CN100334124C - Organic imvite modified epoxyresin - Google Patents
Organic imvite modified epoxyresin Download PDFInfo
- Publication number
- CN100334124C CN100334124C CNB2005100224126A CN200510022412A CN100334124C CN 100334124 C CN100334124 C CN 100334124C CN B2005100224126 A CNB2005100224126 A CN B2005100224126A CN 200510022412 A CN200510022412 A CN 200510022412A CN 100334124 C CN100334124 C CN 100334124C
- Authority
- CN
- China
- Prior art keywords
- organo montmorillonite
- epoxy
- epoxy resin
- imvite modified
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 33
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 33
- -1 C12 ester Chemical class 0.000 claims abstract description 58
- 239000003960 organic solvent Substances 0.000 claims abstract description 10
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 58
- 239000004593 Epoxy Substances 0.000 claims description 41
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 238000002156 mixing Methods 0.000 claims description 18
- 230000008961 swelling Effects 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 17
- 238000002360 preparation method Methods 0.000 claims description 16
- 239000002904 solvent Substances 0.000 claims description 13
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 12
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 10
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 10
- 238000010792 warming Methods 0.000 claims description 7
- ZCPCLAPUXMZUCD-UHFFFAOYSA-M dihexadecyl(dimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCC ZCPCLAPUXMZUCD-UHFFFAOYSA-M 0.000 claims description 4
- REZZEXDLIUJMMS-UHFFFAOYSA-M dimethyldioctadecylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC REZZEXDLIUJMMS-UHFFFAOYSA-M 0.000 claims description 4
- 239000004664 distearyldimethylammonium chloride (DHTDMAC) Substances 0.000 claims description 4
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000005342 ion exchange Methods 0.000 claims description 3
- GZTMDLIDGQGZFL-UHFFFAOYSA-M [Cl-].[NH4+].C(C1=CC=CC=C1)C(C1=CC=CC=C1)[N+](C)(C)CCCCCCCCCCCCCCCC.[Cl-] Chemical compound [Cl-].[NH4+].C(C1=CC=CC=C1)C(C1=CC=CC=C1)[N+](C)(C)CCCCCCCCCCCCCCCC.[Cl-] GZTMDLIDGQGZFL-UHFFFAOYSA-M 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 238000000227 grinding Methods 0.000 claims description 2
- 230000008595 infiltration Effects 0.000 claims description 2
- 238000001764 infiltration Methods 0.000 claims description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 10
- 229910017059 organic montmorillonite Inorganic materials 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 230000032683 aging Effects 0.000 abstract 1
- 238000013019 agitation Methods 0.000 abstract 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 238000005325 percolation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 239000002114 nanocomposite Substances 0.000 description 7
- 239000002086 nanomaterial Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 241000446313 Lamella Species 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000009830 intercalation Methods 0.000 description 3
- 230000002687 intercalation Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012496 blank sample Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000004760 silicates Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
Numbering | Organo montmorillonite add-on (weight ratio) | Tensile strength (Mpa) | Shearing resistance (Mpa) |
0 | Blank sample | 19.6 | 6.6 |
1 | 1% | 11.0 | 11.3 |
2 | 3% | 24.0 | 9.4 |
3 | 5% | 28.7 | 16.1 |
4 | 7% | 30.7 | 15.5 |
5 | 9% | 27.1 | 15.1 |
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100224126A CN100334124C (en) | 2005-12-27 | 2005-12-27 | Organic imvite modified epoxyresin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100224126A CN100334124C (en) | 2005-12-27 | 2005-12-27 | Organic imvite modified epoxyresin |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1793195A CN1793195A (en) | 2006-06-28 |
CN100334124C true CN100334124C (en) | 2007-08-29 |
Family
ID=36804853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100224126A Expired - Fee Related CN100334124C (en) | 2005-12-27 | 2005-12-27 | Organic imvite modified epoxyresin |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100334124C (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105623197A (en) * | 2016-04-08 | 2016-06-01 | 章俊 | Epoxy resin (EP) nano plastic and preparation method thereof |
CN107507692A (en) * | 2017-10-10 | 2017-12-22 | 徐州赛欧电子科技有限公司 | A kind of frame vertical transformer of antirust radiating |
CN109161076A (en) * | 2018-07-26 | 2019-01-08 | 徐州辛辛那提新型材料有限公司 | A kind of preparation process of high impact properties anti-corrosion lightweight PE solid wall pipe |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6017632A (en) * | 1996-06-17 | 2000-01-25 | Claytec, Inc. | Hybrid organic-inorganic nanocomposites and methods of preparation |
CN1250064A (en) * | 1998-10-06 | 2000-04-12 | 中国科学院化学研究所 | Preparation of epoxy resin/montmorillonoid intercalation composite material |
CN1250790A (en) * | 1998-10-13 | 2000-04-19 | 中国科学院化学研究所 | Antiflowing epoxy resin/mentmorillonite compound and its preparing process |
JP2000202937A (en) * | 1999-01-14 | 2000-07-25 | Toppan Printing Co Ltd | Vapor deposition film laminated packaging material |
CN1354198A (en) * | 2001-12-26 | 2002-06-19 | 河北工业大学 | Epoxy resin/montmorillonoid nano-compoiste-material and its preparation method |
-
2005
- 2005-12-27 CN CNB2005100224126A patent/CN100334124C/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6017632A (en) * | 1996-06-17 | 2000-01-25 | Claytec, Inc. | Hybrid organic-inorganic nanocomposites and methods of preparation |
CN1250064A (en) * | 1998-10-06 | 2000-04-12 | 中国科学院化学研究所 | Preparation of epoxy resin/montmorillonoid intercalation composite material |
CN1250790A (en) * | 1998-10-13 | 2000-04-19 | 中国科学院化学研究所 | Antiflowing epoxy resin/mentmorillonite compound and its preparing process |
JP2000202937A (en) * | 1999-01-14 | 2000-07-25 | Toppan Printing Co Ltd | Vapor deposition film laminated packaging material |
CN1354198A (en) * | 2001-12-26 | 2002-06-19 | 河北工业大学 | Epoxy resin/montmorillonoid nano-compoiste-material and its preparation method |
Also Published As
Publication number | Publication date |
---|---|
CN1793195A (en) | 2006-06-28 |
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Owner name: CHENGDU ZHENGGUANG INVESTMENT GROUP CO., LTD. Free format text: FORMER OWNER: CHENGDU ZHENGGUANG NANO TECHNOLOGY CO., LTD. Effective date: 20100413 |
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Effective date of registration: 20100413 Address after: 610031 Ma Jia 23, Huayuan Road, Sichuan, Chengdu Patentee after: Zhengguang Investment Co., Ltd., Chengdu Address before: 610031 Ma Jia 23, Huayuan Road, Sichuan, Chengdu Patentee before: Chengdu Zhengguang Nanotechnology Co., Ltd. |
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