CA978140A - Apparatus for reacting a gas with a material in an electromagnetic field - Google Patents
Apparatus for reacting a gas with a material in an electromagnetic fieldInfo
- Publication number
- CA978140A CA978140A CA151,067A CA151067A CA978140A CA 978140 A CA978140 A CA 978140A CA 151067 A CA151067 A CA 151067A CA 978140 A CA978140 A CA 978140A
- Authority
- CA
- Canada
- Prior art keywords
- reacting
- gas
- electromagnetic field
- electromagnetic
- field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J19/087—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18673971A | 1971-10-05 | 1971-10-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA978140A true CA978140A (en) | 1975-11-18 |
Family
ID=22686104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA151,067A Expired CA978140A (en) | 1971-10-05 | 1972-09-06 | Apparatus for reacting a gas with a material in an electromagnetic field |
Country Status (7)
Country | Link |
---|---|
US (1) | US3705091A (en) |
JP (1) | JPS4844176A (en) |
BE (1) | BE788661A (en) |
CA (1) | CA978140A (en) |
DE (1) | DE2245753A1 (en) |
FR (1) | FR2156582A1 (en) |
GB (1) | GB1358647A (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50267U (en) * | 1973-04-27 | 1975-01-06 | ||
US4362632A (en) * | 1974-08-02 | 1982-12-07 | Lfe Corporation | Gas discharge apparatus |
US4431898A (en) * | 1981-09-01 | 1984-02-14 | The Perkin-Elmer Corporation | Inductively coupled discharge for plasma etching and resist stripping |
DE3632340C2 (en) * | 1986-09-24 | 1998-01-15 | Leybold Ag | Inductively excited ion source |
US5280154A (en) * | 1992-01-30 | 1994-01-18 | International Business Machines Corporation | Radio frequency induction plasma processing system utilizing a uniform field coil |
US5277751A (en) * | 1992-06-18 | 1994-01-11 | Ogle John S | Method and apparatus for producing low pressure planar plasma using a coil with its axis parallel to the surface of a coupling window |
US5433812A (en) * | 1993-01-19 | 1995-07-18 | International Business Machines Corporation | Apparatus for enhanced inductive coupling to plasmas with reduced sputter contamination |
JP3105403B2 (en) * | 1994-09-14 | 2000-10-30 | 松下電器産業株式会社 | Plasma processing equipment |
US6238533B1 (en) * | 1995-08-07 | 2001-05-29 | Applied Materials, Inc. | Integrated PVD system for aluminum hole filling using ionized metal adhesion layer |
US5962923A (en) * | 1995-08-07 | 1999-10-05 | Applied Materials, Inc. | Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches |
US7253109B2 (en) | 1997-11-26 | 2007-08-07 | Applied Materials, Inc. | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system |
WO1999027579A1 (en) * | 1997-11-26 | 1999-06-03 | Applied Materials, Inc. | Damage-free sculptured coating deposition |
US6217937B1 (en) | 1998-07-15 | 2001-04-17 | Cornell Research Foundation, Inc. | High throughput OMVPE apparatus |
US6239553B1 (en) * | 1999-04-22 | 2001-05-29 | Applied Materials, Inc. | RF plasma source for material processing |
US8454810B2 (en) | 2006-07-14 | 2013-06-04 | 4D-S Pty Ltd. | Dual hexagonal shaped plasma source |
KR101874802B1 (en) * | 2016-04-19 | 2018-07-05 | 피에스케이 주식회사 | Plasma source and apparatus for treating substrate including the same |
EP4351281A1 (en) * | 2021-05-27 | 2024-04-10 | Asahi Kasei Kabushiki Kaisha | Plasma generation device, plasma treatment device, and plasma etching device for seamless roller mold |
-
0
- BE BE788661D patent/BE788661A/en unknown
-
1971
- 1971-10-05 US US186739A patent/US3705091A/en not_active Expired - Lifetime
-
1972
- 1972-07-20 JP JP47073000A patent/JPS4844176A/ja active Pending
- 1972-09-06 CA CA151,067A patent/CA978140A/en not_active Expired
- 1972-09-07 FR FR7231705A patent/FR2156582A1/fr not_active Withdrawn
- 1972-09-08 GB GB4189072A patent/GB1358647A/en not_active Expired
- 1972-09-18 DE DE2245753A patent/DE2245753A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DE2245753A1 (en) | 1973-04-12 |
US3705091A (en) | 1972-12-05 |
JPS4844176A (en) | 1973-06-25 |
GB1358647A (en) | 1974-07-03 |
FR2156582A1 (en) | 1973-06-01 |
BE788661A (en) | 1973-03-12 |
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