CA1234915A - Portable memory module - Google Patents
Portable memory moduleInfo
- Publication number
- CA1234915A CA1234915A CA000478453A CA478453A CA1234915A CA 1234915 A CA1234915 A CA 1234915A CA 000478453 A CA000478453 A CA 000478453A CA 478453 A CA478453 A CA 478453A CA 1234915 A CA1234915 A CA 1234915A
- Authority
- CA
- Canada
- Prior art keywords
- casing
- memory module
- printed circuit
- casings
- cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
- H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
- H01M50/213—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/051—Rolled
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Power Sources (AREA)
Abstract
PORTABLE MEMORY MODULE
Abstract of the Disclosure The portable memory module disclosed herein is constructed in a compact cylindrical form facilitating its use in oceanographic and environmental data acquisition environments.
Individual integrated circuit memory components are carried and interconnected by a flexible printed circuit, the components being oriented in columns with pin lines parallel to the axis of a cylindrical battery casing to permit the circuit to be rolled around that casing. The battery casing and rolled printed circuit are then inserted in a protective outer casing, also cylindrical.
Abstract of the Disclosure The portable memory module disclosed herein is constructed in a compact cylindrical form facilitating its use in oceanographic and environmental data acquisition environments.
Individual integrated circuit memory components are carried and interconnected by a flexible printed circuit, the components being oriented in columns with pin lines parallel to the axis of a cylindrical battery casing to permit the circuit to be rolled around that casing. The battery casing and rolled printed circuit are then inserted in a protective outer casing, also cylindrical.
Description
~2345~
1 Background of the Invention The present invention relates to a portable memory module and more particularly to a ~oa~tery-powered memory module suitable for data acquisi~ion at remote locations.
In various oeeanographic studies, it is desirable to acquire data from sensors over a relatively long period of time at remote locations. For example, the heave buoy manufactured and sold by Endeco, IncO o Marion, Massachusetts under the trademark WAVETRACK is adapted to acquire historical information regarding wave height. While telemetry may be effectively used in some situations to transmit the acquired data to a ship- or land-based data acquisi~ion system, ther~ are also situations in which it is preferable to store the data on board the buoy for later retrieval. While tape recorders have commonly ~een used for such local data acquisition, such devices are mechanical in nature and, even when constructed at high cost for unattended duty, are subject to occasional failures.
Among the several objects of the present invention may be noted the provision of a portable memory module suitable for data acquisition at remote locations; the provision of such a memory module which is suitable for incorporation into an oceanographic buoy; the provision of sueh a memory module whieh is of compact configuration and readily incorporated in an oceanographic buoy; the provision of such a memory module which is highly reliable and which is of relati~ely simple and inexpensive construction. Other objects and features will be in part apparent and in part pointed out hereinafter.
.. .
~23i~9~5 1 Summary of the Invention A portable memory modul~ in accordance with the present invention employs ~ cylindrical outer casing and, within said outer casing, a cylindrical inner casing generally concentric therewith~ Between the inner and outer casings, there is provided a helically-rolled flexible printed circuit carrying and interconnectiny a multiplicity of dual-in-line integrated circuit memory components, the components being oriented in columns with the pin lines generally parallel to the axes of the casings. A
battery for powering the memory cornponents is held within the inner casing.
Brief Descri~tion of the Drawings Fig. 1 is a side view, in section, of a cylindrical memory module constructed in accordance with the presept invention, ~ ig. 2 is a transverse sectional view of the memory module;
Fig. 3 is a plan view of a flexible printed circuit employed in the memory module of Figs~ 1 and 2;
FigO 4 is a perspective view of the complete memory module of Figs . 1 and 2, Fig. 5 is a plan view of a flexible printed circuit employed in an alternative embodiment; and Fig. 6 is a perspective view of the alternative embodiment fully assembled.
Corresponding reference characters indicate corre~ponding parts throughout the several views of the drawings.
..
, ................................................. .
3~9~5 1 Description of the Preferred Embodiments Referring now to Fig. 1, it can be seen that the memor~
module of the present invention, designated generally by reference character 11, is generally cylindrical in configuration and comprises an outer cylindrical casing 13 and an inner cylindrical casing 15. The casings 13 and 15 are maintained in generally concentric relationship by a disc-like bottom end cap 17 and, at the top end, an annular end cap 19. A cover 21 is provided for closing off the intexior of the inner casing 15.
The casings 13 and 15 may, for example, be constructed of aluminum tubing while the end caps 17 and 19 may be constructed of a suitable plastic cemented to the tubes. In operation, the inner casing 15 holds batteries, indicated by reference characters 22-25, for powering the electronic memory componen~s of the module.
The electronic memory itself is constructed on a flexible printed circuit 27, the layout of such a printed circuit being shown in Fig. 3. As it is desirable to keep power consump-tion as low as possible, the memory chips and other electronic components employed are preferably of the complementary metal oxide semiconductor (C-MOS) type. Such components are readily available packaged in the so-called dual-in-line plastic (DIP) configuration. In this configuration, connections to the individual semiconductor devices are made through pins arranged along two parallel lines. As may be seen in Fig. 3, the memory chips, designated 31A-38E, are arranged in rows and columns with the individual integrated circuit memory chips being oriented with their pin lines aligned with the column direction. By arranging the integrated circuit packages in columns with their ~2~ 3~5 1 pin lines parallel and in alignment, the flexibility of the printed circuit 27 is preser~ed for bending around an axis parallel to the column direction.
As may be seen in Fig. 2, the completed circuit of Fig.
3 is installed in the module by wrapping it helically around the inner casing 15. Preferably, a thin, non-conductive foam sheet is interposed between the successive layers for cushioning and insulation. However, if the integrated circuit packages are all plastic capped and of sufficient height, they may of themselves provide sufficient spacing and air insulation between successive layers.
In addition to the memory chips 31A-38E, the electronic memory circuit will typically also include various interface and/or microprocessor components. As these may involve larger chip sizes, as indicated by reference characters 39 and 40, these components are preferably placed along one side of the printed circuit, i.e. to the right as seen in Fig. 3 and to the outside of the helical wrap configuration as shown in Figs. 1 and 2. As will be understood, the smaller chip size permit the tighter radius to be formed with the flexible printed circuit. Likewise, in order to accommodate the smaller radius or the initial wraps, the column spacing may be slightly greater for the initial several columns, as shown in Fig. 3, 50 as to increase the flexibility to the left side of the flexible printed circuit as viewed in Fig. 3.
To facilitate connection of the memory module to the data acquisition sensors and electronics with which it is to co-operate, the flexible printed circuit 27 includes also a tab _~_ 1;~3'~91S
1 41 extending from the right side of the main rectangular section of the circuitry and this tab carries a pair of flat edge cable connectors 43 and 44. ~referably, the memory circuitry is arranged to incorporate serial data communication so that the number of leads that must be brought out is relatively small.
As may be seen in FigO 2, the upper end of the outer casing 13 provides a longi~udinal slit~ designated generally by reference character 47O Upon assembly of the module, the tab ~1 is led through this slit so that the connectors 43 and 45 reside outside the outer casing 13, as may best be seen in Figs. 2 and 4. After the circuit is installed between the inner and outer casings and the end caps are mounted in place, a suitable sealant is preferably applied to the region where the tab passes through the slit and the connectors 43 and 44 are cemented to the outside of the casing.
In some situations, it may be desirable to incorporate user I/O (input/output) capabilities for facilitating the transfer of data to other devices. In such cases, a flexible key pad 51 and LCD readout 53 may be attached, as illustrated a Fig.
5, to the flexible printed circuit by tabs 55 and 57 similar to tab 41 and these components can then be mounted on the outside o the casing 13 in the same manner as the connectors 43 and 45.
Such a configuration is illustrated in Fig. 60 In view of the foregoing, it may be seen that several objects of the present invention are achieved and other advantageous results have been obtained.
As various changes could be made in the above constructions without departing from the scope of the invention, ~;~34~L5 1 it should be understood that all matter contained in the above description or shown in the accompan~ing drawings shall be interpreted as illustrative and not in a limiting sense.
What is claimed is:
., .
1 Background of the Invention The present invention relates to a portable memory module and more particularly to a ~oa~tery-powered memory module suitable for data acquisi~ion at remote locations.
In various oeeanographic studies, it is desirable to acquire data from sensors over a relatively long period of time at remote locations. For example, the heave buoy manufactured and sold by Endeco, IncO o Marion, Massachusetts under the trademark WAVETRACK is adapted to acquire historical information regarding wave height. While telemetry may be effectively used in some situations to transmit the acquired data to a ship- or land-based data acquisi~ion system, ther~ are also situations in which it is preferable to store the data on board the buoy for later retrieval. While tape recorders have commonly ~een used for such local data acquisition, such devices are mechanical in nature and, even when constructed at high cost for unattended duty, are subject to occasional failures.
Among the several objects of the present invention may be noted the provision of a portable memory module suitable for data acquisition at remote locations; the provision of such a memory module which is suitable for incorporation into an oceanographic buoy; the provision of sueh a memory module whieh is of compact configuration and readily incorporated in an oceanographic buoy; the provision of such a memory module which is highly reliable and which is of relati~ely simple and inexpensive construction. Other objects and features will be in part apparent and in part pointed out hereinafter.
.. .
~23i~9~5 1 Summary of the Invention A portable memory modul~ in accordance with the present invention employs ~ cylindrical outer casing and, within said outer casing, a cylindrical inner casing generally concentric therewith~ Between the inner and outer casings, there is provided a helically-rolled flexible printed circuit carrying and interconnectiny a multiplicity of dual-in-line integrated circuit memory components, the components being oriented in columns with the pin lines generally parallel to the axes of the casings. A
battery for powering the memory cornponents is held within the inner casing.
Brief Descri~tion of the Drawings Fig. 1 is a side view, in section, of a cylindrical memory module constructed in accordance with the presept invention, ~ ig. 2 is a transverse sectional view of the memory module;
Fig. 3 is a plan view of a flexible printed circuit employed in the memory module of Figs~ 1 and 2;
FigO 4 is a perspective view of the complete memory module of Figs . 1 and 2, Fig. 5 is a plan view of a flexible printed circuit employed in an alternative embodiment; and Fig. 6 is a perspective view of the alternative embodiment fully assembled.
Corresponding reference characters indicate corre~ponding parts throughout the several views of the drawings.
..
, ................................................. .
3~9~5 1 Description of the Preferred Embodiments Referring now to Fig. 1, it can be seen that the memor~
module of the present invention, designated generally by reference character 11, is generally cylindrical in configuration and comprises an outer cylindrical casing 13 and an inner cylindrical casing 15. The casings 13 and 15 are maintained in generally concentric relationship by a disc-like bottom end cap 17 and, at the top end, an annular end cap 19. A cover 21 is provided for closing off the intexior of the inner casing 15.
The casings 13 and 15 may, for example, be constructed of aluminum tubing while the end caps 17 and 19 may be constructed of a suitable plastic cemented to the tubes. In operation, the inner casing 15 holds batteries, indicated by reference characters 22-25, for powering the electronic memory componen~s of the module.
The electronic memory itself is constructed on a flexible printed circuit 27, the layout of such a printed circuit being shown in Fig. 3. As it is desirable to keep power consump-tion as low as possible, the memory chips and other electronic components employed are preferably of the complementary metal oxide semiconductor (C-MOS) type. Such components are readily available packaged in the so-called dual-in-line plastic (DIP) configuration. In this configuration, connections to the individual semiconductor devices are made through pins arranged along two parallel lines. As may be seen in Fig. 3, the memory chips, designated 31A-38E, are arranged in rows and columns with the individual integrated circuit memory chips being oriented with their pin lines aligned with the column direction. By arranging the integrated circuit packages in columns with their ~2~ 3~5 1 pin lines parallel and in alignment, the flexibility of the printed circuit 27 is preser~ed for bending around an axis parallel to the column direction.
As may be seen in Fig. 2, the completed circuit of Fig.
3 is installed in the module by wrapping it helically around the inner casing 15. Preferably, a thin, non-conductive foam sheet is interposed between the successive layers for cushioning and insulation. However, if the integrated circuit packages are all plastic capped and of sufficient height, they may of themselves provide sufficient spacing and air insulation between successive layers.
In addition to the memory chips 31A-38E, the electronic memory circuit will typically also include various interface and/or microprocessor components. As these may involve larger chip sizes, as indicated by reference characters 39 and 40, these components are preferably placed along one side of the printed circuit, i.e. to the right as seen in Fig. 3 and to the outside of the helical wrap configuration as shown in Figs. 1 and 2. As will be understood, the smaller chip size permit the tighter radius to be formed with the flexible printed circuit. Likewise, in order to accommodate the smaller radius or the initial wraps, the column spacing may be slightly greater for the initial several columns, as shown in Fig. 3, 50 as to increase the flexibility to the left side of the flexible printed circuit as viewed in Fig. 3.
To facilitate connection of the memory module to the data acquisition sensors and electronics with which it is to co-operate, the flexible printed circuit 27 includes also a tab _~_ 1;~3'~91S
1 41 extending from the right side of the main rectangular section of the circuitry and this tab carries a pair of flat edge cable connectors 43 and 44. ~referably, the memory circuitry is arranged to incorporate serial data communication so that the number of leads that must be brought out is relatively small.
As may be seen in FigO 2, the upper end of the outer casing 13 provides a longi~udinal slit~ designated generally by reference character 47O Upon assembly of the module, the tab ~1 is led through this slit so that the connectors 43 and 45 reside outside the outer casing 13, as may best be seen in Figs. 2 and 4. After the circuit is installed between the inner and outer casings and the end caps are mounted in place, a suitable sealant is preferably applied to the region where the tab passes through the slit and the connectors 43 and 44 are cemented to the outside of the casing.
In some situations, it may be desirable to incorporate user I/O (input/output) capabilities for facilitating the transfer of data to other devices. In such cases, a flexible key pad 51 and LCD readout 53 may be attached, as illustrated a Fig.
5, to the flexible printed circuit by tabs 55 and 57 similar to tab 41 and these components can then be mounted on the outside o the casing 13 in the same manner as the connectors 43 and 45.
Such a configuration is illustrated in Fig. 60 In view of the foregoing, it may be seen that several objects of the present invention are achieved and other advantageous results have been obtained.
As various changes could be made in the above constructions without departing from the scope of the invention, ~;~34~L5 1 it should be understood that all matter contained in the above description or shown in the accompan~ing drawings shall be interpreted as illustrative and not in a limiting sense.
What is claimed is:
., .
Claims (6)
1. A portable memory module comprising:
a cylindrical outer easing;
a cylindrical inner casing generally concentric with said outer casing;
between said inner and outer casings, a rolled, flexible printed circuit carrying and interconnecting a multiplicity of integrated circuit memory components and within said inner casing, a battery for powering said memory components.
a cylindrical outer easing;
a cylindrical inner casing generally concentric with said outer casing;
between said inner and outer casings, a rolled, flexible printed circuit carrying and interconnecting a multiplicity of integrated circuit memory components and within said inner casing, a battery for powering said memory components.
2. A portable memory module comprising:
a cylindrical outer casing;
a cylindrical inner casing generally concentric with said outer casing;
between said inner and outer casings, a helically rolled printed circuit carrying and interconnecting a multiplicity of dual-in-line integrated circuit memory components oriented in columns with the pin lines parallel to the axes of said casings; and within said inner casing, a battery for powering said memory components.
a cylindrical outer casing;
a cylindrical inner casing generally concentric with said outer casing;
between said inner and outer casings, a helically rolled printed circuit carrying and interconnecting a multiplicity of dual-in-line integrated circuit memory components oriented in columns with the pin lines parallel to the axes of said casings; and within said inner casing, a battery for powering said memory components.
3. A portable memory module as set forth in claim 2 wherein the spacing of the memory component columns is greater on the portion of the printed circuit which is adjacent the inner casing than on the portion which is on the outer portion of the helical rolling.
4. A portable memory module as set forth in claim 2 wherein said outer casing includes a longitudinal slit adjacent one end and said printed circuit includes a tab extending through said slot for providing electrical connections outside of said outer casing.
5. A portable memory module comprising:
a cylindrical outer casing;
a cylindrical inner casing generally concentric with said outer casing;
an end cap closing off said inner and outer casings at one end, between said inner and outer casings, a helically rolled flexible printed circuit carrying and interconnecting a multiplicity of dual-in-line integrated circuit memory components oriented in columns with the pin lines parallel to the axes of said casings;
an annular cap closing off, at the other ends of said casings, the space between said casings within said inner casing, a battery for powering said memory components; and a removable cap for closing off the other end of said inner casing.
a cylindrical outer casing;
a cylindrical inner casing generally concentric with said outer casing;
an end cap closing off said inner and outer casings at one end, between said inner and outer casings, a helically rolled flexible printed circuit carrying and interconnecting a multiplicity of dual-in-line integrated circuit memory components oriented in columns with the pin lines parallel to the axes of said casings;
an annular cap closing off, at the other ends of said casings, the space between said casings within said inner casing, a battery for powering said memory components; and a removable cap for closing off the other end of said inner casing.
6. A portable memory module as set forth in claim 5 wherein said outer casing includes a longitudinal slit adjacent one end and said printed circuit includes a tab extending through said slot for providing electrical connections outside of said outer casing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/612,459 US4510551A (en) | 1984-05-21 | 1984-05-21 | Portable memory module |
| US612,459 | 1984-05-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1234915A true CA1234915A (en) | 1988-04-05 |
Family
ID=24453248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000478453A Expired CA1234915A (en) | 1984-05-21 | 1985-04-04 | Portable memory module |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4510551A (en) |
| CA (1) | CA1234915A (en) |
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| US4858073A (en) * | 1986-12-10 | 1989-08-15 | Akzo America Inc. | Metal substrated printed circuit |
| US4990948A (en) * | 1986-12-27 | 1991-02-05 | Canon Kabushiki Kaisha | Flexible printed circuit board |
| DE3732854C2 (en) * | 1987-09-29 | 1993-12-02 | Siemens Ag | One-piece assembly |
| US4833568A (en) * | 1988-01-29 | 1989-05-23 | Berhold G Mark | Three-dimensional circuit component assembly and method corresponding thereto |
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| US7904130B2 (en) | 2005-09-29 | 2011-03-08 | Nellcor Puritan Bennett Llc | Medical sensor and technique for using the same |
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| US9202660B2 (en) | 2013-03-13 | 2015-12-01 | Teledyne Wireless, Llc | Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes |
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| US10598006B2 (en) | 2017-05-30 | 2020-03-24 | Baker Hughes Oilfield Operations, Llc | Methods and systems for downhole sensing and communications in wells |
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| US2647224A (en) * | 1950-12-02 | 1953-07-28 | Specialties Inc | Means and method for assembling electric circuit components |
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| US3149406A (en) * | 1958-11-10 | 1964-09-22 | Eisler Paul | Method of making electrical heating and conducting devices |
| US3077563A (en) * | 1960-01-15 | 1963-02-12 | Philco Corp | Battery-holding and chassis-supporting unit for battery operated radio receivers |
| NL278148A (en) * | 1961-05-08 | |||
| US3337775A (en) * | 1965-03-26 | 1967-08-22 | David A Scoles | Vibration isolation means |
| US3517438A (en) * | 1966-05-12 | 1970-06-30 | Ibm | Method of packaging a circuit module and joining same to a circuit substrate |
| US3499220A (en) * | 1967-02-28 | 1970-03-10 | Amerace Esna Corp | Method of and apparatus for making a flexible,printed electrical circuit |
| US3505570A (en) * | 1968-03-08 | 1970-04-07 | Edgar O Sprude | Electrical apparatus and method of fabricating it |
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| US4261042A (en) * | 1978-03-28 | 1981-04-07 | Canon Kabushiki Kaisha | Key signal entering device for thin electronic apparatus |
| CH632088A5 (en) * | 1978-04-13 | 1982-09-15 | Kuebler Heinrich Ag | MEASURING GUIDE FOR A LEVEL SENSOR. |
| US4266339A (en) * | 1979-06-07 | 1981-05-12 | Dielectric Systems International, Inc. | Method for making rolling electrode for electrostatic device |
| US4251852A (en) * | 1979-06-18 | 1981-02-17 | International Business Machines Corporation | Integrated circuit package |
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-
1984
- 1984-05-21 US US06/612,459 patent/US4510551A/en not_active Expired - Fee Related
-
1985
- 1985-04-04 CA CA000478453A patent/CA1234915A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US4510551A (en) | 1985-04-09 |
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| MKEX | Expiry |