CA964379A - Method of establishing relatively insulation connections between conductor ends and an insulating substrate - Google Patents
Method of establishing relatively insulation connections between conductor ends and an insulating substrateInfo
- Publication number
- CA964379A CA964379A CA120,461A CA120461A CA964379A CA 964379 A CA964379 A CA 964379A CA 120461 A CA120461 A CA 120461A CA 964379 A CA964379 A CA 964379A
- Authority
- CA
- Canada
- Prior art keywords
- insulating substrate
- conductor ends
- establishing relatively
- relatively insulation
- insulation connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7011885A NL7011885A (de) | 1970-08-12 | 1970-08-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA964379A true CA964379A (en) | 1975-03-11 |
Family
ID=19810763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA120,461A Expired CA964379A (en) | 1970-08-12 | 1971-08-10 | Method of establishing relatively insulation connections between conductor ends and an insulating substrate |
Country Status (10)
Country | Link |
---|---|
US (1) | US3780432A (de) |
JP (1) | JPS5110072B1 (de) |
AU (1) | AU463465B2 (de) |
BR (1) | BR7105101D0 (de) |
CA (1) | CA964379A (de) |
DE (1) | DE2136201C3 (de) |
ES (1) | ES394087A1 (de) |
FR (1) | FR2102211B1 (de) |
GB (1) | GB1293710A (de) |
NL (1) | NL7011885A (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3893234A (en) * | 1972-07-03 | 1975-07-08 | Sierracin Corp | Edge improvement for window with electrically conductive layer |
US3909934A (en) * | 1972-12-02 | 1975-10-07 | Licentia Gmbh | Method of producing a measuring head for measuring electrical components |
JPH033604U (de) * | 1989-06-02 | 1991-01-16 | ||
EP0464232B1 (de) * | 1990-06-30 | 1994-03-16 | Dr. Johannes Heidenhain GmbH | Lötverbinder und Verfahren zur Herstellung einer elektrischen Schaltung mit diesem Lötverbinder |
US5184206A (en) * | 1990-10-26 | 1993-02-02 | General Electric Company | Direct thermocompression bonding for thin electronic power chips |
DE4429002A1 (de) * | 1994-08-16 | 1996-02-22 | Siemens Nixdorf Inf Syst | Anschlußstiele für elektronische Bausteine mit flächigen Anschlußfeldern |
CN101542723A (zh) * | 2006-10-06 | 2009-09-23 | 美高森美公司 | 高温、高压SiC无空隙电子封装 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3396461A (en) * | 1962-12-04 | 1968-08-13 | Engelhard Ind Inc | Printed circuit board and method of manufacture thereof |
GB1087861A (en) * | 1963-04-18 | 1967-10-18 | Sealectro Corp | Improvements in electrical socket connectors and other electrical contact devices |
US3340347A (en) * | 1964-10-12 | 1967-09-05 | Corning Glass Works | Enclosed electronic device |
US3381081A (en) * | 1965-04-16 | 1968-04-30 | Cts Corp | Electrical connection and method of making the same |
US3390308A (en) * | 1966-03-31 | 1968-06-25 | Itt | Multiple chip integrated circuit assembly |
US3371148A (en) * | 1966-04-12 | 1968-02-27 | Radiation Inc | Semiconductor device package and method of assembly therefor |
US3434940A (en) * | 1966-07-21 | 1969-03-25 | Mc Donnell Douglas Corp | Process for making thin-film temperature sensors |
US3618200A (en) * | 1970-04-17 | 1971-11-09 | Matsuo Electric Co | Method of manufacturing chip-shaped passive electronic components |
-
1970
- 1970-08-12 NL NL7011885A patent/NL7011885A/xx unknown
-
1971
- 1971-07-20 DE DE2136201A patent/DE2136201C3/de not_active Expired
- 1971-08-09 GB GB37351/71A patent/GB1293710A/en not_active Expired
- 1971-08-09 AU AU32121/71A patent/AU463465B2/en not_active Expired
- 1971-08-09 JP JP46059670A patent/JPS5110072B1/ja active Pending
- 1971-08-09 BR BR5101/71A patent/BR7105101D0/pt unknown
- 1971-08-10 CA CA120,461A patent/CA964379A/en not_active Expired
- 1971-08-10 US US00170482A patent/US3780432A/en not_active Expired - Lifetime
- 1971-08-10 ES ES394087A patent/ES394087A1/es not_active Expired
- 1971-08-11 FR FR7129371A patent/FR2102211B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2136201A1 (de) | 1973-08-16 |
NL7011885A (de) | 1972-02-15 |
US3780432A (en) | 1973-12-25 |
DE2136201C3 (de) | 1978-05-24 |
DE2136201B2 (de) | 1977-09-22 |
BR7105101D0 (pt) | 1973-04-12 |
AU463465B2 (en) | 1975-07-31 |
FR2102211A1 (de) | 1972-04-07 |
ES394087A1 (es) | 1974-11-16 |
GB1293710A (en) | 1972-10-25 |
JPS5110072B1 (de) | 1976-04-01 |
FR2102211B1 (de) | 1976-05-28 |
AU3212171A (en) | 1973-02-15 |
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