CN100380700C - 用于相变介质存储装置的低热耗小接触面积复合电极 - Google Patents

用于相变介质存储装置的低热耗小接触面积复合电极 Download PDF

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Publication number
CN100380700C
CN100380700C CNB031102026A CN03110202A CN100380700C CN 100380700 C CN100380700 C CN 100380700C CN B031102026 A CNB031102026 A CN B031102026A CN 03110202 A CN03110202 A CN 03110202A CN 100380700 C CN100380700 C CN 100380700C
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China
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dielectric layer
phase change
electrode
dielectric
contact area
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Expired - Fee Related
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CNB031102026A
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Chinese (zh)
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CN1449062A (zh
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H·李
D·M·拉扎洛夫
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HP Inc
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Hewlett Packard Co
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/841Electrodes
    • H10N70/8418Electrodes adapted for focusing electric field or current, e.g. tip-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828Tellurides, e.g. GeSbTe

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
CNB031102026A 2002-04-04 2003-04-04 用于相变介质存储装置的低热耗小接触面积复合电极 Expired - Fee Related CN100380700C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/116507 2002-04-04
US10/116,507 US6670628B2 (en) 2002-04-04 2002-04-04 Low heat loss and small contact area composite electrode for a phase change media memory device

Publications (2)

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CN1449062A CN1449062A (zh) 2003-10-15
CN100380700C true CN100380700C (zh) 2008-04-09

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US (2) US6670628B2 (https=)
EP (1) EP1355365A3 (https=)
JP (1) JP2003332529A (https=)
CN (1) CN100380700C (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105390612A (zh) * 2015-12-03 2016-03-09 中国科学院半导体研究所 基于锥形衬底的相变存储器的制备方法

Families Citing this family (153)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7260051B1 (en) 1998-12-18 2007-08-21 Nanochip, Inc. Molecular memory medium and molecular memory integrated circuit
US20020138301A1 (en) * 2001-03-22 2002-09-26 Thanos Karras Integration of a portal into an application service provider data archive and/or web based viewer
US7035987B2 (en) * 2002-07-02 2006-04-25 Intel Corporation Managing storage in processor-based systems
TWI233204B (en) * 2002-07-26 2005-05-21 Infineon Technologies Ag Nonvolatile memory element and associated production methods and memory element arrangements
US6985377B2 (en) 2002-10-15 2006-01-10 Nanochip, Inc. Phase change media for high density data storage
US6982898B2 (en) 2002-10-15 2006-01-03 Nanochip, Inc. Molecular memory integrated circuit utilizing non-vibrating cantilevers
US7233517B2 (en) 2002-10-15 2007-06-19 Nanochip, Inc. Atomic probes and media for high density data storage
US7425735B2 (en) * 2003-02-24 2008-09-16 Samsung Electronics Co., Ltd. Multi-layer phase-changeable memory devices
US7115927B2 (en) 2003-02-24 2006-10-03 Samsung Electronics Co., Ltd. Phase changeable memory devices
US7211819B2 (en) * 2003-08-04 2007-05-01 Intel Corporation Damascene phase change memory
KR100568109B1 (ko) * 2003-11-24 2006-04-05 삼성전자주식회사 상변화 기억 소자 및 그 형성 방법
DE10356285A1 (de) * 2003-11-28 2005-06-30 Infineon Technologies Ag Integrierter Halbleiterspeicher und Verfahren zum Herstellen eines integrierten Halbleiterspeichers
US7943919B2 (en) * 2003-12-10 2011-05-17 International Business Machines Corporation Integrated circuit with upstanding stylus
CN100508235C (zh) * 2004-01-09 2009-07-01 中国科学院上海微系统与信息技术研究所 相变存储器单元器件的制备方法
DE102004007633B4 (de) * 2004-02-17 2010-10-14 Qimonda Ag Speicherzelle, Halbleiter-Speicherbauelement und Verfahren zur Herstellung einer Speicherzelle
US20050232061A1 (en) 2004-04-16 2005-10-20 Rust Thomas F Systems for writing and reading highly resolved domains for high density data storage
US7379412B2 (en) 2004-04-16 2008-05-27 Nanochip, Inc. Methods for writing and reading highly resolved domains for high density data storage
US7301887B2 (en) 2004-04-16 2007-11-27 Nanochip, Inc. Methods for erasing bit cells in a high density data storage device
DE102004019862A1 (de) * 2004-04-23 2005-11-17 Infineon Technologies Ag Sublithographische Kontaktstruktur in einem Halbleiterbauelement
US7791141B2 (en) * 2004-07-09 2010-09-07 International Business Machines Corporation Field-enhanced programmable resistance memory cell
US7023008B1 (en) * 2004-09-30 2006-04-04 Infineon Technologies Ag Resistive memory element
US7338857B2 (en) * 2004-10-14 2008-03-04 Ovonyx, Inc. Increasing adherence of dielectrics to phase change materials
US7365355B2 (en) * 2004-11-08 2008-04-29 Ovonyx, Inc. Programmable matrix array with phase-change material
US7608503B2 (en) * 2004-11-22 2009-10-27 Macronix International Co., Ltd. Side wall active pin memory and manufacturing method
KR100827653B1 (ko) 2004-12-06 2008-05-07 삼성전자주식회사 상변화 기억 셀들 및 그 제조방법들
US7374174B2 (en) * 2004-12-22 2008-05-20 Micron Technology, Inc. Small electrode for resistance variable devices
JP4428228B2 (ja) * 2004-12-24 2010-03-10 エルピーダメモリ株式会社 半導体装置
TWI261915B (en) * 2005-01-07 2006-09-11 Ind Tech Res Inst Phase change memory and fabricating method thereof
US7208372B2 (en) * 2005-01-19 2007-04-24 Sharp Laboratories Of America, Inc. Non-volatile memory resistor cell with nanotip electrode
DE102005014645B4 (de) * 2005-03-31 2007-07-26 Infineon Technologies Ag Anschlusselektrode für Phasen-Wechsel-Material, zugehöriges Phasen-Wechsel-Speicherelement sowie zugehöriges Herstellungsverfahren
JP2006324501A (ja) * 2005-05-19 2006-11-30 Toshiba Corp 相変化メモリおよびその製造方法
US7321130B2 (en) * 2005-06-17 2008-01-22 Macronix International Co., Ltd. Thin film fuse phase change RAM and manufacturing method
US7238994B2 (en) 2005-06-17 2007-07-03 Macronix International Co., Ltd. Thin film plate phase change ram circuit and manufacturing method
US7514288B2 (en) * 2005-06-17 2009-04-07 Macronix International Co., Ltd. Manufacturing methods for thin film fuse phase change ram
US7463573B2 (en) 2005-06-24 2008-12-09 Nanochip, Inc. Patterned media for a high density data storage device
US20070041237A1 (en) * 2005-07-08 2007-02-22 Nanochip, Inc. Media for writing highly resolved domains
US7367119B2 (en) 2005-06-24 2008-05-06 Nanochip, Inc. Method for forming a reinforced tip for a probe storage device
US7309630B2 (en) 2005-07-08 2007-12-18 Nanochip, Inc. Method for forming patterned media for a high density data storage device
US7504652B2 (en) * 2005-07-13 2009-03-17 Taiwan Semiconductor Manufacturing Company, Ltd. Phase change random access memory
US7521705B2 (en) * 2005-08-15 2009-04-21 Micron Technology, Inc. Reproducible resistance variable insulating memory devices having a shaped bottom electrode
TWI273703B (en) * 2005-08-19 2007-02-11 Ind Tech Res Inst A manufacture method and structure for improving the characteristics of phase change memory
KR100637235B1 (ko) * 2005-08-26 2006-10-20 삼성에스디아이 주식회사 플라즈마 디스플레이 패널
US7381982B2 (en) * 2005-08-26 2008-06-03 Macronix International Co., Ltd. Method for fabricating chalcogenide-applied memory
JP2007073779A (ja) * 2005-09-07 2007-03-22 Elpida Memory Inc 不揮発性メモリ素子及びその製造方法
JP4817410B2 (ja) 2005-09-12 2011-11-16 エルピーダメモリ株式会社 相変化メモリ素子およびその製造方法
US7414258B2 (en) 2005-11-16 2008-08-19 Macronix International Co., Ltd. Spacer electrode small pin phase change memory RAM and manufacturing method
US7479649B2 (en) * 2005-11-21 2009-01-20 Macronix International Co., Ltd. Vacuum jacketed electrode for phase change memory element
US7829876B2 (en) * 2005-11-21 2010-11-09 Macronix International Co., Ltd. Vacuum cell thermal isolation for a phase change memory device
JP4860249B2 (ja) 2005-11-26 2012-01-25 エルピーダメモリ株式会社 相変化メモリ装置および相変化メモリ装置の製造方法
JP4860248B2 (ja) 2005-11-26 2012-01-25 エルピーダメモリ株式会社 相変化メモリ装置および相変化メモリ装置の製造方法
US7459717B2 (en) 2005-11-28 2008-12-02 Macronix International Co., Ltd. Phase change memory cell and manufacturing method
TWI264087B (en) * 2005-12-21 2006-10-11 Ind Tech Res Inst Phase change memory cell and fabricating method thereof
US8062833B2 (en) 2005-12-30 2011-11-22 Macronix International Co., Ltd. Chalcogenide layer etching method
CN100524876C (zh) * 2006-01-09 2009-08-05 财团法人工业技术研究院 相变化存储元件及其制造方法
US7560337B2 (en) * 2006-01-09 2009-07-14 Macronix International Co., Ltd. Programmable resistive RAM and manufacturing method
US20090039335A1 (en) * 2006-02-09 2009-02-12 Motoyasu Terao Semiconductor device and manufacturing method of the same
KR100713809B1 (ko) 2006-02-21 2007-05-02 삼성전자주식회사 상변화 기억 소자 및 그 형성 방법
JP4691454B2 (ja) 2006-02-25 2011-06-01 エルピーダメモリ株式会社 相変化メモリ装置およびその製造方法
US20070232015A1 (en) 2006-04-04 2007-10-04 Jun Liu Contact for memory cell
US7554144B2 (en) 2006-04-17 2009-06-30 Macronix International Co., Ltd. Memory device and manufacturing method
KR100782482B1 (ko) * 2006-05-19 2007-12-05 삼성전자주식회사 GeBiTe막을 상변화 물질막으로 채택하는 상변화 기억 셀, 이를 구비하는 상변화 기억소자, 이를 구비하는 전자 장치 및 그 제조방법
US7423300B2 (en) * 2006-05-24 2008-09-09 Macronix International Co., Ltd. Single-mask phase change memory element
EP1865249B1 (en) * 2006-06-07 2014-02-26 2Oc A gas pressure reducer, and an energy generation and management system including a gas pressure reducer
TW200802840A (en) * 2006-06-15 2008-01-01 Ind Tech Res Inst Phase-change memory cell structures and methods for fabricating the same
US7696506B2 (en) * 2006-06-27 2010-04-13 Macronix International Co., Ltd. Memory cell with memory material insulation and manufacturing method
TW200810092A (en) * 2006-08-15 2008-02-16 Ind Tech Res Inst Phase-change memory and fabrication method thereof
US7442603B2 (en) * 2006-08-16 2008-10-28 Macronix International Co., Ltd. Self-aligned structure and method for confining a melting point in a resistor random access memory
US8003972B2 (en) 2006-08-30 2011-08-23 Micron Technology, Inc. Bottom electrode geometry for phase change memory
US7772581B2 (en) * 2006-09-11 2010-08-10 Macronix International Co., Ltd. Memory device having wide area phase change element and small electrode contact area
US7795607B2 (en) * 2006-09-29 2010-09-14 Intel Corporation Current focusing memory architecture for use in electrical probe-based memory storage
US8766224B2 (en) * 2006-10-03 2014-07-01 Hewlett-Packard Development Company, L.P. Electrically actuated switch
US20080090324A1 (en) * 2006-10-12 2008-04-17 Lee Jong-Won S Forming sublithographic heaters for phase change memories
KR100858083B1 (ko) * 2006-10-18 2008-09-10 삼성전자주식회사 하부전극 콘택층과 상변화층 사이에 넓은 접촉면적을 갖는상변화 메모리 소자 및 그 제조 방법
US7863655B2 (en) 2006-10-24 2011-01-04 Macronix International Co., Ltd. Phase change memory cells with dual access devices
US7476587B2 (en) 2006-12-06 2009-01-13 Macronix International Co., Ltd. Method for making a self-converged memory material element for memory cell
US7473576B2 (en) 2006-12-06 2009-01-06 Macronix International Co., Ltd. Method for making a self-converged void and bottom electrode for memory cell
CN101207178B (zh) * 2006-12-22 2010-12-01 南亚科技股份有限公司 相变存储元件及其制造方法
US8138028B2 (en) * 2007-02-12 2012-03-20 Macronix International Co., Ltd Method for manufacturing a phase change memory device with pillar bottom electrode
US7884343B2 (en) * 2007-02-14 2011-02-08 Macronix International Co., Ltd. Phase change memory cell with filled sidewall memory element and method for fabricating the same
CN100580969C (zh) * 2007-03-22 2010-01-13 财团法人工业技术研究院 相变存储装置
US7786461B2 (en) * 2007-04-03 2010-08-31 Macronix International Co., Ltd. Memory structure with reduced-size memory element between memory material portions
US7859036B2 (en) * 2007-04-05 2010-12-28 Micron Technology, Inc. Memory devices having electrodes comprising nanowires, systems including same and methods of forming same
US7745231B2 (en) 2007-04-17 2010-06-29 Micron Technology, Inc. Resistive memory cell fabrication methods and devices
US7679163B2 (en) * 2007-05-14 2010-03-16 Industrial Technology Research Institute Phase-change memory element
US7906368B2 (en) * 2007-06-29 2011-03-15 International Business Machines Corporation Phase change memory with tapered heater
DE102008032067A1 (de) * 2007-07-12 2009-01-15 Samsung Electronics Co., Ltd., Suwon Verfahren zum Bilden von Phasenänderungsspeichern mit unteren Elektroden
US7884342B2 (en) * 2007-07-31 2011-02-08 Macronix International Co., Ltd. Phase change memory bridge cell
US7729161B2 (en) * 2007-08-02 2010-06-01 Macronix International Co., Ltd. Phase change memory with dual word lines and source lines and method of operating same
US9018615B2 (en) * 2007-08-03 2015-04-28 Macronix International Co., Ltd. Resistor random access memory structure having a defined small area of electrical contact
US8178386B2 (en) 2007-09-14 2012-05-15 Macronix International Co., Ltd. Phase change memory cell array with self-converged bottom electrode and method for manufacturing
US7642125B2 (en) * 2007-09-14 2010-01-05 Macronix International Co., Ltd. Phase change memory cell in via array with self-aligned, self-converged bottom electrode and method for manufacturing
US7646631B2 (en) * 2007-12-07 2010-01-12 Macronix International Co., Ltd. Phase change memory cell having interface structures with essentially equal thermal impedances and manufacturing methods
KR100956773B1 (ko) 2007-12-26 2010-05-12 주식회사 하이닉스반도체 상변화 메모리 소자 및 그 제조 방법
US7639527B2 (en) 2008-01-07 2009-12-29 Macronix International Co., Ltd. Phase change memory dynamic resistance test and manufacturing methods
US7879643B2 (en) * 2008-01-18 2011-02-01 Macronix International Co., Ltd. Memory cell with memory element contacting an inverted T-shaped bottom electrode
KR20090081848A (ko) * 2008-01-25 2009-07-29 삼성전자주식회사 상변화 메모리 장치 및 그 형성 방법
US7879645B2 (en) 2008-01-28 2011-02-01 Macronix International Co., Ltd. Fill-in etching free pore device
CN101504948B (zh) * 2008-02-05 2011-04-06 财团法人工业技术研究院 中空尖笔状结构与包含其的装置及其制造方法
JP2009212202A (ja) * 2008-03-03 2009-09-17 Elpida Memory Inc 相変化メモリ装置およびその製造方法
JP5364280B2 (ja) * 2008-03-07 2013-12-11 株式会社東芝 不揮発性記憶装置及びその製造方法
US20090230375A1 (en) * 2008-03-17 2009-09-17 Taiwan Semiconductor Manufacturing Company, Ltd. Phase Change Memory Device
JP5305711B2 (ja) * 2008-03-31 2013-10-02 株式会社東芝 不揮発性記憶装置及びその製造方法
US7888668B2 (en) * 2008-07-17 2011-02-15 United Microelectronics Corp. Phase change memory
US7754522B2 (en) * 2008-08-06 2010-07-13 Micron Technology, Inc. Phase change memory structures and methods
CN101640251B (zh) * 2008-09-27 2012-06-13 中国科学院上海微系统与信息技术研究所 相变存储器存储单元底电极结构的改进及制作实施方法
IT1392578B1 (it) * 2008-12-30 2012-03-09 St Microelectronics Rousset Metodo di programmazione multilivello di celle di memoria a cambiamento di fase utilizzante impulsi di reset adattativi
WO2010082922A1 (en) * 2009-01-13 2010-07-22 Hewlett-Packard Development Company, L.P. Memristor having a triangular shaped electrode
US8193522B2 (en) * 2009-04-09 2012-06-05 Qualcomm Incorporated Diamond type quad-resistor cells of PRAM
CN101958337B (zh) * 2009-07-16 2012-06-20 中芯国际集成电路制造(上海)有限公司 相变存储器及其制造方法
US8207593B2 (en) * 2009-07-28 2012-06-26 Hewlett-Packard Development Company, L.P. Memristor having a nanostructure in the switching material
US8283649B2 (en) * 2009-07-28 2012-10-09 Hewlett-Packard Development Company, L.P. Memristor with a non-planar substrate
US8283202B2 (en) 2009-08-28 2012-10-09 International Business Machines Corporation Single mask adder phase change memory element
US7927911B2 (en) * 2009-08-28 2011-04-19 International Business Machines Corporation Wafer bonded access device for multi-layer phase change memory using lock-and-key alignment
US8283650B2 (en) 2009-08-28 2012-10-09 International Business Machines Corporation Flat lower bottom electrode for phase change memory cell
US8012790B2 (en) * 2009-08-28 2011-09-06 International Business Machines Corporation Chemical mechanical polishing stop layer for fully amorphous phase change memory pore cell
US8203134B2 (en) 2009-09-21 2012-06-19 Micron Technology, Inc. Memory devices with enhanced isolation of memory cells, systems including same and methods of forming same
US8129268B2 (en) 2009-11-16 2012-03-06 International Business Machines Corporation Self-aligned lower bottom electrode
US8233317B2 (en) * 2009-11-16 2012-07-31 International Business Machines Corporation Phase change memory device suitable for high temperature operation
US7943420B1 (en) * 2009-11-25 2011-05-17 International Business Machines Corporation Single mask adder phase change memory element
CN102130145B (zh) * 2010-01-12 2013-07-17 中芯国际集成电路制造(上海)有限公司 相变存储器及其制造方法
US8361338B2 (en) * 2010-02-11 2013-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Hard mask removal method
US8288750B2 (en) * 2010-04-29 2012-10-16 Taiwan Semiconductor Manufacturing Company, Ltd. Phase change memory device with air gap
US8729521B2 (en) 2010-05-12 2014-05-20 Macronix International Co., Ltd. Self aligned fin-type programmable memory cell
US8395935B2 (en) 2010-10-06 2013-03-12 Macronix International Co., Ltd. Cross-point self-aligned reduced cell size phase change memory
CN102157688B (zh) 2011-03-23 2012-07-18 北京大学 一种阻变存储器及其制备方法
US8598562B2 (en) * 2011-07-01 2013-12-03 Micron Technology, Inc. Memory cell structures
CN103094471A (zh) * 2011-10-28 2013-05-08 中国科学院物理研究所 一种缩小存储节点的非易失性存储装置及其制造方法
US20130248803A1 (en) * 2012-03-22 2013-09-26 Kabushiki Kaisha Toshiba Molecular memory and method of manufacturing the same
US8963116B2 (en) * 2012-10-30 2015-02-24 Globalfoundries Singapore Pte. Ltd. Wrap around phase change memory
JP5972776B2 (ja) * 2012-12-17 2016-08-17 株式会社日立製作所 不揮発性記憶装置
US9444040B2 (en) 2013-03-13 2016-09-13 Microchip Technology Incorporated Sidewall type memory cell
US9349950B2 (en) 2013-03-13 2016-05-24 Microchip Technology Incorporated Resistive memory cell with trench-shaped bottom electrode
KR102098017B1 (ko) * 2013-12-26 2020-04-13 에스케이하이닉스 주식회사 저항 변화 메모리 소자 및 제조 방법
CN104779346B (zh) * 2014-01-15 2017-04-12 清华大学 相变存储单元的制备方法
US9412942B2 (en) 2014-02-19 2016-08-09 Microchip Technology Incorporated Resistive memory cell with bottom electrode having a sloped side wall
US9269606B2 (en) 2014-02-19 2016-02-23 Microchip Technology Incorporated Spacer enabled active isolation for an integrated circuit device
US10003021B2 (en) 2014-02-19 2018-06-19 Microchip Technology Incorporated Resistive memory cell with sloped bottom electrode
US9385313B2 (en) 2014-02-19 2016-07-05 Microchip Technology Incorporated Resistive memory cell having a reduced conductive path area
US9318702B2 (en) 2014-02-19 2016-04-19 Microchip Technology Incorporated Resistive memory cell having a reduced conductive path area
EP3224875A1 (en) 2014-11-26 2017-10-04 Microchip Technology Incorporated Resistive memory cell having a spacer region for reduced conductive path area / enhanced electric field
WO2018126184A1 (en) * 2016-12-29 2018-07-05 The Charles Stark Draper Laboratory, Inc. Tunable electronic nanocomposites with phase change materials and controlled disorder
CN108963070B (zh) * 2017-05-18 2021-12-31 中国科学院微电子研究所 一种阻变存储器及其制作方法
US10950663B2 (en) * 2018-04-24 2021-03-16 Micron Technology, Inc. Cross-point memory array and related fabrication techniques
WO2020131179A2 (en) * 2018-11-21 2020-06-25 The Research Foundation For The State University Of New York Resistive random access memory device
TWI708410B (zh) * 2019-07-08 2020-10-21 華邦電子股份有限公司 可變電阻式記憶體及其製造方法
US20210057645A1 (en) * 2019-08-23 2021-02-25 Globalfoundries Singapore Pte. Ltd. Memory device and method of forming the same
US11038106B1 (en) * 2019-11-22 2021-06-15 International Business Machines Corporation Phase change memory cell with a metal layer
FI129648B (en) 2019-12-20 2022-06-15 Aalto Univ Foundation Sr An electrode
CN111384239A (zh) * 2020-03-06 2020-07-07 厦门半导体工业技术研发有限公司 阻变式存储器以及阻变式存储器的制造方法
US11910731B2 (en) * 2021-02-10 2024-02-20 International Business Machines Corporation Embedded heater in a phase change memory material
US12364172B2 (en) 2021-03-01 2025-07-15 International Business Machines Corporation Electrical memristive devices based on bilayer arrangements of HfOy and WOx
CN113285019B (zh) * 2021-04-15 2023-05-02 中国科学院上海硅酸盐研究所 一种基于相变材料的显示存储器
CN116568043A (zh) * 2022-01-26 2023-08-08 联华电子股份有限公司 半导体存储器元件及其制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5687112A (en) * 1996-04-19 1997-11-11 Energy Conversion Devices, Inc. Multibit single cell memory element having tapered contact
WO1999054128A1 (en) * 1998-04-20 1999-10-28 Energy Conversion Devices, Inc. Memory element with memory material comprising phase-change material and dielectric material
CN1243335A (zh) * 1998-07-28 2000-02-02 西门子公司 叠状电容器的锥形电极
CN1334582A (zh) * 2000-07-17 2002-02-06 惠普公司 自对准电子源装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1465450B1 (de) * 1964-12-22 1970-07-23 As Danfoss Elektronisches Festk¦rperbauelement zum Schalten
US5166758A (en) 1991-01-18 1992-11-24 Energy Conversion Devices, Inc. Electrically erasable phase change memory
US6147395A (en) * 1996-10-02 2000-11-14 Micron Technology, Inc. Method for fabricating a small area of contact between electrodes
US6015977A (en) * 1997-01-28 2000-01-18 Micron Technology, Inc. Integrated circuit memory cell having a small active area and method of forming same
US5933365A (en) 1997-06-19 1999-08-03 Energy Conversion Devices, Inc. Memory element with energy control mechanism
US5912839A (en) 1998-06-23 1999-06-15 Energy Conversion Devices, Inc. Universal memory element and method of programming same
US6800563B2 (en) * 2001-10-11 2004-10-05 Ovonyx, Inc. Forming tapered lower electrode phase-change memories

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5687112A (en) * 1996-04-19 1997-11-11 Energy Conversion Devices, Inc. Multibit single cell memory element having tapered contact
WO1999054128A1 (en) * 1998-04-20 1999-10-28 Energy Conversion Devices, Inc. Memory element with memory material comprising phase-change material and dielectric material
CN1243335A (zh) * 1998-07-28 2000-02-02 西门子公司 叠状电容器的锥形电极
CN1334582A (zh) * 2000-07-17 2002-02-06 惠普公司 自对准电子源装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105390612A (zh) * 2015-12-03 2016-03-09 中国科学院半导体研究所 基于锥形衬底的相变存储器的制备方法

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