CA1181530A - Circuit assembly and method of making same - Google Patents
Circuit assembly and method of making sameInfo
- Publication number
- CA1181530A CA1181530A CA000409475A CA409475A CA1181530A CA 1181530 A CA1181530 A CA 1181530A CA 000409475 A CA000409475 A CA 000409475A CA 409475 A CA409475 A CA 409475A CA 1181530 A CA1181530 A CA 1181530A
- Authority
- CA
- Canada
- Prior art keywords
- wafers
- conducting region
- pin conductor
- pin
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
- H01R12/67—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal insulation penetrating terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
Landscapes
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
ABSTRACT
A circuit assembly and method of making the same involves locating a flat flexible circuit member with an electrically conducting region defined thereon between a pair of opposed, relatively rigid wafers with a pin conductor inserted through the member and the wafers. Each wafer includes an aperture extending through the wafer, the aperture of one wafer aligned with the aperture of the other wafer and arranged to abut with the conducting region at the point of desired termination. The pin conductor is forced into and is retained within each aperture in each wafer, piercing the conducting region on the flat flexible circuit member in the process and making electrical contact with the conducting region.
A portion of the pin conductor extends outwardly of one of the wafers for electrical connection to a female connector.
A circuit assembly and method of making the same involves locating a flat flexible circuit member with an electrically conducting region defined thereon between a pair of opposed, relatively rigid wafers with a pin conductor inserted through the member and the wafers. Each wafer includes an aperture extending through the wafer, the aperture of one wafer aligned with the aperture of the other wafer and arranged to abut with the conducting region at the point of desired termination. The pin conductor is forced into and is retained within each aperture in each wafer, piercing the conducting region on the flat flexible circuit member in the process and making electrical contact with the conducting region.
A portion of the pin conductor extends outwardly of one of the wafers for electrical connection to a female connector.
Description
3C~
This invention relates generally to a method for terminating a flat flexible circuit member with a pin conductor.
Due to their low cost, flat flexible circuit members wherein a pattern of conducting regions are defined by coating or the like on a flexible plastic film have gained widespread acceptance. While the flat flexible circuit members have many advan-tages, some difficulty is experienced in terminating such members because of their flexibility.
In the past flat, flexible circuit members have been terminated in one of two ways. In one method, known as the insulation displacement method, the circuit member is pierced with a sharp portion of a terminal and the terminal is then either crimped or clinched against the circuit member. In the other method, prepunched holes are formed in the circuit member and a pin conductor or the like is then inserted through the holes.
The insulation displacement method is less than optimal since the displacement of the insulation may be incomplete, interfering with the electrical connection between the conducting region on the circuit member and the terminal itself. In addition, the flexibility of the circuit member makes it difficult to crimp or clinch the sharp portion of the terminal to the circuit member. The method involving prepunching of holes in the circuit member is disadvantageous since a requirement of prepunched holes adds additional cost to the production of the circuit member.
It is, therefore, the principle object of the present invention to provide a method of making a circuit assembly in which a flat flexible circuit member is terminated with a pin conductor in a manner which is efficient and inexpensive and overcomes many of the disadvantages experienced in the prior art.
~f~"
i;3~
In accordance with a broad aspect of the invention there is provided a method of making a circuit assembly including a flat, flexible curcuit member with a conducting region defined thereon, said member terminated by a pin conductor, comprising the steps of: arranging a pair of relative~y rigid wafers in opposed relationship on opposite sides of a flexible circuit member, inserting a pair of alignment posts having first.
ends secured to a support plate, through a pair of equally spaced apertures in each of said wafers and said circuit member in order to align an aperture in one of said wafers with an aperture of the other wafer and with a conducting region defined on said member, pressing a pin conductor through said aligned apertures of said wafers and said conducting region, forming an aperture in said conducting region thereby, said pin conductor being pressed through said wafers until one end of said pin conductor is flush with the surface of one of said wafers and the other end of said pin conductor extends outwardly of the woutwardly facing surface of the other of said wafers, and securing said conductor within each of said apertures so as to force fit said pin conductor in said wafers, with said pin conductor in electrical contact with the said conducting region and extending outwardly of one of said wafers.
The invention will now be further described in conjunction with the accompanying drawings, in which:
Figure 1 is a partial perspective view of one embodiment of the circuit assembly of the present invention;
Figure 2 is an exploded view of the circuit assemb.ly shown in ~ 8~S3~i Figure l;
Figure 3 is an enlarged cross-sectional view taken generally along the line 3-3 in Figure l; and Figures 4A through 4C are fragmentary front elevational views illustrating the method of forming the circuit assembly shown in Figure 1.
Turning now to the figures, Figure 1 illustrates a circuit assembly, generally designated 10, of the present invention including a pair of opposed relatively rigid electrically insulating wafers 12~ a plurality of pin conductors 14 and a flat flexible circuit member 16 with a plurality of conducting regions 18 defined thereon. The wafers 12 are arranged in opposed relationship on opposite sides of the circuit member 16 with the pin conductors 14 extending through the wafers 12 and the circuit member 16 so as to secure -the entire assembly 10 together in a stable mounting.
Each wafer 12 is conveniently formed of a nonconducting material such as plastic or the like, preferably of sufficient thickness to have greater rigidity than that possessed by the flexible circuit member 16.
In the preferred embodiment wafers 12 are sufficiently stiff to resist manual flexing. As used herein the term "relatively rigid wafers" means only that the wafers are less flexible than the flexible circuit member 16 resulting in a composite assembly 10 of greater stability. The wafers 12 are identical, with a pair of alignment apertures 20 arranged on opposite ends of the conveniently rectangular wafer 12 and a plurality of pin conductor receiving apertures 22 arranged in a line between the alignment apertures 20. The member 16 is also provided with a pair of alignment apertures 20A3 similar in size and spacing with apertures 20 provided in the wafers 12 and located to either side of the intended 3~
point of termination~ E`or example, each wafer 12 r~ay convem ently ~e made of a plastic such as polypro~ylene molded in ~le form of a rectangular block approximately 2.5 centimeters in length, 0.6 centimeters in width and 0.3 centir~2ters thick, ~he apertu~es 20 and 22 beinc~ formed during the moldiny process. me configuration of ~le apertures 22 corresponds with the cross-sectional shape of the pin conductors 14, and in the illustrated embodiment with pin conductors 14 of a square cross-sectional configuration, the apertures 22 are also conveniently square.
~s shown in Figure 3, one end 24 oL each pin conductor 22 is flush with the outwardly facing surface 26 of the upper wafer 12a while the other end 28 sf each pin conductor 14 extends outwardly beyond the outwardly facing surface 26 of the other wafer 12b. m e outward extension of the end 28 is governed by the specific a~pplication intended, it bein~ n~cessary only that the out~Jard extension be sufficient to enable connectoin of the conductor 14 to an appropriate female conductor of conventional design ~not shown)~
In one con~7entional form of the Llat circuit mem~er 16~ the conductiny regions 18, defined on an upper surface of a ~ase film 30, are covered ~y a thin insulating film 32, such as "l~i~71ar'~0r ine like.
In accordance w1th one embodiment of present invention, the region imm~diately surrounding the point of intended termination of the conducting region 18 within the pin conductor 14 is maintained free of the insulating film 32, creating a gap 34, shGwn in Figure 3.
Preferably, the pin conductor receivin~ apertures 22 are made of sufficiently small size to frictior~lly secure the pin conductors 14 within them. This can be accom-plished by producing a very close tolerance betsYeen the inside size of the apertures 22 and the outside shcape of the pin * Trade Mark ~831 S3~
conductors 14 such that sufficient friction is generated upon insertion to retain the conductors 14 within the apert~res 22. AlternativelyJ the wafers 12 may be made of somewhat resilient material such as hard rubber, resilient plastic or the like such that the conductors 14 are resiliently gripped by the wafers 12 as they force the wafer 12 material outwardly upon penetration.
The method of making the circuit assembly 10, illustrated in Figures 2 and 4A through 4C involves positioning the wafers 12a and 12b on opposite sides of the flat flexible circuit member 16. The pin conductor receiving apertures 22 of one wafer 12 are aligned with those of the opposite wafer 12, each adjacent and preferably in abutting relationship with the location on the conducting region 18 to be terminated.
The alignment apertures 20 of each wafer 12 and the apertures 20A of the member 16 are also aligned with each other. In accordance with one preferred embodiment of the present invention; the pin conductors 14 are preloaded into the wafer 12a, as shown in Figure 2, so that the conductors 14 initially extend out of the outwardly facing surface 26 away from the member 16.
As shown in Figure 4A, a preferred method for aligning the apertures 22 with each other and with ~he desired location for termination utilizes a plate 36 with a pair of upwardly extending, spaced posts 38.
Since the spacing between the posts 38 coincides with that between the apertures 20, the conveniently curved free ends 40 of each post 38 are telescoped through the apertures 20 of the wafer 12b and the flat flexible circuit member 16. In this way the apertures 22 of the wafer 12b are accurately aligned with the desired location of the point of termination on the circuit member 16. The other wafer 12a is then positioned on the i3~
plate 36 with the posts 38 extending through its alignment apertures 20 as well.
In an embodiment in which the pin conductors 14 are preloaded into the wafer 12a, ~he wafer 12a is positioned atop the circuit member 16 with the pin conductors 14 extending outwardly away from the member 16. If desired, the pin conductors 14 are not preloaded into the wafer 12a but are machine fed into the wafers 12 in one operation after the wafers 12 are located in 21 ignment.
In the illustrated embodiment using a preloaded wafer~ press 44 is initially located over the free ends 24 of the pin conductors 14 now extending upwardly away from the upper wafer 12a. The press 44 is operated to move toward the assembly 10, as indicated by the arrow in Figure 4B, causing the pin conductors 14 to push through the circuit member 16, forming apertures at the desired location in the conducting region 18 as the conductors 14 pass through the member 16 and into the wafer 12b.
The downward motion of the press 44 is continued until the pin conductors 14, force fitted into the apertures 22, are in the position, shown in Figure 4B, with the ends 24 of the pin conductors 14 flush with the upper surface of the wafer 12a and the ends 28 extending downwardly from the outwardly facing surface 26 of the wafer 12b. Apertures 46 are provided in the plate 36 to receive the ends 28 of the conductors 14 as they are pressed through the lower wafer 12b. Preferably the apertures 46 are larger than the apertures 22 so that the conductors 14 freely slide through the apertures 46, the apertures 46 merely providing clearance for movement of the conductors 14.
The press 44 is thereafter withdrawn, as shown in Figure 4C, and the completed circuit assembly 10 may be lifted from the plate 36. The resulting circuit assembly 10 is sturdy and may easily be connected to a 536~
conventional female connector ~no~ shown). Thus~ despite the flexible nature of the circuit member 16, a stable mechanical base is formed for subsequent connection to other components. If desired, a plurality of assemblies 10 may be formed on one member 16 in the same operation.
This invention relates generally to a method for terminating a flat flexible circuit member with a pin conductor.
Due to their low cost, flat flexible circuit members wherein a pattern of conducting regions are defined by coating or the like on a flexible plastic film have gained widespread acceptance. While the flat flexible circuit members have many advan-tages, some difficulty is experienced in terminating such members because of their flexibility.
In the past flat, flexible circuit members have been terminated in one of two ways. In one method, known as the insulation displacement method, the circuit member is pierced with a sharp portion of a terminal and the terminal is then either crimped or clinched against the circuit member. In the other method, prepunched holes are formed in the circuit member and a pin conductor or the like is then inserted through the holes.
The insulation displacement method is less than optimal since the displacement of the insulation may be incomplete, interfering with the electrical connection between the conducting region on the circuit member and the terminal itself. In addition, the flexibility of the circuit member makes it difficult to crimp or clinch the sharp portion of the terminal to the circuit member. The method involving prepunching of holes in the circuit member is disadvantageous since a requirement of prepunched holes adds additional cost to the production of the circuit member.
It is, therefore, the principle object of the present invention to provide a method of making a circuit assembly in which a flat flexible circuit member is terminated with a pin conductor in a manner which is efficient and inexpensive and overcomes many of the disadvantages experienced in the prior art.
~f~"
i;3~
In accordance with a broad aspect of the invention there is provided a method of making a circuit assembly including a flat, flexible curcuit member with a conducting region defined thereon, said member terminated by a pin conductor, comprising the steps of: arranging a pair of relative~y rigid wafers in opposed relationship on opposite sides of a flexible circuit member, inserting a pair of alignment posts having first.
ends secured to a support plate, through a pair of equally spaced apertures in each of said wafers and said circuit member in order to align an aperture in one of said wafers with an aperture of the other wafer and with a conducting region defined on said member, pressing a pin conductor through said aligned apertures of said wafers and said conducting region, forming an aperture in said conducting region thereby, said pin conductor being pressed through said wafers until one end of said pin conductor is flush with the surface of one of said wafers and the other end of said pin conductor extends outwardly of the woutwardly facing surface of the other of said wafers, and securing said conductor within each of said apertures so as to force fit said pin conductor in said wafers, with said pin conductor in electrical contact with the said conducting region and extending outwardly of one of said wafers.
The invention will now be further described in conjunction with the accompanying drawings, in which:
Figure 1 is a partial perspective view of one embodiment of the circuit assembly of the present invention;
Figure 2 is an exploded view of the circuit assemb.ly shown in ~ 8~S3~i Figure l;
Figure 3 is an enlarged cross-sectional view taken generally along the line 3-3 in Figure l; and Figures 4A through 4C are fragmentary front elevational views illustrating the method of forming the circuit assembly shown in Figure 1.
Turning now to the figures, Figure 1 illustrates a circuit assembly, generally designated 10, of the present invention including a pair of opposed relatively rigid electrically insulating wafers 12~ a plurality of pin conductors 14 and a flat flexible circuit member 16 with a plurality of conducting regions 18 defined thereon. The wafers 12 are arranged in opposed relationship on opposite sides of the circuit member 16 with the pin conductors 14 extending through the wafers 12 and the circuit member 16 so as to secure -the entire assembly 10 together in a stable mounting.
Each wafer 12 is conveniently formed of a nonconducting material such as plastic or the like, preferably of sufficient thickness to have greater rigidity than that possessed by the flexible circuit member 16.
In the preferred embodiment wafers 12 are sufficiently stiff to resist manual flexing. As used herein the term "relatively rigid wafers" means only that the wafers are less flexible than the flexible circuit member 16 resulting in a composite assembly 10 of greater stability. The wafers 12 are identical, with a pair of alignment apertures 20 arranged on opposite ends of the conveniently rectangular wafer 12 and a plurality of pin conductor receiving apertures 22 arranged in a line between the alignment apertures 20. The member 16 is also provided with a pair of alignment apertures 20A3 similar in size and spacing with apertures 20 provided in the wafers 12 and located to either side of the intended 3~
point of termination~ E`or example, each wafer 12 r~ay convem ently ~e made of a plastic such as polypro~ylene molded in ~le form of a rectangular block approximately 2.5 centimeters in length, 0.6 centimeters in width and 0.3 centir~2ters thick, ~he apertu~es 20 and 22 beinc~ formed during the moldiny process. me configuration of ~le apertures 22 corresponds with the cross-sectional shape of the pin conductors 14, and in the illustrated embodiment with pin conductors 14 of a square cross-sectional configuration, the apertures 22 are also conveniently square.
~s shown in Figure 3, one end 24 oL each pin conductor 22 is flush with the outwardly facing surface 26 of the upper wafer 12a while the other end 28 sf each pin conductor 14 extends outwardly beyond the outwardly facing surface 26 of the other wafer 12b. m e outward extension of the end 28 is governed by the specific a~pplication intended, it bein~ n~cessary only that the out~Jard extension be sufficient to enable connectoin of the conductor 14 to an appropriate female conductor of conventional design ~not shown)~
In one con~7entional form of the Llat circuit mem~er 16~ the conductiny regions 18, defined on an upper surface of a ~ase film 30, are covered ~y a thin insulating film 32, such as "l~i~71ar'~0r ine like.
In accordance w1th one embodiment of present invention, the region imm~diately surrounding the point of intended termination of the conducting region 18 within the pin conductor 14 is maintained free of the insulating film 32, creating a gap 34, shGwn in Figure 3.
Preferably, the pin conductor receivin~ apertures 22 are made of sufficiently small size to frictior~lly secure the pin conductors 14 within them. This can be accom-plished by producing a very close tolerance betsYeen the inside size of the apertures 22 and the outside shcape of the pin * Trade Mark ~831 S3~
conductors 14 such that sufficient friction is generated upon insertion to retain the conductors 14 within the apert~res 22. AlternativelyJ the wafers 12 may be made of somewhat resilient material such as hard rubber, resilient plastic or the like such that the conductors 14 are resiliently gripped by the wafers 12 as they force the wafer 12 material outwardly upon penetration.
The method of making the circuit assembly 10, illustrated in Figures 2 and 4A through 4C involves positioning the wafers 12a and 12b on opposite sides of the flat flexible circuit member 16. The pin conductor receiving apertures 22 of one wafer 12 are aligned with those of the opposite wafer 12, each adjacent and preferably in abutting relationship with the location on the conducting region 18 to be terminated.
The alignment apertures 20 of each wafer 12 and the apertures 20A of the member 16 are also aligned with each other. In accordance with one preferred embodiment of the present invention; the pin conductors 14 are preloaded into the wafer 12a, as shown in Figure 2, so that the conductors 14 initially extend out of the outwardly facing surface 26 away from the member 16.
As shown in Figure 4A, a preferred method for aligning the apertures 22 with each other and with ~he desired location for termination utilizes a plate 36 with a pair of upwardly extending, spaced posts 38.
Since the spacing between the posts 38 coincides with that between the apertures 20, the conveniently curved free ends 40 of each post 38 are telescoped through the apertures 20 of the wafer 12b and the flat flexible circuit member 16. In this way the apertures 22 of the wafer 12b are accurately aligned with the desired location of the point of termination on the circuit member 16. The other wafer 12a is then positioned on the i3~
plate 36 with the posts 38 extending through its alignment apertures 20 as well.
In an embodiment in which the pin conductors 14 are preloaded into the wafer 12a, ~he wafer 12a is positioned atop the circuit member 16 with the pin conductors 14 extending outwardly away from the member 16. If desired, the pin conductors 14 are not preloaded into the wafer 12a but are machine fed into the wafers 12 in one operation after the wafers 12 are located in 21 ignment.
In the illustrated embodiment using a preloaded wafer~ press 44 is initially located over the free ends 24 of the pin conductors 14 now extending upwardly away from the upper wafer 12a. The press 44 is operated to move toward the assembly 10, as indicated by the arrow in Figure 4B, causing the pin conductors 14 to push through the circuit member 16, forming apertures at the desired location in the conducting region 18 as the conductors 14 pass through the member 16 and into the wafer 12b.
The downward motion of the press 44 is continued until the pin conductors 14, force fitted into the apertures 22, are in the position, shown in Figure 4B, with the ends 24 of the pin conductors 14 flush with the upper surface of the wafer 12a and the ends 28 extending downwardly from the outwardly facing surface 26 of the wafer 12b. Apertures 46 are provided in the plate 36 to receive the ends 28 of the conductors 14 as they are pressed through the lower wafer 12b. Preferably the apertures 46 are larger than the apertures 22 so that the conductors 14 freely slide through the apertures 46, the apertures 46 merely providing clearance for movement of the conductors 14.
The press 44 is thereafter withdrawn, as shown in Figure 4C, and the completed circuit assembly 10 may be lifted from the plate 36. The resulting circuit assembly 10 is sturdy and may easily be connected to a 536~
conventional female connector ~no~ shown). Thus~ despite the flexible nature of the circuit member 16, a stable mechanical base is formed for subsequent connection to other components. If desired, a plurality of assemblies 10 may be formed on one member 16 in the same operation.
Claims (4)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A method of making a circuit assembly including a flat, flexible circuit member with a conducting region defined thereon, said member terminated by a pin conductor, comprising the steps of:
arranging a pair of relatively rigid wafers in opposed relationship on opposite sides of a flexible circuit member, inserting a pair of alignment posts having first ends secured to a support plate, through a pair of equally spaced apertures in each of said wafers and said circuit member in order to align an aperture in one of said wafers with an aperture of the other wafer and with a conducting region defined on said member, pressing a pin conductor through said aligned apertures of said wafers and said conducting region, forming an aperture in said conducting region thereby, said pin conductor being pressed through said wafers until one end of said pin conductor is flush with the surface of one of said wafers and the other end of said pin conductor extends outwardly of the outwardly facing surface of the other of said wafers, and securing said conductor within each of said apertures so as to force fit said pin conductor in said wafers, with said pin conductor in electrical contact with the said conducting region and extending outwardly of one of said wafers.
arranging a pair of relatively rigid wafers in opposed relationship on opposite sides of a flexible circuit member, inserting a pair of alignment posts having first ends secured to a support plate, through a pair of equally spaced apertures in each of said wafers and said circuit member in order to align an aperture in one of said wafers with an aperture of the other wafer and with a conducting region defined on said member, pressing a pin conductor through said aligned apertures of said wafers and said conducting region, forming an aperture in said conducting region thereby, said pin conductor being pressed through said wafers until one end of said pin conductor is flush with the surface of one of said wafers and the other end of said pin conductor extends outwardly of the outwardly facing surface of the other of said wafers, and securing said conductor within each of said apertures so as to force fit said pin conductor in said wafers, with said pin conductor in electrical contact with the said conducting region and extending outwardly of one of said wafers.
2. The method of claim 1 including the step of supporting the other of said wafers with said support plate preparatory to said pressing, and receiving the other end of said pin conductor during said pressing in a pin receiving aperture formed in said support plate.
3. The method of claim 1 including the step of locating said pin conductor partially within the aperture in one of said wafers preparatory to aligning the apertures of said wafers with each other and with said conducting region.
4. The method of claim 1 including the steps of covering said conducting region with an insulating film and maintaining the region surrounding the point of intended temrination free of said film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US30334781A | 1981-09-18 | 1981-09-18 | |
| US303,347 | 1981-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1181530A true CA1181530A (en) | 1985-01-22 |
Family
ID=23171671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000409475A Expired CA1181530A (en) | 1981-09-18 | 1982-08-16 | Circuit assembly and method of making same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5925346B2 (en) |
| CA (1) | CA1181530A (en) |
| DE (1) | DE3231380C2 (en) |
| FR (1) | FR2513444B1 (en) |
| GB (1) | GB2107135B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2736214A1 (en) * | 1995-06-29 | 1997-01-03 | Siemens Automotive Sa | Electrical contact pin mounting on flexible flat pcb |
| DE19646716B4 (en) * | 1996-11-12 | 2008-08-28 | Molex Inc., Lisle | Electrical connector, in particular for motor vehicles |
| DE19940543A1 (en) * | 1999-08-26 | 2001-03-01 | Abb Patent Gmbh | Electrical switch device for motor vehicle, has moving contact with dished parts which rest on insulating base having guide holes for pins of moving contact |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3214713A (en) * | 1961-06-30 | 1965-10-26 | Sanders Associates Inc | Flexible printed circuit cable connector |
| GB1177831A (en) * | 1967-01-23 | 1970-01-14 | J & S Engineers Ltd | Methods and Apparatus for Providing Connections Between Printed Circuits |
| US3433888A (en) * | 1967-01-24 | 1969-03-18 | Electro Mechanisms Inc | Dimensionally stable flexible laminate and printed circuits made therefrom |
| US4012093A (en) * | 1971-08-25 | 1977-03-15 | The Deutsch Company Electronic Components Division | Connector arrangement for thin, deflectable conductors |
| BE789365A (en) * | 1971-09-30 | 1973-03-27 | Amp Inc | ELECTRICAL CONNECTOR |
| US3924325A (en) * | 1974-07-02 | 1975-12-09 | Molex Inc | Method and apparatus for mounting terminal pins from a single side of a double sided terminal board |
| US4201436A (en) * | 1978-09-14 | 1980-05-06 | Sealectro Corporation | Miniature matrix assembly |
| FR2488739A1 (en) * | 1980-08-18 | 1982-02-19 | Renault | Automobile distribution panel multilayer flexible circuit interconnect - uses conducting plug inserted into window formed by precut flaps in printed circuit layers and rigid insulating upper and lower supports |
-
1982
- 1982-08-11 FR FR8214018A patent/FR2513444B1/en not_active Expired
- 1982-08-16 CA CA000409475A patent/CA1181530A/en not_active Expired
- 1982-08-24 DE DE3231380A patent/DE3231380C2/en not_active Expired
- 1982-09-02 JP JP57151859A patent/JPS5925346B2/en not_active Expired
- 1982-09-17 GB GB08226618A patent/GB2107135B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2513444A1 (en) | 1983-03-25 |
| JPS58161277A (en) | 1983-09-24 |
| DE3231380C2 (en) | 1986-12-11 |
| JPS5925346B2 (en) | 1984-06-16 |
| GB2107135A (en) | 1983-04-20 |
| GB2107135B (en) | 1985-08-07 |
| DE3231380A1 (en) | 1983-04-07 |
| FR2513444B1 (en) | 1987-08-21 |
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