CH415868A - Circuit semi-conducteur microminiature intégré - Google Patents

Circuit semi-conducteur microminiature intégré

Info

Publication number
CH415868A
CH415868A CH738864A CH738864A CH415868A CH 415868 A CH415868 A CH 415868A CH 738864 A CH738864 A CH 738864A CH 738864 A CH738864 A CH 738864A CH 415868 A CH415868 A CH 415868A
Authority
CH
Switzerland
Prior art keywords
semiconductor circuit
microminiature semiconductor
integrated microminiature
integrated
circuit
Prior art date
Application number
CH738864A
Other languages
English (en)
Inventor
Kilby Jack St Clair
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27408060&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CH415868(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of CH415868A publication Critical patent/CH415868A/fr

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
    • H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
    • H03K3/26—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of bipolar transistors with internal or external positive feedback
    • H03K3/28—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of bipolar transistors with internal or external positive feedback using means other than a transformer for feedback
    • H03K3/281—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of bipolar transistors with internal or external positive feedback using means other than a transformer for feedback using at least two transistors so coupled that the input of one is derived from the output of another, e.g. multivibrator
    • H03K3/286—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of bipolar transistors with internal or external positive feedback using means other than a transformer for feedback using at least two transistors so coupled that the input of one is derived from the output of another, e.g. multivibrator bistable
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    • H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
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    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
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    • H03K3/28—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of bipolar transistors with internal or external positive feedback using means other than a transformer for feedback
    • H03K3/281—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of bipolar transistors with internal or external positive feedback using means other than a transformer for feedback using at least two transistors so coupled that the input of one is derived from the output of another, e.g. multivibrator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/98—Utilizing process equivalents or options
CH738864A 1959-02-06 1960-02-06 Circuit semi-conducteur microminiature intégré CH415868A (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US791602A US3138743A (en) 1959-02-06 1959-02-06 Miniaturized electronic circuits
US792840A US3138747A (en) 1959-02-06 1959-02-12 Integrated semiconductor circuit device
US352380A US3261081A (en) 1959-02-06 1964-03-16 Method of making miniaturized electronic circuits

Publications (1)

Publication Number Publication Date
CH415868A true CH415868A (fr) 1966-06-30

Family

ID=27408060

Family Applications (8)

Application Number Title Priority Date Filing Date
CH738664A CH415867A (fr) 1959-02-06 1960-02-06 Circuit semi-conducteur microminiature intégré
CH131460A CH410194A (fr) 1959-02-06 1960-02-06 Circuit semi-conducteur microminiature intégré
CH738964A CH415869A (fr) 1959-02-06 1960-02-06 Dispositif semi-conducteur
CH291263A CH387799A (fr) 1959-02-06 1960-02-06 Condensateur
CH738564A CH416845A (fr) 1959-02-06 1960-02-06 Circuit semi-conducteur microminiature intégré
CH70665A CH410201A (fr) 1959-02-06 1960-02-06 Circuit microminiature intégré et procédé de fabrication dudit circuit
CH738764A CH380824A (fr) 1959-02-06 1960-02-06 Dispositif semi-conducteur
CH738864A CH415868A (fr) 1959-02-06 1960-02-06 Circuit semi-conducteur microminiature intégré

Family Applications Before (7)

Application Number Title Priority Date Filing Date
CH738664A CH415867A (fr) 1959-02-06 1960-02-06 Circuit semi-conducteur microminiature intégré
CH131460A CH410194A (fr) 1959-02-06 1960-02-06 Circuit semi-conducteur microminiature intégré
CH738964A CH415869A (fr) 1959-02-06 1960-02-06 Dispositif semi-conducteur
CH291263A CH387799A (fr) 1959-02-06 1960-02-06 Condensateur
CH738564A CH416845A (fr) 1959-02-06 1960-02-06 Circuit semi-conducteur microminiature intégré
CH70665A CH410201A (fr) 1959-02-06 1960-02-06 Circuit microminiature intégré et procédé de fabrication dudit circuit
CH738764A CH380824A (fr) 1959-02-06 1960-02-06 Dispositif semi-conducteur

Country Status (10)

Country Link
US (3) US3138743A (fr)
JP (1) JPS6155256B1 (fr)
AT (1) AT247482B (fr)
CH (8) CH415867A (fr)
DE (8) DE1196300B (fr)
DK (7) DK103790C (fr)
GB (14) GB945737A (fr)
MY (14) MY6900300A (fr)
NL (7) NL134915C (fr)
SE (1) SE314440B (fr)

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Also Published As

Publication number Publication date
JPS6155256B1 (fr) 1986-11-27
NL6608451A (fr) 1970-07-23
DK104008C (da) 1966-03-21
GB945741A (en) 1964-01-08
GB945743A (en) 1964-01-08
DE1196296B (de) 1965-07-08
US3261081A (en) 1966-07-19
CH387799A (fr) 1965-02-15
CH410194A (fr) 1966-03-31
DE1196295B (de) 1965-07-08
US3138747A (en) 1964-06-23
GB945734A (en) 1964-01-08
DK104007C (da) 1966-03-21
MY6900296A (en) 1969-12-31
GB945748A (en) 1964-01-08
DK104185C (da) 1966-04-18
DE1196298B (de) 1965-07-08
MY6900293A (en) 1969-12-31
MY6900287A (en) 1969-12-31
DE1439754B2 (de) 1972-04-13
GB945739A (en) 1964-01-08
DE1196299C2 (de) 1974-03-07
NL6608447A (fr) 1970-07-23
MY6900285A (en) 1969-12-31
MY6900290A (en) 1969-12-31
SE314440B (fr) 1969-09-08
US3138743A (en) 1964-06-23
DK104470C (da) 1966-05-23
MY6900301A (en) 1969-12-31
MY6900283A (en) 1969-12-31
NL6608448A (fr) 1970-07-23
MY6900291A (en) 1969-12-31
GB945742A (fr)
MY6900292A (en) 1969-12-31
GB945746A (en) 1964-01-08
NL6608445A (fr) 1970-07-23
AT247482B (de) 1966-06-10
NL134915C (fr) 1972-04-17
CH415867A (fr) 1966-06-30
DK104006C (da) 1966-03-21
CH380824A (fr) 1964-08-14
GB945740A (fr)
GB945745A (en) 1964-01-08
CH416845A (fr) 1966-07-15
MY6900300A (en) 1969-12-31
DK103790C (da) 1966-02-21
DE1196297B (de) 1965-07-08
DE1196297C2 (de) 1974-01-17
DE1196300B (de) 1965-07-08
MY6900315A (en) 1969-12-31
GB945744A (en) 1964-01-08
NL6608452A (fr) 1970-07-23
DE1196299B (de) 1965-07-08
NL6608449A (fr) 1970-07-23
DK104005C (da) 1966-03-21
GB945737A (en) 1964-01-08
GB945749A (en) 1964-01-08
DE1439754A1 (de) 1969-12-04
MY6900302A (en) 1969-12-31
CH410201A (fr) 1966-03-31
GB945747A (fr)
DE1196301B (de) 1965-07-08
MY6900284A (en) 1969-12-31
GB945738A (en) 1964-01-08
NL6608446A (fr) 1970-07-23
MY6900286A (en) 1969-12-31
CH415869A (fr) 1966-06-30

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