that forms plated film on the surface of conductor portion, at this moment for example owing to utilize plated film can improve characteristics such as weldability and reliability of electrical connection, the ceramic substrate that therefore can more certain manufacturing has desirable characteristic is significant.
Description of drawings
Figure 1 shows that relevant first type surface figure ceramic substrate, that be provided with conductor portion of an embodiment of the present application.
Fig. 2 (a) is depicted as the cutaway view that the conductor portion of the ceramic substrate that an embodiment of the present application is relevant and near part thereof are amplified, (b), (c) be depicted as the conductor portion of the ceramic substrate that other example is relevant and the cutaway view that near part is amplified thereof.
Figure 3 shows that the cutaway view of the formation of the ceramic substrate that the embodiment of the present application is relevant.
Figure 4 shows that the state diagram of using resin-encapsulated after installation surface on the relevant ceramic substrate of an embodiment of the present application is installed components and parts, with encapsulation.
Figure 5 shows that after installation surface installed components and parts, being installed in installation base plate with the ceramic substrate (circuit substrate) of the state of resin-encapsulated by scolding tin with encapsulation is state diagram on the epoxy resin base plate.
The ceramic substrate figure that Figure 6 shows that the mobile evaluation test of supply to use and make.
In the manufacturing process of Fig. 7 for the ceramic substrate of the present application, become the key diagram of method of the conductor portion of terminal pad electrode.
Fig. 8 (a) and (b), (c) are depicted as the key diagram of other method that forms conductor portion and glassy layer.
Fig. 9 (a) and (b), (c) are depicted as in the ceramic substrate of the present application, cover the aspect graph that is provided with of glassy layer that the part of conductor portion is provided with like that.
Figure 10 shows that the state diagram that the terminal pad electrode that will form is connected with terminal pad by the scolding tin and the installation of installation base plate on a first type surface of in the past ceramic substrate.
Figure 11 shows that the terminal pad electrode of other ceramic substrate in the past and near structure chart thereof.
Label declaration
1 ceramic substrate body
First type surface of 1a
Another first type surface of 1b
10 ceramic substrates
The 10a circuit substrate
The 10b ceramic substrate
11 the 1st glassy layers
12 the 2nd glassy layers
13 glassy layers
14 conductor portion (terminal pad electrode)
15 surface mount devices
16 surface mount devices
17 encapsulation resins
18 scolding tin
19 plated films
21 formation face inner wires
22 interlayers connect uses through hole
23 surface conductors
31 epoxy resin base plates
32 installation terminal pads
41a, 41b comb-type electrode
43 supports
Embodiment
Shown below is the embodiment of the present application, illustrates in greater detail the feature as the present application.
The manufacture method of the ceramic substrate of the present application at first, below is described.
[manufacturing of ceramic substrate]
(a) will mix SiO
2, Al
2O
3, B
2O
3, and the devitrified glass powder of CaO and alumina powder by etc. part by weight mix, obtain mixed-powder.
(b) for the mixed-powder of 100 weight portions that obtain thus, add the polyvinyl butyral resin of 15 weight portions, the isopropyl alcohol of 40 weight portions and the toluene (ト ロ one Le) of 20 weight portions, carry out mixing in 24 hours with ball mill, make slurry.
(c) skill in using a kitchen knife in cookery is scraped in utilization, and this slurry is wipeed off, makes the ceramic green sheet of thick 120 μ m.
(d) in addition, each layer for the ceramic green sheet of making in above-mentioned (c) operation, as required, carry out the formation processing that interlayer connects the through hole of usefulness, and this through hole is carried out the conductive paste filling, form the printing of the conductive paste of face inner wire simultaneously on the surface of ceramic green sheet, as thermal cycle evaluation substrate.
As to the conductive paste of above-mentioned through hole filling and the conductive paste in the face inner wire, all adopt by with the Ag powder of 83 weight portions, the phenyl propylene-glycol ethyl ether De Kesa ring ethanol of 15 weight portions (Japanese: テ キ サ ノ one Le) and the ethyl cellulose of 2 weight portions mix the conductive paste of making.But the conductive paste that the conductive paste and the face inner wire of through hole filling are used also can adopt different types of conductive paste.
In addition, the thickness of face inner wire forms 20 μ m.
(e) in addition, in order to form the conductor portion that becomes the terminal pad electrode, the ceramic green sheet that the top layer is used, as required, carry out the formation processing that interlayer connects the through hole of usefulness, and this through hole is carried out the conductive paste filling, printing forms the conductive paste that the conductor portion of terminal pad electrode is used from the teeth outwards afterwards.In addition, the conductive paste of using as conductor portion, adopt with above-mentioned (d) operation in the identical conductive paste of conductive paste that uses.
But, also can adopt with above-mentioned (d) operation in the different types of conductive paste of conductive paste that uses.
In addition, the conductive paste that the conductive paste and the face inner wire of through hole filling are used also can adopt different types of conductive paste.
In addition, conductor portion is not limited to use the situation of conductive paste formation, also can form with metal forming.
(f) afterwards, from the part of conductor portion, to cross over the ceramic green sheet of using on the top layer such, printing will form the glass thickener of thickener with the glass material of the glass material identical component that contains in the ceramic green sheet, form the 1st glassy layer.
In the present embodiment, the glass as mixing with formation ceramic substrate body pottery has mixed SiO owing to adopt
2, Al
2O
3, B
2O
3, and the devitrified glass of CaO, therefore the glass of using as the 1st glassy layer adopts the glass identical with this devitrified glass, i.e. employing in following ratio with SiO
2, Al
2O
3, B
2O
3, and the devitrified glass that mixes of CaO.In addition, the glassy phase ratio that the glass of the 1st glassy layer and the 2nd glassy layer described later are used is the glass good with the tack of ceramic substrate body.
SiO
2: 43 weight %
Al
2O
3: 8 weight %
B
2O
3: 6 weight %
CaO:43 weight %
Then, this glass powder 53.2 weight % are mixed the dibutyl carbitol of 30 weight portions and the ethyl cellulose of 15 weight portions with 100 weight portions that amount to of alumina powder 46.8 weight %, make the glass thickener that the 1st glassy layer is used.
In addition, the glass thickener as the 1st glassy layer is used also can replace the dibutyl carbitol, uses and mixes phenyl propylene-glycol ethyl ether De Kesa ring ethanol (Japanese: the glass thickener of making テ キ サ ノ one Le).
Then, print above-mentioned glass thickener, the thickness that forms after burning till is the 1st glassy layer of 8 μ m.
The thickness of the 1st glassy layer (thickness after burning till) is 5～10 μ m preferably usually.During less than 5 μ m,, become cellular at the thickness of the 1st glassy layer because the emptying aperture (pore) in the film increases, therefore bad.In addition,, then, become the reason that layer is peeled off owing to the step difference with conductor portion (electrode) increases if the thickness of the 1st glassy layer surpasses 10 μ m, therefore bad.
In addition, the glass material as the 1st glassy layer is used is adopting SiO
2-Al
2O
3-B
2O
3When-CaO is glass, preferably adopt the glass material of following ranges composition usually:
SiO
2: 28～44 weight %
Al
2O
3: 0～20 weight %
B
2O
3: 0～17.5 weight %
CaO:36～50 weight %
In addition, the glass material as the 1st glassy layer is used except above-mentioned glass material, also can adopt SiO
2-B
2O
3-BaO is glass, SiO
2-B
2O
3-K
2O
4Be glass etc.
(g) again on the 1st glassy layer, printing will be with SiO
2, Al
2O
3, ZnO is the glass thickener that the glass material of main component forms thickener, forms the 2nd glassy layer.
As the glass material that the 2nd glassy layer is used, preferably adopt the good glass material of anti-plating, for example adopt the glass material that contains the Zn more than 10%.
As the glass material that the 2nd glassy layer is used, be more preferably the glass material good with the tack of the 1st glassy layer.For example, when in the glass material that the 1st glassy layer is used, containing Ca, because Ca is dissolved in plating bath easily, therefore can not be used as the glass material that the 2nd glassy layer is used, but by adopting with Ca is to belong to element together but the Zn higher than the anti-plating of Ca, can form anti-plating good and also with the tack of the 1st glassy layer might as well the 2nd glassy layer.
In addition, in addition the glass material as the 2nd glassy layer is used, also can adopt the glass material that contains the Sr more than 7%.By Sr is taken in the glass crystal, can make the glass that is not easy to be dissolved in plating bath.In addition, can adopt Zn-Al-Ba-Si-Sr-Zr-Ca-Mg-Ti is glass etc.
In the present embodiment, as the glass thickener that the 2nd glassy layer is used, be to adopt with SiO
2, Al
2O
3, and ZnO press
SiO
2: 50 weight portions
Al
2O
3: 28 weight portions
The ZnO:22 weight portion
Mixed glass powder 79 weight %, phenyl propylene-glycol ethyl ether De Kesa ring ethanol (Japanese: テ キ サ ノ one Le) 5 weight %, and ethyl cellulose 16 weight % mix and the glass thickener made.
In addition, the glass thickener of the 2nd glassy layer is the glass thickener that can form the 2nd glassy layer that anti-plating will be good than above-mentioned the 1st glassy layer.
Then, print above-mentioned glass thickener, the thickness that forms after burning till is the 2nd glassy layer of 15 μ m.
In addition, the thickness of the 2nd glassy layer (thickness after burning till) 10～20 μ m preferably usually.During less than 10 μ m,, become cellular at the thickness of the 2nd glassy layer because the emptying aperture (pore) in the film increases, therefore bad.In addition, if the thickness of the 2nd glassy layer surpasses 20 μ m, then the problem of Cun Zaiing is, utilizing transfer printing described later to form under the situation of conductor portion, the 1st and the 2nd glassy layer, when printing forms the glass thickener that the 1st glassy layer uses on the 2nd glassy layer, cause oozing profit and increase, during conductive paste that perhaps the filling conductor portion is used after forming glassy layer, the filling deterioration of conductive paste etc.
In addition, the aggregate thickness of the 1st glassy layer and the 2nd glassy layer is preferably in the scope of 15～30 μ m.If the aggregate thickness of the 1st glassy layer and the 2nd glassy layer is less than 15 μ m, then owing to the emptying aperture in the glassy layer makes anti-environmental test deterioration, in addition, if surpass 30 μ m, owing to cause the autgmentability reduction of plated film or install bad, so bad.
(h) afterwards, will apply the ceramic green sheet appropriate combination of above-mentioned processing, carried out stackedly, after to form stacked number be 10 layers duplexer, compressed the ceramic duplexer that is not burnt till with pressure 50MPa, 60 ℃ of pressurizations of temperature.
(i) then, this ceramic duplexer that does not burn till is placed on the pallet of being made by alumina plate, after 3 hours, heated 1 hour for 900 ℃ with temperature, by making ceramic post sintering like this with 600 ℃ of heating of temperature.
In addition, when the ceramic duplexer that will not burn till burns till, in the operation that ceramic duplexer is burnt till, also can be on first type surface of ceramic duplexer or two first type surfaces, configuration by under the sintering temperature of the pottery that constitutes ceramic green sheet in fact not the contraction that constitutes of the ceramic material of sintering suppress to use ceramic green sheet, under such state, ceramic duplexer is burnt till.In this case, in firing process, can prevent from simultaneously ceramic duplexer to be burnt till along the contraction of the direction of the first type surface that is parallel to ceramic duplexer.
(j) afterwards, carry out the thick plating Ni of 5 μ m on the surface of the conductor portion that becomes the terminal pad electrode, carry out the thick plating Au of 0.4 μ m more thereon, by like this, obtain a kind of ceramic substrate, this ceramic substrate has the structure of the peripheral part of the conductor portion that becomes the terminal pad electrode of utilizing the double-deck glassy layer that comprises the 1st glassy layer and the 2nd glassy layer all to cover sandwich construction.
In addition, Figure 1 shows that first type surface figure ceramic substrate, that be provided with conductor portion who makes with said method, Fig. 2 (a) is depicted as the cutaway view with the conductor portion of present embodiment and near the amplification of part thereof.
In the present embodiment, shown in Fig. 1 and Fig. 2 (a), made a kind of ceramic substrate 10, this ceramic substrate 10 is at the periphery of a first type surface 1a of ceramic substrate body 1, disposes the conductor portion (terminal pad electrode) 14 that double-deck glassy layer 13 that a plurality of whole periphery utilizations are made of the 1st glassy layer 11 and the 2nd glassy layer 12 covers.
In addition, shown in Fig. 2 (a), the 2nd glassy layer 12 of the surface of conductor portion 14 and its periphery forms equal height, form such structure, for example can simultaneously compress conductor portion 14, one side forms the 1st and the 2nd glassy layer 11 and 12, and perhaps after forming the 1st and the 2nd glassy layer 11 and 12, coating forms the conductive paste of conductor portion 14 usefulness again.
In addition, the shape of conductor portion and near part thereof is not limited to above-mentioned structure, also can adopt the structure of following explanation.
For example, also can be shown in Fig. 2 (b), the surface of conductor portion 14 is formed on the 1st and the 2nd glassy layer 11 that is lower than its periphery and 12 position.
In addition, also can be shown in Fig. 2 (c), the almost whole face on the surface of the 2nd glassy layer 12 forms the surperficial identical height with conductor portion 14.
In addition, form plated film 19 on the surface of conductor portion 14, but in this case, preferably as Fig. 2 (a), (c) shown in, form the surface that is higher than the 2nd glassy layer 12 as if plated film 19, then can more certain assurance and the conducting of installation base plate.
In addition, in Fig. 2 (b),, also can form the plated film that reaches with the surperficial equal height of the 2nd glassy layer 12, in addition, also can form height above it though plated film 19 is formed on the position on the surface that is lower than the 2nd glassy layer 12.
In addition, before forming plated film 19,, also can be coated with conductive paste again in order to form the conductor portion 14 (with reference to Fig. 2 (c)) with the surperficial equal height of the 2nd glassy layer 12, form thicker conductor portion 14 after, shown in Fig. 2 (c), form plated film 19 like that.
In addition, Figure 3 shows that the cutaway view of the structure of the ceramic substrate made from above-mentioned method.As shown in Figure 3, the structure that this ceramic substrate 10 has is, have in the inside of ceramic substrate body 1 circuit form usefulness face inner wire 21, and face inner wire 21 connect the through hole 22 of usefulness at interlayer, and have surface conductor 23 etc. in the upper surface side of ceramic substrate body 1, dispose the conductor portion (terminal pad electrode) 14 that double-deck glassy layer 13 that a plurality of periphery utilizations are made of the 1st glassy layer 11 and the 2nd glassy layer 12 covers at a first type surface (being lower surface among Fig. 3) 1a simultaneously.
[evaluating characteristics]
＜1〉cracking frequency
On another first type surface 1b of the above-mentioned ceramic substrate body of making like that 1, as shown in Figure 4, after utilizing scolding tin that essential surface mount device 15 and 16 is installed, the encapsulation that in order to epoxy resin is main component encapsulates with resin 17, the circuit substrate 10a that obtains stipulating, the ceramic substrate 10 that promptly obtained installing surface mount device 15 and 16, also encapsulates with resin 17 with encapsulation.
Then, as shown in Figure 5, with the formation of this circuit substrate 10a terminal pad electrode (conductor portion) 14 and be provided with a first type surface 1a of glassy layer 13, utilizing scolding tin to be installed in installation base plate is on the epoxy resin base plate 31, and the terminal pad electrode 14 of circuit substrate 10a is connected with terminal pad 32 with the installation of epoxy resin base plate 31.
Then, with epoxy resin base plate 31 that circuit substrate 10a has been installed under the condition of-55 ℃ to 125 ℃ scope, carry out the load tests of 400 circulations after, make entire circuit substrate 10a be soaked in red liquid penetrant inspection and soak in the liquid, carry out the solvent supersonic ripple and clean, confirm to have flawless.Its result does not observe and cracks.
In addition, when thermal cycle is loaded, because the coefficient of thermal expansion differences of installation base plate and ceramic substrate, make stress concentrate on the position of weak strength, often chap or crackle in the conductor portion (terminal pad electrode) of ceramic substrate and the interface generation of pottery on every side, but it is above-mentioned such, cover double-deck glassy layer 13 by periphery with the 1st glassy layer 11 and the 2nd glassy layer 12 in conductor portion (terminal pad electrode) 14, and the 1st glassy layer by with the pottery that constitutes ceramic substrate body 1 in the isonomic glass material of glassy phase that contains constitute, the 2nd glassy layer constitutes by being difficult to dissolve the glass material of separating out in plating bath than the 1st glassy layer 11, thereby can access adhesive strength and the good glassy layer 13 of anti-plating that has with pottery, even the ceramic substrate that the reliability that does not also crack in thermal cycling test is high.
＜2〉mobile evaluation test
Below, for mobile evaluation test is provided, utilize the method identical with the method for the foregoing description, as shown in Figure 6, make a kind of ceramic substrate 10b, this ceramic substrate 10b have on the surface μ m/150 μ m of lines/at interval=100, a pair of comb- type electrode 41a and 41b, and on this comb- type electrode 41a and 41b, the double-deck glassy layer 13 that constitutes by the 1st glassy layer and the 2nd glassy layer with form setting shown in Figure 6.
Then, on the comb-type electrode 41a of this ceramic substrate 10b and 41b, drip after the deionized water, apply the 10V direct voltage, measure until time till the short circuit between comb-type electrode 41a and the 41b.Its result, comb-type electrode 41a and the 41b time till short circuit is 5 minutes.According to this results verification, above-mentioned such ceramic substrate 10b that constitutes has good anti-mobility.
Actual conditions are in addition, constitute the glass that contains in the pottery of ceramic substrate body and consider that the characteristic of the ceramic substrate of product selects, in most cases do not consider membrane property etc. especially,, usually produce defectives such as pin hole yet at glassy layer even adopt such glass to cover the periphery of conductor portion (terminal pad electrode), in addition, in order to prevent pin hole etc., even increase thickness, from the material aspect, anti-plating is also easily not enough, is difficult to prevent form because of bath corrosion problems such as pin hole.But, as the present application, by cover the periphery of conductor portion (terminal pad electrode) with double-deck glassy layer with the 1st glassy layer and the 2nd glassy layer, and the 1st glassy layer by with the pottery that constitutes the ceramic substrate body in the isonomic glass material of glassy phase that contains constitute, the 2nd glassy layer constitutes by being difficult to dissolve the glass material of separating out in plating bath than the 1st glassy layer, thereby can access the adhesive strength of glassy layer and pottery and anti-plating is good, the high ceramic substrate of reliability that do not have defectives such as pin hole.
In addition, for the purpose of comparison, having made the glassy layer that the periphery that covers the terminal pad electrode uses adopts only by the 1st glassy layer in the present application, promptly only by with the pottery that constitutes the ceramic substrate body in the ceramic substrate of the single layer structure that constitutes of the 1st glassy layer that constitutes of the isonomic glass material of glassy phase that contains, studied its characteristic, the result does not observe above-mentioned＜1〉the crackle that ceramic substrate is produced because of thermal cycle, but under the condition identical, carry out above-mentioned＜2 with the situation of the foregoing description〉mobile evaluation test the time, until the time till the inter-electrode short-circuit shortened to for 10 seconds, confirmed to have the dendritic crystal bulk-growth of Ag, promptly Ag produces and moves.
In addition, for the purpose of comparison, having made the glassy layer of using as the periphery that covers the terminal pad electrode only adopts by the 2nd glassy layer in the present application, promptly only by the ceramic substrate that is difficult to dissolve the single layer structure that the 2nd glassy layer that the glass material of separating out in plating bath constitutes constitutes than the 1st glassy layer, studied its characteristic, the result is in above-mentioned＜1〉thermal cycle in, observe the crackle that ceramic substrate is produced.In addition, under the condition identical, carry out above-mentioned＜2 with the situation of the foregoing description〉mobile evaluation test the time, until the time till the inter-electrode short-circuit shortened to for 15 seconds, confirmed to have the dendritic crystal bulk-growth of the Ag of the part of peeling off from glass, promptly Ag produces and moves.
In addition, in the above-described embodiments, it is the conductive paste of using by printed conductor portion on ceramic green sheet, the glass thickener that the 1st glassy layer is used, and the 2nd glass thickener of using of glassy layer, form the conductor portion that outer periderm glassy layer covers, but when formation becomes the conductor portion 14 of terminal pad electrode, also can be as shown in Figure 7, the glass thickener that printing the 2nd glassy layer is used on support 43, formation has the 2nd glassy layer 12 of peristome, republish the glass thickener that forms the 1st glassy layer 11 thereon, formation has the 1st glassy layer 11 of peristome, the square from it conductive paste of using in the peristome printed conductor portion of the 1st glassy layer 11 and the 2nd glassy layer 12, after forming conductor portion 14, with the conductor portion on the support 43 14, be transferred on the first type surface of ceramic duplexer with the glassy layer 13 that constitutes by the 1st glassy layer 11 and the 2nd glassy layer 12, by like this, on a first type surface of ceramic duplexer, the conductor portion that the double-deck glassy layer that the utilization of formation periphery is made of the 1st glassy layer and the 2nd glassy layer covers.
In addition, also can be simultaneously with reference to Fig. 8 (a) and (b), (c), one side forms conductor portion 14 and the 1st and the 2nd glassy layer 11 and 12 according to the method for following explanation on ceramic substrate (ceramic duplexer) 10.
At first, shown in Fig. 8 (a), on a first type surface of ceramic substrate (ceramic duplexer) 10, by the conductive paste that printing or transfer printing conductor portion are used, shaped conductors portion 14.
In addition, on the surface of support 43, print the glass thickener that the 2nd glassy layer is used, form the 2nd glassy layer 12, form the glass thickener of the 1st glassy layer more thereon by printing, form the 1st glassy layer 11 with peristome with peristome.
Then, the the 1st and the 2nd glassy layer 11 and 12 that forms on the surface with support 43 is transferred on the ceramic substrate (ceramic duplexer) 10 that forms conductor portion 14 (Fig. 8 (b)), remove support 43 (Fig. 8 (c)), thus utilize the 1st and the 2nd glassy layer 11 and 12 cover conductor portion 14 on the ceramic substrates (ceramic duplexer) 10 around.
In addition, also can on two different supports, print the thickener that the 1st and the 2nd glassy layer is used respectively, on a support, form the 1st glassy layer, on another support, form the 2nd glassy layer, order according to the 1st glassy layer and the 2nd glassy layer, glassy layer is transferred on the ceramic substrate (ceramic duplexer) that forms conductor portion, thus shown in Fig. 8 (c), utilize the 1st and the 2nd glassy layer 11 and 12 cover conductor portion 14 on the ceramic substrates (ceramic duplexer) 10 around.
In addition, Figure 5 shows that the ceramic substrate 10 (circuit substrate 10a) of the foregoing description passes through the state diagram that scolding tin 18 is connected with installation base plate (epoxy resin base plate) 31 with its conductor portion 14, and be depicted as an example of the electronic device of the present application.
In this electronic device, because the conductor portion 14 of ceramic substrate 10 is connected with installation base plate reliably by scolding tin 18, and the periphery of the conductor portion 14 of the ceramic substrate 10 of the foregoing description utilizes above-mentioned double-deck glassy layer 13 to cover, therefore on installation base plate, installed since with the good and high ceramic substrate 10 of reliability of the tack of ceramic substrate body 1 and anti-plating, thereby can access the high electronic device of reliability.
In addition, Fig. 9 (a) and (b), (c) be depicted as a part of being arranged to cover conductor portion 14 glassy layer 13 aspect graph is set.
Fig. 9 (a) be depicted as in the foregoing description, glassy layer 14 aspect graph is set, in the above-described embodiments, when the periphery cover glass layer 13 of conductor portion 14, near only covering the periphery of conductor portion 14 glassy layer 13 is set like that, but in the ceramic substrate of the present application, also can shown in Fig. 9 (b), (c), when the periphery cover glass layer 13 of conductor portion 14, utilize glassy layer 13 to cover to the Zone Full except the zone that should expose conductor portion 14.
In addition, in Fig. 9 (b), the surface of the glassy layer that exposes face and outer regions thereof 13 of conductor portion 14 constitutes like that from the surface around it is outstanding, in Fig. 9 (c), the surface of exposing the glassy layer 13 of face around being lower than of conductor portion 14 like that, be that the bottom surface of exposing face and become recess of conductor portion 14 constitutes like that.
Under the situation of the formation of Fig. 9 (c), also can be coated with conductive paste to recess, make the surface of conductor portion 14 reach the surperficial identical height with on every side glassy layer 13, also the electrical thickener of additional guide again forms conductor portion from the outstanding structure in the surface of glassy layer.In addition, also can be not limited to conductive paste, and use metal forming to adjust the height of conductor portion.
Whatsoever under the situation, the form that is provided with of glassy layer 13 that conductor portion 14 and being arranged to covers the part of conductor portion 14 all has no particular limits all distortion in addition.In addition, in Fig. 9 (a) and (b), (c), the stage portion that is depicted as glassy layer 13 and conductor portion 14 is the situation that corner angle are arranged, but also can be the such structure of the smooth variation of thickness.
In addition, the present application also is not limited to the foregoing description in others, the kind of the glass material of the kind of the ceramic material of relevant formation ceramic substrate body, the shape of conductor portion and constituent material, formation glassy layer and composition etc., in addition all application and distortion in scope of invention.
Industrial practicality
As mentioned above, according to the present application, by cover the part of conductor portion with glass material, can Inhibition is concentrated because of the stress to conductor portion that thermal cycle produces, and can improve simultaneously to be arranged to cover become to connect Connect disc electrode conductor portion a part glassy layer, with tack and the anti-plating of ceramic substrate body, Can really obtain the high ceramic substrate of reliability.
Therefore, the present application can be widely used in ceramic substrate and manufacturing technology field thereof and use The field of the electronic device of ceramic substrate etc.
Claims (21)
1. ceramic substrate is characterized in that having:
The ceramic substrate body; And
The part of the conductor portion that forms from a first type surface of described ceramic substrate body, cross over the described glassy layer that first type surface disposes like that of described ceramic substrate body,
Described glassy layer has:
Cross over the 1st glassy layer that the described first type surface of described ceramic substrate body disposes like that, that constitute by the 1st glass material from the part of described conductor portion; And
The 2nd glassy layer that constitutes by the 2nd that on described the 1st glassy layer, form, different glass material with the 1st glass material that constitutes described the 1st glassy layer,
Described the 1st glass material is compared with described the 2nd glass material, is the material good with the tack of described ceramic substrate body,
Described the 2nd glass material is compared with described the 1st glass material, is the good material of anti-plating.
2. ceramic substrate as claimed in claim 1 is characterized in that,
The pottery that constitutes described ceramic substrate body contains glass, and
Described the 1st glass material be with the pottery that constitutes described ceramic substrate body in the glass that contains be the glass material of identical component, simultaneously
Described the 2nd glass material is compared with described the 1st glass material, is to be difficult to dissolve the glass material of separating out in plating bath.
3. ceramic substrate as claimed in claim 1 or 2 is characterized in that,
Form described glassy layer, make it cover the periphery of the described conductor portion that forms on the first type surface of described ceramic substrate body.
4. ceramic substrate as claimed in claim 1 or 2 is characterized in that,
Form described the 2nd glassy layer, make it cover whole described the 1st glassy layer.
5. ceramic substrate as claimed in claim 3 is characterized in that,
Form described the 2nd glassy layer, make it cover whole described the 1st glassy layer.
6. ceramic substrate as claimed in claim 1 or 2 is characterized in that,
Described the 1st glass material is to contain the material that borosilicic acid is a glass,
Described the 2nd glass material is that containing with Si, B and Zn is the material of the glass of main component.
7. ceramic substrate as claimed in claim 3 is characterized in that,
Described the 1st glass material is to contain the material that borosilicic acid is a glass,
Described the 2nd glass material is that containing with Si, B and Zn is the material of the glass of main component.
8. ceramic substrate as claimed in claim 4 is characterized in that,
Described the 1st glass material is to contain the material that borosilicic acid is a glass,
Described the 2nd glass material is that containing with Si, B and Zn is the material of the glass of main component.
9. ceramic substrate as claimed in claim 1 or 2 is characterized in that,
Surface in described conductor portion forms plated film.
10. ceramic substrate as claimed in claim 3 is characterized in that,
Surface in described conductor portion forms plated film.
11. ceramic substrate as claimed in claim 4 is characterized in that,
Surface in described conductor portion forms plated film.
12. ceramic substrate as claimed in claim 6 is characterized in that,
Surface in described conductor portion forms plated film.
13. an electronic device is characterized in that,
The described conductor portion of each the described ceramic substrate in the claim 1 to 12 is connected with installation base plate by scolder.
14. the manufacture method of a ceramic substrate is characterized in that, has following operation:
Form the operation of the ceramic duplexer that does not burn till, this pottery duplexer has such structure, promptly on a first type surface of the duplexer that a plurality of ceramic green sheets are stacked, form conductor portion, a described first type surface of crossing over described duplexer from the part of described conductor portion forms the 1st glassy layer that is made of the 1st glass material like that, on described the 1st glassy layer, the 2nd glassy layer that formation is made of the 2nd glass material different with described the 1st glass material that constitutes described the 1st glassy layer, described the 1st glass material will be made of by good material than described the 2nd glass material the tack with described ceramic substrate body, and described the 2nd glass material will be made of by good material than described the 1st glass material anti-plating; And
The operation that the described ceramic duplexer that does not burn till is burnt till.
15. the manufacture method of ceramic substrate as claimed in claim 14 is characterized in that,
Form the 1st glassy layer, make it cover the periphery of described conductor portion.
16. the manufacture method as claim 14 or 15 described ceramic substrates is characterized in that,
Form described the 2nd glassy layer, make it cover whole described the 1st glassy layer.
17. the manufacture method as claim 14 or 15 described ceramic substrates is characterized in that,
In burning till the operation of described ceramic duplexer, on at least one first type surface of described ceramic duplexer, configuration is by suppressing to use raw cook burning till under the temperature of described ceramic duplexer in fact the contraction that the ceramic material of sintering not constitutes, and carries out burning till of described ceramic duplexer under this state.
18. the manufacture method of ceramic substrate as claimed in claim 16 is characterized in that,
In burning till the operation of described ceramic duplexer, on at least one first type surface of described ceramic duplexer, configuration is by suppressing to use raw cook burning till under the temperature of described ceramic duplexer in fact the contraction that the ceramic material of sintering not constitutes, and carries out burning till of described ceramic duplexer under this state.
19. the manufacture method as claim 14 or 15 described ceramic substrates is characterized in that,
After burning till the operation of described ceramic duplexer, has the operation that forms plated film on the surface of described conductor portion.
20. the manufacture method of ceramic substrate as claimed in claim 16 is characterized in that,
After burning till the operation of described ceramic duplexer, has the operation that forms plated film on the surface of described conductor portion.
21. the manufacture method of ceramic substrate as claimed in claim 17 is characterized in that,
After burning till the operation of described ceramic duplexer, has the operation that forms plated film on the surface of described conductor portion.
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| JP2005346851 | 2005-11-30 | ||
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| JP6832630B2 (en) | 2016-03-28 | 2021-02-24 | 富士通インターコネクトテクノロジーズ株式会社 | Manufacturing method of wiring board |
| US10568205B2 (en) * | 2016-07-27 | 2020-02-18 | Corning Incorporated | Ceramic and polymer composite, and uses thereof |
| EP3605604B1 (en) * | 2017-03-29 | 2023-02-22 | Murata Manufacturing Co., Ltd. | Power module and method for manufacturing power module |
| JP6870427B2 (en) | 2017-03-30 | 2021-05-12 | Tdk株式会社 | Electronic components |
| CN114133232B (en) * | 2021-12-17 | 2023-03-24 | 横店集团东磁股份有限公司 | Ferrite magnetic-isolating sheet and sintering method thereof |
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| CN109156080A (en) * | 2016-05-16 | 2019-01-04 | 株式会社村田制作所 | Ceramic electronic components |
| CN109156080B (en) * | 2016-05-16 | 2021-10-08 | 株式会社村田制作所 | Ceramic electronic component |
| US11641712B2 (en) | 2016-05-16 | 2023-05-02 | Murata Manufacturing Co., Ltd. | Ceramic electronic component |
| US11647581B2 (en) | 2016-05-16 | 2023-05-09 | Murata Manufacturing Co., Ltd. | Ceramic electronic component |
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