CN100485926C - Light-emitting diodes lamp - Google Patents
Light-emitting diodes lamp Download PDFInfo
- Publication number
- CN100485926C CN100485926C CNB2005100970333A CN200510097033A CN100485926C CN 100485926 C CN100485926 C CN 100485926C CN B2005100970333 A CNB2005100970333 A CN B2005100970333A CN 200510097033 A CN200510097033 A CN 200510097033A CN 100485926 C CN100485926 C CN 100485926C
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- CN
- China
- Prior art keywords
- metal tube
- light
- emitting diode
- backlight unit
- diode chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
Abstract
The light emitting diode mainly consists of light-emitting dies and a metal bed for mounting the die. The metal bed comprises at least one hollow high thermal conductivity metal tube. At least two light emitting diode dies are fixed on one end or center of said metal tube by welding said dies on the wall of said metal tube with gold-tin alloy, or bonding the dies on the wall of said metal tube with high thermal conduction silver paste or organic and inorganic adhesive. The said metal tube has fins or threaded heat-delivery surface. The lamp of light-emitting diode has at least one reflector with a reflecting surface made into parabolic shape mounted on said metal tube.
Description
Technical field
The present invention relates to the lamp of a kind of LED source and formation, particularly a kind of universal large-power light-emitting diodes light source and the lamp that assembles belong to a kind of light-emitting component.
Background technology
Large-power light-emitting diodes is called for short LED, is widely known by the people as the advantage and the prospect of lighting source, but also main at present as some special light sources, as automobile brake lamp and torch lamp.The LuxeonLED that the large-power light-emitting diodes that attracts most attention designs and produces for Lumileds, its structural representation as shown in Figure 1.It includes large-power light-emitting diodes 1, silicon chip 2, metal pilum 3, hemisphere sealed mirror 4, insulating material 5, gold thread 6 and electrode 7 etc.Large-power light-emitting diodes 1 is installed on the metal pilum 3, and hemisphere sealed mirror 4 is arranged above, is insulating material 5 around the metal pilum, and electrode 7 connects power supply by gold thread 6.The Metal Substrate cylinder of this package design is long-pending limited, and is insulating material around it, and the heat that has hindered the metal pilum is to outdiffusion.The main product of Lumileds is 1 watt, 3 watts Luxeon LED, and its state-of-the-art technology is 5 watts Luxeon LED, it is said it is the brightest in the world present light-emitting diode (LED).The heat that 5 watts Luxeon LED is produced when luminous is concentrated, and it is very difficult to dispel the heat, and similarly package design wants to accomplish more than 5 watts extremely difficult especially.The 5 watts of requirements that can not satisfy general lighting far away realize illumination if select for use the Luxeon LED of a plurality of 3 watts or 5 watts to make up, and one dispels the heat will rely on external heat abstractor; Two to come each Luxeon LED all be hemisphere sealed mirror design, and its emergent light angle reaches 180 degree, must the various special lens of adapted, could satisfy various lighting requirements, so whole light source can be very complicated, and volume is big, the cost height.
Summary of the invention
The objective of the invention is to overcome the deficiency that prior art exists, a kind of light-emitting diode and lamp of using at general lighting is provided.
The technical solution adopted in the present invention is: it mainly is made of light-emitting diode chip for backlight unit and Metal Substrate that described light-emitting diode chip for backlight unit is installed, described Metal Substrate is made of the high metal tube of at least one hollow thermal conductivity, described light-emitting diode chip for backlight unit be fixed in metal tube in the heart; On the tube wall face that gold-tin alloy that described light-emitting diode chip for backlight unit employing thermal conductivity is high or tin sheet directly are welded on metal tube, perhaps adopt high silver slurry of thermal conductivity or organic and inorganic glue bond on the tube wall of metal tube; Be electrically connected mutually by gold ball bonding between the described light-emitting diode chip for backlight unit, and light-emitting diode chip for backlight unit and be coated with the optics glue-line above the spun gold, the two ends up and down of described metal tube all are connected with identical parabolic reflector by screw thread, and two parabolas are oppositely arranged; Be fitted with Current Control and power source conversion wiring board in the described metal tube.
A kind of LED light lamp, it mainly is made of light-emitting diode chip for backlight unit and Metal Substrate that described light-emitting diode chip for backlight unit is installed, described Metal Substrate is made of the high metal tube of at least one hollow thermal conductivity, described light-emitting diode chip for backlight unit be fixed in metal tube in the heart; On the tube wall face that gold-tin alloy that described light-emitting diode chip for backlight unit employing thermal conductivity is high or tin sheet directly are welded on metal tube, perhaps adopt high silver slurry of thermal conductivity or organic and inorganic glue bond on the tube wall of metal tube; The outer surface of described metal tube is provided with fin or screw thread heat-delivery surface, and the two ends up and down of described metal tube all are connected with identical parabolic reflector by screw thread, and two parabolas are oppositely arranged; Be fitted with Current Control and power source conversion wiring board in the described metal tube.
The present invention is a kind of directly integrated to the heavy-duty diode chip, a plurality of chips are uniformly distributed on the metal tube of two sections openings of fin or screw thread design, under specific supply power voltage, to greatest extent the form of chip with series connection connected, have very strong cost advantage and performance advantage, specifically have: 1, volume can be accomplished very little; 2, the lamp of different capacity can adopt the metal tube of different thicknesses and the chip of different capacity, can optimize material cost and cost of labor; 3, than concentrating or strengthening the traditional method that chip area improves power, disperseed concentrating of heat; 4, chip directly is fixed on the metal tube, has reduced the thermal resistance of chip in the surrounding air; 5, the hollow metal pipe of both ends open has been promoted the natural circulation of cold air, has greatly improved radiating effect; 6, increase the chip side area, improved luminous efficiency; 7, the light that sends of the main exiting surface (front) of each chip and 3 sides is also launched via parabolic reflector, and than traditional large-power light-emitting diodes, this structure can provide better collimated light beam, i.e. the Zui Xiao angle of emergence; 8, screw thread or fin design can make the relative position of chip endless tube and ring-type parabolic reflector freely change, and then regulate beam shape; 9, reduce the voltage ratio of current control circuit part, improved the service efficiency of electric energy; 10, control circuit board can be integrated in the metal tube and lamp holder in conjunction with easily; Characteristics such as it has rational in infrastructure, compact, and is easy to use, reliable.
Description of drawings
Fig. 1 is a kind of structural representation of prior art.
Fig. 2 is a structural representation of the present invention.
Fig. 3 is the example structure schematic diagram of the present invention in the application in general lighting field.
Fig. 4 is the another kind of example structure schematic diagram of the present invention in the application in general lighting field.
Fig. 5 is the present invention's another example structure schematic diagram in the application in general lighting field.
Fig. 6 is a kind of example structure schematic diagram of the present invention.
Embodiment
Below in conjunction with accompanying drawing the present invention is done detailed introduction: light-emitting diode of the present invention mainly is made of light-emitting diode chip for backlight unit 11 and Metal Substrate that described light-emitting diode chip for backlight unit is installed.Described Metal Substrate is made of the high metal tube 12 of at least one hollow thermal conductivity, at least two light-emitting diode chip for backlight unit 11 be fixed in metal tube 12 an end or in the heart.Shown in Figure 2,12 light-emitting diode chip for backlight unit 11 adopt on the tube wall face that high gold-tin alloy of thermal conductivitys or tin sheet directly be welded on metal tube 12, perhaps adopt high silver slurry of thermal conductivity or organic and inorganic glue bond on the tube wall of metal tube 12, constitute the diode chip for backlight unit ring; Described light-emitting diode chip for backlight unit 11 is distributed on the ring-type tube wall of metal tube 12, is electrically connected mutually by spun gold 13 ball bondings between them, and chip 11 and be coated with optics glue-line 14 above the spun gold 13.According to the height of power requirement and driving voltage, series, parallel or mixed the connection are adopted in the electrical connection between the light-emitting diode chip for backlight unit 11, or the module of upside-down mounting LED chip is housed.Above-describedly promptly constitute LED source of the present invention or be referred to as combined LED.
Shown in Figure 2, constitute the metal tube 12 of LED source of the present invention, its outer surface also is provided with fin or screw thread heat-delivery surface 15.This hollow metal pipe 12 is designed to carry radiator, its surface area is big, and is fixed on chip 11 on the metal tube and produces a large amount of heat and pass to metal tube, and the convection current of formation natural air is taken away heat apace metal tube 12 in.
Fig. 3---Figure 6 shows that the assembly type lamp or the lamp holder that utilize above-mentioned LED source to be made, it is that thread surface 15 at metal tube 12 is connected with the threaded reflector 16 of the endoporus of different shape, and representative reflector 16 its inner chambers are paraboloid structure, see Fig. 3---shown in Figure 4, the chip ring can overlap with the parabolic focus ring.16 of reflectors can spinning in and out by screw thread, control the light type of emergent light.When chip ring 17 overlaps with the parabolic focus ring, be nearly parallel light emergence, can be used for remote illumination, see shown in Figure 3; Change the relative position of reflector and chip ring, can obtain the emergent light of different angles, can satisfy the requirement of most of general lightings, see shown in Figure 4.Figure 5 shows that a glass plectane reflector 18 replaces the structure of parabolic reflector.Structure shown in Figure 6 is: at the identical parabolic reflector 16 of the two ends of metal tube 12 precession, can form the annular convergent pencil of rays of 360 degree, can be used for making high-power warning lamp and stroboscopic lamp.
Above-described light-emitting diode chip for backlight unit 11 can be the diode chip for backlight unit that comprises two kinds of different colors at least, the led chip of conversion different colours can be made the light fixture of different colours, as blueness or purple chip, coat corresponding fluorescent material, just can make the white light light fixture; For another example, that the metal tube low side is closely aligned is red, green, blue three kinds of chip rings, and controls the electric current of three chips respectively, just can produce red, green, blue, the versicolor light of bletilla, with making full color light fixture.
The application of light source element body of the present invention is not limited to above several, and the shape of reflector is also ever-changing, and various decorating structures etc. can be arranged.Current Control of the present invention and power source conversion wiring board can be inserted in the metal tube, and power input line is connected on the lamp holder that is fixed on the metal tube other end, and lamp holder can be the screw socket or the socket of standard, also can be the special lamp cap of new led light source.Enough spaces must be left in the junction of metal tube and lamp holder, allow the air can free flow in metal tube.The present invention can also will have the space between tail end block and the metal tube according to difform block is mixed in the requirement of light beam and the needs of decorating at the low side of described metal tube.
The present invention can be applied to LED and replace in the lamp, also may be used on the illuminator of full LED lamp, the forward operating voltage of single led chip be 2 volts to 4 volts, consider from usefulness, allow more led chip connect; Consider from the Electrical Safety aspect, should allow led chip in parallel as far as possible; For more powerful LED lamp, as input power be tens watts and more than, can adopt circular heat pipe as radiator, with the light source element body, be the cold junction that the led chip endless tube directly screws in heat pipe, a large amount of heats that chip produces are transferred to the hot junction of heat pipe expeditiously by heat pipe.
Claims (2)
1, a kind of LED light lamp, it mainly is made of light-emitting diode chip for backlight unit and Metal Substrate that described light-emitting diode chip for backlight unit is installed, described Metal Substrate is made of the high metal tube of at least one hollow thermal conductivity (12), described light-emitting diode chip for backlight unit (11) be fixed in metal tube (12) in the heart; On the tube wall face that gold-tin alloy that described light-emitting diode chip for backlight unit (11) employing thermal conductivity is high or tin sheet directly are welded on metal tube, perhaps adopt high silver slurry of thermal conductivity or organic and inorganic glue bond on the tube wall of metal tube (12); Be electrically connected mutually by spun gold (13) ball bonding between the described light-emitting diode chip for backlight unit (11), and light-emitting diode chip for backlight unit (11) and be coated with optics glue-line (14) above the spun gold (13), the two ends up and down that it is characterized in that described metal tube (12) all are connected with identical parabolic reflector (16) by screw thread, and two parabolas are oppositely arranged; Be fitted with Current Control and power source conversion wiring board in the described metal tube (12).
2, a kind of LED light lamp, it mainly is made of light-emitting diode chip for backlight unit and Metal Substrate that described light-emitting diode chip for backlight unit is installed, described Metal Substrate is made of the high metal tube of at least one hollow thermal conductivity (12), described light-emitting diode chip for backlight unit (11) be fixed in metal tube (12) in the heart; On the tube wall face that gold-tin alloy that described light-emitting diode chip for backlight unit (11) employing thermal conductivity is high or tin sheet directly are welded on metal tube, perhaps adopt high silver slurry of thermal conductivity or organic and inorganic glue bond on the tube wall of metal tube (12); The outer surface of described metal tube (12) is provided with fin or screw thread heat-delivery surface (15), it is characterized in that the two ends up and down of described metal tube (12) all are connected with identical parabolic reflector (16) by screw thread, and two parabolas is oppositely arranged; Be fitted with Current Control and power source conversion wiring board in the described metal tube (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100970333A CN100485926C (en) | 2005-12-31 | 2005-12-31 | Light-emitting diodes lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100970333A CN100485926C (en) | 2005-12-31 | 2005-12-31 | Light-emitting diodes lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1819193A CN1819193A (en) | 2006-08-16 |
| CN100485926C true CN100485926C (en) | 2009-05-06 |
Family
ID=36919066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100970333A Active CN100485926C (en) | 2005-12-31 | 2005-12-31 | Light-emitting diodes lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100485926C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8350450B2 (en) | 2009-09-30 | 2013-01-08 | Foxsemicon Integrated Technology, Inc. | LED lamp |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI476344B (en) * | 2012-05-22 | 2015-03-11 | Albert Chow | Light emitting diodes |
-
2005
- 2005-12-31 CN CNB2005100970333A patent/CN100485926C/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8350450B2 (en) | 2009-09-30 | 2013-01-08 | Foxsemicon Integrated Technology, Inc. | LED lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1819193A (en) | 2006-08-16 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |