BR112016006523A2 - circuito integrado de sistema micro-eletro-mecânico, elemento de medição e sensor de pressão - Google Patents
circuito integrado de sistema micro-eletro-mecânico, elemento de medição e sensor de pressãoInfo
- Publication number
- BR112016006523A2 BR112016006523A2 BR112016006523A BR112016006523A BR112016006523A2 BR 112016006523 A2 BR112016006523 A2 BR 112016006523A2 BR 112016006523 A BR112016006523 A BR 112016006523A BR 112016006523 A BR112016006523 A BR 112016006523A BR 112016006523 A2 BR112016006523 A2 BR 112016006523A2
- Authority
- BR
- Brazil
- Prior art keywords
- micro
- electro
- mechanical system
- mems
- integrated circuit
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
- G01L9/0005—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using variations in capacitance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/0045—Diaphragm associated with a buried cavity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/005—Non square semiconductive diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
resumo “circuito integrado de sistema micro-eletro-mecânico, elemento de medição e sensor de pressão” um circuito integrado de sistema micro-eletro-mecânico (circuito integrado de sistema micro-eletro-mecânico (mems)) para a medição de uma pressão em um espaço de pressão (d), compreendendo um substrato de sistema micro-eletro-mecânico (mems) (30) e um substrato de suporte/carga (31), os quais são unidos, um ao outro, de uma maneira bidimensional, no qual o circuito integrado de sistema micro-eletro-mecânico (mems) (3) se encontra na forma de uma haste e tem uma região de medição (4) com meios de medição eletromecânica e então uma região de bucha (11), e então uma região de formação de contato (6) a qual é conectada a região de medição (4) através de linhas (8) e tem contatos (16), e nos quais o circuito integrado de sistema micro-eletro-mecânico (mems) (3) na região de bucha (11) é adequado para um arranjo apertado por pressão em uma bucha. de acordo com a invenção, os meios de medição eletromecânicos são configurados de tal maneira que o substrato de sistema micro-eletro-mecânico (mems) (30) tem uma cavidade (5) formando um orifício/furo cego, a borda do qual forma uma membrana (7) no substrato de sistema micro-eletro-mecânico (mems) (30), e uma ponte de medição (19) compreendendo elementos piezo resistivos (2) sobre aquele lado desta membrana (7) que fica de frente afastada a partir da cavidade (5). o substrato de sistema micro-eletro-mecânico (mems) (30) é unido ao substrato de suporte (31) com o lado da cavidade (5) voltado para o substrato de suporte (31), com o resultado que o substrato de suporte (31) forma uma parede inferior (50) da cavidade (5) formada sob a membrana (7). 1/1
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH01699/13A CH708708A1 (de) | 2013-10-03 | 2013-10-03 | Messelement zum Messen eines Drucks und Druckmesssensor. |
PCT/CH2014/000142 WO2015048916A1 (de) | 2013-10-03 | 2014-10-02 | Mems-chip, messelement und drucksensor zum messen eines drucks |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112016006523A2 true BR112016006523A2 (pt) | 2017-08-01 |
Family
ID=49322111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112016006523A BR112016006523A2 (pt) | 2013-10-03 | 2014-10-02 | circuito integrado de sistema micro-eletro-mecânico, elemento de medição e sensor de pressão |
Country Status (10)
Country | Link |
---|---|
US (1) | US9927316B2 (pt) |
EP (1) | EP3052915A1 (pt) |
JP (2) | JP2016540192A (pt) |
KR (1) | KR20160065109A (pt) |
CN (1) | CN105593657A (pt) |
BR (1) | BR112016006523A2 (pt) |
CA (1) | CA2924166A1 (pt) |
CH (1) | CH708708A1 (pt) |
MX (1) | MX360473B (pt) |
WO (1) | WO2015048916A1 (pt) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3030738B1 (fr) * | 2014-12-19 | 2020-03-20 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Capteur de pression adapte aux mesures de pression en milieu agressif |
IT201600083804A1 (it) * | 2016-08-09 | 2018-02-09 | St Microelectronics Srl | Procedimento di fabbricazione di un dispositivo a semiconduttore includente una struttura microelettromeccanica ed un associato circuito elettronico integrato e relativo dispositivo a semiconduttore |
CN109025971B (zh) * | 2018-04-28 | 2022-02-01 | 中国石油天然气股份有限公司 | 钻井压力检测装置及其膜片受力机构 |
EP3654005B1 (en) * | 2018-11-15 | 2022-05-11 | TE Connectivity Solutions GmbH | Differential pressure sensor device |
CN114555160B (zh) * | 2019-11-06 | 2023-11-21 | 艾斯曲尔医疗公司 | 喷嘴芯片 |
DE102019133325A1 (de) | 2019-12-06 | 2021-06-10 | Endress+Hauser SE+Co. KG | Druckmessaufnehmer |
DE102020206769B3 (de) * | 2020-05-29 | 2021-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Mikroelektronische anordnung und verfahren zur herstellung derselben |
CN112284608B (zh) * | 2020-09-15 | 2022-08-02 | 南京高华科技股份有限公司 | 电容式微机械气压传感器及其制备方法 |
CN112254865A (zh) * | 2020-09-15 | 2021-01-22 | 南京高华科技股份有限公司 | 电阻式微机械气压传感器及其制备方法 |
CN113155348B (zh) * | 2021-02-26 | 2023-09-12 | 西安微电子技术研究所 | 一种压阻式压力传感器信号处理模块及其集成方法 |
CN114136528B (zh) * | 2021-12-07 | 2024-03-01 | 华东光电集成器件研究所 | 一种soi压力敏感芯片 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4021766A (en) * | 1975-07-28 | 1977-05-03 | Aine Harry E | Solid state pressure transducer of the leaf spring type and batch method of making same |
US4901731A (en) * | 1988-04-27 | 1990-02-20 | Millar Instruments, Inc. | Single sensor pressure differential device |
JPH05340828A (ja) * | 1992-05-18 | 1993-12-24 | Fujikura Ltd | 半導体圧力センサ |
JPH08247873A (ja) * | 1995-03-13 | 1996-09-27 | Tokai Rika Co Ltd | 圧力センサ |
JP2001324398A (ja) * | 2000-03-07 | 2001-11-22 | Anelva Corp | 耐蝕型真空センサ |
US6626044B1 (en) | 2000-10-03 | 2003-09-30 | Honeywell International Inc. | Freeze resistant sensor |
US6505398B2 (en) * | 2000-12-04 | 2003-01-14 | Kavlico Corporation | Very high pressure miniature sensing and mounting technique |
JP4159895B2 (ja) * | 2003-02-17 | 2008-10-01 | キヤノンアネルバ株式会社 | 静電容量型圧力センサ及びその製造方法 |
EP1601942B1 (en) * | 2003-03-10 | 2008-05-07 | Danfoss A/S | Silicon pressure sensor with decreased pressure equalization between measured pressure and reference chamber |
US7111518B1 (en) * | 2003-09-19 | 2006-09-26 | Silicon Microstructures, Inc. | Extremely low cost pressure sensor realized using deep reactive ion etching |
DE102004018408A1 (de) * | 2004-04-16 | 2005-11-03 | Robert Bosch Gmbh | Kapazitiver Drucksensor und Verfahren zur Herstellung |
JP4506478B2 (ja) * | 2005-01-18 | 2010-07-21 | 株式会社デンソー | 圧力センサ |
JP4585426B2 (ja) * | 2005-10-31 | 2010-11-24 | アルプス電気株式会社 | 静電容量型圧力センサ |
EP2166330A1 (en) * | 2008-09-22 | 2010-03-24 | GE Infrastructure Sensing, Inc. | Miniature pressure transducer with elongate base wafer and operable at high temperatures |
US9340414B2 (en) * | 2009-07-07 | 2016-05-17 | MCube Inc. | Method and structure of monolithically integrated absolute pressure sensor |
US8569851B2 (en) * | 2010-06-18 | 2013-10-29 | General Electric Company | Sensor and method for fabricating the same |
US8141429B2 (en) * | 2010-07-30 | 2012-03-27 | Rosemount Aerospace Inc. | High temperature capacitive static/dynamic pressure sensors and methods of making the same |
US8656784B2 (en) * | 2011-08-19 | 2014-02-25 | Kulite Semiconductor Products, Inc. | Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments |
US8714021B2 (en) * | 2012-02-27 | 2014-05-06 | Amphenol Thermometrics, Inc. | Catheter die and method of fabricating the same |
-
2013
- 2013-10-03 CH CH01699/13A patent/CH708708A1/de not_active Application Discontinuation
-
2014
- 2014-10-02 MX MX2016004234A patent/MX360473B/es active IP Right Grant
- 2014-10-02 WO PCT/CH2014/000142 patent/WO2015048916A1/de active Application Filing
- 2014-10-02 US US15/024,482 patent/US9927316B2/en not_active Expired - Fee Related
- 2014-10-02 JP JP2016519887A patent/JP2016540192A/ja active Pending
- 2014-10-02 CA CA2924166A patent/CA2924166A1/en not_active Abandoned
- 2014-10-02 BR BR112016006523A patent/BR112016006523A2/pt not_active Application Discontinuation
- 2014-10-02 CN CN201480054869.2A patent/CN105593657A/zh active Pending
- 2014-10-02 KR KR1020167008702A patent/KR20160065109A/ko not_active Application Discontinuation
- 2014-10-02 EP EP14789767.2A patent/EP3052915A1/de not_active Withdrawn
-
2019
- 2019-05-24 JP JP2019097258A patent/JP6655211B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US9927316B2 (en) | 2018-03-27 |
KR20160065109A (ko) | 2016-06-08 |
EP3052915A1 (de) | 2016-08-10 |
MX2016004234A (es) | 2016-10-07 |
CN105593657A (zh) | 2016-05-18 |
JP6655211B2 (ja) | 2020-02-26 |
JP2019174478A (ja) | 2019-10-10 |
MX360473B (es) | 2018-11-05 |
WO2015048916A1 (de) | 2015-04-09 |
JP2016540192A (ja) | 2016-12-22 |
US20160231189A1 (en) | 2016-08-11 |
CH708708A1 (de) | 2015-04-15 |
CA2924166A1 (en) | 2015-04-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06F | Objections, documents and/or translations needed after an examination request according art. 34 industrial property law | ||
B06U | Preliminary requirement: requests with searches performed by other patent offices: suspension of the patent application procedure | ||
B11B | Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements |