CN100547405C - Realize the shared bus connection method of single dual density in the PCB test - Google Patents
Realize the shared bus connection method of single dual density in the PCB test Download PDFInfo
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- CN100547405C CN100547405C CNB2006101705927A CN200610170592A CN100547405C CN 100547405 C CN100547405 C CN 100547405C CN B2006101705927 A CNB2006101705927 A CN B2006101705927A CN 200610170592 A CN200610170592 A CN 200610170592A CN 100547405 C CN100547405 C CN 100547405C
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- 238000012360 testing method Methods 0.000 title claims abstract description 233
- 230000009977 dual effect Effects 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000001739 density measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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Abstract
The present invention discloses in a kind of PCB test and realizes the shared bus connection method of single dual density, provide a dual density grid and a single density tester channel groups, the dual density grid is divided into the first area, second area, the 3rd zone and the 4th zone, odd number test point range on the first area, even number test point range respectively with second area on even number test point range, odd number test point range is corresponding in turn, odd number test point range on the 3rd zone, even number test point range respectively with the 4th zone on even number test point range, odd number test point range is corresponding in turn, corresponding two test points that list connect one to one, and two test points that are connected are connected in a test channel in the described single density tester channel groups.The present invention is used to connect the tester channel groups that grid that dual density is provided with and single density are provided with, and realizes that tester channel groups can carry out single density test and two kinds of tests of dual density test with the test machine of single density setting, thus the cost that reduction PCB tests.
Description
[technical field]
The invention belongs to printed circuit board (PCB) (Printed Circuit Board; PCB) field tests refers in particular to the bus connection method of a kind of grid and tester channel groups.
[background technology]
Density according to institute's distribution tests point is distinguished, and the grid that is adopted in the PCB universal test has different sizes such as single density grid, dual density grid, and wherein, the single density grid has 100 test points per square inch, and the spacing of two test points is 100mil; The dual density grid has 200 test points per square inch, and the spacing of two test points is 70mil.Common single density test machine is the configuration single density grid and the single density tester channel groups of cooperation with it, test point on the grid and the test channel in the tester channel groups connect one to one, a test point connects a test channel, and in existing test, spread the maximum slope of pin and can accomplish 600mil, then the maximal density of the PCB that can survey is 374 point/square inches, the PCB that surpasses this density then can not test on the single density test machine, and must purchase the higher test machine of density in addition---dual density test machine for example, four density measurement machines etc.---just can carry out Validity Test, this has just caused the rising of PCB testing cost.
[summary of the invention]
The object of the present invention is to provide in a kind of PCB test and realize the shared bus connection method of single dual density, be used to connect the tester channel groups that grid that dual density is provided with and single density are provided with, to realize that tester channel groups can be carried out the single density test with the test machine of single density setting and dual density is tested two kinds of tests.
The object of the present invention is achieved like this: realize the shared bus connection method of single dual density in a kind of PCB test, provide a dual density grid and a single density tester channel groups, described dual density grid is divided into the first area, second area, the 3rd zone and the 4th zone, odd number test point range on the described first area, even number test point range respectively with described second area on even number test point range, odd number test point range is corresponding in turn, odd number test point range on described the 3rd zone, even number test point range respectively with described the 4th zone on even number test point range, odd number test point range is corresponding in turn, corresponding two test points that list connect one to one, and two test points that are connected are connected in a test channel in the described single density tester channel groups.
Realize in the shared bus connection method of single dual density in the above-mentioned PCB test, last corresponding two the test point ranges in described first area, second area, the 3rd zone and the 4th zone, the test point of previous column is connected according to the order of test point in row successively one by one with the test point of back one row.
Realize in the shared bus connection method of single dual density in the above-mentioned PCB test, last corresponding two the test point ranges in described first area, second area, the 3rd zone and the 4th zone, the odd number test point of previous column is connected in turn one by one with the even number test point of back one row, and the even number test point of previous column is connected in turn one by one with the odd number test point of back one row.
Beneficial effect of the present invention is: the shared bus connection method of the single dual density of realization is transformed it based on existing single density test machine in the PCB test disclosed in this invention, its single density grid is replaced with the dual density grid, and the dual density grid is connected with the single density tester channel groups of single density test machine according to of the present invention, when carrying out the test of PCB single density, select the odd number test point range on the dual density grid for use, and even number test point range is unsettled, all odd number test point ranges have constituted the single density grid, and make test point of the corresponding detection of each test channel, so can carry out the single density test, when carrying out the test of PCB dual density, select second area and the 3rd zone on the dual density grid for use, and first area and the 4th zone are unsettled, test point on second area and the 3rd zone has constituted the dual density grid, and make test point of the corresponding detection of each test channel, so can carry out the dual density test, thereby the realization tester channel groups can be carried out single density test and two kinds of tests of dual density test with the test machine of single density setting, has reduced the cost of PCB test.
[description of drawings]
The present invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is the line synoptic diagram of grid of the present invention and tester channel groups.
Fig. 2 is the part line synoptic diagram of grid of the present invention and tester channel groups.
Fig. 3 is the grid of another embodiment of the present invention and the line synoptic diagram of tester channel groups.
Fig. 4 is of the present invention and the grid of the same embodiment of Fig. 3 and the part line synoptic diagram of tester channel groups.
[embodiment]
Realize the shared bus connection method of single dual density in the PCB test disclosed in this invention, it is used to connect dual density grid and single density tester channel groups, can improve existing single density test machine, its single density grid is replaced and is set to the dual density grid, but make through the single density test machine after improving both fill order's density measurement, also can carry out the dual density test.
With reference to illustrated in figures 1 and 2, a dual density grid 10 and a single density tester channel groups 20 have been the invention provides, dual density grid 10 is divided into four zones such as first area 12, second area 14, the 16 and the 4th zone 18, the 3rd zone, the number of the test point 100 on each zone is identical.Odd number test point range on the first area 12 is corresponding in turn with the even number test point range on the second area 14, it is the test of the 1st on the first area 12 point range 121, the 3rd test point range 123, the 5th test point range 125, ... correspond respectively to the test of the 2nd on the second area 14 point range 142, the 4th test point range 144, the 6th test point range 146......, corresponding two test points that list connect successively according to the row order of test point, promptly first test point on the 1st test point range 121 is connected with the 2nd first test point of testing on the point range 142, second test point on the 1st test point range 121 is connected with the 2nd second test point of testing on the point range 142, ..., the rest may be inferred, and realize that connecting one to one of pairing two test points that list, two test points that are connected are connected in a test channel 200 in the single density tester channel groups 20; Even number test point range on the first area 12 is corresponding in turn with the odd number test point range on the second area 14, it is the test of the 2nd on the first area 12 point range 122, the 4th test point range 124, the 6th test point range 126, ... correspond respectively to the test of the 1st on the second area 14 point range 141, the 3rd test point range 143, the 5th test point range 145, ..., corresponding two test points that list connect successively according to the row order of test point, promptly first test point on the 2nd test point range 122 is connected with the 1st first test point of testing on the point range 141, second test point on the 2nd test point range 122 is connected with the 1st second test point of testing on the point range 141, ..., the rest may be inferred, and realizing connecting one to one of pairing two test points that list, two test points that are connected are connected in a test channel 200 in the single density tester channel groups 20.
According to the bus connection method of first area 12 with second area 14, to realize the 3rd zone 16 and being connected of the 4th zone 18, odd number test point range on the 3rd zone 16 is corresponding in turn with the even number test point range on the 4th zone 18, corresponding two test points that list connect successively according to the row order of test point, and two test points that are connected are connected in a test channel 200 in the single density tester channel groups 20; Even number test point range on the 3rd zone 16 is corresponding in turn with the odd number test point range on the 4th zone 18, corresponding two test points that list connect successively according to the row order of test point, and two test points that are connected are connected in a test channel 200 in the single density tester channel groups 20.
Based on existing single density test machine, its single density grid is replaced with the dual density grid, use and realize in the PCB involved in the present invention test that the shared bus connection method of single dual density is connected in single density tester channel groups on the single density test machine with the dual density network, when carrying out the test of PCB single density, select the odd number test point range on the dual density grid for use, and even number test point range is unsettled, all odd number test point ranges have constituted the single density grid, and make test point of the corresponding detection of each test channel, so can carry out the single density test, when carrying out the test of PCB dual density, select second area and the 3rd zone on the dual density grid for use, and first area and the 4th zone are unsettled, test point on second area and the 3rd zone has constituted the dual density grid, and makes test point of the corresponding detection of each test channel, so can carry out the dual density test, thereby the realization tester channel groups can be carried out single density test and two kinds of tests of dual density test with the test machine of single density setting, has reduced the cost of PCB test.
In conjunction with Fig. 3 and Fig. 4, with the explanation another embodiment of the present invention, provide a dual density grid 30 and a single density tester channel groups 40, dual density grid 30 is divided into four zones such as first area 32, second area 34, the 36 and the 4th zone 38, the 3rd zone.Odd number test point range on the first area 32 is corresponding in turn with the even number test point range on the second area 34, corresponding two list, the odd number test point of previous column is connected in turn with the even number test point of back one row, the even number test point of previous column is connected in turn with the odd number test point of back one row, be the 1st test point of the 1st test point range 321 of first area 32, the 3rd test point, ... test the 2nd test point of point range 342 respectively with the 2nd of second area 34, the 4th test point, ... connect, the 2nd test point of the 1st test point range 321 of first area 32, the 4th test point, ... test the 1st test point of point range 342 respectively with the 2nd of second area 34, the 3rd test point, ... connect, ..., the rest may be inferred, realize connecting one to one of pairing two test points that list, two test points that are connected are connected in a test channel 400 in the single density tester channel groups 40; Even number test point range on the first area 32 is corresponding in turn with the odd number test point range on the second area 34, corresponding two list, the odd number test point of previous column is connected in turn with the even number test point of back one row, the even number test point of previous column is connected in turn with the odd number test point of back one row, and two test points that are connected are connected in a test channel 400 in the single density tester channel groups 40.According to the bus connection method of first area 32 with second area 34, to realize the 3rd zone 36 and being connected of the 4th zone 38, odd number test point range on the 3rd zone 36 is corresponding in turn with the even number test point range on the 4th zone 38, corresponding two list, the odd number test point of previous column is connected in turn with the even number test point of back one row, the even number test point of previous column is connected in turn with the odd number test point of back one row, and two test points that are connected are connected in a test channel 400 in the single density tester channel groups 40; Even number test point range on the 3rd zone 36 is corresponding in turn with the odd number test point range on the 4th zone 38, corresponding two list, the odd number test point of previous column is connected in turn with the even number test point of back one row, the even number test point of previous column is connected in turn with the odd number test point of back one row, and two test points that are connected are connected in a test channel 400 in the single density tester channel groups 40.The described bus connection method of this embodiment, it is for the transformation of single density test machine, and it is described to be same as an embodiment.
Claims (3)
1. realize the shared bus connection method of single dual density in a PCB test, it is characterized in that: provide a dual density grid and a single density tester channel groups, described dual density grid is divided into the first area, second area, the 3rd zone and the 4th zone, odd number test point range on the described first area, even number test point range respectively with described second area on even number test point range, odd number test point range is corresponding in turn, odd number test point range on described the 3rd zone, even number test point range respectively with described the 4th zone on even number test point range, odd number test point range is corresponding in turn, corresponding two test points that list connect one to one, and two test points that are connected are connected in a test channel in the described single density tester channel groups.
2. realize the shared bus connection method of single dual density in the PCB test as claimed in claim 1, it is characterized in that: last corresponding two the test point ranges in described first area, second area, the 3rd zone and the 4th zone, the test point of previous column is connected according to the order of test point in row successively one by one with the test point of back one row.
3. realize the shared bus connection method of single dual density in the PCB test as claimed in claim 1, it is characterized in that: last corresponding two the test point ranges in described first area, second area, the 3rd zone and the 4th zone, the odd number test point of previous column is connected in turn one by one with the even number test point of back one row, and the even number test point of previous column is connected in turn one by one with the odd number test point of back one row.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101705927A CN100547405C (en) | 2006-12-26 | 2006-12-26 | Realize the shared bus connection method of single dual density in the PCB test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101705927A CN100547405C (en) | 2006-12-26 | 2006-12-26 | Realize the shared bus connection method of single dual density in the PCB test |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101210939A CN101210939A (en) | 2008-07-02 |
| CN100547405C true CN100547405C (en) | 2009-10-07 |
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| CNB2006101705927A Expired - Fee Related CN100547405C (en) | 2006-12-26 | 2006-12-26 | Realize the shared bus connection method of single dual density in the PCB test |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101210938B (en) * | 2006-12-26 | 2010-10-06 | 深圳麦逊电子有限公司 | PCB Connection method for implementing common use of four-density grid and eight-density grid in PCB test |
| CN103018591A (en) * | 2012-11-27 | 2013-04-03 | 胜宏科技（惠州）股份有限公司 | Method for testing electrical property of high-precision circuit board |
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Address after: 518000 Guangdong city of Shenzhen province Baoan District Shiyan street heart Lang Dong Industrial Zone A6 Patentee after: Shenzhen Mingxin testing equipment Co., Ltd Address before: Nanshan District Ma Liuzhou Industrial Zone Shenzhen city Guangdong province 518000 20 Tung Ping An Patentee before: SHENZHEN MASON TEST EQUIPMENT Co.,Ltd. |
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