CH655518B - - Google Patents

Info

Publication number
CH655518B
CH655518B CH360083A CH360083A CH655518B CH 655518 B CH655518 B CH 655518B CH 360083 A CH360083 A CH 360083A CH 360083 A CH360083 A CH 360083A CH 655518 B CH655518 B CH 655518B
Authority
CH
Switzerland
Application number
CH360083A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US39444282A priority Critical
Priority to US50116783A priority
Application filed filed Critical
Publication of CH655518B publication Critical patent/CH655518B/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating on non-metallic surfaces, e.g. on carbon or carbon composites
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/423Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/173Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/425Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
CH360083A 1982-07-01 1983-06-30 CH655518B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US39444282A true 1982-07-01 1982-07-01
US50116783A true 1983-06-10 1983-06-10

Publications (1)

Publication Number Publication Date
CH655518B true CH655518B (en) 1986-04-30

Family

ID=27014738

Family Applications (1)

Application Number Title Priority Date Filing Date
CH360083A CH655518B (en) 1982-07-01 1983-06-30

Country Status (15)

Country Link
KR (1) KR890002623B1 (en)
AT (1) AT383149B (en)
AU (1) AU564034B2 (en)
CA (1) CA1226846A (en)
CH (1) CH655518B (en)
DE (1) DE3323476C2 (en)
DK (1) DK303083A (en)
ES (1) ES523785A0 (en)
FR (1) FR2529582B1 (en)
GB (1) GB2123036B (en)
IL (1) IL69122A (en)
IN (1) IN160555B (en)
IT (1) IT1208659B (en)
NL (1) NL8302344A (en)
SE (1) SE462434B (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3339946C2 (en) * 1983-11-04 1990-12-06 Klaus 6500 Mainz De Eisenmenger
DE3412447A1 (en) * 1984-03-31 1985-11-28 Schering Ag A process for the production of printed circuits
US4891069A (en) * 1986-06-06 1990-01-02 Techno Instruments Investments 1983 Ltd. Composition for the electrolytic coating of circuit boards without an electroless metal coating
US4749449A (en) * 1987-06-05 1988-06-07 E. I. Du Pont De Nemours And Company Metallization utilizing a catalyst which is removed or deactivated from undesired surface areas
US4895739A (en) * 1988-02-08 1990-01-23 Shipley Company Inc. Pretreatment for electroplating process
US5007990A (en) * 1987-07-10 1991-04-16 Shipley Company Inc. Electroplating process
DE3741459C1 (en) * 1987-12-08 1989-04-13 Blasberg Oberflaechentech Process for the production of plated-through printed circuit boards
US4810333A (en) * 1987-12-14 1989-03-07 Shipley Company Inc. Electroplating process
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom
US5068013A (en) * 1988-08-23 1991-11-26 Shipley Company Inc. Electroplating composition and process
US5004525A (en) * 1988-08-23 1991-04-02 Shipley Company Inc. Copper electroplating composition
US4969979A (en) * 1989-05-08 1990-11-13 International Business Machines Corporation Direct electroplating of through holes
AU644602B2 (en) * 1989-08-31 1993-12-16 Blasberg-Oberflachentechnik Gmbh Plated-through printed circuit board with resist and process for producing it
DE3928832C2 (en) * 1989-08-31 1995-04-20 Blasberg Oberflaechentech A process for producing plated-through printed circuit boards and printed circuit boards semifinished
US5342501A (en) * 1989-11-21 1994-08-30 Eric F. Harnden Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating
US5071517A (en) * 1989-11-21 1991-12-10 Solution Technology Systems Method for directly electroplating a dielectric substrate and plated substrate so produced
US4959121A (en) * 1990-01-05 1990-09-25 General Electric Company Method for treating a polyimide surface for subsequent plating thereon
US5207888A (en) * 1991-06-24 1993-05-04 Shipley Company Inc. Electroplating process and composition
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
DE4138214A1 (en) * 1991-11-21 1993-05-27 Daimler Benz Ag Metallisation of aluminium nitride ceramic - involves ceramic treatment to remove glass surface film
US5262042A (en) * 1991-12-12 1993-11-16 Eric F. Harnden Simplified method for direct electroplating of dielectric substrates
DE4206680C1 (en) * 1992-02-28 1994-01-27 Schering Ag A process for the metallization of dielectric surfaces and the use of hydroxymethanesulfinic acid in the process
US5262041A (en) * 1992-12-11 1993-11-16 Shipley Company Inc. Additive plating process
US5415762A (en) * 1993-08-18 1995-05-16 Shipley Company Inc. Electroplating process and composition
DE4412463C3 (en) * 1994-04-08 2000-02-10 Atotech Deutschland Gmbh A process for producing a palladium colloid solution, and their use
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
DE19643823C2 (en) * 1996-10-30 2002-10-17 Lpw Chemie Gmbh Process for the direct functional metallization of the surface of a plastic object
FR2946433B1 (en) 2009-06-05 2013-07-12 Ecole Polytechnique Dgar Use of an amorphous silicon layer and analysis method
KR101460749B1 (en) * 2013-06-12 2014-11-13 (주)제이스 Lamination technical development of metal printed circuit board having high heat-radiation property

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2733198A (en) * 1956-01-31 Acid copper plating bath
US3095608A (en) * 1959-12-09 1963-07-02 Cabot Corp Process and apparatus for extruding and curing polymeric compositions
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3414493A (en) * 1965-10-19 1968-12-03 Lea Ronal Inc Electrodeposition of copper
DE1790293B2 (en) * 1966-02-22 1973-12-13 Photocircuits Corp., Glen Cove, N.Y. (V.St.A.)
US3682671A (en) * 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
FR2102630A5 (en) * 1970-08-12 1972-04-07 Commissariat Energie Atomique Insulant-metal-bond formation process - esp for metal coating of quartz tubes
DE2102550B2 (en) * 1971-01-20 1977-05-18 With well-adhering metal layers provided moldings
US3984290A (en) * 1973-10-01 1976-10-05 Georgy Avenirovich Kitaev Method of forming intralayer junctions in a multilayer structure
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
SE8303716D0 (en) 1983-06-29
DE3323476A1 (en) 1984-01-05
AT383149B (en) 1987-05-25
IT1208659B (en) 1989-07-10
ES8404769A1 (en) 1984-05-16
NL8302344A (en) 1984-02-01
SE8303716L (en) 1984-01-02
AU1648183A (en) 1984-01-05
DE3323476C2 (en) 1988-10-20
IL69122A (en) 1987-01-30
CA1226846A (en) 1987-09-15
GB2123036A (en) 1984-01-25
FR2529582A1 (en) 1984-01-06
IL69122D0 (en) 1983-10-31
GB8317516D0 (en) 1983-08-03
CA1226846A1 (en)
ATA240783A (en) 1986-10-15
SE462434B (en) 1990-06-25
IT8348608D0 (en) 1983-07-01
AU564034B2 (en) 1987-07-30
FR2529582B1 (en) 1989-05-19
DK303083A (en) 1984-01-02
KR890002623B1 (en) 1989-07-20
GB2123036B (en) 1986-07-09
DK303083D0 (en) 1983-06-30
ES523785D0 (en)
IN160555B (en) 1987-07-18
ES523785A0 (en) 1984-05-16
KR840005498A (en) 1984-11-14

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Legal Events

Date Code Title Description
PL Patent ceased