CN100394149C - 用于原位流量检验和校准的系统和方法 - Google Patents
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
- G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
- G01F25/17—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters using calibrated reservoirs
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
- G01F25/0092—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume for metering by volume
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
- G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
- G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
- G01F25/15—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters specially adapted for gas meters
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
- G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
- G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
- G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
Abstract
一种用于流量控制设备的原位检验和校准的系统和方法,包括连接流量控制设备和流量检验设备的第一网络物理层。流量检验设备的控制器通过第一网络物理层与每个流量控制设备通信,从每个流量控制设备接收气体详细信息和传递函数,并检验每个流量控制设备的流量。流量检验设备的控制器进一步通过第一网络物理层与每个流量控制设备通信,如果必要,校准流量控制设备。流量控制设备的检验和校准优选为根据连接到第二网络物理层的工具控制器提供的单命令执行,第二网络物理层连接到流量控制设备。
Description
技术领域
本发明一般涉及半导体处理设备,特别的,涉及用于将无污染物的、精确计量的生产和吹扫气体提供到半导体处理腔室的系统和方法。更特别的,本发明涉及流量控制设备的原位检验和校准的系统和方法。
背景技术
单个半导体器件的制作需要将仔细同步和准确测量的气体输送到处理腔中。在制作过程中使用各种方法,并且可能需要许多单独的处理步骤,如半导体器件的清洗、磨光、氧化、遮蔽、蚀刻、掺杂、硬化等。这些所使用步骤的特定的次序和有关的材料都有助于特定设备的制作。
因此,晶片制作设备一般包括在其中执行化学蒸涂、等离子体沉积、等离子体蚀刻、真空喷镀和完成其他相似的气体生产过程的区域。处理工具,如化学蒸涂的反应器、真空镀膜机、等离子体蚀刻机或等离子体增强化学蒸涂装置,必须被提供以各种处理气体。必须提供给这些工具无污染物的、准确测量数量的纯净气体。
在典型的晶片制造设备中,气体储存在罐中,该罐通过管道或导管连接到气箱。气箱将无污染物的、准确测量数量的纯的惰性或反应气体从制造设备的罐输送到处理工具。气箱或气体测量系统包括多个具有气体测量单元的气路,例如阀、压力调节器和传感器、质量流量控制器和过滤器/净化器。每一个气路都有自己的连接单独气体源的入口,但是,为了连接处理工具,所有的气路汇聚到一个出口,例如气体集合管。
当输送测定量的气体时,期望并通常必须能够在用于输送这种气体的气体传输系统中获得准确的气流状态的测量,例如,当测量质量流量控制器的准确度或校准质量流量控制器时。一种实现方式是通过测量已知体积的腔室中气体的温度和压力变化率并校准测量值的质量流量。根据所谓的“压力升高率”或“上升速率(ROR)”方法,气流通过测量设备(DUT,例如质量流量测量器)导入真空的、体积已校准的腔室中一段测量的时间间隔Δt。腔室中气体的温度的变化(ΔT)和压力的变化(ΔP)被测量和修正到标准的温度(T0)和压力(P0)。这里使用的术语“标准”意思是“标准状态”,通常定义为“绝对”温度为273.15k和“绝对”压力为1个大气压。已知体积,根据压力随时间的变化(ΔP/Δt)和温度随时间的变化(ΔT/Δt)可以计算气体流速。
许多气体传输系统采用基本为理想气体的气体。换句话说,他们的状态可以根据理想气体定律来精确预测和模拟,该定律表达式为PV=nRT,P是压力,V是体积,n是气体摩尔数,R是通用气体常数,T是绝对温度。固定体积的基本理想气体的随时间的压力变化与温度变化的关系是常数,与气体无关。因此,理想气体定律关系可以用来测定n,质量,也就是说腔中气体的摩尔数。在某些情况下,气体表现与理想气体不同,修正函数可以用来更加准确地补偿压力和温度随时间变化的测量。
一些设备使用ROR方法验证流量。例如,被转让给本发明的受让人的Hinkle的美国专利号5,684,245,公开并要求保护一种应用ROR方法在气体输送系统中测量气体质量流量的设备和方法。本发明的受让人马萨诸塞州安杜佛的MKS仪器公司,也提供了ROR流量检验器产品,例如Tru-FloTM原位质量流量校验器和GBRORTM(气箱上升速率)原位质量流量校验器。
在气体测量装置中,用于检验和校准流量控制设备的新的改进的系统和方法仍然是期望的。优选为,新的改进的系统和方法将使用ROR流量检验器。另外,新的改进的系统和方法将优选提供流量控制设备的原位检验和校准,从而使得检验和校准不需要从气体测量系统中去掉流量控制设备。
发明内容
本发明的示例性实施例提供了一种流量控制设备的原位检验和校准的系统和方法,包括连接流量控制设备和流量检验设备的第一网络物理层。流量检验设备的控制器通过第一网络物理层与每个流量控制设备通信,从每个流量控制设备接收气体详细信息和传递函数,并检验每个流量控制设备的流量。流量检验设备的控制器进一步通过第一网络物理层与每一个流量控制设备通信,如果必要,校准流量控制设备。流量控制设备的检验和校准优选为根据连接到第二网络物理层的工具控制器提供的单命令执行,该第二网络物理层连接流量控制设备。
本领域的技术人员在阅读了附图中显示的优选实施例的以下详细说明之后,将能更清楚的理解本发明的上述和其它的特征和优势。
附图说明
图1是根据现有技术的气体测量系统的示意图,并包括连接气体集合管的质量流量控制器以及连接在气体集合管与真空泵之间的质量流量检验器;
图2是图1中的质量流量检验器的示例性组件的示意图;
图3是根据现有技术的、由图1中的质量流量检验器执行的用于验证一个质量流量控制器的流速的方法的压力时间图;
图4是气体测量系统的示意图,包括根据本发明的质量流量控制器的原位检验和校准的系统的示例性实施例;
在所有的示意图中,同样的参考符号指示相同的或相应的组件和单元。
具体实施方式
参看图4,本发明提供了一种系统100和方法,用于原位检验和校准通过测量装置(DUT),例如质量流量控制器(MFC)的流体流量。系统100和方法特别的应用将无污染物的、精确计量的生产和吹扫(purge)气体提供到半导体处理腔室的气体测量系统。在一个示例性实施例中,新的改进的系统100和方法采用上升速率(RORrate-of-rise)流量检验器。新的改进的系统100和方法提供MFC的原位检验和校准,从而使得检验和校准不需要从气体测量系统中去掉MFC。
首先参见图1和图2,其中显示了现有技术的流量检验设备10。在图1中,流量检验设备10连接在气体测量系统50的气体集合管52和真空泵54之间。气体测量系统50也包括多个控制气体通过连接到气体集合管的管路58的流动的质量流量控制器(MFC)56。在图1的示例性实施例中,系统50包括12个连接到气体集合管52并具有MFC56的管路58。但是,根据需要,系统50可以包含或多或少于12个管路58。
优选但非必要的,每个MFC56包括压力不敏感型的MFC(PiMFC),其可从马萨诸塞州安杜佛(http://www.mksinst.com)的MKS仪器公司得到。PiMFC包括功能和性能上的技术改进,以帮助用户在半导体和高纯度薄膜应用中增加工具生产量和减少系统整体成本。特别的,通过先进的物理模型和数字控制算法,PiMFC提供了实时的准确的流量控制,对上游和下游的压力干扰不敏感。PiMFC使生产气流能够实时控制,在常规的基于数字的MFC上,使准确性和可重复性显著改进,使腔室匹配更好。压力不敏感的质量流量控制器也公开在2002年6月4日提交的共同未决的美国专利申请序列号10/178,721中,该压力波动不敏感的质量流量控制器的设备和方法(律师签号MKS-102),已转让给本发明的受让人并在此引用作为参考。
流量检验设备10被用来检验MFC产生的流速。如图2所示,设备10包括具有预定体积的容器20、控制气体集合管和容器20之间流量的“上游”或第一阀22、控制容器20到真空泵的流量的“下游”或第二阀24以及与容器20的体积相通的容器压力测量设备26。设备10也包括旁路阀28。该容器压力测量设备26可以是压力传感器。
流量检验设备10的控制器30利用流量检验的上升速率法,其在图3中通过压力(P)时间(t)图显示。通常,控制器30是一个计算机处理器,其包括电子存储器和时钟。控制器30通常被编程,从而使得:在操作期间,控制器首先关闭旁路阀28,并打开第一阀22和第二阀24,使流量从MFC12旁路,并通过容器20。控制器30进一步被编程,从而使得在旁路流动稳定的初始周期后,第二阀24关闭,以停止从容器20的流动。当关闭的容器20充满来自MFC12的气体时,控制器30接受来自压力测量设备26的容器的压力测量,接受时钟的时间测量,并且根据气流确定容器压力变化率。然后控制器30利用容器压力的变化率和容器20的已知体积,确定MFC12提供的实际流量。图3描述了在已知体积的容器20中,气体流速是如何由控制器30根据单位时间压力的变化(ΔP/ΔT)来计算的。
流量测量完成后,图2所示的第一阀22被关闭,第二阀24打开以使用真空泵净化容器20。净化后,第二阀24关闭,旁路阀28打开,以允许MFC12和处理室之间的正常流动。
流量检验设备10包括,例如,GBRORTM原位流量检验器或者Tru-FloTM原位流量检验器,两种都可由马萨诸塞州安杜佛(http://www.mksinst.com)的MKS仪器公司获得。GBRORTM是标准组件的气路或者气棍,包括阀、压力容器、压力传感器和安装在集合管上的控制器。GBRORTM和Tru-FloTM流量检验器都是过程透明的,也就是说,操作在气体传输系统的正常处理步骤之间,因此减少了处理工具停机时间。压力测量设备26可包括例如牌的压力传感器,也可由MKS仪器公司获得。
再次参看图1,MFC12的计算机控制器(未示出)和流量检验设备10的控制器30通过到工具控制器60的网络物理层70连接。在一个示例性实施例中,网络物理层包括DeviceNetTM网络物理层70。DeviceNetTM是一种简单的网络解决方案,当为多个供应商提供“相似”组件的互换性时,可以减少布线和安装工业装置的成本和时间。DeviceNetTM是开放的网络标准,其具有开放的规格和协议。供应商不需要购买硬件、软件或与应用DeviceNetTM的系统相连接的设备的许可。DeviceNetTM标准可从开放DeviceNetTM(设备网络)供应商协会组织(www.odva.org)获得。当更多复杂设备可能互联时,DeviceNetTM物理层70允许简单设备的互换性。DeviceNetTM物理层70基于面向广播的通信协议、控制器局域网络(CAN)。1996年超过一千万的CAN芯片被生产。四个主要的CAN芯片提供商有英特尔、摩托罗拉、飞利浦和日立。DeviceNetTM物理层70的两大主要用途是:1)与低水平设备相关联的面向控制的信息的传输;以及2)其他间接与被控制的系统相关联的信息的传输,例如配置。
为了检验通过MFC56中的一个的流量,工具控制器60通过DeviceNetTM物理层70单独控制流量检验设备10和被选择的MFC56中的一个,从而检验被选择的MFC56的流速。
参看图4,本发明中新的改进的系统100提供MFC56的原位检验和校准,从而使得检验和校准不需要从气体测量系统50中去掉MFC56。系统100包括第一网络物理层102,它连接每个MFC56和流量检验设备10到集线器104,该集线器依次被连接到连接工具106。
流量检验设备10的计算机控制器30被重新编程,从而与每个MFC56自动通信,并且如果需要,检验和校准第一网络物理层102上的每个MFC56的流量。特别的,所有的气体详细信息连同传递函数(提供压力不敏感性)被每个MFC56的流量检验设备10的计算机控制器30请求,并被处理以应用前述ROR技术来检验每个MFC56的流速的精确度。这种通信经由第一网络物理层102在流量检验设备10和MFC56之间进行。
原位流量检验和校准由来自“第二”物理层70的工具控制控制器60的单命令启动。在示例性实施例中,第二网络物理层包括DeviceNetTM网络物理层70,尽管其他的协议也可被应用。在一个操作方式中,流量检验数据通过DeviceNetTM网络物理层70被收集和传输到工具控制器60。在另一不同的操作方式中,流量检验设备10的计算机控制器30被编程以接收来自工具控制器70的单命令,并查询测量的MFC56、检验流量并校准MFC,如果必要,将上传校准参数到MFC。对于气体测量系统50的所有MFC56,这些步骤可以是连续的,并且具有根据需要的频率。所有重要的校准数据将被驻留在每个MFC56上。
在本发明的一个示例性实施例中,第一网络物理层包括以太网/互联网协议(EtherNet/IP)网络物理层102。EtherNet/IP是工业网络标准,其利用商业成品的以太网通信芯片和物理介质。IP代表“工业协议”,并且是区别网络的本质。不同于工业以太网群集的许多选择,EtherNet/IP使用了开放的应用层协议。而且,超过一个的供应商和组织支持EtherNet/IP,EtherNet/IP是三大网络组织支持的唯一标准,包括国际控制网络(CI),工业以太网协会(IEA),开放设备网络供应商协会(ODVA)。
EtherNet/IP是协议栈,其为自动化目的而应用开放的、工业成熟的协议扩展了商业成品的以太网。同时,它支持通用的办公协议,例如超文本传输协议(HTTP)、文件传输协议(FTP)和简单网络管理协议(SNMP)。基于TCP/IP协议组,以太网/互联网协议(EtherNet/IP)使用传输控制协议(TCP/IP)用于信息通信,使用数据报协议(UDP/IP)用于I/O通信。通过应用TCP/IP和UDP/IP协议封装数据,这是第一个提供实时I/O控制的工业以太网络。
作为DeviceNetTM的同伴网络,EtherNet/IP使用与DeviceNetTM同样的开放的、坚固的应用层协议-控制和信息协议(CIP)。因此,网络也共享设备规范和对象库。这使EtherNet/IP的开发者可以使用DeviceNetTM对象和规范,用于来自多个提供商的设备的即插即用互操作。DeviceNetTM和EtherNet/IP的组合促进了从传感器到企业软件的透明度。
根据本发明的另一示例性实施例,集线器还连接到ToolWebTM。ToolWebTM是软件“连接”解决方案,其可从MKS仪器公司获得,它允许通过Ethernet/IP网络到所有处理工具程序的连接。BlueBoxTM是硬件通信管理器,可从MKS仪器公司获得,它支持数据收集和路由的ToolWebTM。多种工具可以通过EtherNet/IP网络物理层102被连接到ToolWebTM,并可以将收集的数据公布给通过集线器连接到EtherNet/IP网络物理层102的第三方数据库。通常,ToolWebTM是这样一种系统,其包括硬件,例如BlueBoxTM通信管理器,也包括软件,从而为可能的电子诊断目的对数据进行监测和收集。
虽然已经解释和说明了本发明的优选实施方式,但是本领域技术人员应该理解,也可以进行各种改变和修改。因此,所附的权利要求书覆盖了落入本发明的精神和范围内的这些改变和修改。
Claims (20)
1.一种用于流量控制设备的原位检验和校准的系统,包括:
流量检验设备;
用于将所述流量控制设备连接到所述流量检验设备的第一网络物理层;以及
连接到所述流量检验设备的第二网络物理层;
其中,所述流量检验设备的控制器检验所述流量控制设备中的流量,如果其被确定,则基于该检验,根据通过所述第二网络物理层提供的单命令,在所述第一网络物理层上校准所述流量控制设备。
2.如权利要求1所述的系统,其中,所述第一网络物理层包括以太网/互联网协议网络物理层。
3.如权利要求1所述的系统,其中,所述第二网络物理层包括DeviceNetTM网络物理层。
4.如权利要求1所述的系统,其中,所述流量检验器是上升速率流量检验器。
5.如权利要求4所述的系统,其中,所述流量检验器是GBRORTM原位流量检验器。
6.如权利要求4所述的系统,其中,所述流量检验器是Tru-FloTM原位流量检验器。
7.如权利要求1所述的系统,还包括连接到所述第一网络物理层的流量控制设备。
8.如权利要求7所述的系统,其中,所述流量控制设备包括压力不敏感型的质量流量控制器。
9.如权利要求1所述的系统,还包括连接到所述第一网络物理层的集线器。
10.如权利要求9所述的系统,其中,所述集线器包括BlueBoxTM通信管理器。
11.一种用于流量控制设备的原位检验和校准的方法,包括:
通过第一网络物理层将流量检验设备连接到所述流量控制设备;
连接第二网络物理层和所述流量检验设备;以及
所述流量检验设备的控制器检验所述流量控制设备中的流量,如果其被确定,则基于该检验,根据通过所述第二网络物理层提供的单命令,在所述第一网络物理层上校准所述流量控制设备。
12.如权利要求11所述的方法,其中,所述第一网络物理层包括以太网/互联网协议网络物理层。
13.如权利要求11所述的方法,其中,所述第二网络物理层包括DeviceNetTM网络物理层。
14.如权利要求11所述的方法,其中,所述流量检验器是上升速率流量检验器。
15.如权利要求14所述的方法,其中,所述流量检验器是GBRORTM原位流量检验器。
16.如权利要求14所述的方法,其中,所述流量检验器是Tru-FloTM原位流量检验器。
17.如权利要求11所述的方法,其中,所述流量控制设备包括压力不敏感型的质量流量控制器。
18.如权利要求11所述的方法,还包括连接集线器到所述第一网络物理层。
19.如权利要求18所述的方法,其中,所述集线器包括BlueBoxTM通信管理器。
20.如权利要求11所述的方法,其中,所述流量检验设备被放入流体中,通过气体集合管与所述流量控制设备进行通信。
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- 2004-05-24 DE DE112004001142.6T patent/DE112004001142B4/de not_active Expired - Fee Related
- 2004-05-24 WO PCT/US2004/016142 patent/WO2005006390A2/en active Application Filing
- 2004-05-24 KR KR1020057024836A patent/KR101076833B1/ko active IP Right Grant
- 2004-05-24 GB GB0526353A patent/GB2418260B/en not_active Expired - Fee Related
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US6955072B2 (en) | 2005-10-18 |
DE112004001142B4 (de) | 2018-04-12 |
JP2007525736A (ja) | 2007-09-06 |
KR20060026063A (ko) | 2006-03-22 |
WO2005006390A3 (en) | 2005-07-21 |
US20040261492A1 (en) | 2004-12-30 |
WO2005006390A2 (en) | 2005-01-20 |
DE112004001142T5 (de) | 2006-05-18 |
GB0526353D0 (en) | 2006-02-01 |
KR101076833B1 (ko) | 2011-10-25 |
JP4537393B2 (ja) | 2010-09-01 |
CN1829903A (zh) | 2006-09-06 |
GB2418260B (en) | 2006-12-13 |
GB2418260A (en) | 2006-03-22 |
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