CN100456459C - 半导体芯片的热传导装置 - Google Patents

半导体芯片的热传导装置 Download PDF

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CN100456459C
CN100456459C CNB2005101173795A CN200510117379A CN100456459C CN 100456459 C CN100456459 C CN 100456459C CN B2005101173795 A CNB2005101173795 A CN B2005101173795A CN 200510117379 A CN200510117379 A CN 200510117379A CN 100456459 C CN100456459 C CN 100456459C
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L·S·莫克
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Abstract

本发明旨在改善从半导体芯片至其热沉装置的热传导的方法。所述热传导装置包括液体腔，其中液体在所述腔内循环，以将热量从所述腔的一个位置扩散至在所述腔中部分安装的热导管。然后通过热导管将热量带走至远处的热沉装置。所述腔具有内置的机构，以允许在正常工作期间所述液体膨胀，并且可监控其膨胀状态。

Description

半导体芯片的热传导装置
技术领域
本发明旨在解决半导体芯片的热量耗散问题。本发明涉及用于计算机和电信设备的半导体芯片的热传导和冷却的领域。
背景技术
公知半导体芯片的功率和功率密度正在迅速增大。
由于该高功率和功率密度，大部分的热流阻抗来自芯片至热沉装置，该热沉装置通常具有比芯片大得多的尺寸。因此希望较好的热传导装置，其可减轻这种热阻并提供从微小芯片至热沉装置的较好热传导。
美国4,519,447-“衬底冷却”公开了两种冷却衬底的方法，一种是用于散热的平面蒸汽腔，而另一种是磁流体动力驱动的液体冷却板。
美国5,316,077-“用于电路元件的热沉”公开了一种通过两块板形成冷却剂通道的方法。采用泵驱动通过通道移动的液体冷却剂，并将热量从元件传导至在一个板上的散热片。膨胀室用于容纳液体冷却剂的膨胀。
美国6,019,165-“热交换装置”公开了一种利用通过外部磁场驱动的向心泵叶轮，以移动散热器板内的液体冷却剂并将热量从热源传导至与散热板直接良好热接触的热吸收器的方法。
美国6,029,742-“用于电子设备的热量交换器”公开了一种利用在导管中的磁耦合离心转子组件驱动在导管中的冷却剂，以消除来自电子设备的热量。
发明内容
将要公开的热传导装置具有液体腔，所述液体腔置于与半导体芯片良好热接触，并且具有多个嵌入所述腔内的热导管。所述热导管的另一端在所述腔的外侧突出，并固定在热沉上。通过由电动机驱动的旋转叶片，推动在所述腔内的所述液体在所述腔内循环。所述循环的液体将热量从具有嵌入的微沟道的所述腔的发热侧运送至所述热导管。该构思的优点在于，所述液体腔本身包括在良好限定的区域中，以致可容易地确保其质量，从而可更好地防止产物泄漏。也公开了允许所述液体膨胀和压缩的机构，以及探测所述液体泄漏的方法。
附图说明
图1是具有热导管和风扇热沉组件的热传导装置的三维视图；
图2是在顶部安装有电动机的热传导装置；
图3是在侧面安装有电动机的热传导装置；以及
图4是电动机叶片和液体沟道组件的顶视图。
具体实施方式
图1示出了在半导体芯片封装上的具有与其相关的热沉组件的热传导装置。在半导体芯片封装15上安装热传导装置31。
外部电动机41置于热传导装置31的顶部。两根热导管65的一端插入热传导装置31中。热导管65的另一端固定到热沉63上，该热沉63又靠近风扇61放置。从风扇61出来的空气流将通过热沉63，从而将热量从热沉63带走。
在图2中示出了热传导装置31的代表性结构。热传导装置31包括密封腔311，其中液体沟道组件339置于一侧，热导管65的一端插入其中。旋转叶片415置于液体沟道组件339的中心上方的空间中。在叶片415与液体沟道组件339之间固定中心具有开口的分离器318。叶片415安装在电动机轴412上。电动机41置于热传导装置31的预部，该电动机41是常规的电动机。在腔壁与旋转轴之间的密封机构在本领域是公知的，在此没有给出说明。当叶片415旋转时，将搅拌并推动腔311中的液体从用箭头328所示的热导管65附近的区域流进液体沟道组件339中。液体沟道组件339包括通过沟道壁划分的微沟道组。在热导管65的外部表面上安装有翅片(fin)653，以更好地将热量从液体传导至热导管。具有液体填充口317和用作安全控制以保护热传导装置31的压力释放阀门316。还通过可膨胀的波纹管315以及探测器313保护该装置。当加热在腔311中的液体时，其体积很可能相应地膨胀。其结果是，其将迫使可膨胀的波纹管膨胀。在波纹管315后面的自由空气空间319设计为具有足够的空间，以容纳在正常工作期间的这种膨胀。然而，如果液体的温度比正常工作的温度高得多，波纹管315的膨胀可以更大，从而可触发探测器313。当探测器313被触发时，通过引线312将信号发送至外部的监控电路，并且将随后进行适当的校正。此外，探测器313可探测热传导装置31的工作条件。通过检查在空气空间316中的空气温度和压力，它们可探测液体的体积以及温度，并且通过检查在空气空间319中是否有由于泄漏导致的液体，可探测腔311的完整性。在此所述的探测机构提供了对热传导装置的更好检测。如果该探测机构失效，常规的压力释放阀门将开始起作用，释放高压蒸汽，以保护装置。如图所示，热传导装置置于半导体芯片17的顶部，该半导体芯片17焊接在衬底15上。然后将半导体芯片封装插入管座13中，然后将该管座13焊接到印刷线路板11上。
图3示出了热传导装置31的另一个实施例，其中外部电动机41置于装置腔32的侧面。液体沟道组件33在靠近腔32中的旋转叶片45的一侧。在液体沟道组件33的一端具有垂直部分34，以使液体转向至热导管65。热导管65可具有可选翅片，以更好地将热量从液体传导至热导管65，该翅片在图中未示出。分离器35用于分离液体流。在图4中更详细地示出了代表性液体沟道组件33。这是在分离器35下的液体沟道组件的顶视图。液体被推进到通过沟道壁332划分的沟道331中。箭头333表示液体的流向。液体从靠近叶片轴的中心区域进入，通过由旋转叶片45产生的离心力被推出到沟道331。液体沟道可以是腔壁的部分，或者是焊接或铜焊到腔壁内表面上的独立整体。
为了清楚，在这些图中仅画出了主要部件，并且没有按比例画出。

Claims (16)

1.一种用于芯片散热的热传导装置，包括：
液体腔，其内填充有热传导液体；
在所述腔内的液体沟道组件；
旋转叶片，位于所述腔内，用于循环所述腔内的所述液体；
外部电动机，位于所述腔外，用于驱动所述旋转叶片；
分离器，位于所述腔内，用于分离所述腔内的液体流；以及
在所述腔内的多个热导管；
其中所述腔具有波纹管结构，在由所述腔内的所述液体产生的压力下，所述波纹管结构可膨胀。
2.根据权利要求1的热传导装置，其中所述液体沟道组件具有通过沟道壁划分的多个微沟道。
3.根据权利要求2的热传导装置，其中所述液体沟道组件是所述腔壁的部分，或者是连接到所述腔的内表面上的独立整体。
4.根据权利要求2的热传导装置，其中所述液体沟道组件位于所述腔的内壁，热量从所述腔壁的外部施加到所述腔的内壁。
5.根据权利要求1的热传导装置，其中所述热导管部分插入所述腔中，而所述热导管的另一端固定到热沉装置上。
6.根据权利要求1的热传导装置，其中所述热导管在所述腔内的部分，在所述热导管的周边上具有热传导翅片。
7.根据权利要求1的热传导装置，其中所述腔使液体在所述腔内循环，以将从所述液体沟道组件释放的热量运送到所述热导管。
8.根据权利要求1的热传导装置，其中所述可膨胀的波纹管在所述腔内形成密封的且较小的子腔。
9.根据权利要求8的热传导装置，其中在所述波纹管和所述腔之间形成空气空间。
10.根据权利要求9的热传导装置，其中所述空气空间具有电子探测 器，用于检查在所述空气空间中的空气的温度和压力。
11.根据权利要求10的热传导装置，其中所述探测器具有当所述波纹管接触所述探测器时检查和探测所述可膨胀的波纹管的功能。
12.根据权利要求10的热传导装置，其中所述探测器具有检查和探测从所述子腔泄漏出来的特定液体量的功能。
13.根据权利要求10的热传导装置，其中所述探测器具有连接至外部监控电路的引线。
14.根据权利要求1的热传导装置，其中所述腔具有压力释放阀门。
15.根据权利要求1的热传导装置，其中所述腔具有用于填充的液体填充口。
16.根据权利要求1的热传导装置，其中所述腔由铝和铜的热传导材料制成。
CNB2005101173795A 2004-11-12 2005-11-03 半导体芯片的热传导装置 Expired - Fee Related CN100456459C (zh)

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US10/988,219 2004-11-12

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