BRPI0822705A2 - Painel de ligações impresso e método para fabricar o mesmo - Google Patents

Painel de ligações impresso e método para fabricar o mesmo

Info

Publication number
BRPI0822705A2
BRPI0822705A2 BRPI0822705-5A BRPI0822705A BRPI0822705A2 BR PI0822705 A2 BRPI0822705 A2 BR PI0822705A2 BR PI0822705 A BRPI0822705 A BR PI0822705A BR PI0822705 A2 BRPI0822705 A2 BR PI0822705A2
Authority
BR
Brazil
Prior art keywords
manufacturing
same
patch panel
printed patch
printed
Prior art date
Application number
BRPI0822705-5A
Other languages
English (en)
Inventor
Michimasa Takahashi
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of BRPI0822705A2 publication Critical patent/BRPI0822705A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10484—Obliquely mounted
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
BRPI0822705-5A 2008-05-19 2008-12-22 Painel de ligações impresso e método para fabricar o mesmo BRPI0822705A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7179008P 2008-05-19 2008-05-19
PCT/JP2008/073344 WO2009141928A1 (ja) 2008-05-19 2008-12-22 プリント配線板及びその製造方法

Publications (1)

Publication Number Publication Date
BRPI0822705A2 true BRPI0822705A2 (pt) 2015-07-07

Family

ID=41315060

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0822705-5A BRPI0822705A2 (pt) 2008-05-19 2008-12-22 Painel de ligações impresso e método para fabricar o mesmo

Country Status (8)

Country Link
US (2) US8431829B2 (pt)
EP (1) EP2280594A4 (pt)
JP (1) JPWO2009141928A1 (pt)
KR (1) KR101198061B1 (pt)
CN (1) CN102037796A (pt)
BR (1) BRPI0822705A2 (pt)
TW (1) TW201004499A (pt)
WO (1) WO2009141928A1 (pt)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7982135B2 (en) * 2006-10-30 2011-07-19 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
US8400782B2 (en) 2009-07-24 2013-03-19 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
JP2011119616A (ja) * 2009-12-07 2011-06-16 Fujitsu Ltd プリント配線基板の製造方法、プリント配線基板、および電子装置
CN102771200A (zh) * 2010-02-22 2012-11-07 三洋电机株式会社 多层印刷电路板及其制造方法
CN102548253B (zh) * 2010-12-28 2013-11-06 富葵精密组件(深圳)有限公司 多层电路板的制作方法
WO2012089275A1 (en) 2010-12-30 2012-07-05 Option Wireless Limited Multi board module with implant
KR101789237B1 (ko) * 2011-01-19 2017-10-24 삼성디스플레이 주식회사 액정 표시 장치
DE102011051411A1 (de) * 2011-06-28 2013-01-03 Schweizer Electronic Ag Prepreg, Verfahren zum Herstellen eines Prepregs, Verfahren zum Herstellen eines Leiterplattenelements sowie Leiterplattenelement
US20130025914A1 (en) * 2011-07-25 2013-01-31 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
FR2985367A1 (fr) * 2011-12-29 2013-07-05 3D Plus Procede de fabrication collective de modules electroniques 3d ne comportant que des pcbs valides
JP5406322B2 (ja) * 2012-03-01 2014-02-05 株式会社フジクラ 電子部品内蔵多層配線基板及びその製造方法
JP5261756B1 (ja) * 2012-03-30 2013-08-14 株式会社フジクラ 多層配線基板
TWI465163B (zh) * 2012-04-20 2014-12-11 Bridge Semiconductor Corp 具有內建加強層之凹穴基板及其製造方法
WO2013168539A1 (ja) * 2012-05-09 2013-11-14 株式会社村田製作所 樹脂多層基板およびその製造方法
US20130337648A1 (en) * 2012-06-14 2013-12-19 Bridge Semiconductor Corporation Method of making cavity substrate with built-in stiffener and cavity
JP6082233B2 (ja) * 2012-10-31 2017-02-15 イビデン株式会社 配線板及びその製造方法
FR3001602B1 (fr) 2013-01-25 2021-05-14 Thales Sa Procede de fabrication d'un circuit imprime
JP6160308B2 (ja) * 2013-07-02 2017-07-12 富士通株式会社 積層基板
CN205213161U (zh) 2013-09-06 2016-05-04 株式会社村田制作所 多层基板
US9433077B2 (en) * 2014-02-14 2016-08-30 International Business Machines Corporation Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section
US9351410B2 (en) 2014-03-07 2016-05-24 Fujikura Ltd. Electronic component built-in multi-layer wiring board and method of manufacturing the same
US9699921B2 (en) 2014-08-01 2017-07-04 Fujikura Ltd. Multi-layer wiring board
CN105657971B (zh) * 2014-11-14 2018-11-20 欣兴电子股份有限公司 内埋式元件封装结构及其制作方法
KR102163039B1 (ko) * 2015-04-07 2020-10-08 삼성전기주식회사 인쇄회로기판, 그 제조방법, 및 전자부품 모듈
US10098241B2 (en) 2015-10-23 2018-10-09 International Business Machines Corporation Printed circuit board with edge soldering for high-density packages and assemblies
JP2017123459A (ja) * 2016-01-08 2017-07-13 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板
JP7096992B2 (ja) * 2017-10-31 2022-07-07 大日本印刷株式会社 貫通電極基板及び実装基板
CN110278657B (zh) * 2018-03-16 2022-05-27 宏启胜精密电子(秦皇岛)有限公司 复合电路板及其制造方法
US11178772B2 (en) * 2018-03-29 2021-11-16 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier connected with a separate tilted component carrier for short electric connection
CN116075074A (zh) * 2021-11-02 2023-05-05 宏启胜精密电子(秦皇岛)有限公司 电路板及其制造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
JPH11317582A (ja) * 1998-02-16 1999-11-16 Matsushita Electric Ind Co Ltd 多層配線基板およびその製造方法
US6281446B1 (en) * 1998-02-16 2001-08-28 Matsushita Electric Industrial Co., Ltd. Multi-layered circuit board and method of manufacturing the same
JP2000165007A (ja) 1998-11-27 2000-06-16 Nec Corp プリント配線板、電子部品及び電子部品の実装方法
JP3795270B2 (ja) 1999-09-10 2006-07-12 大日本印刷株式会社 多層プリント配線基板製造方法及び多層プリント配線基板
US6459046B1 (en) * 2000-08-28 2002-10-01 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method for producing the same
JP4166532B2 (ja) * 2002-08-27 2008-10-15 大日本印刷株式会社 プリント配線板の製造方法
JP2005045150A (ja) * 2003-07-25 2005-02-17 Matsushita Electric Ind Co Ltd 中間接続用配線基材および多層配線基板、ならびにこれらの製造方法
TWI246375B (en) * 2004-05-06 2005-12-21 Siliconware Precision Industries Co Ltd Circuit board with quality-identified mark and method for identifying the quality of circuit board
JP2006024744A (ja) * 2004-07-08 2006-01-26 Renesas Technology Corp 半導体装置および半導体装置の製造方法
TWI414218B (zh) * 2005-02-09 2013-11-01 Ngk Spark Plug Co 配線基板及配線基板內建用之電容器
JP4880277B2 (ja) * 2005-10-06 2012-02-22 日本特殊陶業株式会社 配線基板の製造方法
US8071883B2 (en) 2006-10-23 2011-12-06 Ibiden Co., Ltd. Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same
EP2434848A1 (en) 2006-10-24 2012-03-28 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
TWI339880B (en) 2007-05-31 2011-04-01 Unimicron Technology Corp Structure of pachaging substrate and package structure thereof having chip embedded therein
CN102037797B (zh) 2008-05-23 2013-11-06 揖斐电株式会社 印刷电路板及其制造方法

Also Published As

Publication number Publication date
US8431829B2 (en) 2013-04-30
TW201004499A (en) 2010-01-16
WO2009141928A1 (ja) 2009-11-26
US20130213694A1 (en) 2013-08-22
EP2280594A4 (en) 2012-06-27
CN102037796A (zh) 2011-04-27
US20090283312A1 (en) 2009-11-19
KR101198061B1 (ko) 2012-11-07
KR20100102193A (ko) 2010-09-20
JPWO2009141928A1 (ja) 2011-09-29
US9029713B2 (en) 2015-05-12
EP2280594A1 (en) 2011-02-02

Similar Documents

Publication Publication Date Title
BRPI0822705A2 (pt) Painel de ligações impresso e método para fabricar o mesmo
FI20075269A0 (fi) Menetelmä ja järjestely antennin sovittamiseksi
FI20075978A0 (fi) Järjestely ja menetelmä
BR112012015322A2 (pt) propante e método para formar o propante
BRPI0817226A2 (pt) Método
BRPI0817726A2 (pt) Método
FI20065348A0 (fi) Spektrometri ja inferferometrinen menetelmä
BRPI0817292A2 (pt) Método e aparelho para completação de poços.
BRPI0915481A2 (pt) material e método para produzir o mesmo
EP2271182A4 (en) ORGANIC ELECTROLUMINESCENCE ELEMENT AND MANUFACTURING METHOD THEREOF
BRPI0810850A2 (pt) Processo para carbonilação de dimetil éter
BRPI1012024A2 (pt) dispositivo de exibição de eletroluminescente orgânico e método para fabricação do mesmo.
BRPI0807005A2 (pt) Manta impressa e método de produção
BRPI0810846A2 (pt) Processo para carbonilção de dimetil éter
EP2173009A4 (en) WIRELESS LABEL AND METHOD FOR MANUFACTURING THE SAME
BRPI0817667A2 (pt) Método de marcação
EP2118957A4 (en) METHOD FOR MANUFACTURING RF DEVICE AND RF DEVICE MADE THEREFROM
BRPI0816911A2 (pt) Processo para preparação de 4-aminobut-2-enolidas
EP2234466A4 (en) MOUNTED PLATE AND METHOD FOR THEIR PRODUCTION
BRPI0811786A2 (pt) Acionador para inalador dosimetrado
EP2234186A4 (en) ORGANIC ELECTROLUMINESCENCE ELEMENT AND METHOD FOR MANUFACTURING THE SAME
BRPI0814212A2 (pt) Aparelho e método para produzir composto de époxi.
BRPI0807973A2 (pt) Método de enrolamento de propriedades uniformes
BRPI0915443A2 (pt) aparelho de aquecimento e método para produzir o aparelho de aquecimento
BRPI0816237A2 (pt) Processo de ciclopropanação

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 5A, 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2343 DE 01-12-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.