CN100576720C - Constant-temperature type crystal oscillator - Google Patents
Constant-temperature type crystal oscillator Download PDFInfo
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- CN100576720C CN100576720C CN200510070833A CN200510070833A CN100576720C CN 100576720 C CN100576720 C CN 100576720C CN 200510070833 A CN200510070833 A CN 200510070833A CN 200510070833 A CN200510070833 A CN 200510070833A CN 100576720 C CN100576720 C CN 100576720C
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Abstract
Wherein draw the type crystal oscillator at the lead of the thermostatic type that is used for high stability, the present invention is such crystal oscillator, and it comprises: hot body, its give one from the crystal resonator heat supply of wherein having drawn many leads to keep temperature constant; Oscillating element, it has constituted oscillating circuit with described crystal resonator; Temperature control element, it has constituted the temperature control circuit of the temperature that is used to control described crystal resonator; And the circuit board that is used to install described hot body, described oscillating element and described temperature control element, and for the lead that described crystal resonator is installed passes this circuit board, described hot body comprises: heat-conducting plate, it has the through hole that is used for described lead, and be installed on the described circuit board, and its surperficial direct heat is connected on the described crystal resonator; With the chip resistor that is used to heat, it is installed on the described circuit board adjacent with described heat-conducting plate, and itself and described heat-conducting plate hot link.
Description
Technical field
The present invention relates to a kind of lead and draw the high stable crystal oscillator of type and thermostatic type (being called the high stable oscillator hereinafter), and be particularly related to a kind of in heat utilization effective high stable oscillator.
Background technology
The frequency stability of such high stable oscillator is higher, because the operating temperature of crystal oscillator keeps constant by thermostat.Therefore, for example such high stable oscillator uses in the optical communication base station on industrialization ground.Recently, miniaturization even also expanded to these high stable oscillators, and required corresponding miniaturization.
Fig. 2 A and Fig. 2 B describe the block diagram of conventional example that such lead is drawn the crystal oscillator of type.Fig. 2 A is the longitudinal sectional view of high stable oscillator, draws the perspective view of the crystal resonator of type and Fig. 2 B is the lead that uses in oscillator.
Shown in Fig. 2 A, such high stable oscillator comprises first circuit board 1a and second circuit board 1b.The metallic pin 3a support that first circuit board 1a is insulated and passed the outside terminal of metal base 2 by conduct and metal base 2.Arrange that thermostat 4 and temperature control component 5 keep the temperature control device of thermostat 4 temperature constant with structure.Thermostat 4 comprises the metallic cylinder with an openend.Heater coil 6 is wrapped in its periphery, and stationary heat sensitive resistor 5a is as detector unit.In addition, thermostat 4 is based on being protected as automatically controlled power transistor 5b, and this power transistor 5b is installed on the first circuit board 1a.
Second circuit board 1b is supported by the metallic pin 3b that is placed on the first circuit board 1a, and separates a upper shed face of thermostat 4.Crystal resonator 7 and oscillating element 8 are installed on two relative primary flats of primary flat of second circuit board 1b in addition, have therefore constructed an oscillating circuit.This oscillating circuit is a voltage-controlled type that for example has voltage-controlled varactor element 8a.
Shown in Fig. 2 B, the crystal resonator 7 of such crystal oscillator for example comprise one be sealed in canister 7a (TO5 type) inner, have the AT otch or the SC otch wafer 7b that draw five leads 9 from its bottom.This wafer 7b remains on the inside of canister 7a when keeping its plate face level, and as the high stable oscillator, is used for communication equipment especially.
The lead 9 of crystal resonator 7 passes second circuit board 1b and fixes by welding thereon, and the canister 7a that is arranged on a crystal resonator 7 on the primary flat is contained in the thermostat 4.In addition, the oscillating element 8 that the height that its feature is fluctuateed according to the temperature change of voltage-controlled varactor element 8a etc. depends on temperature is arranged on another primary flat of second circuit board 1b, and is contained in the thermostat 4.They are covered by metal shell 10 then.
According to so conventional high stable oscillator, the operating temperature of crystal resonator 7 keeps constant by thermostat 4, therefore can prevent because the frequency fluctuation in the oscillator frequency that variations in temperature causes.In other words, can prevent based on the fluctuation in the oscillator frequency of the frequency-temperature characteristic of crystal resonator 7.In addition,, the second circuit board 1b of oscillating element 8 is installed on the thermostat 4, so also can prevent because the frequency fluctuation that the temperature characterisitic of circuit element self causes because being installed.Because highly depend on temperature, so for example particularly voltage-controlled varactor element 8a of the extremely sensitive element of heat is contained in the inside of thermostat 4, the high stable oscillator can further increase frequency stability, for example can keep 0.05ppm or frequency departure still less.Therefore, the high stable oscillator uses especially and makes industrial purpose.
In addition,, will comprise that the temperature control device of thermostat 4 is arranged on the first circuit board 1a, and will comprise that the oscillating circuit of crystal resonator 7 is arranged on the second circuit board 1b for conventional high stable oscillator.Therefore, can make described temperature control device and described oscillating circuit discretely, and therefore can design them expediently and make them.In addition, oscillating element 8 is installed on the second circuit board 1b, and is electrically connected to first circuit board 1a by metallic pin 3b.Therefore here, first circuit board 1a directly is not drawn out to the outside, and (referring to Japan uncensored patent disclosure book KOKAI Hei 01-195706 number) can prevent to dispel the heat to the outside.
Yet,, therefore need first circuit board 1a and second circuit board 1b owing to make temperature control device and oscillating circuit discretely for the conventional high stable oscillator of last surface construction.In addition, because used the thermostat 4 that accommodates crystal resonator 7, the increase of therefore inevitable oscillator size.Especially because arranged first circuit board 1a with second circuit board 1b so that they be perpendicular to one another relative, so the problem that increases with regard to the height dimension that has oscillator itself.
In addition, oscillator also has a problem, and that is exactly because use separating of the thermostat 4 that is wrapped in the heater coil 6 around it and crystal resonator 7 and make oscillator itself become very expensive having.The oscillator that also has the canister 7a of a use crystal resonator 7, and this canister 7a also is used for thermostat 4.Yet, all there is a problem in the arbitrary example in these two examples, that is exactly that manufacturing operation is pretty troublesome, and makes oscillator self become more expensive on the thermostat 4 owing to being wrapped in heater coil 6.
An object of the present invention is to provide a kind of high stable oscillator, its structure is simpler, and has particularly reduced its height dimension.
In addition, the present invention relates to a kind of crystal resonator that uses mounted on surface (SMD: the constant-temperature type crystal oscillator abbreviation of the device of mounted on surface), and relate to a kind of constant-temperature type crystal oscillator especially with simple structure.
Fig. 6 is the block diagram that is used to explain an example of the crystal oscillator that such conventional surface is installed, and wherein Fig. 6 A is the longitudinal sectional view of constant-temperature type crystal oscillator, and Fig. 6 B shows the schematic block diagram of the crystal oscillator that inserts thermostat.
Such crystal oscillator comprise crystal resonator 22, thermostat 23, oscillating element 24 and be arranged on first circuit board 21a and second circuit board 21b on temperature control component 25.First circuit board 21a is by being used as metallic pin 27a (sealed terminal end) support of insulating and passing the outside terminal of metal base 26 with metal base 26.Second circuit board 21b is supported by the metallic pin 27b that embeds first circuit board 21a.First circuit board 21a and second circuit board 21b are formed by the glass epoxide material.
Shown in Fig. 6 B, crystal resonator 22 for example comprises AT otch that has a pair of lead of drawing 28 or the SC otch wafer that is sealed in can 29 inside.Thermostat 23 is formed by the metallic cylinder 30 that is wound with heater wire 31 around it, and accommodates the crystal resonator 22 that is also shown among Fig. 6 A.In addition, the primary flat of placing metallic cylinder is so that its primary flat towards second circuit board 21b, and these two primary flats are by heat-conducting resin 32 hot links.And then, with couple of conductor 28 bendings of crystal resonator 22 and be connected to second circuit board 21b.
Oscillating element 24 is formed an oscillating circuit with crystal resonator 22, and they are arranged on another primary flat of second circuit board 21b.Temperature control component 25 comprises at least one as the thermistor 25a to temperature-sensing element (device), and constitutes the temperature-control circuit of controlling thermostat 23 temperature with power transistor.Member except that temperature-sensitive resistance 25a all is installed in the outward flange of first circuit board 21a.In this temperature-control circuit, the temperature of thermostat 23 for example detects by thermistor 25a is connected to thermostat 23.Then, based on this detected temperatures, control offers the power of heater coil 31 to keep thermostat 23 temperature inside constant.A metal shell 33 has covered these members.
According to such crystal oscillator, can make its maintenance constant by the operating temperature of thermostat 23 control crystal resonators 22, therefore can prevent because the frequency fluctuation of the frequency of oscillation that variations in temperature causes.In other words, can prevent based on the frequency-temperature characteristic of crystal resonator 22 and the fluctuation of the frequency of oscillation that causes.In addition, be arranged on the thermostat 23, therefore can prevent because the frequency fluctuation that the temperature characterisitic of circuit element self causes because the second circuit board 21b of oscillating element 24 will be installed.
Yet shown in Fig. 6 B, because the crystal oscillator of top structure has used crystal resonator 22, wafer is contained in the can 29 with lead 28 of guiding to the outside in crystal resonator 22, and the size of crystal oscillator self has increased.In addition, because use the thermostat 23 that is twined on it by heater coil 31, crystal oscillator self becomes more expensive and its structure becomes more complicated.Also exist a kind of heater coil 31 directly to be wrapped in oscillator on the canister 29 of crystal resonator 22.Yet,, also require to be used for heater coil 31 is wrapped in operation on the thermostat 23, and therefore, all have the problem of the complexity of an increase structure in the arbitrary example in these two examples even in this case.
In addition, these crystal oscillators be for the use in the base station adopted, just as its that early describe has 0.05ppm or frequency stability still less.Yet,, had the example that surmounts specification because for example the target call 0.1 of GMS arrives 0.2ppm or the frequency stability of appropriateness relatively still less.According to this, can consider the temperature compensating crystal oscillator of mounted on surface.Yet frequency stability approximately is 1ppm in this case, therefore has a problem, and that is exactly that it can not satisfy preassigned.
An object of the present invention is to provide a kind of constant-temperature type crystal oscillator, wherein developed miniaturization and oversimplified structure.
Summary of the invention
Wherein draw the type crystal oscillator at the lead of the thermostatic type that is used for high stability, the present invention is a such crystal oscillator, and it comprises: hot body, and it is given from the crystal resonator heat supply of wherein having drawn many leads to keep temperature constant; Oscillating element, it has constituted oscillating circuit with described crystal resonator; Temperature control element, it has constituted the temperature control circuit of the temperature that is used to control described crystal resonator; And the circuit board that is used to install described hot body, described oscillating element and described temperature control element, and for the lead that described crystal resonator is installed passes this circuit board, described hot body comprises: heat-conducting plate, it has the through hole that is used for described lead, and be installed on the described circuit board, and its surperficial direct heat is connected on the described crystal resonator; With the chip resistor that is used to heat, it is installed on the described circuit board adjacent with described heat-conducting plate, and itself and described heat-conducting plate hot link.
According to such structure, by the chip resistor that is provided on the described circuit board described heat-conducting plate is heated, described oscillating element and described temperature control element are installed on the described circuit board, and described crystal resonator and these component sides to and direct heat be connected to this two elements.Therefore, no longer need thermostat, and only need single circuit board.As a result, can simplified structure, particularly can reduce himself height dimension of oscillator.
In the present invention, described heat-conducting plate has and is positioned at a pair of first recess on distolateral relatively, and the described chip resistor that has been thermally coupled to described heat-conducting plate is set in described first recess.As a result, described chip resistor is set at the position of how much stable symmetries, and can evenly heat described heat-conducting plate.
In addition, in the present invention, in distolateral relatively second recess is arranged, and the power transistor that has been thermally coupled to described heat-conducting plate is set in described second recess at another of described heat-conducting plate.As a result, calandria (chip resistor and power transistor) is set at heat-conducting plate up and down, and can heat more equably heat-conducting plate.In addition, by using the heat of power transistor, reduced the power consumption of chip resistor.
And then, in the present invention, in the central area of described heat-conducting plate, formed hole portion, and temperature altitude is relied on, the extremely sensitive element of heat is set in the portion of described hole, so that described senser is thermally coupled to described heat-conducting plate in described oscillating element and the described temperature control element.As a result, can solve temperature dependency, and can obtain stable properties the extremely sensitive element of heat.
In addition, in the present invention, described heat-conducting plate heat is connected on the primary flat of described circuit board, and described oscillating element is set at facing on another primary flat of described heat-conducting plate of described circuit board.As a result, can make that the temperature characterisitic of described oscillating element is constant, and can make frequency of oscillation more stable.
And then in the present invention, hot link is carried out by heat-conducting resin.As a result, for example can improve the bonding between described crystal resonator and the described heat-conducting plate, and can realize effective heat conduction.
In the present invention, provide the stripping and slicing of passing described circuit board, and it is in the periphery of described heat-conducting plate.As a result, described heat-conducting plate and the described circuit board in its periphery are that heat is isolated, thereby have prevented thermal diffusion.
In addition, the present invention is a kind of constant-temperature type crystal oscillator that has used the crystal resonator of mounted on surface, wherein the crystal resonator of mounted on surface is installed on the circuit board with oscillating element and temperature control element, and its structure is: described crystal resonator is disposed on the ceramic substrate, and at least one is used to produce the chip resistor of heat and highly depends on temperature the extremely sensitive element of heat is disposed in described ceramic substrate.
According to such structure, described crystal resonator is made at mounted on surface, and the described chip resistor that is used to heat is set at ceramic substrate.Therefore obtained a kind of constant-temperature type crystal oscillator that quickens miniaturization and have the structure of simplification.In addition, owing to will to the extremely sensitive arrangements of elements of heat on described ceramic substrate,, can directly detect heating-up temperature so if for example this is a thermally sensitive element.And then, if this then can solve its temperature dependency as an oscillating element.
The described crystal resonator of described crystal oscillator of the present invention is disposed on the primary flat of described ceramic substrate, and described pellet resistance and described thermally sensitive element are disposed on another primary flat of described ceramic substrate.As a result, can be set to face mutually by described chip resistor, and can improve the efficiency of heating surface with crystal resonator.In addition, it is adjacent with described thermally sensitive element that described chip resistor is set to, and therefore can directly detect heat and produce temperature.
In described crystal oscillator of the present invention, described crystal resonator is disposed on the primary flat of described ceramic substrate, and described chip resistor and described thermally sensitive element are disposed on another primary flat of described ceramic substrate, and another primary flat of described ceramic substrate is placed as with a primary flat of described circuit board and faces mutually, and between described chip resistor and described circuit board, provide heat-conducting resin, therefore bonded them.As a result, heat-conducting resin can will come from the heat of described chip resistor effectively be sent to described circuit board.
In described crystal oscillator of the present invention, the oscillating element that constitutes oscillating circuit is disposed on described circuit board and another primary flat that described ceramic substrate is faced mutually.As a result, can transfer heat to described oscillating element, so that temperature is even.Therefore, can prevent because the fluctuation of the oscillating element characteristic that temperature characterisitic causes.
In the present invention, described to the extremely sensitive element of heat or thermally sensitive element or voltage-controlled varactor element.As a result, can directly detect the heat generation temperature of described chip resistor.In addition, can prevent because the capacitance fluctuations that causes of temperature, and can realize about controlling the voltage controlled oscillator that voltage has the stable oscillation stationary vibration frequency.
In described crystal oscillator of the present invention, described circuit board is remained on the circuit board that another is used for mounted on surface by metallic pin.As a result, can obtain a kind of constant-temperature type crystal oscillator that is used for mounted on surface, and further quicken miniaturization.
Description of drawings
Fig. 1 is used to explain that lead of the present invention draws the diagram of the embodiment of type high stable oscillator, and wherein Figure 1A is its longitudinal sectional view, and Figure 1B is the plane graph of main point;
Fig. 2 is used to explain that lead draws the diagram of traditional high stable oscillator of type, and wherein Fig. 2 A is its part longitudinal sectional view, and Fig. 2 B is the perspective view of the container (hat) that holds a crystal oscillator;
Fig. 3 is the diagram of embodiment that is used to explain the crystal oscillator of mounted on surface of the present invention, and wherein Fig. 3 A is the longitudinal sectional view of the crystal oscillator of thermostatic type mounted on surface, and Fig. 3 B is the plane graph of ceramic substrate;
Fig. 4 is the longitudinal sectional view of embodiment that is used to explain the crystal oscillator of another thermostatic type mounted on surface of the present invention;
Fig. 5 is the longitudinal sectional view of embodiment that is used to explain the crystal oscillator of another thermostatic type mounted on surface of the present invention;
Fig. 6 is the diagram that is used to explain the crystal oscillator of traditional mounted on surface, and wherein Fig. 6 A is the longitudinal sectional view of constant-temperature type crystal oscillator, and Fig. 6 B has shown the schematic diagram that is inserted into the crystal oscillator in the thermostat.
Embodiment
Lead is drawn the type crystal oscillator
Fig. 1 is used to explain that lead of the present invention draws the diagram of the embodiment of type high stable oscillator, and wherein Figure 1A is its part longitudinal sectional view, and Figure 1B is the plane graph of main point.
High stable oscillator of the present invention comprises constant-temperature type crystal oscillator, and wherein the operating temperature of crystal oscillator is constant.At this, shown in Figure 1A, this high stable oscillator is by comprising crystal resonator 7 (a crystal wafer 7a) and being installed in the oscillating element 8 of the temperature control element 5 on the single circuit board 1 and the hot body 11 that is connected on the circuit board 1 constitutes.Hot body 11 comprises heat-conducting plate 12 and the chip resistor 13a and the 13b that are used to heat.At this, in order to heat the power transistor that also uses temperature control element 5.
Heat-conducting plate 12 comprises that for example its flat shape is the aluminium sheet of rectangle, and has shown in Figure 1B and be arranged in first couple of distolateral relatively recess 14a, be positioned at and first pair of relative distolateral second couple of recess 14b and bore portion 15 that is positioned at its central area that recess is vertical.This is distolateral relatively to be positioned on the concentric circles of central area at middle part that has as them.Through hole 16 is provided at the peripheral edge of bore portion 15, and the lead 9 of crystal resonator 7 passes through hole 16.In addition, four of heat-conducting plate 12 jiaos are screwed on the circuit board 1.In the present embodiment, between circuit board 1 and heat-conducting plate 12, cover a kind of heat-conducting resin 12b, thereby their hot links are got up.And then, relatively provide the hook-type stripping and slicing 17 that passes completely through circuit board 1 at heat-conducting plate 12 four jiaos.
This crystal resonator comprises and is enclosed in a crystal wafer 7a in the TO8 type crystal resonator 7, and the canister that this resonator 7 is had from five leads 9 of wherein drawing covers.The every lead 9 of crystal resonator 7 passes the through hole in heat-conducting plate 12 and the circuit board 1, and fixes with welding.In the case, it is big that the size of the through hole in the heat-conducting plate 12 is done than in the circuit board 1, so lead 9 and heat-conducting plate 12 are electric insulations.In addition, crystal resonator 7 is faced each other mutually with the bottom of heat-conducting plate 12, and is coated in heat-conducting resin between them directly by hot link by a kind of, and they are installed on the primary flat of circuit board 1.
In oscillating element 8 and temperature control element 5, voltage-controlled varactor element 8a and thermistor 5a are placed on shown in Figure 1B in the bore portion 15, and they are thermally connected on the heat-conducting plate 12 by a kind of heat-conducting resin, wherein voltage-controlled varactor element 8a and thermistor 5a are that hole portion 15 is arranged on the central area of heat-conducting plate 12 to the extremely sensitive element of heat.Not to the extremely sensitive element (8a of heat, other oscillating element 8 5a) is set on another primary flat of circuit board 1, this primary flat is relative with the opposite side of heat-conducting plate 12, and temperature control element 5 is arranged and is installed in the peripheral edge of two primary flats of circuit board 1.
According to this kind structure, heat-conducting plate 12 can also have been installed oscillating element 8 and temperature control element 5 by the chip resistor 13a and the 13b heating that are provided on the circuit board 1 on this circuit board.And then, be connected to the heat-conducting plate of facing mutually 12 owing to hold the bottom of the canister of crystal resonator 7 by direct heat, therefore do not need thermostat, and circuit board 1 can be made of single substrate.Therefore, this structure can be made simply, and generally, particularly the height dimension of crystal oscillator can be done for a short time.
In addition, the chip resistor 13a and the 13b that hot link are advanced the first recess 14a are arranged on the heat-conducting plate 12, and wherein the first recess 14a is provided at the distolateral relatively of heat-conducting plate 12.Therefore, chip resistor 13a and 13b are in the position of how much stable symmetries, and can evenly heat heat-conducting plate 12.And then, power transistor 8c and the 8d that is thermally connected to heat-conducting plate 12 placed the into second recess 14b, wherein the second recess 14b is provided at vertical relative distolateral of the first recess 14a with heating plate 12.Therefore, heat-conducting plate 12 be provided with calandria ( chip resistor 13a and 13b, and power transistor 8c and 8d) up and down, so heating plate 12 can be heated more evenly.In addition, by using the heating of power transistor 8c and 8d, can reduce the electric power consumption of chip resistor 13a and 13b.
In addition, hole portion 15 is provided at the central area of heating plate 12, and be provided at the central area of oscillating element 8 and temperature control element 5, voltage-controlled varactor element 8a and thermistor 5a are thermally connected on the heat-conducting plate 12, and be placed in the hole portion 15, voltage-controlled varactor element 8a and thermistor 5a highly depend on temperature to the extremely sensitive element of heat.As a result, can solve temperature dependency, and can obtain stable properties the extremely sensitive element of heat.And then, heat-conducting plate 12 is thermally connected on the primary flat of circuit board 1, and oscillating element 8 is arranged on being positioned on another primary flat on the opposite side of circuit board 1.Therefore, can make the temperature characterisitic of oscillating element 8 constant, and make frequency of oscillation further stable.
In addition, because the hot link of crystal resonator 7 and heat-conducting plate 12 realizes that by heat-conducting resin is set heat-conducting resin has good caking property, thereby makes heat conduction more effective between them.And then because stripping and slicing 17 is the various pieces that are provided at the circuit board 1 on the peripheral edge that is arranged in heat-conducting plate 12, so heat-conducting plate 12 and the various piece that is positioned at the circuit board 1 on its edge be that heat is isolated, and prevented thermal diffusion thus.
In the above embodiments, crystal resonator 7 can be applied to and have on five TO8 types of drawing lead.In addition, the number of chip resistor 13a and 13b and power transistor 8c and 8d is respectively two.Yet its number can increase or reduce on demand.In addition, can use single chip resistor 13.
And then the hole portion 15 that is provided in the central area of heat-conducting plate 12 can be replaced 14a and 14b by the recess on the opposite end that is provided at heat-conducting plate 12.Another is chosen as, and can omit these recesses and hole portion, and chip resistor 13a, 13b etc. can be provided at simply on the peripheral edge of heat-conducting plate 12 that flat shape is a rectangle.Yet, at this for example for hot link heat-conducting plate 12 and crystal resonator 7a and use heat-conducting resin.Yet alternatively, can apply a kind of resin of fusing and be cured, perhaps can use the thin plate that solidifies in advance.Yet, because two-part caking ability is depended in hot link, so do not think that heat-conducting resin is essential.
The crystal oscillator of mounted on surface
Fig. 3 is the diagram of embodiment that is used to explain the crystal oscillator of mounted on surface of the present invention, wherein Fig. 3 A is the longitudinal sectional view of constant-temperature type crystal oscillator, and Fig. 3 B is the plane graph of the ceramic substrate (from the rear side of crystal oscillator) that is used for crystal oscillator of the present invention.
At first, as shown in Figure 3A, the crystal oscillator of mounted on surface of the present invention has first circuit board 21a and the second circuit board 21b that is formed by glass epoxy resin.First circuit board 21a comprises the substrate of multilayer, has circuit pattern on its multilayer planar, and has the mounting terminal 36 that is used for mounted on surface on its outer surface.To be provided on the primary flat of second circuit board 21b by the thermal conductive ceramic substrate 34 that metallic pin 27b supports.In addition, the oscillating element 24 that constitutes oscillating circuit is arranged in the central area of another primary flat, and the temperature control element 25 that will constitute temperature control circuit is arranged in its periphery.
The crystal resonator 22 that will be used for mounted on surface is arranged in a primary flat of ceramic substrate 34.The resonator 22 of this mounted on surface has and is enclosed in a crystal wafer in the ceramic vessel, and has the mounting terminal on the bottom surface that for example is positioned at a rectangle part.Two chip resistor 35a that are used to produce heat and 35b are arranged as relative, and are arranged in the central area of another primary flat relative with second circuit board 21b with crystal resonator 22.
In addition, among temperature control element, will be arranged between chip resistor 35a and the 35b as the thermistor 25a of thermally sensitive element.By backflow, as utilize scolder that each mounting terminal integrally is fixed to these crystal resonators 22, chip resistor 35 and 35b and terminal 25a.
In addition, as shown in Figure 3A, a kind of heat-conducting resin 32 is arranged between the surface of chip resistor 35a and 35b and second circuit board 21b, and uses metallic pin 27b that ceramic substrate 34 is arranged on the primary flat of second circuit board 21b.The clip portion that is provided on the bore edges of crown cap 33 is inserted in the opening of the periphery that is provided at first circuit board 21a, and makes its engagement, therefore connected two parts.Like this, second circuit board 21b is received.
In the crystal oscillator of such mounted on surface of the present invention, electricity is offered the chip resistor 35a and the 35b of generation heat by the power transistor of temperature control circuit.As a result, the Joule heat of chip resistor 35a and 35b is transmitted to ceramic substrate 34, thus to its heating.Via the mounting terminal that is used for mounted on surface the crystal resonator 22 that is fixed to ceramic substrate 34 is heated similarly.In addition, by the temperature of the ceramic substrate 34 of the direct detection arrangement of thermistor 25a on crystal resonator 22, thereby controlled supply of electric power.
Be bonded in the primary flat of second circuit board 21b and the heat-conducting resin 32 between chip resistor 35a and the 35b heat of chip resistor 35a and 35b is transferred to second circuit 21b effectively.Owing to oscillating element 24 is arranged in chip resistor 35a on another primary flat with the second circuit board 21b part relative with 35b, has therefore solved their temperature dependency.
According to such structure, this crystal oscillator can be done to such an extent that to draw the oscillator of lead than traditional having little, because this crystal oscillator is a mounted on surface.Because the heating source of crystal resonator 22 is chip resistor 35a and 35b and ceramic substrate 34, therefore can do the structure of this crystal resonator simpler, and compare with traditional crystal oscillator, do not need to twine the operation of heater wire and can make this crystal oscillator more cheap with the heater wire that twines around thermostat.
In addition, in the present invention, because first circuit board 21a used mounting terminal 36 to carry out mounted on surface.Do not need to use traditional metal base, and then can realize minimizing (shortening).
In the above embodiment of the present invention, crystal oscillator is a mounted on surface, yet it can be configured to as shown in Figure 4.That is, in the embodiment shown in fig. 4, be similar to traditional example, circuit board 21 can directly be supported by the metallic pin 27a that is installed to hermetically on the metal base 26.In the present embodiment, second circuit board 21b as shown in Figure 3A just becomes optional.
And then, as shown in Figure 5, for example utilizing a metal base 26 that is used for resistance welded, second circuit board 21b can be sealed in the crown cap 33.In the case, because each of oscillating element 24 and temperature control element 25 is sealed, therefore keeps apart, and improved aging degradation characteristic with extraneous air.
In addition, in the embodiment of the invention described above, as shown in Figure 3A, only thermistor 25a is arranged on another primary flat of ceramic substrate 34.Yet, for example can be arranged on this ceramic substrate as the voltage-controlled varactor element that temperature altitude is relied on, with the frequency fluctuation that further prevents to cause owing to temperature with to the extremely sensitive element of heat.And then as shown in Figure 3A, chip resistor 35a that only will be used to heat and 35b are arranged on a primary flat of ceramic substrate 34.Yet, for example in order to supply the power transistor that heat can be provided with temperature control circuit.
And then, as shown in Figure 3A, crystal resonator 22 is provided on the primary flat of ceramic substrate 34, and chip resistor 35a and 35b are provided on another primary flat of substrate 34.Yet because ceramic substrate 34 has fabulous heat conductivility and its macroscopical heat distribution is uniformly, therefore these elements of layout will be facilitated similar effects on same primary flat.
Claims (7)
1. constant-temperature type crystal oscillator, it comprises:
Hot body, its give one from the crystal resonator heat supply of wherein having drawn many leads to keep temperature constant;
Oscillating element, it has constituted oscillating circuit with described crystal resonator;
Temperature control element, it has constituted the temperature control circuit of the temperature that is used to control described crystal resonator; And
Be used to install the circuit board of described hot body, described oscillating element and described temperature control element, and the lead of described crystal resonator passes this circuit board and is used for installing, wherein:
Described hot body comprises:
Heat-conducting plate, it has the through hole that is used for described lead, and is installed on the described circuit board, and and direct heat relative with described crystal resonator connects; With
Chip resistor that is used to heat and power transistor, it is installed on the described circuit board adjacent with described heat-conducting plate, and itself and described heat-conducting plate hot link;
Described heat-conducting plate have be positioned at a pair of on distolateral relatively first recess and be positioned at another to second recess on distolateral relatively, described another to distolateral relatively perpendicular to described a pair of distolateral relatively, described chip resistor is set in described first recess, and power transistor is set in described second recess;
The central area of described heat-conducting plate has hole portion, and the heat-sensitive element in described oscillating element and the described temperature control element is set in the portion of described hole, so that be thermally coupled to described heat-conducting plate;
Described heat-conducting plate, described chip resistor, oscillating element and temperature control element are disposed on the primary flat of described circuit board, and described oscillating element and temperature control element are disposed on another primary flat relative with a described primary flat of described circuit board.
2. constant-temperature type crystal oscillator as claimed in claim 1, wherein said hot link is by the heat-conducting resin medium.
3. constant-temperature type crystal oscillator as claimed in claim 1, the hook-type stripping and slicing of wherein passing described circuit board is provided at the four jiaos of corresponding positions, periphery with described heat-conducting plate.
4. constant-temperature type crystal oscillator that has used the crystal resonator of mounted on surface, wherein the crystal resonator of mounted on surface is installed on the circuit board with oscillating element and temperature control element, wherein said crystal resonator is disposed on the ceramic substrate, and at least one chip resistor and heat-sensitive element of being used to produce heat are disposed in described ceramic substrate;
Described crystal resonator is disposed on the primary flat of described ceramic substrate, and described chip resistor and described heat-sensitive element are disposed on another primary flat of described ceramic substrate;
Another primary flat of described ceramic substrate is placed as with a primary flat of described circuit board and faces mutually, connects airtight to be provided with heat-conducting resin between described chip resistor and described circuit board.
5. constant-temperature type crystal oscillator as claimed in claim 4, the oscillating element that wherein constitutes oscillating circuit is placed on another primary flat of facing mutually with described ceramic substrate.
6. constant-temperature type crystal oscillator as claimed in claim 4, wherein said heat-sensitive element are thermally sensitive element or voltage-controlled varactor element.
7. constant-temperature type crystal oscillator as claimed in claim 4, wherein said circuit board are remained on the circuit board that is used for mounted on surface by metallic pin.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004148797A JP4426375B2 (en) | 2004-05-19 | 2004-05-19 | Highly stable crystal oscillator using a thermostatic chamber |
| JP2004148797 | 2004-05-19 | ||
| JP2004157072 | 2004-05-27 |
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| Publication Number | Publication Date |
|---|---|
| CN1700589A CN1700589A (en) | 2005-11-23 |
| CN100576720C true CN100576720C (en) | 2009-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200510070833A Expired - Fee Related CN100576720C (en) | 2004-05-19 | 2005-05-19 | Constant-temperature type crystal oscillator |
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| CN (1) | CN100576720C (en) |
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| CN103107775A (en) * | 2013-01-17 | 2013-05-15 | 广东大普通信技术有限公司 | Heating device and constant-temperature crystal oscillator comprising the same |
| CN103117704A (en) * | 2013-01-17 | 2013-05-22 | 广东大普通信技术有限公司 | Double-groove constant temperature crystal oscillator |
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| CN103117704B (en) * | 2013-01-17 | 2016-02-17 | 广东大普通信技术有限公司 | Double-groove constant temperature crystal oscillator |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2005333315A (en) | 2005-12-02 |
| JP4426375B2 (en) | 2010-03-03 |
| CN1700589A (en) | 2005-11-23 |
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