CN100570213C - LED Lighting Module - Google Patents

Abstract

A light-emitting diode lighting module, which is mainly composed of an LED light source chip and a radiator. A light source module is formed by at least two LED light source chips. A light-emitting diode lighting module is formed; the light source module is composed of at least four LED light source chips, and a single chip is made of six-grain and frameless packaging, and the power range is 6-12W; the light source module is composed of at least four Composed of four LED light source chips, a single chip is made of multi-grain red, green and blue mixed light and frameless packaging, with a power range of 6-12W; the light source module is implanted with four red, green and blue mixed light LED chips, The total power range is 24-46W; it can guarantee the quality of the light source, it is not easy to cause light decay due to over temperature, and increase the service life of the LED chip; it can reduce the waste of lighting maintenance and reduce the amount of harmful substances used in lighting; it is beneficial to the safety of lighting fixtures Assembly and mass production; it is beneficial to the quality control and assembly cost saving of lighting fixture production.

Description

LED Lighting Module

technical field

The invention relates to a light-emitting diode lighting module, in particular to a light-emitting diode lighting module which integrates a light source module, a power supply module, a heat dissipation module and a heat pipe, and is modularized, light and thin, high-power and high-efficiency.

Background technique

At present, most of the practical light-emitting diode (LED) lighting fixtures are composed of LED light source chips, heat-dissipating aluminum blocks or loose heat-dissipating fins, wires, power supplies, secondary optical components (optical cups or lenses, etc.), light source sealing cover glass And shell and other parts, components assembled. The above-mentioned LED lighting lamps have the following disadvantages: First, the heat generated by the LED crystal grain dissipates heat to all sides in the form of a point heat source, and the cross-sectional area in the heat dissipation direction is small, so it cannot transfer heat to the heat dissipation device quickly and in a large area. For example, aluminum blocks or loose fins are easy to accumulate inside the LED chip, causing the chip temperature to be higher than its maximum temperature, resulting in light decay or damage; second, each package unit must be welded with two positive and negative contacts, and there are many solder joints. , complex processing, difficult quality control, and difficult mass production; third, if LED light source chips are to form high-efficiency and low-risk parallel circuits, they must start from the outside of the chip, resulting in many wiring, complex processing, difficult quality control, and difficult to measure Fourth, because the substrate circuit of the LED light source chip only has a simple positive and negative circuit, it does not have the colorful control ability of red, green and blue (RGB) mixed light; fifth, the packaging form of the LED light source chip has a frame, which will reduce the The light projection rate of the crystal grain; Sixth, the packaging material of the LED light source chip is not suitable, because the high radiant heat of more than 100C will be generated when the light passes through the packaging material after power-on, so the selection of the packaging material must meet the following conditions: the first high temperature High light transmittance should be maintained to maintain lighting efficiency. Second, it should be flexible to prevent the packaging material from forming cracks due to the stress of thermal expansion and contraction, resulting in grain oxidation. Third, it is not easy to age, and it is currently available on the market. Most of the packaging materials are epoxy resin materials, which cannot meet the above requirements; Seventh, for lighting factories, because there are many parts, the assembly and processing steps are complicated, which is not conducive to mass production; Eighth, the power supply uses constant voltage and constant current Source, no control function, unable to optimize and diversify the lighting output of the chip; Ninth, the volume and weight of lighting fixtures are large, and they cannot be matched with the shells of existing lamps, and special shells must be used, which is not conducive to rapid market introduction.

Contents of the invention

The purpose of the present invention is to overcome the above-mentioned deficiencies, and provide a simple structure, easy to use, reliable, can form a modular, to reduce the assembly parts of lighting lamps, can optimize the lighting output of LED chips, and improve efficiency LED lighting modules. The object of the present invention is accomplished through the following technical solutions, which mainly consist of LED light source chips and a heat sink, and at least two LED light source chips form a light source module, and the described light source module and the heat sink formed by the heat dissipation module , a power supply module and a heat pipe constitute a light-emitting diode lighting module.

The light source module is composed of at least four LED light source chips, and a single chip is made of six-chip and frameless package, with a power range of 6-12W.

The light source module is composed of at least four LED light source chips, a single chip is made of multi-chip red, green and blue mixed light and frameless packaging, and the power range is 6-12W.

The light source module is implanted with four red, green and blue mixed light LED chips, with a total power range of 24-46W.

The power circuits between the chips in the light source module of the present invention are parallel circuits. In a single chip with six crystal grains, every two crystal grains are connected in series, and each pair of crystal grains connected in series are connected in parallel.

The light source module is connected to the heat dissipation module through a heat pipe, and a single or multiple oscillators are implanted in the heat dissipation module.

The heat pipe is formed by flattening or bending a heat pipe with an original outer diameter of 6mm, the thickness of the flattened surface is 2.5-4.5mm, the width is 6.0-10mm, and the length is less than or equal to 1900mm; the front view of the heat dissipation module is One of rectangle, square, circle, ellipse, and egg shape; while the side view appearance is one of rectangle, wave, mountain shape, and triangle.

The heat dissipating module is provided with airflow dispersion grooves for distributing airflow, and is provided with heat dissipation fins.

The heat dissipation fins of the heat dissipation module are equidistant or closely spaced.

Compared with the prior art, the present invention has the following technical effects: 1. The temperature at the junction of the LED chip and the circuit substrate is lower than 80°C, which can ensure the quality of the light source, prevent light decay due to overtemperature, and prolong the service life of the LED chip. 2. Due to the good heat dissipation effect and less maintenance, it can be used in high-efficiency, energy-saving and environmentally-friendly lighting applications, which can reduce lighting maintenance waste and reduce the amount of harmful substances used in lighting; 3. The present invention is beneficial to the assembly of lighting fixtures and mass production; 4, the present invention has the quality control and assembly cost saving of lighting fixture production.

Description of drawings

Fig. 1 is a structural representation of the present invention

Fig. 2 is a structural schematic diagram of another embodiment of the present invention.

Detailed ways

The present invention will be described in detail below in conjunction with accompanying drawing: As shown in accompanying drawing 1, the present invention mainly is made up of LED light source chip 1, radiator 2. A light source module is composed of at least two LED light source chips 1 , and the light source module, a heat sink composed of a heat dissipation module 3 , a power supply module 4 and a heat pipe 5 constitute a light emitting diode lighting module.

The light source module is composed of at least four LED light source chips 1, and a single chip is made of six-chip and frameless package, with a power range of 6-12W.

The light source module described in the invention is composed of at least four LED light source chips 1, and a single chip can also be: made of multi-chip red, green and blue mixed light and frameless packaging, with a power range of 6-12W.

The light source module is implanted with four red, green and blue mixed light LED chips, with a total power range of 24-46W.

The power supply circuit between the chips 1 in the light source module of the present invention is a parallel circuit. In a single chip with six crystal grains, every two crystal grains are connected in series, and each pair of crystal grains connected in series are connected in parallel.

The light source module is connected to the heat dissipation module 3 through a heat pipe 5. The heat pipe 5 can quickly transfer the heat generated by the LED light source chip 1 in the light source module to the heat dissipation module 3 during operation, so as to reduce the heat dissipation of the LED light source. The operating temperature of chip 1. A single or multiple oscillators are embedded in the heat dissipation module 3 .

The heat pipe 5 of the present invention is formed by flattening or bending a heat pipe with an original outer diameter of 6mm, the thickness of the flattened surface is 2.5-4.5mm, the width is 6.0-10mm, and the length is less than or equal to 1900mm. The front view appearance is one of rectangle, square, circle, ellipse, and egg shape; while the side view appearance is one of rectangle, wave shape, mountain shape, and triangle shape.

The heat dissipation module 3 of the present invention is provided with an airflow dispersing groove 6 for dispersing the airflow, and is provided with heat dissipation fins 7; and the heat dissipation fins 7 of the heat dissipation module 3 are equally spaced or alternately spaced, so that Improve the cooling effect of the cooling module.

Claims (6)

1, a kind of light-emitting diode lighting module, it is mainly by led light source chip (1), and radiator (2) is formed, and it is characterized in that it has formed a light source module by at least four led light source chips (1), one chip is that six crystal grain and the packaged type that does not have frame are made power bracket 6-12W; Described light source module has been formed light-emitting diode lighting module with the radiator (2), power module (4) and the heat pipe (5) that are made of radiating module (3); Power circuit between each chip (1) in the described light source module is a parallel circuit, and in the one chip of six crystal grain, per two crystal grain are series connection, and every pair of intergranule of series connection is in parallel.

2, a kind of light-emitting diode lighting module, it is mainly by led light source chip (1), radiator (2) is formed, it is characterized in that it has formed a light source module by at least four led light source chips (1), one chip is polycrystalline grain RGB mixed light and does not have the frame packaged type and make power bracket 6-12W; Described light source module has been formed light-emitting diode lighting module with the radiator (2), power module (4) and the heat pipe (5) that are made of radiating module (3); Power circuit between each chip (1) in the described light source module is a parallel circuit, and in the one chip of six crystal grain, per two crystal grain are series connection, and every pair of intergranule of series connection is in parallel.

3, light-emitting diode lighting module according to claim 1 and 2 is characterized in that described light source module by the fit radiating module (3) that is connected in of a heat pipe (5), and implanting in this radiating module (3) has single or a plurality of oscillators.

4, light-emitting diode lighting module according to claim 3, it is characterized in that described heat pipe (5) is to be flattened or brake forming by original outer diameter 6mm heat pipe, the thickness of flattening plane is 2.5-4.5mm, and width is 6.0-10mm, and length is less than or equal to 1900mm; It is a kind of in rectangle, square, circle, ellipse, the egg shape that described radiating module (3) is faced outward appearance; And the side-looking outward appearance is a kind of in rectangle, waveform, chevron, the triangle.

5, light-emitting diode lighting module according to claim 4 is characterized in that described radiating module (3) is provided with the air-flow that disperses air-flow and disperses groove (6), and is provided with radiating fin (7).

6, light-emitting diode lighting module according to claim 5 is characterized in that radiating fin (7) spacing of described radiating module (3) is between equidistant or close lean phase.

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