BRPI0705011A - eletrodo negativo cilìndrico de deposição fìsica de vapor (pvd) - Google Patents
eletrodo negativo cilìndrico de deposição fìsica de vapor (pvd)Info
- Publication number
- BRPI0705011A BRPI0705011A BRPI0705011-9A BRPI0705011A BRPI0705011A BR PI0705011 A BRPI0705011 A BR PI0705011A BR PI0705011 A BRPI0705011 A BR PI0705011A BR PI0705011 A BRPI0705011 A BR PI0705011A
- Authority
- BR
- Brazil
- Prior art keywords
- pvd
- evaporation material
- negative electrode
- vapor deposition
- substrate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1303—Paper containing [e.g., paperboard, cardboard, fiberboard, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/1355—Elemental metal containing [e.g., substrate, foil, film, coating, etc.]
- Y10T428/1359—Three or more layers [continuous layer]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/139—Open-ended, self-supporting conduit, cylinder, or tube-type article
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Materials For Medical Uses (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
Abstract
ELETRODO NEGATIVO CILìNDRICO DE DEPOSIçãO FìSICA DE VAPOR A presente invenção proporciona um eletrodo negativo cilíndrico de deposição física de vapor (PVD) que compreende um material de evaporação cobrindo a superfície circunferencial externa de um substrato cilíndrico, o eletrodo negativo cilíndrico de PVD inclui uma parte de acoplamento dotada de pelo menos qualquer uma forma protuberante e uma forma rebaixada, formada com partes angulares arredondadas na interface entre o substrato e o material de evaporação. De acordo com essa estrutura, desfolhamento ou fissuramento do material de evaporação por parte de urna tensão residual provocada na interface entre o substrato e o material de evaporação por uma diferença de expansão térmica entre os dois pode ser suprimida, e pode-se assegurar também aderência suficiente entre os dois.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006179874A JP4680841B2 (ja) | 2006-06-29 | 2006-06-29 | Pvd用筒状ターゲット |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0705011A true BRPI0705011A (pt) | 2008-05-20 |
Family
ID=38617304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0705011-9A BRPI0705011A (pt) | 2006-06-29 | 2007-06-29 | eletrodo negativo cilìndrico de deposição fìsica de vapor (pvd) |
Country Status (8)
Country | Link |
---|---|
US (1) | US7955673B2 (pt) |
EP (1) | EP1873274B1 (pt) |
JP (1) | JP4680841B2 (pt) |
CN (1) | CN101096750B (pt) |
AT (1) | ATE478973T1 (pt) |
BR (1) | BRPI0705011A (pt) |
DE (1) | DE602007008644D1 (pt) |
PT (1) | PT1873274E (pt) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060226003A1 (en) * | 2003-01-22 | 2006-10-12 | John Mize | Apparatus and methods for ionized deposition of a film or thin layer |
US9659758B2 (en) * | 2005-03-22 | 2017-05-23 | Honeywell International Inc. | Coils utilized in vapor deposition applications and methods of production |
US20060278520A1 (en) * | 2005-06-13 | 2006-12-14 | Lee Eal H | Use of DC magnetron sputtering systems |
DE102007044651B4 (de) * | 2007-09-18 | 2011-07-21 | W.C. Heraeus GmbH, 63450 | Rohrsputtertarget mit grabenförmig strukturierter Außenfläche des Trägerrohres sowie Verfahren zu seiner Herstellung |
US20090194414A1 (en) * | 2008-01-31 | 2009-08-06 | Nolander Ira G | Modified sputtering target and deposition components, methods of production and uses thereof |
US20130140173A1 (en) * | 2011-06-10 | 2013-06-06 | Séverin Stéphane Gérard Tierce | Rotary sputter target assembly |
CN103397301A (zh) * | 2013-07-17 | 2013-11-20 | 中国南玻集团股份有限公司 | 圆筒旋转银靶及其制备方法 |
US11183373B2 (en) | 2017-10-11 | 2021-11-23 | Honeywell International Inc. | Multi-patterned sputter traps and methods of making |
CN112743075A (zh) * | 2020-12-29 | 2021-05-04 | 宁波江丰电子材料股份有限公司 | 一种管状靶材的绑定方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6417862A (en) | 1987-07-10 | 1989-01-20 | Fujitsu Ltd | Sputtering device |
US5354446A (en) * | 1988-03-03 | 1994-10-11 | Asahi Glass Company Ltd. | Ceramic rotatable magnetron sputtering cathode target and process for its production |
JPH05230645A (ja) | 1991-12-24 | 1993-09-07 | Asahi Glass Co Ltd | セラミックス回転カソードターゲット及びその製造法 |
JPH07173622A (ja) * | 1993-12-17 | 1995-07-11 | Kobe Steel Ltd | Pvd法用円筒状ターゲット |
JPH07228967A (ja) | 1994-02-17 | 1995-08-29 | Mitsubishi Materials Corp | 長尺円筒状スパッタリングターゲット |
JPH08109472A (ja) | 1994-10-14 | 1996-04-30 | Asahi Glass Co Ltd | スパッタリング用ターゲットおよびその製造方法 |
US5593624A (en) * | 1995-05-24 | 1997-01-14 | Lewis; Eugene R. | Method for making cellular packaging board with inhibitor |
JP3810840B2 (ja) | 1996-01-16 | 2006-08-16 | 株式会社神戸製鋼所 | アークイオンプレーティング装置に用いる積層ターゲット及びその製造方法 |
JP2000199055A (ja) | 1999-01-06 | 2000-07-18 | Hitachi Metals Ltd | Crタ―ゲット材およびその製造方法 |
CN1281780C (zh) * | 2000-09-08 | 2006-10-25 | 旭硝子株式会社 | 圆筒状靶及其制造方法 |
PT1752556E (pt) | 2005-08-02 | 2008-01-22 | Applied Materials Gmbh & Co Kg | Cátodo tubular para aplicação em processo de pulverização catódica |
-
2006
- 2006-06-29 JP JP2006179874A patent/JP4680841B2/ja not_active Expired - Fee Related
-
2007
- 2007-05-30 US US11/755,318 patent/US7955673B2/en not_active Expired - Fee Related
- 2007-06-28 AT AT07111291T patent/ATE478973T1/de not_active IP Right Cessation
- 2007-06-28 DE DE602007008644T patent/DE602007008644D1/de active Active
- 2007-06-28 EP EP07111291A patent/EP1873274B1/en not_active Not-in-force
- 2007-06-28 PT PT07111291T patent/PT1873274E/pt unknown
- 2007-06-29 CN CN2007101262923A patent/CN101096750B/zh not_active Expired - Fee Related
- 2007-06-29 BR BRPI0705011-9A patent/BRPI0705011A/pt not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP1873274A2 (en) | 2008-01-02 |
JP4680841B2 (ja) | 2011-05-11 |
JP2008007824A (ja) | 2008-01-17 |
EP1873274A3 (en) | 2008-01-23 |
DE602007008644D1 (de) | 2010-10-07 |
ATE478973T1 (de) | 2010-09-15 |
CN101096750B (zh) | 2010-12-22 |
US7955673B2 (en) | 2011-06-07 |
CN101096750A (zh) | 2008-01-02 |
US20080003385A1 (en) | 2008-01-03 |
PT1873274E (pt) | 2010-09-30 |
EP1873274B1 (en) | 2010-08-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06T | Formal requirements before examination [chapter 6.20 patent gazette] |
Free format text: PARECER 6.20 |
|
B11E | Dismissal acc. art. 34 of ipl - requirements for examination incomplete | ||
B11T | Dismissal of application maintained [chapter 11.20 patent gazette] |