BRPI0908323A2 - método para poduzir um artigo sobremoldado - Google Patents

método para poduzir um artigo sobremoldado

Info

Publication number
BRPI0908323A2
BRPI0908323A2 BRPI0908323A BRPI0908323A BRPI0908323A2 BR PI0908323 A2 BRPI0908323 A2 BR PI0908323A2 BR PI0908323 A BRPI0908323 A BR PI0908323A BR PI0908323 A BRPI0908323 A BR PI0908323A BR PI0908323 A2 BRPI0908323 A2 BR PI0908323A2
Authority
BR
Brazil
Prior art keywords
producing
overmolded article
overmolded
article
Prior art date
Application number
BRPI0908323A
Other languages
English (en)
Inventor
R Keenihan James
M Clarey Todd
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0908323A2 publication Critical patent/BRPI0908323A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S30/00—Structural details of PV modules other than those related to light conversion
    • H02S30/10—Frame structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14377—Coating a portion of the article, e.g. the edge of the article using an additional insert, e.g. a fastening element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
BRPI0908323A 2008-05-05 2009-05-01 método para poduzir um artigo sobremoldado BRPI0908323A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5034108P 2008-05-05 2008-05-05
PCT/US2009/042507 WO2009137351A2 (en) 2008-05-05 2009-05-01 Improved method for encapsulating the edge of a flexible sheet

Publications (1)

Publication Number Publication Date
BRPI0908323A2 true BRPI0908323A2 (pt) 2018-07-17

Family

ID=41265318

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0908323A BRPI0908323A2 (pt) 2008-05-05 2009-05-01 método para poduzir um artigo sobremoldado

Country Status (8)

Country Link
US (1) US8377358B2 (pt)
EP (1) EP2282891B1 (pt)
JP (1) JP2011519755A (pt)
KR (1) KR101249273B1 (pt)
CN (1) CN102017108B (pt)
BR (1) BRPI0908323A2 (pt)
ES (1) ES2526932T3 (pt)
WO (1) WO2009137351A2 (pt)

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US20100108118A1 (en) * 2008-06-02 2010-05-06 Daniel Luch Photovoltaic power farm structure and installation
US8884155B2 (en) 2006-04-13 2014-11-11 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9865758B2 (en) 2006-04-13 2018-01-09 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
FR2914785B1 (fr) * 2007-04-06 2009-05-15 Saint Gobain Ct Recherches Revetement de toiture photovoltaique
CN102470659B (zh) 2009-08-13 2014-10-22 陶氏环球技术有限责任公司 多层层压结构体及制造方法
US9935289B2 (en) 2010-09-10 2018-04-03 Industrial Technology Research Institute Institute Environmental sensitive element package and encapsulation method thereof
CN103348493B (zh) 2010-12-17 2016-01-27 陶氏环球技术有限责任公司 改良的光伏器件
US9231123B1 (en) 2011-03-08 2016-01-05 Apollo Precision (Fujian) Limited Flexible connectors for building integrable photovoltaic modules
US9112080B1 (en) 2011-03-11 2015-08-18 Apollo Precision (Kunming) Yuanhong Limited Electrical connectors of building integrable photovoltaic modules
US20170151719A1 (en) 2011-08-29 2017-06-01 Impossible Objects Llc Methods and Apparatus for Three-Dimensional Printed Composites Based on Folded Substrate Sheets
US9833949B2 (en) 2011-08-29 2017-12-05 Impossible Objects, Inc. Apparatus for fabricating three-dimensional printed composites
EP3345744A1 (en) 2011-08-29 2018-07-11 Impossible Objects, Inc. Methods and apparatus for 3d fabrication
US9776376B2 (en) 2011-08-29 2017-10-03 Impossible Objects, LLC Methods and apparatus for three-dimensional printed composites based on flattened substrate sheets
US9577133B2 (en) 2011-11-16 2017-02-21 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Flexible connectors of building integrable photovoltaic modules for enclosed jumper attachment
US9634606B2 (en) 2011-11-30 2017-04-25 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Offset building integrable photovoltaic structures and assemblies having multi-conductor return lines
US8613169B2 (en) 2012-01-06 2013-12-24 Miasole Electrical routing structures for building integrable photovoltaic arrays
EP2856507A4 (en) * 2012-05-29 2016-01-27 Essence Solar Solutions Ltd FRAME HOLDER FOR AN OPTICAL ELEMENT
CN103855105B (zh) 2012-12-06 2017-04-26 财团法人工业技术研究院 环境敏感电子元件封装体及其制作方法
US9847512B2 (en) 2012-12-22 2017-12-19 Industrial Technology Research Institute Electronic device package structure and manufacturing method thereof
US10343243B2 (en) 2013-02-26 2019-07-09 Robert Swartz Methods and apparatus for construction of machine tools
US9393770B2 (en) 2013-03-06 2016-07-19 Impossible Objects, LLC Methods for photosculpture
US9847509B2 (en) 2015-01-22 2017-12-19 Industrial Technology Research Institute Package of flexible environmental sensitive electronic device and sealing member
PL3093115T3 (pl) * 2015-05-13 2018-01-31 Stefan Pfaff Werkzeug Und Formenbau Gmbh Co Kg Urządzenie przyjmujące i sposób natryskiwania
DE102015109279B4 (de) * 2015-06-11 2024-01-04 Webasto SE Verfahren zur Herstellung eines faltbaren und/oder aufwickelbaren Funktionselements sowie Windabweiserelement und Rollobahn einer Rolloanordnung eines Kraftfahrzeugs
WO2017087546A1 (en) 2015-11-17 2017-05-26 Impossible Objects, LLC Additive manufacturing method and apparatus
JP6895445B2 (ja) 2016-02-12 2021-06-30 インポッシブル オブジェクツ，エルエルシー 自動化された複合系付加製造のための方法および装置
US10946592B2 (en) 2016-09-11 2021-03-16 Impossible Objects, Inc. Resistive heating-compression method and apparatus for composite-based additive manufacturing
US10784816B2 (en) * 2018-12-20 2020-09-22 Hall Labs Llc Electrical and mechanical roof underlayment
KR102303600B1 (ko) 2017-03-17 2021-09-23 임파서블 오브젝츠, 아이앤씨. 인쇄 공정용 분말 시스템 리사이클러를 위한 방법 및 장치
US11040490B2 (en) 2017-03-17 2021-06-22 Impossible Objects, Inc. Method and apparatus for platen module for automated composite-based additive manufacturing machine
US10597249B2 (en) 2017-03-17 2020-03-24 Impossible Objects, Inc. Method and apparatus for stacker module for automated composite-based additive manufacturing machine
US10425035B2 (en) 2017-09-15 2019-09-24 Miasolé Hi-Tech Corp. Module connector for flexible photovoltaic module

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Also Published As

Publication number Publication date
JP2011519755A (ja) 2011-07-14
US20110101564A1 (en) 2011-05-05
WO2009137351A3 (en) 2010-02-25
US8377358B2 (en) 2013-02-19
EP2282891A2 (en) 2011-02-16
CN102017108A (zh) 2011-04-13
KR101249273B1 (ko) 2013-04-01
EP2282891B1 (en) 2014-11-19
CN102017108B (zh) 2013-11-06
ES2526932T3 (es) 2015-01-16
WO2009137351A2 (en) 2009-11-12
KR20110014631A (ko) 2011-02-11

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 6A, 7A, 8A E 9A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2481 DE 24-07-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.