CN100552352C - Circuit board drying device - Google Patents

Abstract

The invention discloses a circuit substrate drying device, which is provided with a main air blowing opening on the bottom surface, an air inlet channel communicated with the main air blowing opening and an air outlet channel adjacent to the air inlet channel, wherein the air outlet channel is provided with an air blower. A compression channel is formed by a side wall connected with the air inlet channel and the air outlet channel and is positioned on the main air blowing opening, the compression channel gradually shrinks from the air inlet channel to the air outlet channel, and the side wall is provided with a bulge part to enable the compression channel to shrink suddenly to form a turbulent flow channel on the gradually shrinking side of the compression channel. The present invention utilizes the turbulent flow channel to make the air flow be extruded and vibrated and frictionally heated, and utilizes the negative pressure phenomenon produced by the sharp change of air flow, so that the moisture on the surface of the circuit substrate can be vibrated and mixed in the air flow and simultaneously be carried away.

Description

Circuit board drying device

technical field

The invention relates to a drying device used for removing moisture on the surface of a circuit substrate and drying.

Background technique

As shown in Fig. 3 to Fig. 4, it is generally used for drying the drying device of circuit board surface moisture, and this drying device comprises a sponge roller 82 and separates a distance from sponge roller 82 and arranges an air knife 83 in parallel, and this air knife 83 communicates with an air intake pipe 831, and the preheated hot air 85 is sucked into and guided into the air knife 83 through the blower 84. In addition, the air knife 83 is provided with a narrow and long air nozzle 832 relative to the bottom end of the air intake pipe 831, for The hot air 85 in the air knife 83 is released to form a strong airflow to blow to the surface 811 of the circuit substrate 81 . When the circuit substrate 81 advances through the drying device, the sponge roller 82 initially absorbs a large amount of moisture on the surface 811 of the circuit substrate 81, and then utilizes the strong airflow formed by the air nozzle 832 to remove the remaining moisture on the circuit substrate 81 to Forcefully drive away and make the surface of the circuit board dry.

However, the disadvantages of this circuit substrate drying device are as follows:

First, the drying effect on the surface of the circuit substrate is poor. Generally speaking, the surface 811 of the circuit board 81 passing through this drying device has been dried, but because the wind speed blown out from the air nozzle 832 is too strong, it is easy to blow the moisture on the surface 811 of the circuit board 81 back to the dry part, causing dryness instead. The effect is not good, as can be seen in the 4th picture.

Its two, the air pressure of the hot air that is blown out from the air nozzle of air knife is uneven. The reason is that the air nozzle 832 directly below the air intake pipe 831 can generate strong wind pressure, while the air pressure derived from the air nozzle 832 away from the two sides of the air intake pipe 831 gradually weakens, making the circuit under the air nozzle 832 The drying degree of the surface 811 of the substrate 81 is uneven.

Its three, consume a large amount of electric energy. It becomes hot blast 85 owing to must use electric heater to heat external air, to provide drying effect.

Its 4th, this drying device accounts for more equipment volume and needs larger site space. Because the drying effect of this drying device is not good, it is necessary to install multiple sets of air knives 83 to provide better drying effect.

Fifth, it is easy to cause pollution and scratches on the surface of the circuit substrate. Since the sponge roller 82 is easily polluted and attached to debris after long-term use, if it is not cleaned regularly or replaced with a new one, the surface 811 of the circuit substrate 81 will be polluted and scratched.

Sixth, the water vapor in the blind hole of the circuit board cannot be removed and brought out.

As shown in Fig. 5 to Fig. 6, it is another kind of conventional circuit board drying device, which is to improve the shortcoming of the poor drying effect of the previous drying device. The improvement is that the bottom plate 93 installed at the bottom of the air knife 92 There are several micro-diameter pores 931 (the hole is 0.2 mm) and a row of spaced several large pores 932 (the hole is 0.5 mm), and a micro-diameter pore 931 is obliquely corresponding to a large hole 932. A narrow slit 933 is provided between the micro-diameter air hole 931 and the large air hole 932, so that the hot air 94 blown from the bottom plate 93 will form a vortex flow, and improve the original situation that the drying effect of the surface 911 of the circuit board 91 is not good.

However, this kind of circuit substrate drying device only improves the shortcomings of the original drying device's poor drying effect, but still has the second to sixth items missing from the first circuit substrate drying device, and even derives another missing item, namely the bottom plate 93 The pores of the upper micro-diameter pores 931 and the large pores 932 are very small and are easily blocked by pollutants, so the drying effect is still unstable.

Contents of the invention

The main purpose of the present invention is to solve the above problems and provide a circuit substrate drying device, which has a smaller equipment volume, does not require a larger space, and can achieve the drying effect of the shortest distance, greatly reducing the drying time. Process time.

Another purpose of the present invention is to enable the drying device to achieve the effect of effectively removing and taking away the moisture on the surface of the circuit substrate and in the slits or blind holes.

Another object of the present invention is to provide a drying device that consumes less power.

The purpose of the present invention is achieved like this:

The circuit substrate drying device provided by the present invention comprises:

A boundary plane is defined on the bottom side of the circuit substrate drying device.

A main blow opening in the boundary plane.

An air inlet passage is connected to the main blowing opening, and the airflow is introduced into it by the air supply device.

An air outlet channel adjacent to the air inlet channel is connected to the main blowing opening, and a blower is arranged in the air outlet channel.

A compression channel is formed between a side wall connected to the air inlet channel and the air outlet channel and the boundary plane, and is located on the main blowing opening. The side wall is relatively inclined to the boundary plane, so that the compression channel is formed gradually shrink;

On the tapering side of the compression channel, the side wall has a raised portion to shrink the compression channel suddenly to form a flow disturbance channel.

Description of drawings

The present invention will be further described below in conjunction with accompanying drawing.

Fig. 1 is a schematic plan view of the present invention.

Fig. 2 is a schematic diagram of plane action of the present invention.

Fig. 3 is a schematic structural diagram of a conventional circuit substrate drying device.

FIG. 4 is a planar action schematic diagram of the halo phenomenon occurring between the air knife and the circuit substrate shown in FIG. 3 .

FIG. 5 is a structural schematic diagram of another conventional circuit substrate drying device.

FIG. 6 is a schematic plan view of the vortex flow formed by the hot air blown from the bottom plate in FIG. 5 .

Detailed ways

The following description is the selected embodiment structure of the present invention, which is for illustration only, and is not limited by this structure in the patent application.

Please refer to Fig. 1, Fig. 2, the circuit substrate drying device of the present embodiment, it comprises:

A boundary plane 11 is defined on the bottom side of the circuit substrate drying device.

A main blowing opening 111 located in the boundary plane 11 .

A front blowing opening 112 is located in front of the boundary plane 11 .

An air intake passage 12 is connected to the main air blowing opening 111 , and the air 4 is introduced therein by a blower 41 .

An outlet channel 16 adjacent to the inlet channel 12 is connected to the main blowing opening 111 .

A compression channel 14 is formed between the side wall 13 and the boundary plane 11 connected to the air inlet channel 12 and the air outlet channel 16, and is located on the main blowing opening 111. The side wall 13 is relatively inclined to the boundary plane 11 to form a compression channel. 14 tapers from the inlet passage 12 to the outlet passage 16.

On the tapering side of the compression channel 14 , the side wall has a raised portion 131 to make the compression channel 14 contract suddenly to form a flow disturbance channel 15 .

A blowing channel 17 is connected to the front blowing opening 112 , the blowing channel 17 is connected to the air outlet channel 16 , and the air 4 is introduced into the front blowing opening 112 by another blower 42 .

The detailed description for drying circuit substrates according to this embodiment is as follows:

As shown in FIG. 2 , a circuit substrate 3 is passed from the right side below the aforementioned drying device.

The external air 4 is sucked in by the blower 41 and introduced into the compression passage 14 through the intake passage 12, and then exported from the outlet passage 16. Since the cross section of the compression passage 14 is tapered, a positive pressure airflow is generated in the compression passage 14, to the airflow When passing through the turbulent flow channel 15 with the smallest cross-section, its flow velocity intensifies and becomes a negative pressure state, and when the air 4 enters the turbulent flow channel 15, it is disturbed by the raised portion 131 of the side wall, and the airflow that originally followed the stable flow of the side wall forms a disturbance. At this time, the air flow in the turbulent state generates high-frequency vibrations and makes the gas molecules rub against each other to heat up. Through these principles, when the circuit board 3 passes under the main air blowing opening 111, the surface of the circuit board 3 is blown by the vibrating air flow. Even the viscosity of the moisture in the slit or blind hole is destroyed and detaches from the circuit substrate and is atomized and mixed into the air flow. At the same time, due to the temperature rise of the air flow, the remaining water vapor on the surface of the circuit substrate 3 can be further heated and vaporized to achieve a definite drying effect.

When the air flow passes through the spoiler channel 15, moreover, because the air outlet channel 16 and the spoiler channel 15 are connected to each other, the air flow enters the outlet channel 16 whose cross-section suddenly becomes larger from the narrow spoiler channel 15 and produces negative pressure due to rapid expansion. Because of the negative pressure state, the atomized moisture can be completely taken away and enter the air outlet channel 16 with the air flow, which can prevent the moisture from rebounding and adhering to the surface of the dried circuit substrate 3 .

Utilize the airflow derived from the air outlet passage 16, and introduce the air 4 into the blowing passage 17 by another blower 42 and flow to the front blowing opening 112, so that the surface of the circuit board 3 passing through the front blowing opening 112 can be covered with water Perform initial cleanup.

As can be seen from the description of the foregoing embodiments, the present invention has the following advantages:

First, the drying device has the shortest distance drying effect, greatly reducing drying time and increasing production capacity.

Second, the equipment is small in size and does not require a large site space.

Third, avoid the use of sponge rollers to avoid pollution and damage to the circuit board caused by sponge rollers.

Fourth, the water vapor in the slits or blind holes of the circuit substrate can be effectively and surely removed and taken away.

Fifth, the high-frequency vibration generated by the turbulent airflow makes the gas molecules rub against each other and heat up, and has a drying effect on the circuit board, so there is no need to pre-heat the introduced airflow. Compared with the conventional drying device, it saves energy consumption characteristics.

Claims (2)

1, a kind of circuit base plate drying device is characterized in that: this drying device comprises:

Define a boundary plane in this circuit base plate drying device bottom surface side;

One is positioned at the main blow openings of boundary plane;

One inlet channel, it is to be communicated to main blow openings, and can air-flow be imported wherein by a feeder;

In the outlet passageway of inlet channel, it is to be communicated to main blow openings, and is provided with an air blast in outlet passageway near one;

Be connected in by one and constitute a pressure channel between the abutment wall of inlet channel and outlet passageway and boundary plane and be positioned on the main blow openings, this abutment wall relative tilt reduces to outlet passageway from inlet channel and form pressure channel in boundary plane;

Reduce side in pressure channel, relative tilt has a lug boss in this abutment wall of boundary plane to be contracted pressure channel suddenly and forms a flow-disturbing passage.

2, according to the described circuit base plate drying device of claim 1, it is characterized in that: this drying device comprises that more one is positioned at and puts blow openings before the boundary plane, an and insufflation channel, this insufflation channel system is communicated to preposition blow openings, this insufflation channel system is communicated in outlet passageway, and by described air blast air is directed into preposition blow openings.

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