CH583969A5 - - Google Patents
Info
- Publication number
- CH583969A5 CH583969A5 CH398575A CH398575A CH583969A5 CH 583969 A5 CH583969 A5 CH 583969A5 CH 398575 A CH398575 A CH 398575A CH 398575 A CH398575 A CH 398575A CH 583969 A5 CH583969 A5 CH 583969A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7404364A NL7404364A (nl) | 1974-04-01 | 1974-04-01 | Werkwijze en inrichting voor het bewerken van vlakke voorwerpen. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH583969A5 true CH583969A5 (https=) | 1977-01-14 |
Family
ID=19821089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH398575A CH583969A5 (https=) | 1974-04-01 | 1975-03-27 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US4009540A (https=) |
| JP (1) | JPS50134574A (https=) |
| BE (1) | BE827435A (https=) |
| CA (1) | CA1010159A (https=) |
| CH (1) | CH583969A5 (https=) |
| DE (1) | DE2512400C2 (https=) |
| FR (1) | FR2266304B1 (https=) |
| GB (1) | GB1491938A (https=) |
| IT (1) | IT1049391B (https=) |
| NL (1) | NL7404364A (https=) |
| SE (1) | SE7503558L (https=) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5364463A (en) * | 1976-11-22 | 1978-06-08 | Nippon Telegr & Teleph Corp <Ntt> | Fixing tray of semiconductor wafers |
| US4132037A (en) * | 1977-02-28 | 1979-01-02 | Siltec Corporation | Apparatus for polishing semiconductor wafers |
| EP0013684A1 (de) * | 1979-01-26 | 1980-08-06 | Heinrich Wagner Maschinenfabrik GmbH & Co | Form- oder Rüttelformmaschine |
| US4519168A (en) * | 1979-09-18 | 1985-05-28 | Speedfam Corporation | Liquid waxless fixturing of microsize wafers |
| US4707201A (en) * | 1986-08-20 | 1987-11-17 | Canadian Instrumentation And Research Limited | Method of producing polished block type, single mode, evanscent wave directional couplers by means of mass production of the coupler halves |
| JPH04180650A (ja) * | 1990-11-15 | 1992-06-26 | Nec Kyushu Ltd | フルカットダイシング用テープ |
| JPH0828086B2 (ja) * | 1991-06-04 | 1996-03-21 | 富士通株式会社 | 磁気ヘッドスライダの製造装置及び製造方法 |
| US5220754A (en) * | 1992-03-02 | 1993-06-22 | Amad Tayebi | Recovered compact disk and a method and an apparatus for recovery thereof |
| US5267418A (en) * | 1992-05-27 | 1993-12-07 | International Business Machines Corporation | Confined water fixture for holding wafers undergoing chemical-mechanical polishing |
| EP0599299B1 (en) * | 1992-11-27 | 1998-02-04 | Kabushiki Kaisha Toshiba | Method and apparatus for polishing a workpiece |
| FR2715503B1 (fr) * | 1994-01-26 | 1996-04-05 | Commissariat Energie Atomique | Substrat pour composants intégrés comportant une couche mince et son procédé de réalisation. |
| US5733175A (en) * | 1994-04-25 | 1998-03-31 | Leach; Michael A. | Polishing a workpiece using equal velocity at all points overlapping a polisher |
| US5607341A (en) * | 1994-08-08 | 1997-03-04 | Leach; Michael A. | Method and structure for polishing a wafer during manufacture of integrated circuits |
| US5632667A (en) * | 1995-06-29 | 1997-05-27 | Delco Electronics Corporation | No coat backside wafer grinding process |
| US6159824A (en) | 1997-05-12 | 2000-12-12 | Silicon Genesis Corporation | Silicon-on-silicon wafer bonding process using a thin film blister-separation method |
| US6033974A (en) | 1997-05-12 | 2000-03-07 | Silicon Genesis Corporation | Method for controlled cleaving process |
| US6291313B1 (en) | 1997-05-12 | 2001-09-18 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
| US6548382B1 (en) | 1997-07-18 | 2003-04-15 | Silicon Genesis Corporation | Gettering technique for wafers made using a controlled cleaving process |
| US6291326B1 (en) | 1998-06-23 | 2001-09-18 | Silicon Genesis Corporation | Pre-semiconductor process implant and post-process film separation |
| US6263941B1 (en) | 1999-08-10 | 2001-07-24 | Silicon Genesis Corporation | Nozzle for cleaving substrates |
| US6500732B1 (en) | 1999-08-10 | 2002-12-31 | Silicon Genesis Corporation | Cleaving process to fabricate multilayered substrates using low implantation doses |
| FR2828579B1 (fr) * | 2001-08-13 | 2004-01-30 | St Microelectronics Sa | Procede de manipulation d'une plaquette de silicium mince |
| US7018268B2 (en) * | 2002-04-09 | 2006-03-28 | Strasbaugh | Protection of work piece during surface processing |
| US9362439B2 (en) | 2008-05-07 | 2016-06-07 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled shear region |
| US8993410B2 (en) | 2006-09-08 | 2015-03-31 | Silicon Genesis Corporation | Substrate cleaving under controlled stress conditions |
| US8329557B2 (en) | 2009-05-13 | 2012-12-11 | Silicon Genesis Corporation | Techniques for forming thin films by implantation with reduced channeling |
| DE102009052744B4 (de) * | 2009-11-11 | 2013-08-29 | Siltronic Ag | Verfahren zur Politur einer Halbleiterscheibe |
| CN103258764B (zh) * | 2012-02-21 | 2016-06-15 | 欣兴电子股份有限公司 | 用于晶片薄化的载具及其制法 |
| FR3012257A1 (fr) * | 2013-10-21 | 2015-04-24 | Soitec Silicon On Insulator | Procede de prehension d'un substrat |
| CN115709413B (zh) * | 2022-09-30 | 2025-02-11 | 深圳长盛高精密五金有限公司 | 一种精密轴的加工磨削设备及方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2353066A (en) * | 1943-11-03 | 1944-07-04 | Walter W Phillips | Safety razor blade sharpener |
| US2443987A (en) * | 1945-10-13 | 1948-06-22 | O H Calhoun | Work holder |
| US2855653A (en) * | 1955-10-07 | 1958-10-14 | Tile Council Of America | Apparatus for making tile panels |
| US3004766A (en) * | 1959-11-02 | 1961-10-17 | Andrew J Bryant | Vacuum chuck |
| US3330714A (en) * | 1962-03-08 | 1967-07-11 | Vari Products Co | Method of adhering adhesive backed light reflector unit to a mounting surface |
| US3131476A (en) * | 1963-03-21 | 1964-05-05 | Philco Corp | Production of semiconductor blanks |
| DE1982787U (de) * | 1968-01-13 | 1968-04-04 | Albert Fezer | Vorrichtung zum halten von insbesondere duennwandigen werkstuecken, z. b. duennen blechen, folien od. dgl. |
| US3681139A (en) * | 1969-10-16 | 1972-08-01 | Western Electric Co | Method for handling and maintaining the orientation of a matrix of miniature electrical devices |
| US3740900A (en) * | 1970-07-01 | 1973-06-26 | Signetics Corp | Vacuum chuck assembly for semiconductor manufacture |
| US3809050A (en) * | 1971-01-13 | 1974-05-07 | Cogar Corp | Mounting block for semiconductor wafers |
-
1974
- 1974-04-01 NL NL7404364A patent/NL7404364A/xx not_active Application Discontinuation
-
1975
- 1975-03-21 DE DE2512400A patent/DE2512400C2/de not_active Expired
- 1975-03-25 US US05/561,938 patent/US4009540A/en not_active Expired - Lifetime
- 1975-03-26 SE SE7503558A patent/SE7503558L/xx unknown
- 1975-03-27 GB GB12923/75A patent/GB1491938A/en not_active Expired
- 1975-03-27 CA CA223,604A patent/CA1010159A/en not_active Expired
- 1975-03-27 CH CH398575A patent/CH583969A5/xx not_active IP Right Cessation
- 1975-03-28 IT IT21829/75A patent/IT1049391B/it active
- 1975-03-29 JP JP50037441A patent/JPS50134574A/ja active Pending
- 1975-04-01 FR FR7510153A patent/FR2266304B1/fr not_active Expired
- 1975-04-01 BE BE154987A patent/BE827435A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB1491938A (en) | 1977-11-16 |
| NL7404364A (nl) | 1975-10-03 |
| JPS50134574A (https=) | 1975-10-24 |
| IT1049391B (it) | 1981-01-20 |
| DE2512400C2 (de) | 1982-03-18 |
| FR2266304A1 (https=) | 1975-10-24 |
| BE827435A (fr) | 1975-10-01 |
| CA1010159A (en) | 1977-05-10 |
| SE7503558L (https=) | 1975-10-02 |
| US4009540A (en) | 1977-03-01 |
| DE2512400A1 (de) | 1975-10-02 |
| FR2266304B1 (https=) | 1978-07-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased | ||
| PL | Patent ceased |