CN100578275C - Production method of optical module - Google Patents
Production method of optical module Download PDFInfo
- Publication number
- CN100578275C CN100578275C CN200510106837A CN200510106837A CN100578275C CN 100578275 C CN100578275 C CN 100578275C CN 200510106837 A CN200510106837 A CN 200510106837A CN 200510106837 A CN200510106837 A CN 200510106837A CN 100578275 C CN100578275 C CN 100578275C
- Authority
- CN
- China
- Prior art keywords
- support
- sensor chip
- adjutage
- lens
- folding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
A method for preparing optical module includes providing a support, setting a LED chip and a sensing chip on aid support, forming protective layers to separately cover LED chip and sensing chip with lens.
Description
Technical field
The present invention relates to a kind of method of making optical module, particularly relate to a kind of method of utilizing protective seam to form lens and protecting the optical module inner member.
Background technology
Optical mouse can be divided into polishing system (light-generating system) and imaging system (imagingsystem).The polishing system is made of light emitting diode, holder, lens combination.And the imaging system is made of lens (being arranged in the lens combination), glue shell, sensor chip, conducting bracket and aperture.Below will describe in detail.
See also Fig. 1; Fig. 1 is the cut-open view of previous optical mouse 10 structures.At first be ready to conducting bracket 26, it has a plurality of legs 13, because Fig. 1 is easy synoptic diagram, sees also the leg 13 among Fig. 3.Be fixed in sensor chip 24 on the conducting bracket 26 and finish routing, then, conducting bracket 26 is fixed on the glue shell 22.Glue shell 22 is the black colloid of an injection mo(u)lding; it is a space container; be used for protecting sensor chip 24; and it includes a lower cover; this lower cover has a hole (aperture); therefore this lower cover can be used as an aperture 28 uses, and the function of aperture 28 is covers unwanted light beam to improve the optical imagery quality.
See also Fig. 2; Fig. 2 is the exploded view of Fig. 1 optical mouse 10.Utilize the fixedly position of light emitting diode 12 of holder 14, printed circuit board (PCB) 30 is located at the top of lens combination 16.Printed circuit board (PCB) 30 can be by being connected to come auxiliary fixedly sensor chip 24 and light emitting diode 12 with conducting bracket 26 with holder 14.
See also Fig. 3, Fig. 3 for the glue shell 22 of welding among Fig. 1 in the synoptic diagram of printed circuit board (PCB) 30.When welding, must on aperture 28, stick dustproof adhesive tape 17, as shown in Figure 3, be used for protecting sensor chip 24 when glue shell 22 is welded on the printed circuit board (PCB) 30, the destruction that is not subjected to welding substance.A plurality of legs 13 of conducting bracket 26 are inserted in a plurality of corresponding welding holes on the printed circuit board (PCB) 30, so that glue shell 22 is fixed on the printed circuit board (PCB) 30.
Because the printed circuit board (PCB) 30 of when welding part can immerse in the welding substance 23 with glue shell 22, and the temperature during welding is quite high, and therefore resistant to elevated temperatures dustproof adhesive tape 17 can be avoided the destruction of high temperature or 23 pairs of sensor chips 24 of welding substance.Yet the adhesive tape 17 that needs again after welding finishes to prevent dust tears off from aperture 28, just can continue follow-up assembling or test action.If will keep in repair optical mouse 10, must again the adhesive tape 17 that prevents dust be sticked up again, to avoid the pollution of dust, real is inconvenience.
At last, imaging system and the polishing system that combines is fixed on the base 40, promptly finishes the making of optical mouse 10.
By above-mentioned manufacturing process as can be known, the manufacturer that makes conventional optical mouse 10 need order sensor chip 24 respectively, have the over cap and the dustproof adhesive tape 17 of aperture 28, to be assembled on the glue shell 22.In addition, also need order light emitting diode 12 and lens combination 16 and lens 18 (being arranged in the lens combination 16), again with all elements combination to finish the making of optical mouse 10.For manufacturer, order these elements to different vendor and quite bother.In addition,, therefore cause the structure of optical mouse 10 comparatively complicated because the element of combination is more, also comparatively difficult in the assembling.In addition, because measuring optical mouse 10 is respectively each element to be tested assembling again, therefore have the problem in the collocation.If when assembling be the position between positioning lens 18 and the sensor chip 24 exactly, and the position between lens combination 16 and the light emitting diode 12, then can reduce the sensitivity of optical mouse 10.
Summary of the invention
Therefore, the invention provides a kind of method of making optical module, to solve the above problems.
The method of the making optical module that the present invention discloses comprises the following steps:
(a) provide a support;
(b) light source is located on this support;
(c) form the protective seam that comprises first lens that is covered in this light source; And
(d) sensor chip on the illuminant module is located on this support, the adjutage of moving this support of folding is so that the aperture on this adjutage is arranged in the top that this sensor chip receives the zone of light;
(e) form the protective seam that comprises second lens that is covered in this sensor chip and this adjutage;
Aperture on this adjutage that described folding moves is able to the position between these second lens on this sensor chip and this sensor chip;
This light source and this illuminant module wherein be located on this support constitute this optical module.
The present invention also discloses a kind of method of making optical module, and it comprises the following steps:
(a) provide a support;
(b) sensor chip is located on this support, the adjutage of moving this support of folding is so that the aperture on this adjutage is arranged in the top that this sensor chip receives the zone of light;
(c) form the protective seam that comprises lens and this adjutage that is covered in this sensor chip, the aperture on the adjutage that described folding moves is able to the position between this sensor chip and this lens; And
(d) light source module is located on this support;
This light source module and this sensor chip wherein be located on this support constitute this optical module.
Description of drawings
Fig. 1 is the cut-open view of existing optical mouse structure;
Fig. 2 is the exploded view of Fig. 1 optical mouse;
Fig. 3 is the synoptic diagram of the printed circuit board (PCB) of glue shell in Fig. 2 among welding Fig. 1;
Fig. 4 to Fig. 8 is the synoptic diagram of combination illuminant module of the present invention and each step of light source;
Fig. 9 is the synoptic diagram of another embodiment of conducting bracket of the present invention;
Figure 10 is provided with the synoptic diagram of another embodiment of aperture for the present invention;
Figure 11 and the exploded view of Figure 12 for the different embodiment of combination optical mouse of the present invention;
Figure 13 is the synoptic diagram of the printed circuit board (PCB) of optical module in Figure 11 among welding Fig. 8;
Figure 14 is the cut-open view of optical mouse of the present invention assembling after finishing.
Embodiment
In order to solve the problems of the prior art, the invention provides a kind of process for making of optical mouse and relevant assembling mode.See also Fig. 4 to Fig. 8; Fig. 4 to Fig. 8 makes up the synoptic diagram of illuminant module and each step of light source module for the present invention.
At first prepare as the conducting bracket among Fig. 4 60, it comprises a plurality of legs 62; Then, be individually fixed in a sensor chip 72 and a light-emitting diode chip for backlight unit (LED chip) 74 on the conducting bracket 60 and carry out routing, as shown in Figure 5, the conducting bracket 60 of some between the position of sensor chip 72 and light-emitting diode chip for backlight unit 74 wherein.Come, as shown in Figure 6, the lid 80 that will have aperture 82 is fixed on the conducting bracket 60 again, and makes aperture 82 be arranged in the top that sensor chip 72 receives the zone of light, and lid 80 can be plastic material or other material.Next as shown in Figure 7, carry out the mold step, utilize protective seam 75 that sensor chip 72 and light-emitting diode chip for backlight unit 74 are covered fully, and utilize the protective seam 75 of part to form lens 71,73.Protective seam 75 can be resin (epoxy), and it can be can anti-265 ℃ thermosetting cement.If use transparent resin, the visible light emitting diode chip of then can arranging in pairs or groups, as the light-emitting diode chip for backlight unit of red, blueness or green etc., or laser diode (laser diode, LD) chip etc.If use the transparent opaque resin of infrared ray, the infrared light-emitting diode chip of then can arranging in pairs or groups.The material of protective seam 75 does not limit the material of the above, and any material that can be used to protect chip or form lens all is a category of the present invention.
At last as shown in Figure 8, a plurality of legs 62 of cutting conducting bracket 60, and adjustment leg 62, and with the conducting bracket between sensor chip 72 and light-emitting diode chip for backlight unit 74 positions 60 folding moving at an angle 77, promptly finish the illuminant module in the optical mouse and the combination of light source module, about angle 77 in after detailed explanation is arranged.
The mode that aperture 82 is set among Fig. 6 does not limit utilizes extra lid 80 to reach.For instance, if with the conducting bracket 90 of the conducting bracket among Fig. 4 60 design as having a plurality of legs 92 among Fig. 9, conducting bracket 90 and conducting bracket 60 differences are conducting bracket more than 90 has the adjutage 94 of aperture 96.When manufacturing process steps is carried out when aperture is set, as long as the moving adjutage 94 of folding as shown in figure 10, also can be reached the effect of Fig. 6 so that aperture 96 is arranged in the top that sensor chip 72 receives the zone of light.
For convenience of description, the optical module label of Fig. 8 being finished is 91.By the optical module 91 of Fig. 8 of the present invention, the structure of optical mouse can be simplified as shown in figure 11; Figure 11 is the synoptic diagram of combination optical mouse 100 of the present invention, wherein bracing frame 95 comprises two holes 951,952 and an inclined-plane 953, hole 951,952 is respectively in order to hold lens 71,73, and inclined-plane 953 is in order to support angle 77, change because of external force or other factors with the angle of avoiding angle 77, bracing frame 95 is fixed in the framework 971 on the base 97.During combination optical mouse 100 of the present invention, only need are welded in the leg 62 of the optical module 91 of Fig. 8 on the printed circuit board (PCB) 93, printed circuit board (PCB) 93 is fixed on the fixed leg 99 of base 97, and optical module 91 can be located to guarantee it by bracing frame 95 again, can finish the assembling of optical mouse 100.In addition, also can omit the bracing frame 95 among Figure 11, as shown in figure 12, the leg 62 of optical module 91 is welded in printed circuit board (PCB) 93 after, again printed circuit board (PCB) 93 is fixed in the fixed leg 99 on the base 97, promptly finish assembling.
Because protective seam 75 is high temperature resistant, therefore when the optical module 91 of Fig. 8 was welded on the printed circuit board (PCB) 93, protective seam 75 can directly protect chip 72,74 to destroy chip 72,74 to avoid welding substance or high temperature, as shown in figure 13; Figure 13 for the optical module 91 of welding among Fig. 8 in the synoptic diagram of printed circuit board (PCB) 93.The present invention need not to paste extraly dustproof adhesive tape 17 and protects chip, therefore can simplify the program of manufacture craft and the trouble that dustproof adhesive tape 17 was pasted or torn off in minimizing.
Please continue to consult Figure 14, the cut-open view that Figure 14 assembles after finishing for optical mouse 100 of the present invention wherein uses the aperture 96 among Figure 10.As shown in figure 14, the conducting bracket between sensor chip 72 and the light emitting diode 74 90 must form an angle 77, the just angle among Fig. 8 77.The size of angle 77 is wanted suitably just can to make light that light emitting diode 74 penetrates to be projected to sensor chip 72 via the refraction action of lens 73 and is received on the using planar 98 under the light zones, and wherein angle 77 is preferably 60 ° to 85 °.
Compared with prior art, the present invention utilizes protective seam to form the lens of sensor chip and light-emitting diode chip for backlight unit, replaces traditional optical lens group.Because protective seam can be high temperature resistant, therefore when welding, can avoid welding substance or high temperature to destroy chip, also can avoid pollution chips such as dust.In addition, because sensor chip and light-emitting diode chip for backlight unit all are arranged on the conducting bracket, therefore only the angle that needs to adjust conducting bracket between this two elements to be to locate this two elements, therefore can simplify the structural design of optical mouse and avoids testing respectively in the prior art each element and assemble the problem that is produced again.The present invention directly tests on desktop after whole optical mouse has been assembled, and meets the test mode of mouse manufacturer.
The above only is preferred embodiment of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (14)
1. method of making optical module, it comprises the following steps:
(a) provide a support;
(b) light source is located on this support;
(c) form the protective seam that comprises first lens that is covered in this light source; And
(d) sensor chip on the illuminant module is located on this support, the adjutage of moving this support of folding is so that the aperture on this adjutage is arranged in the top that this sensor chip receives the zone of light;
(e) form the protective seam that comprises second lens that is covered in this sensor chip and this adjutage;
Aperture on this adjutage that described folding moves is able to the position between these second lens on this sensor chip and this sensor chip;
This light source and this illuminant module wherein be located on this support constitute this optical module.
2. the method for claim 1, it comprises that in addition a plurality of legs with this support are fixed on the circuit board.
3. method as claimed in claim 2, it comprises in addition this optical module is fixed on the bracing frame.
4. method as claimed in claim 3, it comprises in addition this bracing frame is fixed on the base.
5. the method for claim 1, it comprises moving this support to one angle of folding in addition, so that this illuminant module is sensed the light that this light source projects to one using planar is reflected.
6. method as claimed in claim 5, wherein moving this support to this angle of folding is between moving this support to 60 degree of folding and 85 degree.
7. the method for claim 1, wherein said light source is a light emitting diode.
8. method of making optical module, it comprises the following steps:
(a) provide a support;
(b) sensor chip is located on this support, the adjutage of moving this support of folding is so that the aperture on this adjutage is arranged in the top that this sensor chip receives the zone of light;
(c) form the protective seam that comprises lens that is covered in this sensor chip and this adjutage, the aperture on the adjutage that described folding moves is able to the position between this sensor chip and this lens; And
(d) light source module is located on this support;
This light source module and this sensor chip wherein be located on this support constitute this optical module.
9. method as claimed in claim 8, wherein step (c) is for forming the resin that comprises lens that is covered in this sensor chip and this adjutage.
10. method as claimed in claim 8, it comprises that in addition a plurality of legs with this support are fixed on the circuit board.
11. method as claimed in claim 8, it comprises in addition this optical module is fixed on the bracing frame.
12. method as claimed in claim 11, it comprises in addition this bracing frame is fixed on the base.
13. method as claimed in claim 8, it comprises moving this support to one angle of folding in addition, is projected to the light that a using planar is reflected so that this sensor chip senses this light source module.
14. method as claimed in claim 13, wherein moving this support to this angle of folding is between moving this support to 60 degree of folding and 85 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510106837A CN100578275C (en) | 2005-09-26 | 2005-09-26 | Production method of optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510106837A CN100578275C (en) | 2005-09-26 | 2005-09-26 | Production method of optical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1940613A CN1940613A (en) | 2007-04-04 |
| CN100578275C true CN100578275C (en) | 2010-01-06 |
Family
ID=37958958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200510106837A Expired - Fee Related CN100578275C (en) | 2005-09-26 | 2005-09-26 | Production method of optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100578275C (en) |
-
2005
- 2005-09-26 CN CN200510106837A patent/CN100578275C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1940613A (en) | 2007-04-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10963667B2 (en) | Under-screen biometric identification apparatus and electronic device | |
| TWI735232B (en) | Light emitter and light detector modules and method of fabricating the same | |
| EP3410169A1 (en) | Optical lens head, camera module and assembling method therefor | |
| JP5256790B2 (en) | Solid-state imaging device, manufacturing method of solid-state imaging device, and manufacturing method of camera module | |
| JP6357440B2 (en) | Stereolithography equipment | |
| JPS634318A (en) | Cursor controller | |
| CN1979243A (en) | Image pickup apparatus and method for manufacturing the same | |
| JP2007060288A (en) | Small camera module | |
| CN109886118A (en) | Fingerprint recognition component and electronic equipment | |
| US7764271B2 (en) | Method of manufacturing an optical module | |
| CN209859155U (en) | Fingerprint identification device and electronic equipment | |
| CN100578275C (en) | Production method of optical module | |
| CN208580413U (en) | Fingerprint mould group and electronic equipment | |
| JP2006268015A (en) | Optical element, optical system and methods of manufacturing the same, and optical device | |
| CN112621210A (en) | Automatic assembly method, device and system for FAC mirror in semiconductor pump source shell | |
| CN100426207C (en) | Light-source module and optical module with light-sensitive module fitted on carriage | |
| CN104869293A (en) | Image obtaining apparatus for imaging target area | |
| CN203164578U (en) | HD reflow mobile phone camera module group | |
| JP2021534453A (en) | Lens group assembly, optical lens, imaging module and lens group assembly method | |
| JP2003227970A (en) | Optical link device | |
| CN1971926A (en) | Encapsulation structure of optical sensing element with micro-packaging area | |
| CN204681462U (en) | A kind of image acquiring device for target area imaging | |
| CN210691344U (en) | Fingerprint identification device | |
| US20170276871A1 (en) | Bonding method, method of producing optical module, and optical module | |
| CN214845769U (en) | Photoelectric sensor and distance measuring device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Free format text: FORMER OWNER: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131108 Owner name: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131108 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: 213166 CHANGZHOU, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20131108 Address after: 213166 Wujin high tech Industrial Development Zone, Jiangsu Province, Yang Lake Road, No. 88 Patentee after: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Patentee after: Lite-On Technology Corporation Address before: Taipei City, Taiwan, China Patentee before: Lite-On Technology Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100106 Termination date: 20170926 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |