BR7603581A - Processo aperfeicoado para fabricacao de uma fita de interconexao de ligacao em grupo e fita aperfeicoada obtida por este processo - Google Patents

Processo aperfeicoado para fabricacao de uma fita de interconexao de ligacao em grupo e fita aperfeicoada obtida por este processo

Info

Publication number
BR7603581A
BR7603581A BR7603581A BR7603581A BR7603581A BR 7603581 A BR7603581 A BR 7603581A BR 7603581 A BR7603581 A BR 7603581A BR 7603581 A BR7603581 A BR 7603581A BR 7603581 A BR7603581 A BR 7603581A
Authority
BR
Brazil
Prior art keywords
tape
manufacturing
perfected
group connection
perfect
Prior art date
Application number
BR7603581A
Other languages
English (en)
Portuguese (pt)
Inventor
C Burns
Original Assignee
Nat Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Semiconductor Corp filed Critical Nat Semiconductor Corp
Publication of BR7603581A publication Critical patent/BR7603581A/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/047—Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
BR7603581A 1975-07-07 1976-06-04 Processo aperfeicoado para fabricacao de uma fita de interconexao de ligacao em grupo e fita aperfeicoada obtida por este processo BR7603581A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59347775A 1975-07-07 1975-07-07

Publications (1)

Publication Number Publication Date
BR7603581A true BR7603581A (pt) 1977-06-28

Family

ID=24374872

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7603581A BR7603581A (pt) 1975-07-07 1976-06-04 Processo aperfeicoado para fabricacao de uma fita de interconexao de ligacao em grupo e fita aperfeicoada obtida por este processo

Country Status (6)

Country Link
JP (1) JPS6053463B2 (https=)
BR (1) BR7603581A (https=)
CA (1) CA1052912A (https=)
DE (1) DE2630269A1 (https=)
FR (1) FR2317853A1 (https=)
GB (1) GB1522408A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4231154A (en) * 1979-01-10 1980-11-04 International Business Machines Corporation Electronic package assembly method
GB2137805B (en) * 1982-11-19 1987-01-28 Stanley Bracey Chip carrier
US4505225A (en) * 1983-08-31 1985-03-19 National Semiconductor Corporation Self-aligning apparatus for semiconductor lead frame processing means
EP0190642B1 (en) * 1985-01-31 1992-05-06 Hitachi, Ltd. Magnetic bubble memory module
DE3686990T2 (de) * 1985-08-23 1993-04-22 Nippon Electric Co Verfahren zum herstellen einer halbleiteranordnung wobei ein filmtraegerband angewendet wird.
GB2205683B (en) * 1987-04-08 1990-08-22 Casio Computer Co Ltd An electronic apparatus and a method for manufacturing the same
KR910004797B1 (ko) * 1987-04-08 1991-07-13 가시오 게이상기 가부시기가이샤 소형 전자기기 및 그 제조방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
US3859718A (en) * 1973-01-02 1975-01-14 Texas Instruments Inc Method and apparatus for the assembly of semiconductor devices
DE2414297C3 (de) * 1974-03-25 1980-01-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur teilautomatischen Herstellung von Zwischenträgern für Halbleiterbauelemente

Also Published As

Publication number Publication date
DE2630269A1 (de) 1977-01-27
CA1052912A (en) 1979-04-17
FR2317853A1 (fr) 1977-02-04
FR2317853B1 (https=) 1982-03-12
GB1522408A (en) 1978-08-23
JPS5210076A (en) 1977-01-26
JPS6053463B2 (ja) 1985-11-26

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