CN100583407C - Visual inspection apparatus, visual inspection method, and peripheral edge inspection unit that can be mounted on visual inspection apparatus - Google Patents

Visual inspection apparatus, visual inspection method, and peripheral edge inspection unit that can be mounted on visual inspection apparatus Download PDF

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Publication number
CN100583407C
CN100583407C CN 200680014011 CN200680014011A CN100583407C CN 100583407 C CN100583407 C CN 100583407C CN 200680014011 CN200680014011 CN 200680014011 CN 200680014011 A CN200680014011 A CN 200680014011A CN 100583407 C CN100583407 C CN 100583407C
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portion
inspection
direction
sample
observation
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CN 200680014011
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Chinese (zh)
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CN101167171A (en )
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土坂新一
横田敦俊
蛇石广康
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奥林巴斯株式会社
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Abstract

The invention provides a visual inspection apparatus, visual inspection method, and peripheral edge inspection unit that can be mounted on visual inspection apparatus. A visual inspection apparatus is provided with a macroscopic inspecting section (10) and a microscopic inspecting section (11), and the microscopic inspecting section (11) has an inspection stage (31) and a microscope (32) on a mounting plate (30). The inspection stage (31) is movable in an X direction, a Y direction and a Z direction, and is also rotatable in a direction. Furthermore, a periphery inspecting section (12) is fixed on the mounting plate (30) for obtaining an enlarged image of a periphery of a wafer (W). The periphery inspecting section (12) is arranged to pick up an image of the periphery of the wafer (W) held by the inspection stage (31).

Description

外观捡查装置、外观检査方法以及可安装在外观检査装置上的边缘 Exterior Haka means, methods and visual inspection may be mounted on the edge of the visual inspection apparatus

部检查单元 Checking unit portion

技术领域 FIELD

本发明涉及检查工件外观的外观检查装置、外观检查方法以及可安装在这种外观检査装置上的用于检查工件边缘部的边缘部检查单元。 The present invention relates to a visual inspection to check the appearance of the workpiece, and a visual inspection method for checking unit for checking an edge portion of the workpiece edge portions may be mounted on such an appearance inspection apparatus.

背景技术 Background technique

当在半导体晶片等工件上形成电路等图案时,使用检查工件正面是否具有缺陷的外观检查装置。 When the circuit pattern is formed on a workpiece such as a semiconductor wafer, used to check whether the front workpiece inspection device defects. 作为这种外观检查装置,具有如下外观检查装置:可自由摇动、旋转地保持工件,具有使检査者目视进行工件正面检查(宏观检查)的宏观检查部、以及取得工件的放大图像来进行检查(微观检查)的微观检査部,可用一台装置来进行宏观检査和微观检査(例如,参见专利文献l)。 As such an appearance inspection device having the visual inspection apparatus: swing freely, rotatably held workpiece, having a macroscopic visual inspection by the inspection portion of the front side workpiece inspection (macroscopic examination), and to obtain an enlarged image of the workpiece to perform check (microscopic inspection) microscopic examination portion, a device can be used for macroscopic examination and microscopic examination (for example, see Patent Document l).

此外,在工件上形成电路等时,由于热处理等有时会在工件上产生毛刺或内部应力。 Further, when the circuit is formed on a workpiece, burrs may be generated on the workpiece or internal stress by the heat treatment and the like. 如果这种毛刺或内部应力变大,则晶片有时会在电路制造过程中破裂,所以已知通过预先放大工件边缘部进行观察,来检査是否具有以后有可能演变为破裂的裂缝。 If such burrs or internal stress becomes large, the wafer may be broken in a circuit manufacturing process, it is known in advance amplifying observation workpiece edge portions, to check whether there is likely to evolve into later rupture cracks. 作为用于检査工件边缘部(边缘部检查)的外观检查装置,具有如下外观检查装置:其具有可旋转地支撑工件的支撑部;连续拍摄工件边缘部的边缘部摄像部;以及对边缘部进行照明的边缘部照明部(例如,参见专利文献2)。 As the appearance inspection apparatus for inspecting a workpiece edge portion (edge ​​portion inspection), the appearance inspection apparatus has the following: having a support portion rotatably supporting a workpiece; continuous shooting imaging an edge portion of the edge of the workpiece; and a pair of edge portions an edge portion of the illumination unit (e.g., see Patent Document 2) illumination.

专利文献1:日本特开2004-96078号公报专利文献2:日本特开2003-243465号公报 Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-96078 Patent Document 2: Japanese Laid-Open Patent Publication No. 2003-243465

但是,为了一并实施宏观检查、微观检査、边缘部检查,必须在专利文献1所公开的外观检查装置和专利文献2所公开的外观检査装置之间,用机械臂或装载机(loader) —边交接一边搬运晶片,具有生产节拍时间变长的课题。 However, to be implemented in conjunction macroscopic examination, microscopic examination, the edge portion of the check, in Patent Document 1 between the appearance inspection apparatus disclosed in Patent Document 2 and the visual inspection device disclosed, a robot arm or a loader (Loader ) - the side edge delivery handling wafers having the tact time becomes longer subject. 另外,在一个外观检査装置上外置安装另一个外观检查装置的情况下,虽然可縮短搬运时间,但该情况下也需要交接工件等。 In addition, when the appearance inspection apparatus on a mounting another external appearance inspecting apparatus, although shortened handling time, but also in this case requires transferring the workpiece and the like. 而且,作为装置整体的设置面积与单独设置的情况相比并未改变。 Further, the apparatus does not change the overall installation area as compared with the case of separately provided.

发明内容 SUMMARY

本发明正是鉴于上述情况而完成的,其主要目的在于,在进行宏观检查、微观检查、边缘部检查时,縮短生产节拍时间,并且使装置变小, 简化装置结构。 The present invention has been accomplished in view of the above, the main object is performed macroscopic examination, microscopic examination, the edge of the inspection, the tact time shortened, and the apparatus is reduced, to simplify the apparatus configuration.

解决上述课题的本发明提供一种外观检查装置,其特征在于,该外观检查装置具有:外观检查部,其用于对工件正面进行外观检查;边缘部检査部,其取得上述工件的侧面部、倒角部及其正背面的周围部分的放大像,以及配置在上述外观检査部上、保持上述工件的保持单元,上述外观检查部和上述边缘部检査部共用在上述保持单元。 The present invention is to solve the above problems is a visual inspection device, wherein the visual inspection device includes: an appearance inspection unit for visual inspection of the front workpiece; the edge of the inspection unit, acquiring the side surface portion of the workpiece , the chamfered portion and an enlarged image of the front and back of the peripheral portion, and disposed on the visual inspection section of the workpiece holding means holding the visual inspection of the inspection portion and the edge portion of the holding means in common.

此外,本发明提供一种外观检查方法,其特征在于,该外观检査方法具有:利用配置在外观检查部上的保持单元保持工件并对上述工件正面进行外观检查的步骤;使边缘部检查部与上述保持单元相对接近的步骤,其中,该边缘部检査部取得上述工件的侧面部、倒角部及其正背面的周围部分的放大像;以及在使上述保持单元相对接近的状态下,利用 Further, the present invention provides a method for appearance inspection, wherein the visual inspection method comprising: using a holding means disposed on the visual inspection of the portion of the front step of the workpiece and the workpiece holding visual inspection; inspection portion of the edge portion and said holding means relatively close to the step, wherein the side surface edge portion of the inspection unit acquisition, the chamfered portion and an enlarged image of the front and back of the peripheral portion of the workpiece; and a lower holding means so that the relatively close state, use

边缘部检査部取得上述工件的边缘部的放大像的步骤。 An edge portion of the inspection step of obtaining an enlarged image of the edge portion of the workpiece.

在本发明中,在进行外观检查时,将工件保持在保持单元上, 一边适当移动保持单元一边进行检查。 In the present invention, during a visual inspection, the workpiece held by the holding means, while holding the mobile unit while appropriately checked. 而且,在进行边缘部检查时,不进行工件的移动放置而在将工件保持在该保持单元上的状态下旋转工件,利用边缘部检查部取得工件的边缘部的放大像。 Further, the edge portion during inspection, without moving the workpiece and rotating the workpiece is placed in a state where the workpiece held on the holding unit, using the edge of the inspection unit obtains an enlarged image of the edge portion of the workpiece.

而且,本发明提供一种可安装在外观检査装置上的边缘部检查单元, Further, the present invention provides a unit for checking an edge portion may be mounted on the appearance inspection apparatus,

其特征在于,该边缘部检查单元具有:固定部,其相对于外观检查部可自由拆装,该外观检查部在以可自由移动的方式将工件保持在保持单元上的状态下对工件正面实施外观检查;以及放大像取得部,其被配置成朝向上述保持单元所保持的上述工件的边缘部,可取得上述工件的侧面部、倒角部及其正背面的周围部分的放大像。 Characterized in that the edge of the inspection unit comprises: a fixed portion with respect to the lower portion detachably visual inspection, visual inspection of the portion in a freely movable manner on the holding means to hold the workpiece in a state of a workpiece positive visual inspection; and enlarged image acquiring unit, which is arranged toward an edge portion of the workpiece held by the holding unit, the side surface portion can be obtained, the chamfered portion and an enlarged image of the front and back of the peripheral portion of the workpiece.

在本发明中,通过将固定部固定在外观检查部的规定位置上,可使 In the present invention, by fixing the fixing portion at a predetermined position of the appearance inspection unit, can

8用外观检査部的保持单元来进行边缘部检査。 8 with the holding means to perform visual inspection unit checks the edge portion. g卩,不用移动放置被搬入到外观检査部的工件即可实施外观检查。 g Jie, without being placed in the mobile unit loaded into the workpiece appearance inspection appearance inspection can be implemented.

此处,边缘部是指工件的侧面部、倒角部及其正背面的周围部分。 Here, the edge portion is referred to as peripheral portion of the side surface portion of the workpiece, the chamfered portion and the back surface of n. 此外,当工件为晶片的情况下,涂布抗蚀剂后除去了不需要的抗蚀剂的边缘切割线部分也包含在边缘部之内。 Further, in the case where the workpiece is a wafer, the resist is removed after coating a resist unwanted edge cut line is also included in the portion of the edge portion.

根据本发明,在具有用于对工件正面进行外观检查的外观检查部的外观检查装置中,由于在工件正面的外观检査和进行工件的边缘部的检査的边缘部检査中共用保持工件的保持单元,因此,不进行工件的移动放置,即可在保持在保持单元上的状态下进行外观检查和边缘部检查。 According to the present invention, in the appearance inspection apparatus has an appearance inspection unit for visual inspection of the front surface of the workpiece, since the workpiece inspection front edge portion and a visual inspection of the inspection portion of the edge of the workpiece to hold the workpiece by CCP holding means, therefore, does not move the workpiece is placed, a state can be maintained in the holding unit and the visual inspection of the inspection edge.

因此,与单独构成装置的情况相比能减小设置面积。 Thus, compared with the case the individual constituent devices can be reduced installation area. 而且,由于可省略移动工件的距离和移动放置的麻烦,所以能縮短检查的生产节拍时间。 Further, since the movement distance and movement of the workpiece positioned trouble may be omitted, so that the inspection can be shortened tact time.

附图说明 BRIEF DESCRIPTION

图1是表示本发明的实施方式的外观检査装置的概要结构的俯视图。 1 is a plan view showing a schematic configuration of the visual inspection apparatus according to an embodiment of the present invention.

图2是表示外观检查装置的概要结构的侧视图。 FIG 2 is a side view showing a schematic configuration of a visual inspection apparatus. 图3是说明边缘部检査部的拆装的分解图。 FIG 3 is an exploded view of the detachable portion of the edge portion of the inspection will be described. 图4是表示外观检查装置的概要结构的俯视图。 FIG 4 is a plan view showing a schematic configuration of a visual inspection apparatus. 图5是表示外观检查装置的概要结构的侧视图。 FIG 5 is a side view showing a schematic configuration of a visual inspection apparatus. 图6是表示外观检查装置的概要结构的侧视图。 FIG 6 is a side view showing a schematic configuration of a visual inspection apparatus. 图7是表示外观检查装置的概要结构的俯视图。 7 is a plan view showing a schematic configuration of a visual inspection apparatus. 图8是表示从正面观察第1方式的可变视野方向观察装置的结构例的图。 FIG 8 is a diagram showing an example of the observation means observing a first embodiment of a variable field from the front direction.

图9A是表示从侧面观察第1方式的可变视野方向观察装置的结构例的图。 FIG 9A is a diagram showing a configuration example of a variable field observation apparatus viewed in the direction of the first embodiment from the side.

图9B是表示从图9A的箭头Al侧观察到的镜凸轮的结构例的图。 FIG. 9B is a diagram showing a configuration of the embodiment of FIG. 9A viewed from the arrow Al to the mirror side of the cam. 图IOA是用于说明第1方式的可变视野方向观察装置中的可观察视野方向的图。 FIG IOA is a view for explaining a first embodiment of a variable field direction of the direction of view of field observation apparatus is observed.

图10B是用于说明第1方式的可变视野方向观察装置中的可观察视野方向的图。 10B is a view for explaining a first embodiment of a variable field direction of the direction of view of field observation apparatus is observed.

图11是表示从正面观察第2方式的可变视野方向观察装置的结构例的图。 FIG 11 is a diagram showing an example of the observation means observing a second embodiment of a variable field from the front direction.

图12A是表示从正面观察第3方式的可变视野方向观察装置的结构例的图。 FIG 12A is a diagram showing a configuration example of a variable field observation apparatus as viewed in the direction of the third embodiment from the front.

图12B是表示从背面观察第3方式的可变视野方向观察装置的结构例的图。 FIG 12B is a diagram showing a configuration example of a variable field from the apparatus rear view seen in the direction of the third embodiment.

图12C是表示从图12B的箭头Cl侧观察到的可动型正反观察镜的截面结构例的图。 12C is a diagram viewed from the arrow Cl in FIG. 12B to the side of the movable cross-sectional configuration example of the positive and negative viewer.

图13A是用于说明第3方式的可变视野方向观察装置的动作的图。 FIG 13A is a view for explaining a third embodiment of a variable field direction of operation of the apparatus as viewed in FIG. 图13B是用于说明第3方式的可变视野方向观察装置的动作的图。 13B is a view for explaining a third embodiment of a variable field direction of operation of the apparatus as viewed in FIG. 图13C是用于说明第3方式的可变视野方向观察装置的动作的图。 13C is a view for explaining a third embodiment of a variable field direction of operation of the apparatus as viewed in FIG. 图13D是用于说明第3方式的可变视野方向观察装置的动作的图。 13D is a view for explaining a third embodiment of a variable field direction of operation of the apparatus as viewed in FIG. 图13E是用于说明第3方式的可变视野方向观察装置的动作的图。 FIG 13E is a view for explaining a third embodiment of a variable field direction of operation of the apparatus as viewed in FIG. 图13F是用于说明第3方式的可变视野方向观察装置的动作的图。 FIG 13F is a view for explaining a third embodiment of a variable field direction of operation of the apparatus as viewed in FIG. 图13G是用于说明第3方式的可变视野方向观察装置的动作的图。 FIG 13G is a view for explaining a third embodiment of a variable field direction of operation of the apparatus as viewed in FIG. 符号说明 Symbol Description

1、 51、 71外观检查装置 1, 51, the visual inspection device 71

10宏观检查部(外观检查部) Macroscopic examination section 10 (appearance inspection unit)

11微观检査部(外观检查部) Microscopic examination section 11 (appearance inspection unit)

12、 61边缘部检查部(边缘部检查单元) 12, the edge 61 of the inspection unit (inspection unit edge portion)

15、 30、 72安装板 15, 30, 72 of the mounting plate

22宏观检查单元(保持单元) Macroscopic examination unit 22 (holding means)

31、 74、 95检查台(保持单元) 31, 74, the inspection table 95 (holding means)

36A、 79旋转轴 36A, 79 rotation shaft

41固定部 Fixing portion 41

44放大像取得部 An enlarged image acquiring unit 44

45、 96控制装置 45, the control device 96

73自动宏观检査部(外观检查部) Macroscopic examination unit 73 automatically (appearance inspection unit)

10W晶片(工件) 10W wafer (workpiece)

101基座 101 base

101a电动机安装板 Motor mounting plate 101a

102电动机 Motor 102

103滚珠螺杆组件 103 ball screw assembly

103a滚珠螺杆 The ball screw 103a

103b滚珠螺杆导向件 103b ball screw guide member

104 Z方向移动线性导向件104a、 106a轨道 104 Z-direction moving linear guides 104a, 106a track

104b、 106b外壳(case) 104b, 106b of the housing (Case)

105 Z移动台105a臂 The mobile station 105 Z arm 105a

106 X方向移动线性导向件 106 X-direction moving linear guide

107 :K移动板108凸轮 107: K cam plate 108 moves

108a、 118a凸轮面 108a, 118a of the cam surface

109、 117凸轮辊 109, the cam roller 117

111、 120拉伸弹簧 111, the tension spring 120

112 CCD相机 112 CCD camera

114晶片 Wafer 114

115旋转镜 Rotating mirror 115

116旋转轴 The rotating shaft 116

118镜凸轮 Cam mirror 118

119旋转臂 119 rotating arm

121a、 121b弹簧挂钩 121a, 121b spring hook

122成像透镜 The imaging lens 122

200、 201、 202可变视野方向观察装置(边缘部检査部) 具体实施方式 200, 201, 202 DETAILED DESCRIPTION observation visual field direction variable device (inspection portion of an edge portion) mode

ii参照附图详细说明用于实施本发明的优选方式。 ii preferred embodiment for carrying out the present invention will be described with reference to the accompanying drawings. (第1实施方式) (First embodiment)

如图1所示,外观检查装置1在面向检査者的前面(图1中的下方) As shown, the appearance inspection apparatus 1 (downward in FIG. 1) facing the front of the examinee 1

设有检査部2,在检查部2的背面侧上连接有装载机部3。 An inspection unit 2, the loader portion 3 on the back side part 2 is connected to inspection. 装载机部3并列连接有晶片托架4A、 4B,该晶片托架4A、 4B收容作为工件的半导体晶片W (下面称为晶片W)。 Loader section 3 are connected in parallel carrier wafer 4A, 4B, the wafer carrier 4A, 4B accommodating the semiconductor wafer W as a workpiece (hereinafter referred to as a wafer W). 另外,晶片托架4A、 4B可在上下方向上以规定间距收容多个晶片W,例如,在晶片托架4A上收容未检查的晶片W,在晶片托架4B上收容已检査的晶片W。 Further, the carrier wafer 4A, 4B may be at a predetermined pitch in the vertical direction, a plurality of accommodating the wafer W, e.g., wafer W housed unchecked on the wafer carrier. 4A, 4B bracket accommodating inspected wafer W wafer . 而且,各晶片托架4A、 4B 可相对于装载机部3独立地进行拆装。 Further, each wafer brackets 4A, 4B with respect to the loader unit 3 may be independently detachable.

装载机部3具有搬运机械臂5。 Having a handling portion 3 loader robot arm 5. 搬运机械臂5由多关节臂构成,在其前端的手柄5A上设有吸附保持晶片W的吸附孔6。 Handling robot arm 5 is constituted by a multi-joint arm provided with the suction opening 6 holding the wafer W at its front end 5A of the handle. 该搬运机械臂5 可自由移动且可自由转动地构成,使得可在2个晶片托架4A、 4B各自与检查部2的宏观检查部10之间搬运晶片W。 The conveying robot arm 5 is freely movable and can rotate freely, such that the carrier in the two wafer 4A, 4B macroscopic examination transfers a wafer between the respective portions of the inspection portion 10 W. 2 '' ''

检查部2具有:用于由检查者以目视方式宏观地进行检查(宏观检查)的宏观检查部10;以及用于进行通过作为高于目视的高倍率的放大像而取得晶片W正面的像来实施的检查(微观检査)的微观检查部ll, 在微观检查部11上安装有取得晶片W的边缘部的放大像的边缘部检查部12。 Check unit 2 has: Macroscopic examination by the examiner portion visually inspected macroscopically manner (macroscopic examination) of 10; and a front face for wafer W acquired as above by visual observation of an enlarged image of high magnification check (microscopic inspection) microscopic examination ll image portion to be implemented, on microscopic examination portion 11 is attached to an edge portion of the wafer W inspection unit 12 acquires an enlarged image of the edge portion.

在宏观检査部10中,在安装板15上可自由旋转且可自由升降地设置有回转臂16。 In the macroscopic examination section 10, and is rotatably movable and provided with a pivot arm 16 on the mounting plate 15. 在回转臂16中,从旋转轴17起以等角度水平延伸设置有3根搬运臂18、 19、 20,在各搬运臂18、 19、 20的前端部分别设有多个吸附孔(晶片吸盘)21。 In the pivot arm 16, starting from 17 at equal angles with a horizontal rotary axis 3 is provided extending transport arm 18, 19, 20, each of the transfer arm 18, the distal end portion 19, 20 are respectively provided with a plurality of suction holes (wafer chuck )twenty one. 这些吸附孔21与未图示的吸引装置连接。 These suction holes 21 connected to a suction device not shown. 而且,回转臂16被转动控制为使搬运臂18、 19、 20分别配置在位置P1、 P2、 P3上3位置P1是在与装载机部3之间进行晶片W的转交的转交位置,位置P2是进行宏观检查的检查位置。 Further, the pivot arm 16 is rotated to control the conveying arm 18, 19, 20 are disposed at positions P1, P2, P3 3 position P1 is the position transmitted in the care of the wafer W between the loader and the portion 3, the position P2 macroscopic examination is the examination location. 位置P3是在与微观检查部11 之间进行晶片W的转交的转交位置。 Position P3 is transmitted at the transfer point W between the wafer 11 and the portion of the microscopic examination.

另外,在位置P2上设有宏观检查单元22。 Further, at position P2 means 22 is provided with macroscopic examination. 宏观检査单元22具有固定在安装板15上的基座部23,在基座部23上,在Z方向(上下方向) 可自由升降且可自由摆动地设有吸附保持晶片W的保持部24,可使位于位置P2的晶片W向着检查者立起,旋转、摇动。 Macroscopic examination unit 22 has a base portion 23 fixed to the mounting plate 15, the base portion 23, vertically movable in the Z direction (vertical direction) and is swingably provided with a holding portion 24 suction holding the wafer W enable the wafer W located at position P2 toward the examinee standing, rotating, rocking. 而且,在回转臂16的 Further, the pivot arm 16

上方设有对位于位置P2的晶片W进行照明的照明部(未图示)。 It is provided above the wafer W located at position P2 illuminating unit that illuminates (not shown). 照明部 Lighting Department

例如由光源和光学系统构成,该光学系统可在作为散射光来照射照明光、 For example, a light source and an optical system, the optical system may be irradiated with illumination light as light scattering,

或进行聚光来照射晶片W之间进行切换。 Condensing irradiated or switch between the wafer W.

此外,在位置P3上设有进行晶片W的定位的位置检测传感器50。 Further, the position detecting sensor is provided for positioning the wafer W in the 50 position P3. 该位置检测传感器50通过在将晶片W放置在旋转台36上的状态下使其旋转,来捡测晶片W的缺口(notch)位置和中心位置的偏差。 The position detecting sensor 50 is rotated by the wafer W is placed in a state where the rotary table 36 to pick up the wafer W measured gaps (Notch) and the position deviation of the center position. 并且,当检测出位置偏差的情况下,在用搬运臂18、 19、 20举起晶片W的状态下校正旋转台36的位置,使得旋转台36的旋转中心与晶片W的旋转中心一致,之后,通过使搬运臂18、 19、 20下降,可进行高精度的定位。 And, in the case where the detected positional deviation, a correction of the rotational position of the table 36, 20 with the wafer W lifted state of the transport arms 18 and 19, so that the rotation center of the rotary table 36 coincides with the rotation center of the wafer W, then , by the conveying arm 18, 19, 20 is lowered, positioning can be performed with high accuracy.

如图1和图2所示,微观检査部11具有:设置在被适当的减振机构减振后的安装板30上,作为保持晶片W的保持单元的检査台31;以及观察检查台31上的晶片W的显微镜32。 1 and 2, microscopic inspection portion 112 includes: a mounting plate 30 disposed on the rear of the vibration damping mechanism suitable, as holding the wafer W held inspection stage unit 31; and observe the inspection station 31 wafer W on the microscope 32. 检査台31上下层叠配置有可在图1所示的X方向上自由移动的X轴滑块33和可在Y方向上自由移动的Y轴滑块34,在Y轴滑块34上设有可在Z方向上自由移动的Z轴台35。 Inspection table 31 includes a vertical stack is freely movable in the X direction shown in FIG. X-axis and Y-axis slider 33 is freely movable in the Y-direction slider 34 is provided on the Y-axis slider 34 freely movable in the Z-direction of the Z-axis table 35. 在Z轴台35上设有旋转台36,该旋转台36是可在^方向上自由旋转的旋转机构。 A rotary table 36 in the Z-axis table 35, the rotary table rotating mechanism 36 is freely rotatable in the direction ^. 如图2所示,旋转台36具有与未图示的电动机连接的旋转轴36A,在旋转轴36A的上端部上固定有圆板上的保持部36B。 As shown, the turntable 236 has a rotary shaft 36A is connected to a motor (not shown), the upper end portion of the rotary shaft 36A is fixed to the circular plate holding portion 36B. 保持部36B的外径小于晶片W的外径,在其中央部上设有用于吸附晶片W 的吸附孔〔未图示)。 36B is smaller than the outer diameter of the holding portion of the outer diameter of the wafer W, is provided with suction holes (not shown) [for adsorbing the wafer W in the center portion thereof). 该吸附孔与未图示的吸引装置连接。 The suction holes (not shown) connected to a suction device.

而且,在微观检査部ll中,在安装板30的前侧的侧部上固定有边缘部检查部12。 Further, the microscopic examination portion ll, the mounting plate portion 12 checks an edge portion on the side of the front side 30. 周围检查部具有3个放大像取得部,该放大像取得部由摄像光学系统和CCD等摄像元件等构成,其从上方、侧方、下方拍摄晶片的边缘部。 Check peripheral portion having an enlarged image acquisition section 3, the enlarged image obtaining unit is constituted by an imaging optical system and an image pickup element such as a CCD, etc., that captures the edge portion of the wafer from above, the side, below. 并且,所拍摄的图像显示在显示部60上,由检査者进行观察和检査。 Then, the captured image is displayed on the display unit 60, viewing and examination by the examiner. 边缘部检查部12位于使用微观检查部11的显微镜32来观察晶片W正面时不会产生妨碍的位置、即假想线所示的微观检查区域A的外侧,在微观检查时不会干扰晶片W。 An edge portion 12 of the inspection using a microscope positioned microscopic examination portion 11 without hindering the 32 position of the wafer front surface as viewed W, i.e., the outer microscopic examination region A shown in phantom lines, when microscopic examination do not interfere with the wafer W. 如图3所示,边缘部检查部12是与安装板30独立的可自由拆装的边缘部检查单元,其具有通过滚珠螺杆40固定在安装板30的螺孔30A中的固定部41,基座部42从固定部41 3, the edge portion 12 of the inspection of the mounting plate 30 is a separate unit detachably edge checking unit, which has a fixed portion 41 fixed to the screw hole 30A through the ball screw 40 of the mounting plate 30 of the base the seat portion 42 from the fixed portion 41

13延伸设置在Z方向上。 13 extending in the Z direction. 在该基座部42上,凹部43形成为晶片w的边缘部可进入,在此设有放大像取得部44,该放大像取得部44由作为放大光学系统的显微镜和CCD (Charged Coupled Device:电荷耦合器件)构成。 On the base portion 42, the concave portion 43 is formed in an edge portion of the wafer w can enter, with this enlarged image acquisition section 44, the enlarged image obtaining unit 44 as amplified by a microscope and an optical system CCD (Charged Coupled Device: charge coupled device) composed. 放大像取得部44具有:从上方观察晶片W的边缘部的上表面(正面) 的放大像取得部44A;从侧方观察晶片W的边缘部的放大像取得部44B; 以及从下方观察晶片W的边缘部的下表面(背面)的放大像取得部44C。 An enlarged image acquiring unit 44 has: image acquisition unit 44A from the enlarged upper surface of the edge portion of the observation of the wafer W from above (the front side); the enlarged edge portion viewed wafer W from the side of the image acquisition unit 44B; and viewed from below the wafer W an edge portion of the lower surface (back surface) of the enlarged image acquisition section 44C. 另外,放大像取得部44只要是能取得图像的结构就不限于CCD。 Further, an enlarged image of the structure can be achieved as long as the image acquisition unit 44 is not limited to the CCD. 此外, 边缘部检査部12可以是可自由移动地具有1个放大像取得部44的1眼式、以从左右方向夹着放大像取得部44B的方式追加有2个放大像取得部44的5眼式等各种结构。 Further, the edge portion 12 of the inspection may be with a formula 1 to obtain an enlarged image portion 44 is freely movable, so as to sandwich the right and left direction from an enlarged image obtained through additional portion 44B has two enlarged image acquisition section 44 5 and other type structures. 作为l眼式的例子,可以举出如下结构:其由光轴方向恒定、且可在XYZ方向上相对移动的显微镜和镜(mirror) 构成,以始终将显微镜与观察对象部位的距离保持为恒定的方式移动镜和显微镜。 L-eye as an example, a structure may include: a constant which is the optical axis direction, and is relatively movable in the XYZ directions microscope and a mirror (Mirror) configured to always keep a distance microscope observation target region and the constant manner and the movable mirror microscope. 作为第2变形例,将在后面叙述其具体结构。 As a second modification, a specific configuration thereof will be described later.

而且,作为1眼式的其他例子,还可以举出如下结构:仅具有1个图3的边缘部检查部12的放大像取得部44,晶片W的端部相对于中心转动。 Further, as another example of a formula can also be configured as follows: an edge portion having only an enlarged portion of an inspection of FIG. 3 of the image acquisition unit 12 44, the end portion of the wafer W with respect to the center of rotation.

并且,如图2所示,检査台31和边缘部检査部12与控制装置45连接。 As shown in FIG 2, the inspection table 31 and the edge 12 of the inspection unit 45 is connected to the control device. 控制装置45由CPU (Central Processing Unit:中央处理单元)和存储器等构成,用于控制外观检査装置1的整体。 The control device 45 by a CPU (Central Processing Unit: Central Processing Unit) and memory, for controlling the appearance inspection apparatus 1 as a whole. 除此之外,在控制装置45上还连接有宏观检查部10、搬运机械臂5和显示器等显示装置(未图示)。 In addition, the control device 45 is also connected to a display device (not shown) Macroscopic examination section 10, conveying the robot arm 5 and the monitor.

下面,说明本实施方式的作用。 Next, operation of the present embodiment.

首先,将收容有检查对象的晶片W的晶片托架4A和空的晶片托架4B安装到装载机部3上。 First, a wafer carrier housing has an inspection object wafer W 4A and 4B the empty wafer carrier portion 3 is mounted onto the loader. 搬运机械臂5从晶片托架4A上取出一个晶片W,转交至位于宏观检查部10的位置P1上的搬运臂18。 Carrying out a robot arm 5 of the wafer W from the wafer carrier 4A, referred to position P1 located on the carrying arm portion 10 of a macroscopic inspection 18. 回转臂16在将晶片W吸附保持于搬运臂18上的状态下转动,将晶片W移动到位置P2。 In the wafer W attracted and held on the transfer arm 18 of pivot arm 16 is rotated under the state, the wafer W is moved to the position P2. 此处,在解除搬运臂18的吸附而用宏观检査单元22来保持晶片W使其上升之后,用摆动机构使晶片W立起,旋转、摇动。 Here, the transfer arm 18 is desorbed and 22 after holding the wafer W so as to rise, so that the wafer W is raised by the swing mechanism, rotation, shaking macroscopic inspection unit.

把来自照明部的照明光照射到晶片W正面上,通过目视确认了有无 The illumination light incident from the illumination portion on the front surface of the wafer W, the presence or absence of visually confirmed

14缺陷以及缺陷的状态之后,使晶片W下降而再次吸附保持到搬运臂18 After 14 defects and the defect state, the wafer W is lowered to transfer adsorbed holding arm 18 again

上。 on. 另外,此时在位置P1上通过回转臂16的转动来配置搬运臂20,通过搬运机械臂5在该搬运臂20上放置下一个晶片W。 Further, at this time the transfer position P1 to configure the arm 20 by rotating the rotary arm 16, a wafer transfer by the robot arm 5 is placed at the transfer arm 20 W.

然后,转动回转臂16,将位于位置P2的晶片W移动到位置P3,将位于位置Pl的晶片W移动到位置P2。 Then, rotating the rotary arm 16, the wafer W is moved to a position P2 located at a position P3, the wafer W located at the position Pl is moved to position P2. 由于检査台31在位置P3上等待, 所以将晶片W从搬运臂18移动放置在检査台31的保持部36B上。 Since the inspection table 31 waits at the position P3, so that the transfer arm 18 moves the wafer W from the table 31 is placed on the inspection of the holding portion 36B. 另外, 此时对移动到位置P2上的下一个晶片W实施与上述相同的宏观检查。 Further, at this time move to the next wafer W in the same position P2 above macroscopic examination. 此外,还将另一个晶片W放置在移动到位置Pl的搬运臂19上。 Further, the wafer W is placed in the other will move into the position Pl handling arm 19.

在微观检查部11中,在检查台31的旋转台36上在位置P2对晶片W进行定位,控制装置45使检查台31移动,使晶片W中成为检查对象的位置移动到显微镜32的物镜32A (参见图2)的视野内。 In the microscopic examination section 11, on the rotating table 36 checks table 31 to position the wafer W at the position P2, the control device 45 the inspection 31 mobile station, the wafer W becomes the position of the inspection object is moved to the microscope objective 32, 32A (see FIG. 2) within the field of view. 检査者窥视未图示的目镜来目视确认由显微镜32所取得的放大像。 Examiner peep eyepiece (not shown) to enlarge the image visually confirmed by the microscope 32 obtained. 此处,当在显微镜32上设置有摄像装置的情况下,也可以在目视显示部60的同时进行检查。 Here a check, in the case where the imaging device is provided on the microscope 32, may be a visual display unit 60 simultaneously. 如果一边移动检查台31—边对所有检查对象进行微观检査,则控制装置45如箭头B所示使检查台31在XY方向上向斜前方移动,使检查台31接近边缘部检查部12,然后, 一边调整高度, 一边使晶片W的边缘部进入边缘部检查部12的凹部43内。 If the inspection station while the mobile 31- microscopic examination of all sides for inspection object, the control means 45 as indicated by arrow B so that the inspection table 31 moves obliquely forward in the XY direction as shown, so that the inspection table 31 close to the edge 12 of the inspection unit, then, while adjusting the height of the edge portion of the wafer W while the edge 43 into the recess portion 12 of the inspection unit.

在边缘部检查部12中,例如用上侧的放大像取得部44A来取得晶片W的边缘部的正面的图像,用控制装置45来进行图像处理而输出给显示部60。 In the edge portion of the inspection unit 12, for example, spend an enlarged side image acquisition section 44A acquires the image of the front edge portion of the wafer W to the image processing control unit 45 outputs to the display unit 60. 此时,控制装置45旋转检査台31的旋转轴36A,使晶片W以规定速度向e方向旋转。 At this time, the control means 45 rotates the rotation shaft 36A examination table 31, the wafer W is rotated at a predetermined speed in the direction e. 这样进行一周的晶片W的边缘部的检查,确认有无伤痕等,之后同样地用放大像取得部44B和放大像取得部44C依次取得晶片W的边缘部的侧面和背面的图像,进行边缘部检查。 Such a check edge portion of the wafer W week, to confirm whether a scratch, in the same manner after the enlarged image acquisition section 44B, and 44C sequentially enlarged image acquiring unit acquires the image and the back side surface of the edge portion of the wafer W, the edge portion an examination. 另外,也可以使各放大像取得部44A、 44B、 44C动作一次,同时进行从3个方向的检查。 Further, it is also possible to enlarge each image acquisition unit 44A, 44B, 44C operation once, while checking the three directions. 另外,边缘部的检查优选通过图像处理来自动进行检测。 Further, preferably the edge portion of the inspection is detected automatically by image processing. 例如, 也可以比较合格品的晶片W的边缘部的亮度信息和预先取得的检查对象晶片的亮度信息。 For example, the luminance may be the luminance information and the information of the edge portion of the inspection subject wafer beforehand acquired comparison-defective wafer W. 此外,由于只要是1个晶片W则边缘部亮度除去缺口部之外都恒定,所以也可以将亮度变化超过恒定值的部分作为缺陷提取出来。 Further, since as long as an edge portion of the wafer W is removed outside the cutout portion luminance is constant, it may be a constant value over the luminance change portion extracted as a defect.

15在边缘部检查结束之后,使检查台31从边缘部检查部12离开,返回到作为搬运位置的位置P3,移动放置到在位置P3等待的搬运臂18上。 After the end edge 15 of the inspection, the inspection table 31 away from the edge of the inspection portion 12, to return to the position P3 as a transfer position, moving the position P3 is placed onto the transfer arm 18 from the waiting. 回转臂16使搬运臂18、 19、 20旋转,使完成检查的晶片W返回到位置Pl。 Pivot arm 16 causes the transfer arm 18, 19, 20 is rotated, so that complete inspection of the wafer W returns to the position Pl. 搬运机械臂5搬出完成检查的晶片W,收容到晶片托架4B中。 Handling robot arm 5 carry-out completion inspected wafer W, the wafer accommodated in the carrier 4B. 将未检査的晶片W重新移动放置到变空的位置Pl的搬运臂18上。 The inspected wafer W is not placed on the moved back position Pl empty conveying arm 18. 此外, 将在位置P2进行了宏观检査的下一个晶片W搬入、移动放置到,于位置P3的检査台31上。 Further, at the position P2 will be a macroscopic examination of the next wafer W is loaded, moves placed at the position P3 inspection table 31. 然后,同样地对晶片托架4A内成为检查对i的所有晶片W进行检査,之后卸下晶片托架4A、 4B,安装接下来进行检查的晶片托架。 Then, in the same manner to become the bracket 4A of the wafer carrier wafer inspection for all the inspection of the wafer W i, after removing the carrier wafer 4A, 4B, the installation of the next inspection.

另外,在该外观检查装置1中,结束微观检査之后再转移到边缘部检查,但也可以通过控制装置45的控制而在任意的定时转移到微观检查或者边缘部检査。 Further, in the appearance inspection apparatus 1, and then proceeds to the end edge of the inspection microscopic examination, but may also be transferred to a microscopic inspection or edge inspection unit at an arbitrary timing by the control of the control means 45. 而且,还可以不进行宏观检査而仅进行微观检査和边缘部检查,也可以不进行微观检查而仅进行宏观检查和边缘部检查。 Moreover, also may not be the only macroscopic examination and microscopic examination edge portion inspection, microscopic examination may not be performed only for macroscopic examination and inspection edge portion.

根据该实施方式,在进行晶片W的外观检查时,将边缘部检查部12 安装在微观检查部11上,在微观检查和边缘部检查双方中共用微观检查部11的检登台31,所以能减小装置的设置面积。 According to this embodiment, when the wafer W is performed visual inspection, the inspection portion of the edge portion 12 is mounted on microscopic examination unit 11, a microscopic examination and inspection both edge portions shared by microscopic examination stage portion 3111 of the subject, it is possible to reduce It means a small installation area. 而且,可无需从微观检查中转交晶片W就进行边缘部检査,且与用独立装置构成的情况相比检查台31的移动距离也可大幅度减小,所以能縮短检査的生产节拍时间。 Further, the wafer W can be transmitted without microscopic examination proceeds from the edge of the inspection and compared with a case of constituting a separate device from the mobile station 31 checks may also be greatly reduced, it is possible to shorten the examination time tact .

由于边缘部检査部12和检查台31构成为可自由地相对临近和离幵, 所以能防止微观检査时晶片W等与边缘部检查部12发生干扰。 Since the edge portion 12 of the inspection and inspection station 31 is configured to be relatively freely and Depart from near, it is possible to prevent the wafer W, microscopic examination and the edge portion 12 of the inspection interference. 而且, 由于把边缘部检查部12和检査台31设置在同一块安装板30上,所以高度方向上的偏差变小,易于调整边缘部检查时的高度。 Further, since the edge portion 12 of the inspection and the inspection table 31 is provided on the same mounting plate 30, the deviation in the height direction becomes small, easy to adjust the height at the edge of the inspection. 特别是在本实施方式中,在将晶片W转交给旋转台36时能高精度地进行定位,所以在用边缘部检查部12旋转晶片W进行检查时,可抑制晶片W在观察位置上旋转而导致的移动,能进行高倍率的检查。 Especially in the present embodiment, when the wafer W is transferred to the turntable 36 can be precisely positioned, so when the edge portion of the inspection unit 12 to check the rotation of the wafer W, the wafer W can be suppressed at the observation position on rotation due to movement, high-magnification can be checked. 此外,由于位置检测传感器50在位置P3检测晶片W的缺口位置与中心位置的偏差量,所以即使不再次放置晶片W,也可以通过在检査边缘部时控制检査台31,从而在旋转晶片W时以不产生偏心的状态进行检查。 Further, since the position detecting sensor 50 in the position P3 and the position deviation amount of the center position of the notch of the wafer W is detected, even if the wafer W is not placed again, may be checked by the control station 31 when checking the edge portion, whereby rotation of the wafer a state does not occur when the eccentric checked W.

此外,在微观检査部11的安装板30上贯穿设置固定边缘部检査部12的螺孔30A,将边缘部检查部12作为边缘部检査单元,构成为可自由拆装于微观检查部11,所以仅在具有宏观检查部10和微观检査部11的外观检查装置上安装边缘部检查部12即可实施边缘部检查。 In addition, the fixed edge portion is provided through screw hole. 30A inspection portion 12 of plate 30 on the mounting portion 11 of the micro-inspection, the inspection portion of the edge portion 12 as an edge portion of the inspection unit, configured to detachably on microscopic examination unit 11, only the edge portion having a mounting portion inspection apparatus 11 of the appearance inspection unit 10 checks the macro and microscopic inspection unit 12 to check the embodiment edge portion. 即,仅通过最小限度的改变,即使是现有的外观检查装置也能取得上述效果。 That is, by changing only the minimum, even in the conventional appearance inspection apparatus can achieve the above effects. 另外, 边缘部检查部12也可以一体地固定安装在安装板30上。 Further, the edge 12 of the inspection unit may be integrally mounted on the mounting plate 30.

另外,也可以釆用如下结构:在边缘部检查部12的固定部41与基座部42之间设置可在B方向自由水平移动的一轴台,使基座部42可向晶片W自由进退。 Further, and also it can be used the following structure: in the fixed portion between the edge portion 12 of the inspection unit 41 and the base shaft portion 42 is provided a movable table freely in the horizontal direction B, so that the base portion 42 can freely advance and retract the wafer W . 此时也能取得与上述相同的效果。 In this case possible to obtain the same effect as described above. 而且,通过使边缘部检查部12向检查台31移动,能进一步减小生产节拍时间。 Further, by making the edge portion 12 to the inspection unit 31 checks the mobile station, the tact time can be further reduced. 安装在固定部41和基座部42之间的台不限于一轴台。 Station 41 mounted between the fixed portion and the base portion 42 is not limited to a pillow block. 例如也可以是还可在与B 方向正交的方向上自由移动的二轴台、还可向Z方向移动的三轴台、或者可在B方向和Z方向上移动的二轴台。 For example, two-axis stage may be further movable in a direction orthogonal to the direction B, may be moved three-axis stage in the Z direction, or the two axis table movable in the Z direction and the B direction. 在将显微镜32构成为物镜部32A可在Z轴方向上移动、将基座部42构成为可在Z方向上自由移动的情况下,由于无需在检査台31上设置Z轴台35,所以能简化检查台31 的结构。 In the microscope objective lens unit 32A composed of 32 movable in the Z-axis direction, the base portion 42 is configured to the case where freely movable in the Z direction, there is no need to check the Z-axis stage 35 is provided on the table 31, so the structure can be simplified inspection table 31.

此外,上述实施方式也可以变形为具有如下功能,记录由微^见检査部或者边缘部检査部的任意一个检査部正在进行检查时的观察赵置的坐标,当由另一个检査部进行检查时,根据所记录的观察位置的坐标将观察位置移动到另一个检查部的观察位置上(第1变形例)。 Further, the above-described embodiments may be modified to have a function, a recording see Zhao observed when being examined is set to any one inspection or edge inspection unit of the inspection portion of the coordinates by the micro ^, when checked by another when the inspection unit, based on the coordinates of the observation position of the recorded position of the other inspection will observe the observation portion moved to a position (a first modification).

艮P,在该第l变形例中,如图l、 2所示,具有检查台95以取代上述第1实施方式的外观检查装置1的检查台31,该检查台95具有与检查台31相同的结构,而且,可检测晶片W在XYZ各轴方向上的位置的坐标;并且,具有控制装置96以取代控制装置45,该控制装置96具有与控制装置45相同的结构,而且,取得由检查台95检测的晶片的位置的坐标信息进行存储,使用该坐标信息来进行外观检查装置1的控制。 Gen P, in this first modification example l, l as shown in FIG, 2, the appearance inspection apparatus for inspecting table 95 instead of the first embodiment includes an inspection station 31 1, the inspection station 95 has the same inspection table 31 the structure and can coordinate position detecting wafer W in the respective axis directions XYZ; and, a control device 96 in place of the control means 45, the control means 96 has the same control device 45 structure and made by the inspection coordinate information of the position detecting wafer table 95 stores, using the coordinate information to perform an appearance inspection apparatus 1 is controlled.

在检査台95上例如安装有未图示的步进电动机,作为在各移动方向驱动与检查台31同样设置的X轴滑块33、 Y轴滑块34、 Z轴台35和旋转台36的动力源。 On the inspection table 95 is mounted a stepping motor (not shown) as a drive with the same inspection table 31 X-axis disposed in each moving direction of the slider 33, Y-axis slider 34, Z-axis table 35 and the rotary table 36 power source. 并且,可根据距离该步进电动机的基准位置的旋转角的信息,检测晶片W移动后的位置的坐标。 And, according to the information from the reference position of the rotation angle of the stepping motor, the detection of the coordinate position of the wafer W is moved. 此处,除了步进电动机之外,检查台95的动力源例如可以优选采用 Here, in addition to the stepping motor, the inspection table 95 can be preferably used, for example, a power source

伺服电动机.、直线检测元件(linear scale)、线性电动机等可检测位置坐标的适当的致动器或检测元件等。 Servomotor., Line detection element (linear scale), the position of the linear motor or the like can detect a suitable actuator or the like detecting element coordinates.

下面,说明该第l变形例的作用。 Next, the operation of the first embodiment modification l.

在移动放置在检查台95上的晶片W,作为微观检查而用显微镜32 来观察晶片W的边缘部时,为了发现缺陷并确认侧面和背面侧,有时要马上转移到边缘部检查,观察晶片W的边缘部。 Moving placed on the inspection stage 95 of the wafer W, as the microscopic examination and the microscope 32 when viewed in the edge portion of the wafer W, in order to detect defects, and that the side surfaces and the back side, sometimes immediately transferred to the edge of the inspection, observation of the wafer W the edge portion.

此时,检査台95由于可检测各轴方向的坐标,所以例如按下一个按钮等,用操作部70发出指示,将该坐标信息存储到控制装置96中。 At this time, since the inspection table 95 may detect the coordinates of each axis, so that for example, pressing a button or the like, an instruction operation section 70, the coordinate information is stored into the control unit 96. 并且,当使用存储在控制装置96中的坐标信息,从正在进行微观检查的显微镜32的物镜的光轴上的点97转移到边缘部检查时,通过控制装置96 控制检査台95,使得即使用边缘部检查部也能直接观察由显微镜32观察到的点97,移动晶片W以使点97到达边缘检査部的摄像光学系统的光轴上。 When and, when the coordinate information stored in the control device 96, 97 is transferred from the point on the optical axis of the objective lens of the microscope 32 being microscopic examination to the edge of the inspection, check control table 96 by the control device 95, i.e., such that direct observation point 97 can move the wafer W is observed by a microscope 32 to point 97 so that the optical axis of the imaging optical system onto an edge portion of the inspection using the edge portion of the inspection.

对于移动后的晶片W,通过操作部70手动地、或者通过预先输入而设定的观察方法自动地观察各种任意位置的边缘部,之后转移到原本的显微镜32进行的晶片W的边缘部观察。 After the wafer W is moved by the operation portion 70 manually, or by the observation method is set in advance to automatically input a variety of edge portion was observed in any position, the process moves to the edge portion of the wafer W observation microscope 32 of the original . 即,使用存储在控制装置96中的点97的坐标信息控制检查台95,将原本晶片W的边缘部的由显微镜32进行外观检査后的点97,移动到可再次由显微镜32观察的位置上。 That is, the coordinate information stored in the control unit 96 checks the table 95 in the control point 97, by the edge portions of the original wafer W microscope 97 and 32 after visual inspection, to be moved by a microscopic observation position again 32 on.

反之,在移动放置在检査台95上的晶片W,通过边缘部检查来观察晶片W的边缘部时,为了发现缺陷并通过放大后的图像进行确认,有时要马上转移到基于显微镜的微观检查,观察晶片W的边缘部。 Conversely, moving the examination table 95 is placed on the wafer W, when viewed edge portion of the wafer W is checked by the edge portion, in order to find defects and confirmed by the enlarged image, sometimes immediately transferred on to a microscope microscopic examination , the edge portion of the wafer W was observed.

此时,使用检查台95检测通过用操作部70进行指示而正在进行边缘部检査的点97的坐标,将该坐标信息存储到控制装置96中。 At this time, the inspection table 95 by the operation detecting section 70 for instructing the ongoing coordinates of the edge portion 97 of the check point, and the coordinate information stored in the control unit 96. 然后, 在转移到基于显微镜的微观检査时,通过控制装置96控制检查台95,使得即使在显微镜32的边缘部观察中也能直接观察由边缘部检查部观察到的点97,移动晶片W以使点97到达显微镜32的光轴上。 Then, when transferred to a microscope based on microscopic examination, the examination table 96 the control means 95 controls so that even can be observed by a direct observation of the inspection portion of the edge 97 to a point 32 at an edge portion of the microscopic observation, the wafer W moves so that the spot 97 onto the optical axis 32 of the microscope.

当手动地或者自动地对移动后的晶片W进行各种任意位置的基于显微镜的边缘部观察之后,转移到原来的边缘部检查部进行的边缘部观察。 When manually or automatically moving the wafer W after various arbitrary position after an edge portion based on microscopic observation, observation is transferred to the edge portion of the original edge portion of the inspection section.

18即,使用存储在控制装置96中的点97的坐标信息控制检查台95,将原本晶片W的由边缘部检查部进行边缘部检査后的点97,再次移动到可通过边缘部检查部观察的位置上。 97 and 18 after i.e., using the coordinate information stored in the control device 96 controls the inspection stage 95 in the point 97, the original edge of the wafer W by the edge of the inspection of the inspection unit may be moved again to the edge portion by the inspection portion the position of the observation. 说明该第1变形例的效果。 The effect of this modification of the first embodiment.

根据本变形例,例如当移动放置在检查台95上的晶片W,用显微镜32观察晶片W的边缘部时,不但想观察晶片正面,还想直接观察边缘部的情况下或者相反的情况下,即在外观检査与边缘部检查之间转移的情况下,仅通过按下一个操作部70的按钮来存储各检查中观察到的点的坐标信息,使用该坐标信息移动晶片W,所以能在各检查中观察相同的观察的点。 According to this modification, for example, when the mobile station 95 is placed on the inspection of the wafer W, when the microscope 32 with the edge portion of the wafer W was observed not only want to observe the front side of the wafer, I would like to directly observe the case of the edge portion or the opposite case, i.e., between the case where the visual inspection and the inspection portion of the transfer edge, just by pressing a button operation unit 70 stores the coordinate information of points observed in each check, using the coordinate information of the mobile wafer W, it is possible in each examination observed in the same observation point. 因此,例如在观察从晶片正面延续到边缘部背面的伤痕和缺口等的情况下,可通过显微镜进行的外观检査和边缘部检査而没有位置偏差地连续观察这些伤痕和缺口的位置,所以能提高观察精度和观察速度。 Thus, for example, when viewed from the front side of the wafer continues to flaw and the back edge portion of the notch or the like, and an edge portion of visual inspection can be performed by microscopic inspection without positional deviation continuously observe the location of these notches and scratches, so observation and observation accuracy can be improved speed.

由此,能顺利地连续进行晶片W的边缘部、其他正面的外观检查、 边缘部检查。 Thus, the edge can be smoothly continuous portion of the wafer W, other positive visual inspection, the edge of the inspection.

(第2实施方式) (Second Embodiment)

第2实施方式的特征在于,边缘部检査部设置在通过目视进行检查的宏观检查部上。 A second embodiment is that the edge portions of the inspection unit is provided on a macroscopic inspection by visual inspection. 其他结构和作用与第l实施方式相同。 The other structure and action of the first embodiment l.

如图4所示,在外观检査装置51中,边缘部检查部6"1 (外缘部检査单元)可自由拆装地设置在宏观检查部10的安装板15上。边缘部检查部61具有固定在安装板15上的固定部62、 一轴台63、安装有放大像取得部44的基座部42,基座部42被安装为可自由接近和离开位置P2。 如图5所示,在基座部42最接近的检查位置上,水平保持在宏观检査单元22上的晶片W的边缘部进入凹部43。此外,如假想线所示,在基座部42离开最远的位置上,从宏观检查区域C退避,不会妨碍回转臂16 的转动和宏观检査单元22引起的晶片W的摇动(摆动)。 4, in the appearance inspection apparatus 51, the edge portion 6 of the inspection, "1 (the outer edge portion of the inspection unit) detachably provided on a macroscopic inspection portion 15 of the mounting plate 10 edge portion of the inspection 61 has a fixed portion 62 fixed to the mounting plate 15, a pillow block 63 is attached to an enlarged image acquiring unit 44 of the base portion 42, the base portion 42 is mounted to be freely toward and away from position P2. FIG. 5 shown in the inspection position 42 closest to the base portion, the horizontal portion of the wafer W held on the edge on the macroscopic inspection unit 22 into the recess 43. in addition, as shown in phantom line, in the base portion 42 furthest away position, retracted from macroscopic examination region C, the wafer W does not interfere with the pivot arm caused by the rocking (oscillating) 16 rotation and macroscopic inspection unit 22.

此外,宏观检查单元22是除了升降机构、摇动机构之外还设置有旋转机构的保持单元,该旋转机构在使晶片W摇动的状态下旋转所保持的晶片W。 Further, the macroscopic examination unit 22 is in addition to the lifting mechanism, the swing mechanism is also provided with a holding means of the rotating mechanism, the rotating mechanism rotating the wafer held by the wafer W at a swing state W.

在该实施方式下进行晶片W的外观检查的情况下,通过宏观检查单元22吸附保持被搬运到位置P2上的晶片W并进行宏观检查。 In the case of visual inspection of the wafer W in this embodiment, holding the wafer W is conveyed to the position P2 by macroscopic and macroscopic inspection unit 22 checks adsorption. 当宏观检查结束之后,将晶片W水平保持在规定高度上,把边缘部检查部61移动到检查位置上。 When the end of a macroscopic inspection, the wafer W is horizontally held at a predetermined height, the edge portion of the inspection unit 61 to move the inspection position. 然后, 一边用宏观检查单元22旋转晶片W, 一边与第1实施方式相同地进行边缘部检查。 Then, the macroscopic inspection unit 22 while rotating the wafer W, while the edge portion with the same inspection of the first embodiment. 当边缘部检查结束之后,使边缘部检査部61后退到等待位置,之后将晶片W从宏观检査单元22移动放置到搬运臂19。 When the end edge of the inspection, inspection portion of the edge portion 61 retracted to the standby position, the wafer W is placed after moving from the macro inspection unit 22 to the transfer arm 19. 而且,旋转回转臂16而将晶片W搬运到位置P3。 Further, the pivot arm 16 and rotating the wafer W carried to the position P3. 然后,将晶片W移动放置到微观检査部11上进行微观检查,当微观检查结束之后,使晶片W经由位置P3返回到位置P1,然后将其收容到晶片托架4B 上。 Then, the wafer W is placed on the moving portion 11 Microscopic examination of microscopic examination, microscopic examination after the end of the wafer W is returned to the position P1 through P3 position, and then storing it onto the wafer carrier 4B.

另外,在该外观检査装置51中,结束宏观检査之后再转移到边缘部检查,但也可以通过控制装置45的控制而在任意的定时转移到宏观检查或者边缘部检查。 Further, in the appearance inspection apparatus 51, and then transferred to an edge portion of a macroscopic inspection after the inspection, but can also be transferred to a macroscopic inspection or edge inspection unit at an arbitrary timing by the control of the control means 45. 而且,还可以不进行微观检查而只进行宏观检查和边缘部检査,也可以不进行宏观检査而只进行微观检査和边缘部检查。 Furthermore, microscopic examination also may not be performed but only the edge portion macroscopic examination and inspection, inspection may not be performed only for macroscopic examination and microscopic examination edge portion.

在本实施方式中,在宏观检査部10中设置边缘部检查部61,在宏观检查和边缘部检査双方中共用宏观检查部10的宏观检査单元22,因此, 能减小装置的设置面积。 In the present embodiment, the macroscopic examination unit 10 checks the portion 61 is provided an edge portion, the edge portion at macroscopic examination and inspection shared by both macroscopic examination unit 22 checks the macro-portion 10, therefore, the setting means can be reduced area. 而且,可无需从宏观检查中转交晶片W就进行边缘部检查,且与用独立装置构成的情况相比边缘部检查部61的移动距离也可大幅度减小,所以能縮短检查的生产节拍时间。 Further, the macro can be transmitted without examination on the edge portion of the wafer W inspection, and may also be greatly reduced compared to the moving distance of the edge portion 61 of the inspection apparatus by the case independently of the configuration, it is possible to shorten the examination time tact . 另外,将宏观检査单元22与边缘部检査部61设置为可相对自由接近离开所带来的效果、 以及安装在同一块安装板15上所带来的效果与第1实施方式相同。 Further, the macroscopic examination of the inspection unit 22 and the edge portion 61 to be disposed relatively freely toward and away from the effect brought about, and mounted on a mounting plate 15 with the effect brought by the first embodiment. 而且, 将边缘部检査部61构成为可自由拆装于宏观检查部10的效果与第1实施方式相同。 Further, the edge portion of the inspection unit 61 is configured to detachably and 10 to effect the first portion of the same embodiment macroscopic examination.

(第3实施方式) (Third Embodiment)

第3实施方式的特征在于,边缘部检查部被设置在自动宏观检查部上,该自动宏观检查部通过图像处理从由摄像装置拍摄到的图像中自动提取缺陷。 A third embodiment is that the edge portion is provided on the inspection portion of the automatic macroscopic examination portion, macroscopic examination of the automatic defect portion automatically extracted from the image taken by the imaging device by image processing to the. 其他结构和作用与第1实施方式相同。 Other structure and action are same as the first embodiment.

如图6和图7所示,外观检查装置71具有经过减振的安装板72, 在安装板72上构筑有自动宏观检査部73。 As shown in FIG 6 and FIG 7, through the appearance inspection apparatus 71 has a damping mounting plate 72 is mounted on the build plate 72 with a portion 73 automatically macroscopic examination. 自动宏观检查部73具有检查台74、以在X方向上失着检查台74的方式固定的照明部75和摄像部76。 Macroscopic examination section 73 having an automatic inspection station 74 to check out the table 74 in the X direction, the illumination portion 75 of the fixed portion 76 and the imaging.

20检查台74由X轴台77、 Z轴台78和作为旋转机构的旋转轴79构成,在旋转轴79上固定有吸附保持晶片的保持板80。 20 checks table 74 77, Z-axis table 78 and the rotation axis as a rotation mechanism is constituted by an X-axis table 79, the rotary shaft 79 is fixed to the suction holding of the wafer holding plate 80. 照明部75具有线光源, 该线光源从斜上方对晶片W的上表面(正面)照射线状的照明光。 Illuminating portion 75 has a linear light source, a line light source illuminating light from obliquely above the upper surface of the wafer W (the front side) of the linear illumination. 线光源在与X方向正交的Y方向上延伸。 Line source extending in the Y direction orthogonal to the X direction. 同样地,摄像部76配置有光学系统,使得拍摄来自照明部75的照明光在晶片W的上表面所反射的线状的反射光和衍射光,在其像位置上,在Y方向上呈线状地排列有摄像元件。 Similarly, the imaging unit 76 is disposed an optical system, such that the photographing illumination light from the illumination light and the diffracted portion of light 75 reflected on the surface of the wafer W in the reflected linear, like in its upper position, in the Y-direction line- arrayed imaging element. 并且,摄像部76的光轴与照明部75的光轴被配置为在晶片W的上表面上交叉。 Further, the optical axis of the imaging unit 76 and the illumination unit 75 is arranged to intersect the upper surface of the wafer W. 并且,摄像部76与照明部75被设置在可自由转动的部件91、 92上,部件91、 92在各自交叉的晶片W上的线上具有旋转轴90。 Further, the imaging unit 76 and the illumination portion 75 is rotatably provided on the member 91, 92, member 91, 92 on the respective lines cross the wafer W having a rotating shaft 90. 通过摄像部76和照明部75独立地转动,可在正反射、±1、 土2次的衍射光等适于各种观察条件的角度下进行拍摄。 , Imaging can be performed for all observed at an angle of specular reflection conditions, ± 1, soil and other secondary diffracted light by the imaging portion 76 to rotate independently and an illumination portion 75.

而且,在安装板72上固定有边缘部检查部12。 Further, on the mounting plate 72 is fixed to an edge portion 12 of the inspection. 边缘部检查部12设置在从假想线所示的晶片W的宏观检查区域D退避的位置上。 Edge of the inspection portion 12 provided on the wafer W shown in macroscopic examination region from an imaginary line D retracted position. 另外,检査台74在X方向上的可动范围大于宏观检查区域D,可使晶片W的边缘部进入边缘部检查部12的凹部43内。 Further, in the X-direction movable table 74 is larger than macroscopic inspection range of the inspection area D, make the edge portion of the wafer W into the edge 12 of the recess 43 of the inspection unit.

说明本实施方式的作用。 Effects of the present embodiment will be described. 预先使检査台74在位置P4所示的转交位置上等待,通过未图示的搬运机械臂将晶片W搬入转交位置,将晶片W 吸附保持在检查台74上。 Waiting for the inspection table 74 in advance at the passing position shown in the position P4, the robot arm (not shown) conveying the wafer W is loaded the transfer point, the wafer W is sucked and held on the inspection table 74. 接着,通过使检查台74在X方向上向边缘部检查部12侧移动,来自照明部75的线状的照明光在晶片W上表面反射, 按照每条线被摄像部76取入,拍摄晶片W整体的图像。 Next, the inspection stage 74 is moved toward the side edge 12 of the inspection unit in the X direction, from the linear illumination light illuminating portion 75 of the surface reflection, each line in accordance with the imaging section 76 is taken on the wafer W, the wafer shooting W overall image.

控制装置45取由摄像部76拍摄到的图像和预先取得的合格品的图像的差值,通过图像处理将亮度差在恒定值以上的区域作为缺陷进行提取。 Qualified difference image taken by the image pickup section 76 to the imaging control device 45 and obtained in advance by image processing the luminance difference is extracted as a defect in the above constant region. 然后,按照每个晶片W在存储部中登记提取出的缺陷的位置、大小的信息和经过自动缺陷分类的分类信息。 Then, according to the position of each wafer W registered in the storage unit the extracted defect information and the size information is automatically categorized classification of defects.

当晶片W的自动宏观检查结束之后,进一步在X方向上移动检查台74,使得其接近边缘部检查部12,使晶片W的边缘部进入边缘部检查部12的凹部43。 When the wafer W after the automatic macroscopic examination, examination is further moved in the X direction stage 74 so that it approaches the edge of the inspection unit 12, so that the edge portion of the wafer W into the edge portion of the inspection portion of the recess portion 4312. 在该位置上使晶片W在e方向上旋转,与第1实施方式同样地进行边缘部检查。 In this position, the wafer W on the rotational direction e, check edge portion similarly to the first embodiment. 当边缘部检查结束之后,停止晶片W的旋转后返回到位置P4,搬出晶片W。 When the end portion of the edge inspection, to stop the rotation of the wafer W is returned to the position P4, unloading the wafer W. 另外,在该外观检查装置71中,在结束自动宏观检查之后再转移到 Further, in the appearance inspection apparatus 71, after the end of a macroscopic inspection and transferred to the automatic

边缘部检査,但也可以通过控制装置45的控制在任意的定时转移到宏观检查或者边缘部检查。 The edge of the inspection, but can also be controlled by the control means 45 at an arbitrary timing is transferred to a macroscopic inspection or edge inspection unit. 此外,还可以配置边缘部检査部12,使得在自动宏观检査结束之后,晶片W的边缘部进入边缘部检查部】2的凹部43内。 In addition, an edge portion can also be configured to check portion 12, so that after the automatic macroscopic examination, the edge portion of the wafer W into the edge portion of the inspection portion of the recess 43] 2. 由于照明部75被配置为可转动,所以即使在这种位置上配置边缘部检査部12,只要不妨碍自动宏观检査就可进行配置。 Since the illumination unit 75 is configured to be rotatable, so that even in such an edge portion disposed at a position checking portion 12, do not prevent the macroscopic examination can be automatically configured. 而且,还可以将边缘部检査部12构成为可在X方向上自由移动,边缘部检查部12接近自动宏观检查结束之后的晶片W。 Further, the edge portion may also be configured to check portion 12 is freely movable in the X direction, the edge portion 12 approaches the inspection portion after the end of the automatic wafer W. Macroscopic examination

在本实施方式中,在自动宏观检查部73中设置边缘部检查部12, 在宏观检査和边缘部检査两方中共用自动宏观检查部73的检查台74,所以能减小装置的设置面积。 In the present embodiment, the automatic macroscopic examination portion 73 is provided an edge portion 12 of the inspection, inspection are common to both the macro automatic inspection of the inspection table 7473 in the macroscopic examination and the edge portion, so that the device can be reduced provided area. 而且,可无需从宏观检査中转交晶片W就进行边缘部检查,且与用独立装置构成的情况相比检查台74的移动距离也可大幅度减小,所以能縮短检查的生产节拍时间。 Further, the wafer W can be transmitted without macroscopic examination on the edge of the inspection and compared with a case of constituting a separate device from the mobile station 74 checks may also be greatly reduced, the inspection can be shortened tact time. 尤其,当移动检査台74而使晶片W的边缘部进入边缘部检査部12的凹部43的情况下,通过仅使捡査台74在X方向上延长而能低成本地进行制造。 In particular, when the mobile station 74 checks the edge portion of the wafer W into the edge portion of the inspection portion of the case 12 of the recess 43, but can be manufactured at low cost extended by Haka only the table 74 in the X direction. 另外,将检查台74和边缘部检査部12设置为可自由相对接近离开所带来的效果、以及安装在同一块安装板72上所带来的效果与第1实施方式相同。 Further, the inspection station 74 and the edge effect of the inspection unit 12 is provided to be freely brought relatively close to the departure, and mounted in the same block 72 brings the same effects as those of the first embodiment of the mounting plate. 此外,将边缘部检查部12构成为可自由拆装于自动宏观检查部73的效果与第1实施方式相同。 Further, the edge portion of the inspection unit 12 is configured the same as the automatic detachably macroscopic examination unit 73 and the effect of the first embodiment.

另外,本发明不限于上述各实施方式而可广泛应用。 Further, the present invention is not limited to the above embodiments but can be widely applied. 例如,在第1实施方式中,边缘部检査部12的设置位置不限于图1 所示的位置,也可以安装在安装板30的侧缘部。 For example, in the first embodiment, the edge position of the inspection unit 12 is provided is not limited to the position shown in FIG. 1, it may be attached to the side edge portion 30 of the mounting plate. 在该结构中,可使安装板30的前侧变小。 In this configuration, the front side of the mounting plate 30 can be reduced. 在该情况下也将边缘部检查部12配置为在微观检查时不会产生妨碍的位置上等待。 In this case also, the edge portion 12 is configured to check when waiting will not interfere with microscopic examination position.

还可以是如下的外观检査装置:不具有宏观检查部IO而仅具有微观 Appearance inspection apparatus may also be as follows: IO portion having no macroscopic examination and microscopic only

检査部11和边缘部检查部12。 Checking portion 11 and an edge portion 12 of the inspection. 同样地,还可以是如下的外观检査装置: Likewise, the appearance inspection apparatus may be as follows:

不具有微观检查部11而仅具有宏观检査部10和边缘部检査部12。 Microscopic examination having no macroscopic examination portion 11 and the edge portion 10 of the inspection unit 12 only. 此外, 还可以是由自动宏观检查部73和微观检査部11构成的外观检査装置。 In addition, the appearance inspection apparatus may also be constituted by the automatic macroscopic examination and microscopic examination section 73 portion 11. 还可以通过在显微镜32上设置晶片W的边缘部可进入的凹部,并 Can also recesses provided in the upper edge portion 32 of the wafer W may enter the microscope, and

22在该凹部上配置放大像取得部44来形成边缘部检查部。 An enlarged image acquisition section 22 is configured to form an edge portion 44 on the inspection portion of the recessed portion. 在该情况下,能进一步减小微观检查部ll的空间。 In this case, the space can be further reduced to microscopic inspection portion ll. 此外,只要具有配置空间,则既可以 Further, as long as the configuration space, either

在位置Pl上设置旋转台和边缘部检查部,也可以在位置P3上设置旋转 The turntable is provided and an edge portion of the inspection position Pl, may be provided on the rotational position P3

台和边缘部检査部。 And an edge portion of the inspection station.

工件不限于半导体晶片,还可以应用玻璃基板等各种工件。 The workpiece is not limited to a semiconductor wafer, various workpieces may also be applied as a glass substrate. 此外,在上述边缘部检查部的结构中,可采用具有如下说明的可变 Further, in the configuration of the inspection portion of the edge portion, as explained below may be employed with variable

视野方向观察装置的结构。 Observation means visual field direction of the structure. 该可变视野方向观察装置为具备上述放大像 The observation means is a variable visual field direction includes the enlarged image

取得部44的1眼式的例子的具体结构的变形例(下面称作第2变形例)。 Modification of the specific configuration of the example of the formula to obtain a portion 44 (hereinafter referred to as a second modification). 下面,以上述工件是作为平板状试样的晶片的情况为例进行说明。 Next, the above-described workpiece is a wafer as the plate-like sample described as an example. 首先,说明本变形例的可变视野方向观察装置的概念。 First, a variable field direction means the concept of the present modification observed. 对于可变视野方向观察装置,例如说明将其安装在显微镜装置上的—个例子。 For variable observation means visual field direction, which will be described, for example, a microscope mounted on apparatus - an example.

本变形例的可变视野方向观察装置的实施方式是如下的观察装置: 将由晶片等构成的平板作为试样(观察对象物或者标本)进行保持,配置到可向彼此正交的3轴方向移动和旋转的显微镜装置的台的附近而观察试样的外周端面。 DESCRIPTION variable field direction of the observation apparatus of the present modification is the observation that means: a flat plate such as a wafer by a sample (or specimen observation object) for holding, may be configured into three axial directions orthogonal to each other to move nearby station apparatus and a microscope observation and rotation of the outer circumferential end surface of the sample. 例如设晶片为(平板状)的试样,则在垂直于晶片主面的方向上配置观察光学系统(此处,例如为摄像光学系统)的光轴。 For example, the wafer is provided (plate-shaped) sample, in a direction perpendicular to the main surface of the wafer disposed observation optical system (here, for example, the imaging optical system) of the optical axis.

使放置在该摄像光学系统固有的从焦点位置到物镜的距离、即所谓的WD (工作距离)的内侧的旋转镜旋转,变更试样观察设置方向(视野方向), 由此使其具有始终将伴随视野方向变更的物镜和试样之间的距离保持为上述WD的机构。 Placed so that the distance from the focal position inherent to the objective lens of the imaging optical system, i.e. so-called inside of the WD (working distance) of the rotating mirror is rotated to change direction is provided to observe the specimen (view direction), whereby it has always the distance between the objective lens along the view direction changes and the sample holding means above WD.

在本变形例中,由放置有观察光学系统和旋转镜的光学系统台(2 轴台二ZX台)、将镜的旋转移动到Z方向的旋转台以及卡合在这些旋转台上的2个凸轮构成基本的要素。 In this modification, the optical system is placed by the observation optical system and a rotating mirror stage (stage 2 ZX two-axis stage), the rotation of the movable mirror to the Z direction and the turntable engages in the turntable 2 the basic configuration of the cam elements.

作为本变形例的概念上的结构由下述a、 b、 c、 d、 e构成。 As a conceptual structure modification according to the present embodiment by the following a, b, c, d, e configured.

a. 在与试样的面正交的方向(Z方向)和平行的方向(X方向)上可动的2轴台; . A surface of the sample in a direction perpendicular (Z-direction) and parallel to the direction (X direction) on the movable shaft 2 of the table;

b. 具有使2轴台在Z方向上移动的驱动部的基座; . B-axis table with the susceptor 2 to move in the Z-direction driving portion;

C.台的X方向移动部,其由下列部分构成:固定在基座上的X方向 C. X-direction movement stage portion, which consists of the following parts: the base is fixed to the X-direction

23凸轮;与安装在上述2轴台的X方向移动板上的凸轮卡合的辊;在使基座和X方向移动板(X台)接近的方向上作用的拉伸弹簧; The cam 23; the X-direction movement of the shaft 2 mounted on the table plate cam engaging rollers; and in that the X-direction moving base plate (stage X) in the direction of action of the tension spring close;

d. 在X台上配置有把光轴调整为与试样面成直角的观察(f微镜) 光学系统、以及在该显微镜的物镜和该透镜的焦点位置之间将^細任意偏向的旋转镜; d. In the X axis table is arranged to adjust the surface of the sample to be observed and perpendicular to (f micromirror) optical system, and any deflection of the rotation of the microscope between the objective lens and the focal position of the lens fine ^ mirror;

e. 具有固定在基座上的镜凸轮和与安装在从上述旋转镜的旋'转轴突出的旋转臂上的凸轮卡合的辊,在旋转臂和设有X台的拉杆(弹簧挂钩) 之间配置拉伸弹簧,该拉伸弹簧作用在将辊按压在凸轮上的方向上,通过基座的驱动装置,观察光学系统的位置和旋转镜的角度随凸轮而变化, 即使移动视野方向,焦点也始终在试样的端面上。 e. having a mirror fixed to the base and the cam from rotating the swivel arm projecting cam engaging shaft of the roller of said rotating mirror ', with the X stage and the rotary arm lever (spring hook) installed in the disposed between the tension spring, the tension spring acts in the direction of the roller pressed against the cam by driving the base unit, the position of the optical observation system and the rotation angle of the mirror varies with the cam, even if the moving direction of the field of view, focus always end face of the specimen.

虽然该可变视野方向观察装置可以作为检查(观察)装置独立地构成,但也可以安装成将晶片用显微镜装置的晶片作为试样进行保持,配置到可向彼此正交的3轴方向移动和旋转的显微镜装置的台的附近,可观察保持在台上的试样的外周端面。 While this observation means visual field direction variable may be independently configured as an inspection (observation) apparatus, but may be mounted to the wafer by the wafer holding means as a microscope specimen may be disposed to the three axial directions orthogonal to each other and move near the rotating table microscope apparatus can observe the specimen table held at the outer circumferential end face. 当然,如后所述,试样不限于晶片。 Of course, as described later, the sample is not limited to the wafer. 此外,在下面的说明中,将试样取为晶片,将试样的正背面的平面部称为主面。 Further, in the following description, taken as a sample wafer, the planar portion is the back surface of a sample is called the primary. 此外,试样的外周端面主要是指并非试样的正背面的平面的边缘部,在通过加工实施倒角等后的情况下和涂布了抗蚀剂后、观察环绕在除去边缘部的抗蚀剂后的正面的被称作边缘切割线(edge cut line)的部分背面的周围部的抗蚀剂等的情况下,假定也包含该周围部分。 Further, the outer peripheral end surface of a sample mainly refers to the edge portions of the front and back of the plane of the sample are not, in the case of processing by the chamfering and the like after the resist is coated, anti observed around the edge portion is removed like the case where the resist around the back portion of the front portion of the rear of the corrosion inhibitors is referred to an edge cut line (edge ​​cut line), it is assumed that the peripheral portion is also included.

下面,详细说明本变形例的第l方式(以下简称为第l方式)。 Next, a detailed description of a first embodiment of the present modification l (hereinafter referred to as the first embodiment l).

图8和图9A、 9B表示可变视野方向观察装置200的第1方式。 8 and FIG. 9A, 9B denotes a variable field of view direction of the observation apparatus 200 in the first embodiment. 此处,图8是表示从正面观察第1方式的可变视野方向观察装置的结构例的图,图9A是表示从侧面观察第1方式的可变视野方向观察装置的结构例的图,图9B是表示从图9A的箭头Al侧(与图8相对的背面侧)观察到的镜凸轮的结构例的图D Here, FIG. 8 shows a view of the first embodiment is a variable field direction from the front showing a configuration example of the observation apparatus, FIG. 9A is a diagram showing a configuration example of a variable field from the apparatus of the first embodiment in a side view seen in the direction, FIG. 9B is a diagram illustrating a configuration example D as viewed from the side of arrow Al of FIG. 9A (the side opposite to the back surface in FIG. 8) to the cam mirror

说明该可变视野方向观察装置200的结构。 Description of the variable visual field direction of the device structure 200 is observed. 另外,在下面的说明中, 将与作为试样的晶片的主面相同的方向且与端面的接线正交的方向设为X方向,将与主面正交的方向设为Z方向。 In the following description, a direction orthogonal to the wiring main surface of a sample wafer in the same direction and the end face is defined as X direction, the Z direction and a direction perpendicular to the main surface.

本装置的基座101是钢、铝或者不锈钢等金属材料的板形部件。 The unit base 101 is a plate-shaped member of metal materials such as steel, aluminum, or stainless steel. That

24基座101的长度方向被配置在与作为试样的晶片114的主面正交的方向上。 24 the longitudinal direction of the base 101 are arranged in a direction to the main surface of the wafer as a sample 114 of perpendicular.

在该基座101的上端以突出为L字形的方式安装有电动机安装板 Upper end of the base 101 in a manner projecting L-shaped mounting plate attached to the motor

101a,在该电动机安装板101a上设有电动机102。 101a, motor 102 is provided on the motor mounting plate 101a. 电动机102的旋转轴(未图示)通过未图示的控制器在X方向上旋转。 A rotating shaft (not shown) of the motor 102 is rotated in the direction X by a controller (not shown). 电动机102的旋转轴与滚珠螺杆103a连接。 The rotation shaft of the motor 102 is connected to the ball screw 103a. 滚珠螺杆103a可自由旋转地插入嵌合在滚珠螺杆导向件103b上,该滚珠螺杆导向件103b安装在臂105a上,该臂105a 从固定在基座101上的Z移动台105伸出。 The ball screw 103a is rotatably fitted on the ball screw is inserted into the guide member 103b, 103b guide the ball screw mounted on the arm 105a, 105a of the arm moves from the fixed base 101 on a Z stage 105 protrudes. 通过这些滚珠螺杆103a和滚珠螺杆导向件103b构成滚珠螺杆组件103。 These ball screw ball screw 103a and 103b guide member 103 constituting the ball screw assembly. 通过该结构,借助于电动机102的旋转轴的旋转使滚珠螺杆103a移动,以推起或者按下滚珠螺杆导向件103b。 With this configuration, the rotation shaft of the motor 102 by the rotation of the ball screw 103a is moved or pressed to push up the ball screw guide member 103b.

此外,由固定在Z方向移动台105上的轨道104a和可滑动地与轨道104a卡合且固定在基座101上的外壳104b构成Z方向移动线性导向件104。 Further, the Z-direction movement fixed rail 104a on the table 105 and are slidably engaged on the base 101 and fixed rails 104a and 104b constituting the housing of the card moving direction Z linear guide 104.

而且,在基座101上,通过多个支柱固定有凸轮108,该凸轮108 形成有在上方侧弯曲为凹形的凸轮面108a。 Further, on the base 101, by a plurality of struts 108 fixed to a cam, the cam 108 has a concave curved upper side of the cam surface 108a is formed. 在该基座101的下方侧通过多个支柱固定有镜凸轮118,该镜凸轮118形成有弯曲为与凸轮面108a 不同的凹形的凸轮面118a。 In the lower side of the base 101 by a plurality of struts 118 fixed to cam the mirror, the mirror 118 is formed with a curved cam 108a is different from the cam surface of the concave surface 118a.

而且,由固定在Z方向移动台105上的轨道106a、和可滑动地与轨道106a卡合且固定在X移动板107上的外壳106b构成X方向移动线性导向件106。 Further, in the Z-direction movement fixed rail 106a on the table 105, and 106a are slidably engaged with the rail and is fixed to the X moving plate 107 constituting the X-direction moving 106b housing a linear guide 106. 通过该结构,基于X方向移动线性导向件106的Z方向移动台105和基于Z方向移动线性导向件104的X移动板107可相对于XZ平面二维地进行移动。 With this structure, the movement in the Z direction of the linear guide member 106 and the moving mobile station 105 based on the linear guide 104 moves in the Z direction X plate 107 can be moved two-dimensionally relative to an XZ plane based on the X direction.

此外,在X移动板107上可旋转地固定有凸轮辊109,该凸轮辊109 一边沿着凸轮108的凸轮面108a旋转一边移动。 Further, in the X-moving plate 107 is rotatably fixed to a cam roller 109, the cam roller 109 while moving along the cam surface 108a of the cam 108 rotation. 在X移动板107上可转动地设有旋转轴116。 Movement in the X-plate 107 may be provided with a rotary shaft 116 rotatably. 以从该旋转轴116延伸出来的方式一体地固定有旋转臂119。 So as to extend from the rotary shaft 116 is integrally fixed out of the rotary arm 119. 在旋转臂119上可旋转地安装有凸轮辊117,该凸轮辊117沿着作为转动引导部发挥作用的镜凸轮118的凸轮面118a移动。 On the rotary arm 119 is rotatably mounted a cam roller 117, the cam roller 117 is rotated along the guide portion functioning as a mirror of the cam surface 118 of the moving cam 118a. 旋转轴116 通过凸轮辊117沿着凸轮面118a移动而旋转。 The rotation shaft 116 rotates the cam roller 117 moves along the cam surface 118a by. 在基座101的凸轮108侧的上端设有拉杆形状的弹簧挂钩121a,在X移动板107的上端且弹簧挂钩121a的相反侧设有弹簧挂钩121b。 In the upper side of the base 101 of the cam lever 108 is provided with a hook shaped spring 121a, and the upper end of the spring hook X moving plate 107 on the opposite side 121a of a spring hook 121b. 在这些弹簧挂钩121a、 121b上悬挂固定有拉伸弹簧111。 In the spring hook 121a, a tension spring 111 is fixed to the suspension on 121b. 通过该拉伸弹簧111 的推力,作用为凸轮辊109始终推压在凸轮108上。 By the urging force of the tension spring 111, acting as a cam roller 109 is always pressed against the cam 108. 如图9B所示,拉伸弹簧120悬挂固定在旋转臂119的孔和设置在X移动板107上的弹簧挂钩122A之间。 9B, the suspension spring tension spring 120 fixed to the rotary arm 119 and a hole provided in the X-moving plate 107 between the hook 122A. 通过拉伸弹簧120的推力,作用为凸轮辊117始终推压在镜凸轮118的凸轮面118a上。 By a tensile force of the spring 120, acting as a cam roller 117 is always pressed on the mirror surface 118a 118 of the cam.

而且,在X移动板107上,设置有作为观察光学系统的摄像部123, 该摄像部123在与安装在旋转台上的状态的晶片的主面正交的方向上具有光轴。 Further, in the X-moving plate 107, is provided as an imaging unit of the observation optical system 123, the imaging unit 123 has an optical axis in a direction perpendicular to the main surface of the wafer is mounted on the rotary table and the state of. 该摄像部123由成像透镜122和CCD相机112构成,该CCD 相机112接收在成像透镜122上成像的光像,生成经过光电转换;的图像信号。 The imaging unit 123 is constituted by an imaging lens 122 and a CCD camera 112, CCD camera 112 receives the light image on an imaging lens 122 for imaging, generating through photoelectric conversion; image signal. 当然,成像透镜122既可以像显微镜那样由物镜和对来自物镜的无限远光束进行成像的透镜构成,也可以使用变焦透镜单体。 Of course, the imaging lens 122 may be configured as a lens for imaging by the objective lens and the light beam from the objective lens to infinity microscope image, a zoom lens monomers may be used. 此外,对焦和变焦变倍机构也可以是电动的。 In addition, focus and zoom zoom mechanism may also be electrically powered. 在成像透镜的WD内具有使成像透镜122的光轴偏向的旋转镜115,其与安装在X移动板107上的旋转轴116接合。 Having an imaging lens optical axis 122 so that rotation of the deflecting mirror 115 in the imaging lens WD, which engages with the rotating shaft mounted on the moving plate 107 X 116.

说明安装在这样构成的显微镜装置上的可变视野方向观察装置200 的动作。 DESCRIPTION variable field direction is mounted on a microscope apparatus constituting such an operation apparatus 200 viewed.

说明本装置在下面的步骤中,即使相对于晶片的端面改变视野方向(即使旋转旋转镜)也始终对焦的情况。 In the following the present apparatus described steps, even if the end surface of the wafer to change the direction of the field of view (even if the rotation of the rotating mirror) relative to always focus.

首先参照图8,按照检查者(观察者)的指示,通过未图示的控制器的控制来使电动机102旋转。 Referring first to FIG. 8, the instructions examiner (observer), and to the motor 102 is rotated by the control of a controller (not shown). 滚珠螺杆103a也通过该旋转而旋转,以推起或者按下滚珠螺杆导向件103b的方式进行移动。 The ball screw 103a is also rotated by the rotation, or by pressing the push-up manner to the ball screw moves the guide member 103b. 当为按下移动时, Z驱动板105按照Z方向移动线性导向件104的导向方向以接近晶片114 的方式进行移动。 When the depressing movement is, Z direction of the guide drive plate 105 is moved in accordance with a linear guide 104 in the Z direction closer to the wafer 114 is moved manner.

在其下降时,Z驱动板105通过拉伸弹簧111的推力使凸轮辊109 按压在凸轮108上,沿着凸轮面108a右向移动。 When it is lowered, Z drive plate 105 causes the cam roller 111 by the urging force of the tension spring 109 is pressed against the cam 108, the cam surface 108a along the right mobile. 与此同时,旋转臂119 也通过拉伸弹簧120使凸轮辊117按压在镜凸轮118的凸轮面118a上进行移动。 At the same time, the rotary arm 119 by the tension spring 120 presses the cam roller 117 moves on the mirror surface 118a 118 of the cam. 当凸轮辊117沿着凸轮面118a进行移动时,旋转臂119在顺时针方向进行转动。 When the cam roller 117 moves along the cam surface 118a, the rotating arm 119 is rotated in the clockwise direction.

也就是说,成像透镜122沿着Z方向(光轴方向)以接近晶片114 的方式下降,同时在晶片114的主面方向以离开端部的方式在X方向上进行移动。 That is, the imaging lens 122 in a manner close to the wafer 114 is lowered along the Z-direction (optical axis direction), while the main surface of the wafer 114 in a direction away from the end portion is moved in the X direction. 如图8所示,实际上晶片114的端部和旋转轴116下降相同距离(WD)。 As shown, in fact, the end portion of the rotary shaft 116 of the wafer 114 drops 8 are the same distance (WD). 随着此时旋转臂119在顺时针方向上的转动,旋转镜115 也顺时针转动。 At this time, with rotation of the rotary arm 119 in the clockwise direction, rotating mirror 115 is also rotated clockwise. 即,凸轮面I18a的形状被设计为,成像透镜122的光轴在旋转镜1:15上偏向,光轴和晶片114的端面始终一致,且其端面通过旋转镜与成像透镜的距离WD保持为恒定。 That is, the shape of the cam surface is designed to I18a, the optical axis of the imaging lens 122 on the rotating deflecting mirror 1:15, the end face of the optical axis and the wafer 114 is always the same, and the end face held by the rotating mirror and the imaging distance WD of the lens is constant.

其结果,能实现即使改变观察晶片U4的端面的角度(e),成像透镜122的焦点也始终与其端面重合的状况。 As a result, changing the angle can be realized even if the end surface of the wafer was observed U4, (E), the focus of the imaging lens 122 always coincides with the end face of its status. 不过,在本实施方式中,优选的是可观察的视野方向相对于晶片114的主面为±45度左右。 However, in the present embodiment, it is preferable that the direction of the field of view can be observed with respect to the main surface of the wafer 114 is approximately ± 45 degrees. 其理由在于,当旋转镜115的反射角度接近与成像透镜122的光轴平行时,必须使旋转镜115的反射面(镜面)变得极大,所以实质上镜的反射面的面积具有限制。 The reason is that, when the rotation angle of the optical axis of the reflection mirror 115 is close to the imaging lens 122 is parallel to the reflecting surface must be of the rotating mirror 115 (mirror) becomes extremely large, so the area of ​​the reflecting surface of the mirror having a substantially limit.

参照图10A、图10B简单说明其理由。 Referring to FIGS. 10A, 10B briefly described reason.

如图IOA所示,用实线表示从与晶片114的主面相同的方向"=0) 开始观察时的成像透镜122和旋转镜U5 "2=45度)的位置关系,虚线表示从上方观察端面时的成像透镜122和旋转镜115的位置关系。 FIG IOA shown by a solid line from the main surface of the wafer 114 in the same direction "= 0) and the imaging lens 122 at the start of the rotating mirror U5 observed" positional relationship 2 = 45 degrees), as seen from above the dashed line represents the positional relationship between the imaging lens 122 and a mirror 115 during rotation of the end face.

当^为^时,6>2= (1/2) *^。 When ^ when ^ 6> 2 = (1/2) * ^. 由此,0越大则62也越大,如单点划线所示,反射面与光轴一致,会对观察产生妨碍。 Thus, the larger 62 0 greater, as dashed-dotted line, the optical axis consistent with the reflecting surface, will impede observation generation. 同样地如图10B所示, 在从晶片114的下方进行观察的情况下,晶片114的一部分进入成像透镜122和旋转镜115之间,会对观察产生妨碍。 In the same manner as shown in FIG. 10B, in a case where viewed from below the wafer 114, a portion of the wafer 114 and the rotating mirror 122 enters between the imaging lens 115, it will impede observation generation.

进一步补充说明,当^=0时,成像透镜122的光轴与晶片114的端面最远。 Further added that, when ^ = 0, the optical axis of the imaging lens 122 of the wafer 114 farthest end surface. 可知随着0进一步增大,光轴接近晶片114。 0 As can be seen further increased, the optical axis 114 near the wafer. 由此,要考虑到这些情况来设计镜凸轮118。 Thus, taking into account these circumstances to design the mirror 118 of the cam.

如上所述,根据本变形例的第1方式的可变视野方向观察装置200, 相对于晶片等具有2个主面的试样114的外周端面,在与主面正交的方向(Z方向)上与试样114的外周端面保持大致恒定距离,同时移动旋转镜115,所以外周端面到观察光学系统的距离WD (工作距离)恒定,可 As described above, according to the variable visual field direction of the first embodiment of the present modification observation apparatus 200, with respect to the outer circumference of a sample such as a wafer having two major surfaces of the end surface 114, in a direction perpendicular to the main surface (Z direction) an outer periphery of the upper end surface 114 and the sample distance remains substantially constant, while moving the rotary mirror 115, so that the outer peripheral end face to the observation optical system distance WD (working distance) is constant, can be

27在观察(拍摄)端面期间始终将焦点对准试样的端面。 27 observing (photographing) the end face always in focus during the end surface of the sample.

此外,支撑摄像部123的X移动板在晶片114的主面方向上只移动维持距离WD的程度,所以可使本实施方式的可变视野方向观察装置变小。 Further, the imaging section X movable support plate 123 is moved in the direction of the main surface of the wafer 114 is maintained only to the extent of the distance WD, the present embodiment allows the variable visual field direction becomes small observation apparatus embodiment. 此外,作为检查装置,无需一定单独构成,也可以配置在现有的显微镜装置的台的附近来使用,该现有的显微镜装置可保持试样而向彼此正交的3轴方向移动和旋转。 In addition, as an inspection apparatus need not necessarily be constituted separately, may be configured to use the table in the vicinity of a conventional microscope apparatus, the conventional microscope apparatus can move the sample holder 3 is rotated in the axial direction and orthogonal to each other. 当然,不限于用于晶片的显微镜装置,也可安装在具备其他台的装置上。 Of course, a microscope apparatus is not limited to a wafer, it can be mounted on the apparatus provided with the other stations.

而且,通过与观察凸轮108、 118的凸轮面108a、 118a的弯曲状态的试样的外周端面的形状适应,可利用最佳焦点来观察各种试样。 Furthermore, the shape adapted to the outer circumferential surface of the cam surface 108 was observed, the sample 118 is curved state 108a, 118a, and various samples may be observed using the best focus. 例如, 还可以采用可自由拆装凸轮108、 118的结构,构成为适当按照试样来进行更换。 For example, the structure may also be employed detachably cam 108, 118, configured in accordance with the sample to an appropriate replacement. 由此,即使试样的端面的截面形状构成为充分变圆的形状或者略微变圆的程度的形状,也能容易地进行摄像部的对焦。 Accordingly, even when the sectional shape of the end surface shape of a sample is sufficiently configured rounded or slightly rounded degree of shape, it can be easily focus the imaging unit.

通过使上述实施方式的外观检查装置1的边缘部检査部12具备这种可变视野方向观察装置200,可将晶片114的端面和与该端面延续的正背面的观察像导入到边缘部检查部12的显微镜,找出产生在晶片端面上的缺口或裂痕。 By the above-described embodiment, the edge portion of the appearance inspection apparatus 12 of the inspection unit 1 includes a variable field of view seen in the direction of this apparatus 200, and may be a continuation of the end face was observed with the end surface of the front and back of the wafer 114 to the edge portion of the image inspection introducing the microscope portion 12, to identify cracks or chipping at the end face of the wafer. 此外,只要是掩模图形的检查,则也能检査抗蚀剂膜的修边状态和翻转到晶片背面的情况等。 Further, as long as the mask pattern inspection, the repair can be checked resist film edges to flip state and a case where the back surface of the wafer and the like.

接着参照图ll,说明本变形例的第2方式(下面简称为第2方式) 的可变视野方向观察装置的结构例。 Referring next to Figure ll, description of the second embodiment of the present modification (hereinafter simply referred to as the second embodiment) and a variable visual field direction of the structure observation apparatus embodiment. 另外,对于图ll所示的结构部位, 对于与上述图8和图9A、图9B所示的结构部位同等的部位赋予相同的参照符号,省略其说明。 Further, parts of the structure shown in FIG ll, those described above for FIGS. 8 and 9A, the portion equivalent to the structure shown in FIG. 9B portions denoted by the same reference numerals, and description thereof is omitted.

本方式是在上述第1方式中,在进行观察的角度上具有限制(±45 度左右),实现从试样的正上方或正下方进行观察的例子。 This embodiment is described in the first, having a limit (about ± 45 degrees) is performed on the angle of observation, to achieve the example viewed from directly above or below the sample. 本方式中,通过进一步设置图11所示的2个正反观察镜,可观察试样的外周部的正背面。 In the present embodiment, by further providing two reverse sight glass shown in FIG. 11, the outer periphery of the back surface can be observed positive portion of a sample.

在该可变视野方向观察装置201中,构成为在基座130上形成切口部B1,晶片114的端部嵌入其中。 In the observation apparatus 201 in a variable field direction, a cut portion B1 is configured on the base 130, the end portion of the wafer 114 is embedded therein. 而且,在将晶片114的端部插入切口部B1时,在从该端部略微进入内侧的位置上配置正反观察镜131、 132, 该正反观察镜131、 132分别固定在光轴(与晶片114的主面正交的方向) Further, when the end portion of the wafer 114 is inserted into the cutout portion B1, disposed at a position slightly inward from entering the sight glass on the both end portions 131, 132, the positive and negative observation mirror 131, 132 are fixed to the optical axis (with a direction perpendicular to the main surface of the wafer 114)

28上的上方和下方。 Above and below on the 28.

例如,以观察晶片114的上主面为例,如果假定成像透镜122的光轴与旋转镜115和正反观察镜131的倾斜相同,则与由正反观察镜131 偏向的光轴相同。 For example, observed on the main surface of the wafer 114 as an example, if it is assumed the same as the rotational axis of the imaging lens 122 and the mirror 115 is inclined forward and reverse sight glass 131, is the same as observed by the reverse mirror 131 toward the optical axis. 即,由这些正反观察镜131、 132弯曲的光轴与晶片114 的各主面正交,所以其结果为可观察晶片114的外周部的正面和背面。 I.e., the optical axis 132 bending the main faces of the wafer 114 is orthogonal to the observation of these positive and negative mirror 131, so that a result can be observed the front and back outer peripheral portion of the wafer 114.

在这种配置中,凸轮135与上述第1方式的凸轮形状对应地设有凸轮面135a,该凸轮面135a为了使来自正反观察镜的光轴与成像透镜光轴一致而延长。 In this configuration, the cam 135 of the first embodiment is provided with cam shape corresponding to the cam surfaces 135a, 135a of the cam surface in order to make the optical axis of the imaging lens from the optical axis coincides reverse viewer extended. 通过设置凸轮面135a,可与正反观察镜的角度关联地确定旋转镜角度,使得光轴与成像透镜光轴一致。 By providing the cam surface 135a, it may determine the rotation angle of the mirror with associated mirror reverse observation angle, so that the same optical axis of the imaging lens. 当然,为了使LIO、 Lll以及L12之和与WD —致,同样在凸轮134上也施加有凸轮面134a的形状。 Of course, in order to make LIO, Lll and L12 and the sum WD - actuator, the cam 134 is also similarly applied to the shape of a cam surface 134a. 另外,由于晶片114的个体差异等导致WD不完全一致的情况下,还能通过使光圈插入观察光学系统使得具有充分的被摄场深度、或是设置AF (自动聚焦)装置来进行应对。 Further, since the case where the cause is not exactly WD individual differences of the wafer 114, but also by inserting the diaphragm such that the observation optical system is sufficient depth of field of having, or set AF (auto focusing) means to respond.

另外,以晶片为一个例子说明了作为本变形例的可变视野方向观察装置的观察对象的试样,但当然不限于此,例如也可通过将其安装在用于液晶显示面板的玻璃基板的检查装置上,来观察玻璃基板的端面。 Further, a wafer sample example illustrates the observation target as the observation means visual field direction variable modification of the present embodiment, but of course not limited thereto, for example, also be mounted on the glass substrate for the liquid crystal display panel the inspection means to observe the end face of the glass substrate. 之外,还可通过将其安装在金属切削装置上,来观察所切削的产品的端面。 Addition, also by the end face of the cutting means mounted on the metal, to observe the cut product. 如上所述,根据上述第1、第2方式,能从期望的角度观察作为试样的晶片的外周端面,无需每次进行对焦作业即可简单地观察在其整个外周的端面和正背面产生的缺口和断裂等伤痕和附着的异物。 As described above, according to the above first and second embodiment, as viewed from the desired angle of the wafer outer peripheral end surface of a sample, the focusing operation can be performed without each simply observing the notch end surface and its back surface of the entire periphery of the n-generated and fracture scars and other foreign matter adhering. 此外,在该第2方式中,也与上述第1方式相同地安装在显微镜装置上,可容易地安装到晶片外观检查装置和晶片检査装置等上。 Further, in the second embodiment, the same manner to the first embodiment mounted on a microscope device can be easily mounted on the wafer appearance inspection apparatus and wafer inspection apparatus and the like. 此外,还可以将其设置在曝光装置、涂敷器、显影器等具有旋转台的基板处理装置中。 Further, it may be provided on a substrate processing apparatus having a turntable exposure apparatus, an applicator, a developer, and the like.

下面,说明本变形例的第3方式(以下,简称为第3方式)的可变视野方向观察装置。 Next, a third modification of the present embodiment (hereinafter simply referred to as third embodiment) observation means visual field direction variable.

在上述第2方式中,正反观察镜131、 132是固定的,与旋转镜115 的角度无关地朝向恒定方向。 In the second embodiment, the reverse was observed mirror 131, 132 is fixed, and the rotation angle of the mirror 115 towards a constant direction regardless. 因此,在利用旋转镜115观察晶片114的端面时,如果设定为低倍率观察则有时正反观察镜131、 132会进入旋转镜115的观察视野中。 Therefore, when using a rotating mirror 115 is an end view of the wafer 114, if set to the low magnification observation may reverse the viewer 131, 132 will enter the observation field of view 115 of the rotating mirror. 本方式是设置可动型正反观察镜,在观察试样的端面时,使其从旋转镜115的观察视野退避的结构例。 The present embodiment is provided a movable front and back mirrors, when viewed in the end face of the sample, so that the structure of embodiment retracted from the observation field of the rotating mirror 115.

图12A是表示从正面观察第3方式的可变视野方向观察装置的结构例的图,图12B是表示从背面观察第3方式的可变视野方向观察装置的结构例的图,图12C是表示从图12B的箭头Cl侧观察到的可动型正反观察镜的截面结构例的图。 12A is a variable field of the third embodiment viewed from a direction front view of the embodiment of the structure observation apparatus, FIG. 12B is a diagram showing an example of the apparatus as viewed from a direction of a rear view of a variable field of the third embodiment, and FIG. 12C shows Cl viewed from the arrow side in FIG. 12B to the movable cross-sectional configuration example of the positive and negative viewer. 另外,关于图12A、图12B、图12C所示的结构部位,对于与上述图8和图9所示的结构部位同等的部位赋予相同的参照符号,省略其说明。 Further, with respect to FIGS. 12A, 12B, 12C structural site represented by the structural site for the equivalent portions shown in the above FIGS. 8 and 9 are denoted by the same reference numerals, and description thereof is omitted.

如图12A所示,可变视野方向观察装置202设有可动型正反观察镜171、 172,使得在由旋转镜115观察晶片114的端面时,以晶片114的主面为基准,相对于旋转镜115,镜面171a、 172a位于具有任意角度&、 "的俯角(以成像透镜122的光轴方向为基准收敛于旋转镜115的方向) 的规定位置。任意角度&、"是为了防止在晶片114反射的外光(照明光等)在可动型正反观察镜171、 172再次反射并射入到旋转镜115而设置的角度。 12A, a variable field direction of observation apparatus 202 is provided with a movable reverse viewer 171, 172, 114 such that when the end faces of the wafer observed by the rotating mirror 115, the main surface of the wafer 114 as a reference, with respect to rotating mirror 115, the mirror 171a, 172a is located in an arbitrary angle & "depression angle (optical axis direction of the imaging lens 122 as a reference mirror 115 converges to the rotational direction) of the predetermined position. & arbitrary angle," is to prevent the wafer external light (illumination light) reflected by 114 in the movable type reverse viewer 171, 172 and again reflected to the incident angle of the rotating mirror 115 is provided. 任意角度&、"被设为,相对于晶片ll4的正反主两略微倾斜,相对于旋转镜115具有俯角(相对于晶片主面为仰角)。 & Arbitrary angle, "is set, slightly inclined with respect to the positive and negative two main ll4 wafer with respect to the rotating mirror 115 has a depression angle (with respect to the main surface of the wafer elevation).

这些可动型正反观察镜171、 172为相同结构,如图12B所示,它们被配置成相对于晶片114 (光轴方向)线对称。 These movable type reverse viewer 171, 172 have the same structure, shown in Figure 12B, which are arranged symmetrically with respect to the wafer 114 (optical axis direction) of the line. 在这些可动型正反观察镜171、 172之间设有驱动板173,该驱动板173固定在图9所示的X移动板107上,伴随上下移动而转动可动型正反观察镜171、 172中的任意一个。 These movable type on reverse viewer 171, 173 is provided between the drive plate 172, as shown in FIG. 9 fixed to the driving plate 173 of the X moving plate 107, rotates along with the vertical movement of the movable type reverse viewer 171 , any one of 172.

下面,以可动型正反观察镜171为一个例子进行说明。 Here, in order to reverse the movable viewer 171 will be described as an example. 如图12C所示,可动型正反观察镜171由以下部分构成:嵌入轴承181而可旋转地安装在基座101上的镜主体182;可更换地安装在镜主体182上的镜台183;固定在镜台183的前端部(在该图中为下表面侧)上的镜184;为了规定上述规定位置而设置在基座101上的止动部185;通过轴承181连接固定在镜主体182上的杆部186;设置在杆部186的前端部上伴随驱动板173的上下移动而转动镜主体182的凸轮188;以及施加用于使镜主体182返回规定位置的推力的线圈弹簧187。 12C, the movable mirror 171 is composed of positive and negative observed following parts: bearing insert 181 is rotatably mounted on the mirror body 182 in the base 101; replaceably mounted on the mirror body 182 of the stage 183; fixed to the distal end portion 183 of the stage (in the figure the lower surface side) of the upper mirror 184; a stopper portion for a predetermined in the predetermined position on the base 101 disposed 185; 181 via a bearing 182 is fixed on the mirror body a rod portion 186; provided at the end of the lever portion 186 moves up and down accompanying the drive plate 173 and the mirror 188 rotating cam body 182; and a mirror body 182 for applying a return force of the coil spring 187 in a predetermined position.

作为将镜台183安装到镜主体182上的结构,在镜主体182的安装 The stage 183 is installed as a mirror structure to the body 182, the body 182 is mounted in the mirror

30面m上至少设置2个销189a、 18%与螺孔190,在镜台183上,分别使与这些销189a、 189b嵌合的孔191a、 191b和螺钉用孔191c开口。 It is provided on the surface of at least 30 m 2 pins 189a, 18% with the screw 190, 183 on the stage, respectively with the pins 189a, 189b of the fitting holes 191a, 191b and the screw hole openings 191c. 安装是在镜主体182的销189a、 189b上嵌合镜台183的孔191a、 191b,之后通过螺钉用孔191c把螺钉192拧入螺孔190进行固定。 The pin 189a is mounted on the mirror body 182, the fitting holes 191a 183 of the stage, on 191b 189b, then 191c is screwed into the screw hole to screw holes 192 and fixed by a screw 190. 由于这样构成为可拆装镜台183,所以即使镜被污染也能容易地洗净。 Since such stage 183 is configured to be detachable, even when the mirror is contaminated it can be easily cleaned.

止动部185由固定在基座101上的止动柱193和确定卡止杆部186 的规定位置的止动器194构成。 The stopper portion 185 is fixed by a stop post 193 on the base 101, and determines a predetermined position of the lever engaging portion 186 of the stopper 194 configured. 线圈弹簧187的一端挂在杆部186上, 另一端挂在基座101上,其推力被设为始终由杆部186按压止动器194。 One end of the coil spring 187 is hooked on the shaft portion 186, and the other end hanging on the base 101, which is set to a thrust lever 186 is always pressed by the stopper 194.

接着参照图13A至图13G,说明如此构成的可动型正反观察镜171、 172的动作。 Referring next to FIGS. 13A to 13G, the configuration described thus reverse the movable viewer 171, 172 operation. 该观察例是从晶片上表面经过端面观察晶片下表面。 Observation of the surface is observed through the lower end surface of the wafer from the wafer.

图13A表示观察从装置正面观察到的晶片114的上表面的状态,图7B表示从其背面侧观察到的可动型正反观察镜171、 172的转动状态。 FIG 13A shows a view seen from the front surface of the apparatus to a state of the wafer 114, FIG. 7B shows a view from the back side of the movable mirror 171 viewed reverse rotation state 172. 在该观察状态下,旋转镜115位于可动型正反观察镜172的上方,可动型正反观察镜172的凸轮188被驱动板173拉起。 In this observation state, reverse rotation of the mirror 115 is positioned above the sight glass 172 may be movable type, the movable type reverse sight glass 188 of the cam 172 is driven to pull the plate 173. 然后,映射在可动型正反观察镜172上的晶片正面(主面上表面)通过旋转镜115而沿着成像透镜122的光轴被投影。 Then, the movable mapped on reverse type front sight glass wafer 172 (main surface side) 115 is projected along the optical axis of the imaging lens 122 by rotating the mirror. 此时可动型正反观察镜171为空闲状态,其被线圈弹簧187推压,以镜面成为上述规定位置的方式保持为任意的角度&。 At this time, the movable-type holding viewer reverse idle state 171, a coil spring 187 which is pressed to the predetermined position the mirror to become an arbitrary angle & way.

而且,当根据图13A、图13B所示的状态从大致垂直于晶片114的表面的法线的方向观察外周端面时,旋转镜115 —边旋转一边被按下, 到达晶片114的端面的观察(参见图13C、图13D)。 Further, when viewed from the outer peripheral end surface substantially perpendicular to a direction normal to the surface of the wafer 114 in accordance with FIGS. 13A, a state shown in 13B, the rotating mirror 115 - one side edge is pressed rotation, observed 114 reaches the end surface of the wafer ( Referring to 13C, the FIG. 13D). 在观察该端面的状态下,可动型正反观察镜171、 172的各凸轮188、 195不接触驱动板173 而为空闲状态。 In observing the state of the end surface, the movable type reverse viewer 171, 188 of each cam 172, 195 does not contact the drive plate 173 to the idle state. 因此,可动型正反观察镜171、 172都为空闲状态,分别被线圈弹簧187推压,它们分别以镜面成为上述规定位置的方式保持为任意的角度&、"。 Thus held, the movable type reverse viewer 171, 172 are idle, the coil springs 187 are pressed, respectively, in a mirror position reaches the predetermined angle & arbitrary manner,. "

此时,如图13E所示,可动型正反观察镜171、 172的镜184为转动的状态,可使其不进入旋转镜115的观察视野。 At this time, as shown in FIG. 13E, the movable type reverse viewer 171, 172, 184 to rotate the mirror state, it does not enter the observation field of view 115 of the rotating mirror.

而且,为了观察晶片114的背面,旋转镜115—边旋转一边被按下, 位于可动型正反观察镜171的下方,可动型正反观察镜171的凸轮195 Further, in order to observe the back surface of the wafer 114, while rotating the rotating mirror 115- side is pressed, positioned below the movable mirror 171 of the reverse was observed, the movable cam 171 of the sight glass 195 reciprocal

31被驱动板173按下。 31 drive plate 173 is pressed. 并且,映射在可动型正反观察镜171上的晶,背面 Further, the reverse mapping in the movable type crystal, the back surface of the sight glass 171

(主面下表面)通过旋转镜115沿着成像透镜122的光轴被投影。 (Lower surface of the main surface) is projected along the optical axis of the imaging lens 122 by rotating the mirror 115. :此时可动型正反观察镜172为空闲状态,其被线圈弹簧187推压,以镜面成为上述规定位置的方式保持为任意的角度^ (参见图13F、图13G)。 At this time, the movable-type holding viewer reverse to the idle state 172, a coil spring 187 which is pressed to the predetermined position becomes a mirror way ^ arbitrary angle (see FIG. 13F, FIG. 13G):.

如上所述,根据本实施方式,伴随旋转镜的移动,上下配置的2个可动型正反观察镜中的一个转动,可通过转动后的可动型正反观te镜和旋转镜将试样的正面或者背面的观察像导入到成像透镜的光轴。 As described above, according to the present embodiment, the mirror moves with rotation, two vertically arranged movable type in a forward and reverse rotation of the sight glass, by the rotation of the movable mirror and the n-te other hand, the sample rotating mirror observation of the front or rear of the optical axis of the image introduced into the imaging lens. 此外, 当观察试样的端面的情况下,可动型正反观察镜从观察视野一起退避。 Further, when the end surface of the specimen was observed in the case of the movable type reverse viewer retracted together from the observation field. 因此,可提供仅作为观察对象的试样位于观察视野范围内的易于观察的观察像。 Thus, a sample may be provided only as an observation target is positioned in an observation image viewed easily observed within the field of view. 此外,在该第3方式中,也与上述第1方式同样地安装在显微镜装置上,可容易地安装到晶片外观检查装置和晶片检査装置等上。 Further, in the third embodiment, similarly to the first embodiment mounted on a microscope device can be easily mounted on the wafer appearance inspection apparatus and wafer inspection apparatus and the like.

另外,本方式的可变视野方向观察装置202是考虑到基于观察者直视的目视观察和使用摄像元件的监视器图像这两者的装置。 The variable view direction according to the present embodiment in view of the observation means 202 of the apparatus was visually observed, and both the monitor image using the imaging device based on an observer look. 不过,不限于该第3方式,例如只要是仅观察监视器图像的结构,也可通过如下动作来实现:从拍摄到的观察图像中除去混入的正反观察镜的图像.,或者不从摄像元件取入相当于正反观察镜的图像信号而生成为图像。 However, the third embodiment is not limited to, for example, as long as the structure is observed only monitor image can also be achieved by the following operation: mixing the reverse image of the sight glass is removed from the observation image captured, from the captured or not. element corresponding to the image signal taken in reverse observation image generated as the mirror.

在上述第2变形例的说明中,以将各方式的可变视野方向观察装置安装在显微镜等检查装置上的情况为例,说明了在本发明的外观检查装置的边缘部检査部中具备该可变视野方向观察装置时的结构,但上述各方式的可变视野方向观察装置也能以单体的形式优选用作可改变对试样的视野方向的观察装置。 In the above-described second modified example, the field of view of each variable to the embodiment seen in the direction where the device is mounted on a microscope examination apparatus to illustrate the inspection portion provided at an edge portion of an appearance inspection apparatus of the present invention the variable field structure when viewed in the direction of the apparatus, but a variable field direction of each of the above embodiment can also be used as observation means visual field changes direction of the sample observation apparatus preferably in the form of monomer.

说明该情况下的背景技术。 BACKGROUND The statements in this case.

例如,在日本特开平9-269298号公报(专利文献A)和曰本特开2003-344307号公报(专利文献B)中公开有如下的端部缺陷检查装置: 为了检测产生在晶片端面上的缺口和裂痕等,专门检查该端面。 For example, in JP 9-269298 (Patent Document A) and said present-Open No. 2003-344307 Patent Publication (Patent Document B) discloses a defect inspection portion of the following end devices: To detect the generated surface of the wafer end gaps and cracks and other specialized checks the end face.

这种背景技术具有如下课题。 This background art has the following problems.

在上述晶片边缘检査中,为了检测晶片的端面的缺口和裂痕等,通常通过对拍摄外周整体的晶片边缘而得到的图像进行目视来进行检测, 或者通过经过光电转换的检测值的变化来进行检测。 In the inspection of the wafer edge, in order to detect cracks and gaps the end face of the wafer, usually through images photographing the entire outer peripheral edge of the wafer is obtained to detect visually or by photoelectric conversion through a change of the detection value for testing. 专利文献A的端部缺陷检查装置是根据来自晶片端面的衍射光的一部分检测缺口和裂痕等的结构,所以是无法观察与晶片端面连接的正面侧和背面侧的结构。 An end portion of the defect inspection apparatus of patent document A is a structural part of diffracted light detected gaps and cracks from the end face of the wafer and the like, so that the structure of the front side and back side of the wafer can not be observed with the end face of the connector. 同样地,在专利文献2所公开的缺陷检查装置中, 也是无法对与晶片端面连接的正面侧和背面侧观察缺口和裂痕等的结构。 Similarly, in the defect inspection apparatus disclosed in Patent Document 2, the notch and cracks are not observed on the front and back and the like connected to the side end surface of the wafer structure. 此外,专利文献A、 B都是无法对除去正面侧的边缘部的抗蚀剂之后的边缘切割线进行观察的结构。 Further, Patent Document A, B line structure are not observed after removing the cutting edge of the front side edge portion of the resist.

此外,用于液晶显示装置的玻璃基板也相同,需要确认产生在玻璃基板端部的缺口和裂痕等所产生的损伤或者不需要的膜等来实施最佳的处理。 Further, the glass substrate for a liquid crystal display device is also the same, it is necessary to confirm the generation of the best embodiment of the glass substrate processing damage and cracks in the end portions of the notches or the like generated unwanted film.

于是,要求一种能从期望的角度观察试样的外周端面(端面和该端面所连接的外周缘的正背面)的可变视野方向观察装置。 Thus, the demand for a variable from a desired angle between the observation field of view (front and back end surfaces and an outer peripheral edge of the end surface is connected to) the outer circumferential end surface of a sample observation apparatus direction. 通过如下结构来提供这种可变视野方向观察装置。 This provides a variable visual field direction by the following structure observation apparatus.

(1) 可变视野方向观察装置的特征在于,具有:观察光学系统,其观察上述平板状的试样的外周端面;以及镜部,使上述观察光学系统的 Wherein (1) a variable field direction of the observation apparatus comprising: an observation optical system observation sample end surface of the outer periphery of the flat plate; and a mirror unit, so that the observation optical system

光轴偏向而到达上述试样的外周端面上,通过上述镜部的转动来变更视野方向,同时将上述观察光学系统和上述试样的外周端面的距离保持为大致恒定,并观察上述试样的外周端面。 Deflecting the optical axis and reaches the outer peripheral end of the sample surface, view direction is changed by rotating the mirror portion, while the observation optical system and the end face of the outer periphery of the sample distance remains substantially constant, and observation of the sample an outer peripheral end face.

(2) 可变视野方向观察装置的特征在于,具有:基座部,其固定在可观察上述平板状的试样的外周端面的位置上;观察光学系统,..其具有与上述试样的表面正交的光轴;二轴台,其支撑上述观察光学系统,在上述试样的上述表面的正交方向和平行方向上可动;镜部,其可自由转动地支撑在上述二轴台上,使上述观察光学系统的光轴偏向而到达上述试样的外周端面上;以及转动引导部,其设置在上述基座部上,为了上述镜部进行滑动而推压并抵接,当上述二轴台在正交方向上移动对,转动上述镜部,使得使上述观察光学系统的光轴偏向而到达上述试样的外周端面上,通过上述镜部的转动来变更视野方向,同时将上述观察光学系统和上述试样的外周端面之间的距离保持为恒定,并观察上述试样的外周端面。 Wherein (2) a variable field direction of the observation device comprising: a base portion which is fixed to the end face position observable outer periphery of the plate-like sample on; observation optical system having the above-described .. sample surface perpendicular to an optical axis; two-axis stage, supporting the observation optical system may be movable in a parallel direction and an orthogonal direction of the surface of said sample; the mirror portion, which is rotatably supported in the above-described two-axis stage , so that the optical axis of the observation optical system toward the outer peripheral end face reaches the sample; and a rotation guide portion, which is provided on the base portion, the mirror unit slides to be pressed against and into contact when said two axis stage is moved in an orthogonal direction to the rotation of the mirror portion, such that the optical axis of the observation optical system toward an outer peripheral end face and reaches the sample, the view direction is changed by rotating the mirror portion, while the above observations the distance between the optical system and the outer peripheral end surface of the sample is kept constant, and observe the outer circumferential end surface of the sample.

(3) 根据(2)所述的可变视野方向观察装置,其特征在于,上述 (3) a variable field observation apparatus according to the direction (2), characterized in that said

33基座部配置在显微镜装置的台的附近,该显微镜装置的台保持上述试样而可向彼此正交的3轴方向移动和旋转。 A base portion 33 disposed in the vicinity of the microscope stage apparatus, the microscope stage holding the specimen and the apparatus can be moved and rotated in three axis directions orthogonal to each other. ' '

(4) 根据(2)所述的可变视野方向观察装置,其特征在于,上述转动引导部由以下部分构成:第1凸轮,其设置在上述基座部上,并具有弯曲凸轮面,使得当上述二轴台在正交方向上移动时上述镜部相对于上述试样的外周端面为大致恒定间隔;以及第1凸轮辊,其当上述二轴台在正交方向上移动时,沿着上述凸轮面的弯曲而滑动移动,并且,转动上述镜部,使得上述观察光学系统的光轴到达上述试样的外周端面上。 (4) The variable observation visual field direction of the device (2), characterized in that the rotary guide consists of the following parts: a first cam provided on the base portion and having a curved cam surface, such that when the above-described two-axis stage is moved in an orthogonal direction with respect to the mirror outer periphery of the end face portion of the sample is substantially constant interval; and when the first cam roller, which when said two axis table is moved in the orthogonal direction, along bending movement of the slide cam face, and rotation of the mirror portion, such that the optical axis of the observation optical system reaches the outer peripheral end surface of the sample.

(5) 根据(2)所述的可变视野方向观察装置,其特征在于,上述 (5) a variable field observation apparatus according to the direction (2), characterized in that said

可变视野方向观察装置还具有台引导部,该台引导部由以下部分构成: A variable field direction of the observation apparatus further includes a table guide portion, the guide portion of the table is constituted by the following parts:

第2凸轮,其设置在上述基座部上,并具有弯曲凸轮面,该弯曲凸轮面 A second cam provided on the base portion, and a cam having a curved surface, the curved cam surface

用于当上述二轴台在正交方向上移动时,按照上述转动引导部的平行方向的移动,维持上述观察光学系统的光轴与上述试样的表面正交的方向; It is used when said two axis table is moved in the orthogonal direction, parallel to the direction of movement according to the rotation of the guide portion, the direction of the surface to maintain the optical axis of the observation optical system and the sample orthogonal;

以及第2凸轮辊,其设置在上述二轴台上,当在上述正交方向上移动时, And a second cam roller, which is provided in the two-axis stage, when moved in the orthogonal direction,

沿着上述凸轮面的弯曲而滑动移动。 Sliding movement along the curved surface of the cam.

(6) 根据(2)所述的可变视野方向观察装置,其特征在于,在上述可变视野方向观察装置中还具有2个固定镜,该2个固定镜以配置在上述试样的正背面的上方和下方的方式固定在上述基座上,上述2个固定镜把上述观察光学系统的光轴弯折在上述试样的外周端面方向上。 (6) a variable field observation apparatus according to the direction (2), characterized in that the apparatus further comprises two fixed mirrors the variable observation visual field direction, the two fixed mirrors are disposed in the sample is positive upward and downward is fixed to the rear surface of the base, the two stationary mirror to the optical axis of the observation optical system is bent in the direction of the outer circumferential end surface of the sample.

(7) 根据(2)所述的可变视野方向观察装置,其特征在于,在上述可变视野方向观察装置中还具有2个转动镜,该2个转动镜设置在上述试样的表面的上方和下方,把上述观察光学系统的光轴弯折在上述试样的外周端面方向上,从上方或者下方观察时被设定为规定角度。 (7) a variable field observation apparatus according to the direction (2), characterized in that the apparatus further comprises two rotational microscopy of the variable visual field direction, the two rotatable mirror disposed on the surface of said sample above and below the optical axis of the observation optical system is bent in the face direction on the outer periphery of the sample, when viewed from above or below is set to a predetermined angle.

(8) 根据(2)所述的可变视野方向观察装置,其特征在于,在上述可变视野方向观察装置中还具有2个转动镜,该2个转动镜辯照配置在上述试样的表面的上方和下方的方式可转动地配置在上述基^上,上述转动镜,在观察上述试样的上表面或者下表面时,转动该转动镜中的任意一个,通过上述镜部将该试样的观察像入射到上述观察光学系统中, 在观察上述试样的外周端面时,相对于上述转动镜把该转动镜的镜面设定为俯角,使其退避到上述观察光学系统的观察视野外。 (8) a variable field observation apparatus according to the direction (2), characterized in that the apparatus further comprises two rotational microscopy of the variable visual field direction, the two rotatable mirror disposed in defense of the sample as upward and downward surface rotatably disposed on the base ^, the rotating mirror, when viewed on the surface or a lower surface of the sample, any rotation of one of the rotating mirror, the mirror portion by the trial the sample observation image incident on the observation optical system, an outer peripheral end face of the sample was observed with respect to the rotation of the rotating mirror to mirror a mirror set at a depression angle, it was observed to said retracted out of view of the observation optical system .

(9)可变视野方向观察装置的特征在于,其是安装在观察平板状的试样正面的显微镜装置上的观察装置,该可变视野方向观察装置具有: 二轴台,其在与上述试样的表面正交的Z方向和与上述试样的表面平行的X方向上可动;基座,其具有使上述二轴台在Z方向上移动的驱动部; 台的平行方向移动部,其由固定在上述基座上的第1凸轮、安装在上述二轴台的X方向移动板上且沿着该第1凸轮移动的辊、以及作用在使上述基座和上述X方向移动板接近的方向上的拉伸弹簧构成;显微镜装置的观察光学系统,其光轴在上述二轴台上与上述试样的表面正交;镜部, 其配置在上述观察光学系统内的物镜和该物镜的焦点位置之间,可使上述光轴任意进行偏向;第2凸轮,其固定在上述基座上;第2辊,其安装在从上述镜部的旋转轴伸出的旋转臂上,沿着上述第2凸轮移动; (9) In the variable visual field direction of the observation device in that it is a sample observation apparatus in front of the microscope observation of a plate-like mounting, observation visual field direction of the variable device comprising: a two-axis stage, in which the above-mentioned test movable in the Z direction orthogonal to the surface of the sample and the X-direction parallel to the surface of said sample; base having the above-described two-axis driving unit moving the stage in the Z direction; a direction parallel to the mobile station unit, which a first cam fixed on said base, is mounted in the direction of the two X-axis table and the movable plate moves along the first cam roller, and acts so that the base plate and said X-direction moving closer tension spring constituting direction; observation optical system of the microscope, with its optical axis perpendicular to the surface of the sample stage in said two shafts; mirror portion, disposed within the objective lens and the objective lens of the observation optical system between the focus position, the optical axis can arbitrarily biased; a second cam, which is fixed to the base; a second roller, mounted on a swivel arm extending from the rotation axis of the mirror portion, along the moving the second cam; 以及拉伸弹簧,其悬挂固定在上述旋转臂和上述二轴台之间,作用在上述 And a tension spring suspended between said rotating arm is fixed and said two axis table, in the above-described effect

第2辊被上述第2凸轮推压的方向上,伴随上述二轴台向Z方向的移动, 上述观察光学系统的位置和上述旋转镜的角度通过上述第1、第2凸轮而 Is pushed in the direction of the second cam the second roller, along with the above-described two-axis stage is moved in the Z direction, the position of the observation optical system and the rotation angle of the mirror by the first and second cam

移动,即使任意改变视野方向,也相对于上述试样的外周端面和延续到该外周端面的正背面来变更视野方向,同时将上述物镜和上述试样的外周端面之间的距离保持为恒定。 Moving, even if arbitrarily changed view direction, also with respect to the outer circumferential end surface of the sample and continued to the front and rear surfaces of the outer peripheral end surface of the changed visual field direction, while the distance between the outer periphery of the objective lens and the sample end surface is kept constant.

在上述(1)〜(9)所述的可变视野方向观察装置中,通过旋转引 Observed in (1) to (9) in the direction of the variable field of the apparatus, by rotating the lead

导部来改变观察光学系统的位置和旋转镜的角度,即使变更视野方向, 也能始终对试样的外周端面和与之延续的主面(上下表面)一边进行对焦一边进行观察。 The guide portion changes the position and the rotation angle of the mirror observation optical system, even if the view direction is changed, the sample can always end face and the outer circumferential continuation with the main surface (vertical surface) while focus while observing.

因此,可提供一种可变视野方向观察装置,其能够从期望的角度拍摄或者目视观察试样的外周端面(端面及该端面所连接的外周缘的正背面)。 Thus, possible to provide a variable field of view direction of the observation apparatus capable of photographing from a desired angle or the outer periphery of the sample was visually observed end surfaces (front and back end surfaces and an outer peripheral edge of the end surface is connected).

35 35

Claims (18)

1.一种外观检查装置,其特征在于,该外观检查装置具有: 外观检查部,其用于对工件正面进行外观检查; 边缘部检查部,其取得上述工件的侧面部、倒角部及其正背面的周围部分的放大像;以及配置在上述外观检查部上、保持上述工件的保持单元, 上述外观检查部和上述边缘部检查部共用上述保持单元。 An appearance inspection apparatus, wherein the visual inspection device includes: an appearance inspection unit for visual inspection of the front workpiece; the edge of the inspection unit, acquiring the side surface portion of the workpiece, the chamfered portion and enlarged image of the peripheral portion of the front and back; and disposed on the visual inspection section of the workpiece holding means holding the visual inspection of the inspection portion and the edge portion of the holding means common.
2. 根据权利要求1所述的外观检査装置,其特征在于,将上述保持单元和上述边缘部检查部设置成可自由相对接近和离开。 2. The appearance inspection apparatus according to claim 1, wherein said holding means and said edge portion inspection unit arranged relatively movable toward and away.
3. 根据权利要求1或2所述的外观检查装置,其特征在于,上述边缘部检査部以可自由拆装的方式设置在上述外观检查部上。 The appearance inspection device according to claim 1, wherein the inspection portion to the edge portion is detachably provided on the appearance inspection unit.
4. 根据权利要求1所述的外观检查装置,其特征在于,上述外观检査部具有取得上述工件正面的放大像的微观检查部,以可自由移动的方式在上述微观检査部和上述边缘部检査部之间共用上述微观检查部的上述保持单元。 The appearance inspection apparatus according to claim 1, wherein the visual inspection portion having a front portion made Microscopic examination of the enlarged image of the workpiece to be freely movable in the above-described manner and microscopic inspection of the edge portion the holding means of the common portion between the microscopic inspection of the inspection unit.
5. 根据权利要求4所述的外观检查装置,其特征在于,该外观检查装置具有如下功能:对利用上述微观检查部或者上述边缘部检査部中的任意一个检查部进行检查时的观察位置的坐标进行记录,在利用另一个检查部进行检查时,根据所记录的上述观察位置的坐标,将上述观察位置移动到另一个检査部的观察位置上。 The appearance inspection apparatus according to claim 4, characterized in that the appearance inspection apparatus has a function of: when the observation position of an arbitrary portion of an inspection using the inspection microscopic inspection portion of the edge portion or the portion to be checked recording the coordinates, when checked with another inspection unit, based on the coordinates of the observation position of the recorded move the observation position to the viewing position of the other portion of the inspection.
6. 根据权利要求1所述的外观检查装置,其特征在于,上述保持单元和上述边缘部检查部设置在经过减振的同一块安装板上。 6. The appearance inspection apparatus according to claim 1, wherein said holding means and said edge portion through inspection portion provided with a vibration-damping mounting plate.
7. 根据权利要求1所述的外观检查装置,该外观检査装置具有可变视野方向观察装置,其特征在于,上述工件是平板状的试样, 上述边缘部检査部具有:观察光学系统,其观察上述平板状的试样的外周端面;以及镜部,使上述观察光学系统的光轴偏向而到达上述试样的外周端面上,上述边缘部检查部通过上述镜部的转动来变更视野方向,同时将上述观察光学系统和上述试样的外周端面的距离保持为大致恒定,并观察上述试样的外周端面。 The appearance inspection apparatus according to claim 1, the appearance inspection device having a variable field of view direction of observation apparatus, wherein the workpiece is a plate-like sample, said edge portion inspection unit comprises: an observation optical system which observe the plate-like outer peripheral end surface of the sample; and a mirror section, so that the optical axis of the observation optical system toward the outer peripheral end surface of the sample reaches the edge of the field of view of the inspection unit is changed by rotating the mirror portion direction, while the outer periphery of the observation optical system and the sample end surface is kept substantially constant distance, and observe the outer circumferential end surface of the sample.
8. 根据权利要求1所述的外观检查装置,该外观检査装置具有可变视野方向观察装置,其特征在于,上述工件是平板状的试样, 上述边缘部检査部具有:基座部,其固定在可观察上述平板状的试样的外周端面的位置上;观察光学系统,其具有与上述试样的表面正交的光轴;二轴台,其支撑上述观察光学系统,在上述试样的上述表面的正交方向和平行方向上可动;镜部,其可自由转动地支撑在上述二轴台上,使上述观察光学系统的光轴偏向而到达上述试样的外周端面上;以及转动引导部,其设置在上述基座部上,为了上述镜部进行滑动而推压并抵接,当上述二轴台在正交方向上移动时,转动上述镜部,使得使上述观察光学系统的光轴偏向而到达上述试样的外周端面上,上述边缘部检査部通过上述镜部的转动来变更视野方向,同时将上述观察光学系统 The appearance inspection apparatus according to claim 1, the appearance inspection device having a variable field of view direction of observation apparatus, wherein the workpiece is a plate-like sample, said edge portion inspection unit includes: a base portion which is fixed to the outer circumferential end surface of the plate-like was observed on the sample; observation optical system having an optical axis perpendicular to the surface of said sample; two-axis stage, supporting the observation optical system, in the and movable parallel to a direction perpendicular to a direction of the surface of a sample; the mirror portion, which is rotatably supported in the above-described two-axis table, and the optical axis of the observation optical system and reaches the outer periphery of the deflection of the end face of the sample; and a rotation guide portion, which is provided on the base portion, the mirror unit slides to be pressed against and into contact when said two-axis stage is moved in the orthogonal direction, rotation of the mirror unit, so that the observation optical axis deflection system of the sample to reach the outer peripheral end surface of the edge portion of the inspection field of view direction is changed by rotating the mirror portion, while the above-described viewing optical system 上述试样的外周端面之间的距离保持为恒定,并观察上述试样的外周端面。 The distance between the outer periphery of the end surface of the sample is kept constant, and observe the outer circumferential end surface of the sample.
9. 根据权利要求8所述的外观检查装置,其特征在于,上述可变视野方向观察装置的上述基座部配置在显微镜装置的台的附近,该显微镜装置的台保持上述试样而可向彼此正交的3轴方向移动和旋转。 9. The visual inspection device of claim 8, wherein the variable visual field direction of the base portion of the observation device disposed in the vicinity of the microscope stage apparatus, the microscope stage holding the specimen and the apparatus to be 3-axis directions orthogonal to each other and rotating movement.
10. 根据权利要求8所述的外观检查装置,其特征在于, 上述可变视野方向观察装置的上述转动引导部由以下部分构成:第1凸轮,其设置在上述基座部上,并具有弯曲凸轮面,使得当上述二轴台在正交方向上移动时上述镜部相对于上述试样的外周端面为大致恒定间隔;以及第1凸轮辊,其当上述二轴台在正交方向上移动时,沿着上述凸轮面的弯曲而滑动移动,并且,转动上述镜部,使得上述观察光学系统的光轴到达上述试样的外周端面上。 10. The visual inspection device of claim 8, wherein said rotary guide means observation visual field direction of the variable portion is constituted by: a first cam provided on the base portion and having a curved cam surface, such that when the outer circumferential end surface of the mirror portion of the sample with respect to the above two-axis stage is moved in an orthogonal direction to a substantially constant interval; and a first cam roller, which when said two axis table is moved in the orthogonal direction when the sliding movement along the curved surface of the cam, and the rotation of the mirror portion, such that the optical axis of the observation optical system reaches the outer peripheral end surface of the sample.
11. 根据权利要求IO所述的外观检查装置,其特征在于, 上述可变视野方向观察装置还具有台引导部,该台引导部由以下部分构成:第2凸轮,其设置在上述基座部上,并具有弯曲凸轮面,该弯曲凸轮面用于当上述二轴台在正交方向上移动时,按照上述转动引导部的平行方向的移动,维持上述观察光学系统的光轴与上述试样的表面正交的方向;以及第2凸轮辊,其设置在上述二轴台上,当在上述正交方向上移动时, 沿着上述凸轮面的弯曲而滑动移动。 11. The appearance inspection apparatus according to claim IO wherein the observation means visual field direction variable table further includes guide portion, the guide portion of the table is constituted by the following parts: a second cam, which is provided on the base portion upper, and having a curved cam surface for the curved cam surface when said stage is moved in two axes orthogonal direction, parallel to the direction of movement according to the rotation of the guide portion, to maintain optical axis of the observation optical system and the sample a direction normal to the surface; and the second cam roller, which is provided in the two-axis stage, when moved in the orthogonal direction, along the curved surface of the cam and sliding movement.
12. 根据权利要求8所述的外观检查装置,其特征在于, 在上述可变视野方向观察装置中还具有2个固定镜,该2个固定镜以配置在上述试样的正背面的上方和下方的方式固定在上述基座上,上述2个固定镜把上述观察光学系统的光轴弯折在上述试样的外周端面方向上。 12. The visual inspection device of claim 8, wherein the variable visual field direction in the observation apparatus further has two fixed mirror, the two stationary mirror is disposed above the front and back surfaces of the sample, and downward is fixed on the base, the two stationary mirror to the optical axis of the observation optical system is bent in the direction of the outer circumferential end surface of the sample.
13. 根据权利要求8所述的外观检查装置,其特征在于, 在上述可变视野方向观察装置中还具有2个转动镜,该2个转动镜设置在上述试样的表面的上方和下方,把上述观察光学系统的光轴弯折在上述试样的外周端面方向上,从上方或者下方观察时被设定为规定角度。 13. The visual inspection device of claim 8, wherein the apparatus further includes a turning mirror 2 viewed in the direction of the variable field of view, the two rotatable mirror disposed above and below the surface of the sample, the optical axis of the observation optical system is bent in the face direction on the outer periphery of the sample, when viewed from above or below is set to a predetermined angle.
14. 根据权利要求8所述的外观检查装置,其特征在于, 在上述可变视野方向观察装置中还具有2个转动镜,该2个转动镜按照配置在上述试样的表面的上方和下方的方式可转动地配置在上述基座上,上述转动镜,在观察上述试样的上表面或者下表面时,转动该转动镜中的任意一个,通过上述镜部将该试样的观察像入射到上述观察光学系统中,在观察上述试样的外周端面时,相对于上述转动镜把该转动镜的镜面设定为俯角,使其退避到上述观察光学系统的观察视野外。 14. The visual inspection device of claim 8, wherein the apparatus further comprises two rotational microscopy of the variable visual field direction, above and below the surface of the sample according to the two rotatable mirror disposed manner rotatably disposed on the base, the rotating mirror, when viewed on the surface or a lower surface of the sample, any rotation of one of the rotating mirror by the mirror portion of the image incident on the sample was observed to the observation optical system, when the outer circumferential end surface of the sample was observed, the rotation of the rotating mirror the mirror specular angle of depression with respect to the set, so that it is retracted to the outside of the observation field of the observation optical system.
15. 根据权利要求13所述的外观检查装置,该外观检查装置具有可变视野方向观察装置,其特征在于, 上述工件是平板状的试样,上述边缘部检查部是安装在观察上述平板状的试样正面的显微镜装置上的观察装置,上述边缘部检查部具有-二轴台,其在与上述试样的表面正交的Z方向和与上述试样的表面平行的X方向上可动;基座,其具有使上述二轴台在Z方向上移动的驱动部; 台的平行方向移动部,其由固定在上述基座上的第1凸轮、安装在上述二轴台的X方向移动板上且沿着该第1凸轮移动的辊、以及作用在使上述基座和上述X方向移动板接近的方向上的拉伸弹簧构成;显微镜装置的观察光学系统,其光轴在上述二轴台上与上述试样的表面正交;镜部,其配置在上述观察光学系统内的物镜和该物镜的焦点位置之间,可使上述光轴任意进行偏向;第2凸轮, 15. The visual inspection device of claim 13, the appearance inspection apparatus having a variable field of view direction of observation apparatus, wherein the workpiece is a plate-like sample, said edge portion is mounted on the inspection portion of the plate-like observation means microscope observation apparatus positive sample inspection portion of the edge portion having - two-axis stage which is movable on a surface of said sample perpendicular to the Z-direction and parallel to the surface of the sample in the X direction ; base having the above-described two-axis driving unit moving the stage in the Z direction; a direction parallel to the mobile station unit, a first cam which is fixed on the base, the mounting direction of the movement in the X-axis table of two plate and movable along the first cam roller, and that the tension spring on the base plate and said X direction constituting a direction approaching; observation optical system of a microscope apparatus, in which the optical axis of the above-described two-axis orthogonal to the surface of said sample stage; a mirror portion, disposed between the objective lens and the focal position of the objective lens in the observation optical system, the optical axis can arbitrarily biased; a second cam, 固定在上述基座上;第2辊,其安装在从上述镜部的旋转轴伸出的旋转臂上,沿着上述第2凸轮移动;以及拉伸弹簧,其悬挂固定在上述旋转臂和上述二轴台之间,作用在上述第2辊被上述第2凸轮推压的方向上,伴随上述二轴台向Z方向的移动,上述观察光学系统的位置和上述转动镜的角度通过上述第l、第2凸轮而移动,即使任意改变视野方向, 也相对于上述试样的外周端面和延续到该外周端面的正背面来变更视野方向,同时将上述物镜和上述试样的外周端面之间的距离保持为恒定。 Fixed to the base; a second roller, mounted on a swivel arm extending from the rotation axis of the mirror portion, moves along the second cam; and a tension spring, which is fixed to the suspension arm and said rotating between the two-axis stage, acting in the direction of the second roller is pressed to the second cam, with the above-described two-axis stage in the Z direction of the moving angle, a position of the observation optical system and the rotating mirror by the first l the second cam is moved, even if arbitrarily changed view direction, also with respect to the sample of an outer circumferential surface and extended to the front and rear surfaces of the outer peripheral end surface of the changed visual field direction, while the objective lens and the sample of the outer circumferential end surface of distance remains constant.
16. —种外观检査方法,其特征在于,该外观检查方法具有: 利用配置在外观检查部上的保持单元保持工件并对上述工件正面进行外观检査的步骤;使边缘部检査部与上述保持单元相对接近的步骤,其中,该边缘部检查部取得上述工件的侧面部、倒角部及其正背面的周围部分的放大像; 以及在使上述保持单元相对接近的状态下,利用边缘部检查部取得上述工件的边缘部的放大像的步骤。 16. - Species appearance inspection method, characterized in that the visual inspection method comprising: using a holding means disposed on the visual inspection of the portion of the front step of the workpiece and the workpiece holding visual inspection; inspection portion of the edge portion said holding means relatively close to the step, wherein an edge portion of the side surface portion acquires the inspection portion of the workpiece, the chamfered portion and an enlarged image of the peripheral portion of the front and back; and in that the said holding means relatively close state, the edge an enlarged portion of the inspection image acquiring step at the edge portion of the workpiece.
17. —种可安装在外观检查装置上的边缘部检查单元,其特征在于,该边缘部检查单元具有:固定部,其相对于外观检查部可自由拆装,该外观检査部在以可自由移动的方式将工件保持在保持单元上的状态下对工件正面实施外观检查;以及放大像取得部,其被配置成朝向上述保持单元所保持的上述工件的的边缘部,可取得上述工件的侧面部、倒角部及其正背面的周围部分的放大像。 17. - then the edge of the inspection unit may be installed in the appearance inspection apparatus, characterized in that the edge of the inspection unit comprises: a fixed portion with respect to the appearance inspection unit detachably, the appearance inspection unit to be visual inspection of the front embodiment work in a state freely movable manner workpiece held by the holding unit; and an edge portion of an enlarged image acquiring unit, which is arranged toward the workpiece the holding unit holding the can acquire the workpiece the side surface portion, a chamfered portion and an enlarged image of the peripheral portion of the front and back.
18. 根据权利要求17所述的可安装在外观检查装置上的边缘部检査单元,其特征在于,上述固定部和上述放大像取得部通过可在一轴方向上自由移动的台进行连接。 An edge portion of the inspection unit may be installed in the appearance inspection apparatus according to claim 17, wherein said fixing portion and said enlarged image acquisition section connected by a freely movable table in an axial direction.
CN 200680014011 2005-04-27 2006-04-26 Visual inspection apparatus, visual inspection method, and peripheral edge inspection unit that can be mounted on visual inspection apparatus CN100583407C (en)

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