CN100512023C - High-speed signal transmission-line structure of connected-pole parallel series - Google Patents

High-speed signal transmission-line structure of connected-pole parallel series Download PDF

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Publication number
CN100512023C
CN100512023C CNB2006100825885A CN200610082588A CN100512023C CN 100512023 C CN100512023 C CN 100512023C CN B2006100825885 A CNB2006100825885 A CN B2006100825885A CN 200610082588 A CN200610082588 A CN 200610082588A CN 100512023 C CN100512023 C CN 100512023C
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China
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line
signal transmission
circuit board
multiple field
speed signal
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Expired - Fee Related
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CNB2006100825885A
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Chinese (zh)
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CN101075813A (en
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陈彦豪
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Dan Suzhen
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Inventec Corp
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Abstract

The invention is used in a multi-layer PCB such as high speed digital PCB. A high speed transmission line is formed on the high speed digital PCB; the high speed signal transmission line structure at least comprises: a first conducting line, a first conducting cylinder, a second conducting line, a second conducting cylinder and a bottom layer connection line. The invention can reduce the adverse effect to the quality of transmitted signals by the resonance effect.

Description

The high-speed signal transmission-line of tool conductivity connected-pole parallel series
Technical field
The invention relates to a kind of high speed signal circuit topology, particularly about a kind of high-speed signal transmission-line of tool conductivity connected-pole parallel series, it can be applicable to a multiple field circuit board, high-speed digital circuit plate for example, on this high-speed digital circuit plate, form the high-speed signal transmission-line that a kind of tool conductivity is communicated with the post serial connection, provide a signal transfer functions that can prevent resonance effects the high-frequency digital signal that transmits on this high-speed digital circuit plate.
Background technology
At present owing to wireless network, mobile phone, global positioning system (Global PositioningSystem, GPS) and the fast development and the demand of wireless communication technique such as Digital Television, the design of high-speed digital circuit and make and become very popular electronic technology of communications industry.Basically most of high-speed digital circuit all uses microstrip line (microstrip line) or band line (strip line) as signal transmssion line, transmit the digital signal of high frequency by this transmission line, the above digital signal (in this manual, so-called " high-frequency digital signal " is to be defined as the above digital signal of 1GHz) of 1GHz particularly.
Structurally a kind of circuit board of multiple field is normally adopted in the manufacturing of high-speed digital circuit.In the circuit board of this multiple field, the connection post (via) of a kind of conductivity of the common employing of signal transmission between the different flaggies connects the little circuit on the different flaggies.Fig. 1 promptly shows the high-speed signal transmission-line structure in a kind of multiple field circuit board 10 commonly used.As shown in the figure, should be applied in a multiple field circuit board 10 by high-speed signal transmission-line structure commonly used, and this multiple field circuit board 10 must have a top layer 21 and a bottom layer 22 at least, wherein the inside of this top layer 21 is formed with a top layer ground plane 31, and the inside of this bottom layer 22 then is formed with a bottom ground plane 32 (two flaggies 21,22 up and down that only exemplarily show shown in Figure 1; On concrete enforcement, these two flaggies 21,22 still comprise one or more flaggies).Should comprise by high-speed signal transmission-line structure commonly used: (a) one first conducting wire 110; (b) one second conducting wire 120; And (c) one be communicated with post 130.First conducting wire 110 is formed at the direction outwardly of the top layer ground plane 31 of this multiple field circuit board 10; And it has one first end points 111 and one second end points 112, and wherein this first end points 111 is to be used to be connected to one first electronic component (accompanying drawing does not mark).120 of second conducting wires are the directions inwardly that is formed at the top layer ground plane 31 of this multiple field circuit board 10; And it has one first end points 121 and one second end points 122, and wherein this first end points 121 is to be used to be connected to one second electronic component (accompanying drawing does not mark).
Because above-mentioned first conducting wire 110 is the top that is positioned at top layer ground plane 31, the below that second conducting wire 120 is positioned at top layer ground plane 31; Therefore if the two will be connected, the present practice promptly forms a connection post 130 and runs through this multiple field circuit board 10, by being communicated with second end points 122 that post 130 is connected to second end points 112 of first conducting wire 110 second conducting wire 120, first conducting wire 110 can be electrically connected to second conducting wire 120, form a continuous signal transmission line (formed signal transmission path is promptly shown in a series of arrow of Fig. 1).
Yet above-mentioned connection post 130 is when practical application, because a bit of 131 (hereinafter referred to as " transport parts, top ") that wherein top only arranged are by the actual transmission signals that is used as, a long section 132 of its below forms an open circuit stub (open stub).In the transmission of high-frequency digital signal, this bottom open circuit stub 132 can cause a resonance effect, influences signal transmission quality.
A kind of solution of the problems referred to above is to adopt anti-brill mode (back drill) to remove the bottom open circuit stub 132 of connection post 130 belows, just, remove this bottom open circuit stub 132 with a drill bit (accompanying drawing does not mark) brill from the bottom layer 22 of multiple field circuit board 10.Yet this practice has multinomial shortcoming in practical application, and this comprises anti-rig and man-hour that needs are extra, increased manufacturing cost and the anti-process of boring easily causes the bit errors between the different flaggies in this multiple field circuit board 10.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, main purpose of the present invention is to provide a kind of high-speed signal transmission-line of tool conductivity connected-pole parallel series, does not adopt anti-brill mode, reduces above-mentioned conductivity and is communicated with the resonance effects that post causes.
For reaching above-mentioned purpose and other purpose, the invention provides a kind of high-speed signal transmission-line structure of tool conductivity connected-pole parallel series.Tool conductivity connected-pole parallel series formula high-speed signal transmission-line of the present invention comprises at least: one first conducting wire be formed on the top layer ground plane of this multiple field circuit board, and it has one first end points and one second end points; One first conductivity is communicated with post, has a top and a bottom, and its top is second end points that is connected to this first conducting wire on the layer of the top of this multiple field circuit board, and its bottom then is communicated to the bottom layer of this multiple field circuit board; One second conducting wire is formed on the top layer ground plane of this multiple field circuit board, and it has one the 3rd end points and one the 4th end points; One second conductivity is communicated with post, has a top and a bottom, and its top is the 4th end points that is connected to this second conducting wire on the layer of the top of this multiple field circuit board, and its bottom then is the bottom layer that is communicated to this multiple field circuit board; And a connection line, the bottom that this first conductivity is communicated with post is connected to the bottom that this second conductivity is communicated with post.
The high-speed signal transmission-line of tool conductivity connected-pole parallel series of the present invention is applied in a multiple field circuit board, high-speed digital circuit plate for example, on this high-speed digital circuit plate, form the high-speed signal transmission-line that a tool conductivity is communicated with the post serial connection, provide a signal transfer functions that can prevent resonance effects the high-frequency digital signal that transmits on this high-speed digital circuit plate.
As from the foregoing, the high-speed signal transmission-line of tool conductivity connected-pole parallel series of the present invention adopts the conductivity of pair of parallel serial connection to be communicated with the conducting wire that post connects the upper and lower, the open circuit stub that the redundance that makes conductivity be communicated with post forms can be shorter than prior art, reduces the harmful effect that resonance effects causes the transmission signals quality with this.
Description of drawings
Fig. 1 is the structural representation of existing ultra high speed signal transmission line;
Fig. 2 is the structural representation of the high-speed signal transmission-line of tool conductivity connected-pole parallel series of the present invention;
Fig. 3 is the high-speed signal transmission-line of tool conductivity connected-pole parallel series of the present invention and reflection loss of the prior art and the insertion loss performance diagram with respect to frequency; And
When Fig. 4 is applied in the carry high frequency digital signal for the present invention, signal elevating time characteristic eye pattern compared with prior art.
Embodiment
Embodiment
Below cooperate Fig. 2 to Fig. 4, describe the high-speed signal transmission-line of tool conductivity connected-pole parallel series of the present invention in detail.
Fig. 2 is the structural representation of the high-speed signal transmission-line of tool conductivity connected-pole parallel series of the present invention.As shown in the figure, high-speed signal transmission-line of the present invention is to be applied in a multiple field circuit board 20, for example wireless network, mobile phone, global positioning system (GlobalPositioning System, GPS) or the high-speed digital circuit plate used of Digital Television, and this multiple field circuit board 20 has a top layer 21 and a bottom layer 22, wherein the inside of this top layer 21 is formed with a top layer ground plane 31, then is formed with a bottom ground plane 32 (two flaggies 21,22 up and down that only exemplarily show shown in Figure 2 on this bottom layer 22; On concrete enforcement, these two flaggies 21,22 still comprise one or more flaggies).
As shown in Figure 2, high-speed signal transmission-line of the present invention comprises at least: (A) one first conducting wire 210; (B) one first conductivity is communicated with post 220; (C) one second conducting wire 230; (D) one second conductivity is communicated with post 240; And (E) bottom connection line 250.
First conducting wire 210 is formed at the direction outwardly (being the top of top layer ground plane 31) of these multiple field circuit board 20 top layer ground planes 31; And it has one first end points 211 and one second end points 212, and wherein this first end points 211 is to be used to be connected to one first electronic component (not marking), and 212 of second end points are to be used to be connected to this first conductivity to be communicated with post 220.
It is the connection post of a conductivity that first conductivity is communicated with post 220, has a top 221 and a bottom 222; And its top 221 is second end points 212 that are connected to above-mentioned first conducting wire 210 on the top of this multiple field circuit board 20 layer 21, and 222 of its bottoms are the bottom layer 22 that is communicated to this multiple field circuit board 20.
Second conducting wire 230 is the directions inwardly (being the below of top layer ground plane 31) that are formed at the top layer ground plane 31 of this multiple field circuit board 20; And it has one the 3rd end points 231 and one the 4th end points 232, and wherein the 3rd end points 231 is to be used to be connected to one second electronic component (not marking), and 232 of the 4th end points are to be used to be connected to this second conductivity to be communicated with post 240.
It is the connection post of a conductivity that second conductivity is communicated with post 240, has a top 241 and a bottom 242; And its top 241 is the 4th end points 232 that are connected to above-mentioned second conducting wire 230 on the top of this multiple field circuit board 20 layer 21, and 242 of its bottoms are the bottom layer 22 that is communicated to this multiple field circuit board 20.
Bottom connection line 250 is circuits of a conductivity, and it is to be formed on the bottom layer 22 of this multiple field circuit board 20, is used for the bottom 222 of above-mentioned first conductivity connection post 220 is electrically connected to the bottom 242 that this second conductivity is communicated with post 240.
As mentioned above, first conducting wire 210, first conductivity connection post 220, bottom connection line 250, second conductivity are communicated with post 240 and promptly are connected in regular turn with second conducting wire 230, form a continuous signal transmission line (formed signal transmission path is promptly shown in a series of arrow among Fig. 2) between the 3rd end points 231 of first end points, 211 to second conducting wires 230 of first conducting wire 210.
In this signal transmission line, a bit of part of top between the top layer 21 and second conducting wire 230 that second conductivity is communicated with post 240 still can form an open circuit stub (openstub) 243.Yet compare the open circuit stub 132 that the length of the open circuit stub 243 on this second conductivity connection post 240 obviously forms much smaller than existing technology shown in Figure 1 with prior art shown in Figure 1.
According to the electromagnetism basic principle, if the length of an open circuit stub is l, the phase velocity of transmission signals is V p, the resonance frequency f that causes of this open circuit stub then ResBe:
f res = v p 4 l
Can learn that by above-mentioned formula the length of open circuit stub is shorter, make resonance frequency increase.
Fig. 3 show the high-speed signal transmission-line of tool conductivity connected-pole parallel series of the present invention and prior art about reflection loss (reflection loss) and insertion loss (insertion loss) with respect to the performance diagram of frequency.Thus Fig. 3 as can be known, in the frequency range of 1GHz-7GHz, reflection loss S11 of the present invention and insertion loss S21 all have significant improvement, are better than prior art; Wherein reflection loss S11 compared with prior art reduces 10-15dB approximately, and insertion loss S21 has reduced 12dB approximately on the Frequency point of 5.6GHz.
Fig. 4 is an eye pattern (eye diagram), show that the present invention is applied in transmission PCI-E II (PCIExpress II, PCI=Peripheral Component Interconnect wherein) under the situation of signal, the characteristic of signal elevating time (rise time) compared with prior art.Eye pattern can be found out thus, and prior art has the rise time of comparatively delaying owing to be subjected to the influence of resonance frequency; But can obtain tangible improvement behind employing the present invention, make the rise time comparatively quick.
Generally speaking, the invention provides a kind of high-speed signal transmission-line of tool conductivity connected-pole parallel series, be applied in a multiple field circuit board, on this multiple field circuit board, form a high-speed signal transmission-line; The present invention has adopted the conductivity of pair of parallel serial connection to be communicated with the conducting wire that post connects the upper and lower, make conductivity be communicated with the open circuit stub that the post redundance forms, shorten more than existing, reduced the harmful effect that resonance effects causes the transmission signals quality.Therefore the present invention has better progressive and practicality than prior art.

Claims (9)

1. the high-speed signal transmission-line of a tool conductivity connected-pole parallel series, be applied in a multiple field circuit board, and this multiple field circuit board has a top layer and a bottom layer at least, wherein the inside of this top layer is formed with a top layer ground plane, forms a signal transmission line on this multiple field circuit board; It is characterized in that the high-speed signal transmission-line of this tool conductivity connected-pole parallel series comprises at least:
One first conducting wire is formed on the top layer ground plane of this multiple field circuit board, and it has one first end points and one second end points;
One first conductivity is communicated with post, has a top and a bottom, and its top is second end points that is connected to this first conducting wire on the layer of the top of this multiple field circuit board, and its bottom then is communicated to the bottom layer of this multiple field circuit board;
One second conducting wire is formed on the top layer ground plane of this multiple field circuit board, and it has one the 3rd end points and one the 4th end points;
One second conductivity is communicated with post, has a top and a bottom, and its top is the 4th end points that is connected to this second conducting wire on the layer of the top of this multiple field circuit board, and its bottom then is the bottom layer that is communicated to this multiple field circuit board; And
One connection line, the bottom that this first conductivity is communicated with post is connected to the bottom that this second conductivity is communicated with post.
2. the high-speed signal transmission-line of tool conductivity connected-pole parallel series as claimed in claim 1 is characterized in that, this connection line is to be formed on the bottom layer of this multiple field circuit board.
3. the high-speed signal transmission-line of tool conductivity connected-pole parallel series as claimed in claim 1 is characterized in that, this first conducting wire is the top that is formed at the top layer ground plane of this multiple field circuit board.
4. the high-speed signal transmission-line of tool conductivity connected-pole parallel series as claimed in claim 1 is characterized in that, this second conducting wire is the below that is formed at the top layer ground plane of this multiple field circuit board.
5. the high-speed signal transmission-line of tool conductivity connected-pole parallel series as claimed in claim 1 is characterized in that, this multiple field circuit board is a high-speed digital circuit plate.
6. the high-speed signal transmission-line of tool conductivity connected-pole parallel series as claimed in claim 5 is characterized in that, this high-speed digital circuit plate is the high-speed digital circuit plate that a wireless network is used.
7. the high-speed signal transmission-line of tool conductivity connected-pole parallel series as claimed in claim 5 is characterized in that, this high-speed digital circuit plate is the high-speed digital circuit plate that a mobile phone is used.
8. the high-speed signal transmission-line of tool conductivity connected-pole parallel series as claimed in claim 5 is characterized in that, this high-speed digital circuit plate is the high-speed digital circuit plate that a global positioning system is used.
9. the high-speed signal transmission-line of tool conductivity connected-pole parallel series as claimed in claim 5 is characterized in that, this high-speed digital circuit plate is the high-speed digital circuit plate that a Digital Television is used.
CNB2006100825885A 2006-05-18 2006-05-18 High-speed signal transmission-line structure of connected-pole parallel series Expired - Fee Related CN100512023C (en)

Priority Applications (1)

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CNB2006100825885A CN100512023C (en) 2006-05-18 2006-05-18 High-speed signal transmission-line structure of connected-pole parallel series

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Application Number Priority Date Filing Date Title
CNB2006100825885A CN100512023C (en) 2006-05-18 2006-05-18 High-speed signal transmission-line structure of connected-pole parallel series

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CN100512023C true CN100512023C (en) 2009-07-08

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CN105307404A (en) * 2015-12-09 2016-02-03 浪潮电子信息产业股份有限公司 Parallel through hole design method for improving signal quality and reducing processing cost

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Inventor after: Dan Suzhen

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Address after: Victory Street Dong Guan Lu ancient county town of Zhumadian city of Henan Province in two groups

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