BR0113993A - Formulações à base de borracha de silicone e seu emprego - Google Patents
Formulações à base de borracha de silicone e seu empregoInfo
- Publication number
- BR0113993A BR0113993A BR0113993-2A BR0113993A BR0113993A BR 0113993 A BR0113993 A BR 0113993A BR 0113993 A BR0113993 A BR 0113993A BR 0113993 A BR0113993 A BR 0113993A
- Authority
- BR
- Brazil
- Prior art keywords
- silicone rubber
- rubber formulations
- formulations
- well
- dielectric constant
- Prior art date
Links
- 229920002379 silicone rubber Polymers 0.000 title abstract 3
- 239000004945 silicone rubber Substances 0.000 title abstract 3
- 238000010058 rubber compounding Methods 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Materials For Medical Uses (AREA)
Abstract
"FORMULAçõES à BASE DE BORRACHA DE SILICONE E SEU EMPREGO". A invenção refere-se a formulações de borracha de silicone com uma constante dielétrica com um reduzida e corpos moldados a partir deles, assim como seu emprego.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10047276A DE10047276A1 (de) | 2000-09-25 | 2000-09-25 | Siliconkautschukformulierungen mit einer niedrigen Dielelktrizitätszahl und deren Verwendung als Isolatormaterial |
PCT/EP2001/011092 WO2002024813A1 (de) | 2000-09-25 | 2001-09-25 | Silikonkautschukformulierungen und deren verwendung |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0113993A true BR0113993A (pt) | 2003-08-12 |
Family
ID=7657426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0113993-2A BR0113993A (pt) | 2000-09-25 | 2001-09-25 | Formulações à base de borracha de silicone e seu emprego |
Country Status (12)
Country | Link |
---|---|
US (1) | US20040092643A1 (pt) |
EP (1) | EP1337588B1 (pt) |
JP (1) | JP5148042B2 (pt) |
KR (1) | KR100852028B1 (pt) |
CN (1) | CN100349980C (pt) |
AT (1) | ATE420925T1 (pt) |
AU (1) | AU2002218195A1 (pt) |
BR (1) | BR0113993A (pt) |
CA (1) | CA2423418C (pt) |
DE (2) | DE10047276A1 (pt) |
HK (1) | HK1071152A1 (pt) |
WO (1) | WO2002024813A1 (pt) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10238369A1 (de) * | 2002-08-22 | 2004-03-04 | Degussa Ag | Mittel als Haftvermittler für gefüllte und peroxidisch zu vernetzende Gummicompounds |
CN1323103C (zh) * | 2005-04-28 | 2007-06-27 | 陈俊光 | 球形有机硅橡胶制品及其制造方法 |
JP4586981B2 (ja) * | 2005-06-23 | 2010-11-24 | 信越化学工業株式会社 | 自己接着性オルガノポリシロキサン組成物 |
US7767754B2 (en) * | 2005-11-08 | 2010-08-03 | Momentive Performance Materials Inc. | Silicone composition and process of making same |
US7951871B2 (en) * | 2006-11-10 | 2011-05-31 | Exxonmobil Chemical Patents Inc. | Curing rubber by hydrosilation |
US8247494B2 (en) * | 2009-11-23 | 2012-08-21 | Exxonmobil Chemical Patents Inc. | Thermoset compositions with dispersed thermoplastic resin therein and process for making them |
CN102190890B (zh) * | 2010-01-26 | 2015-06-17 | 横滨橡胶株式会社 | 有机硅树脂组合物及其使用方法、有机硅树脂、含有其的结构体、和光半导体元件密封体 |
DE102010062139A1 (de) * | 2010-11-29 | 2012-05-31 | Wacker Chemie Ag | Einkomponentige Organopolysiloxanmassen mit hoher relativer Permittivität |
CN102827479A (zh) * | 2012-08-20 | 2012-12-19 | 中昊晨光化工研究院有限公司 | 一种液体硅橡胶 |
CN103756329B (zh) * | 2013-12-25 | 2016-04-27 | 广东阿尔派新材料股份有限公司 | 一种应用于电力电缆附件的绝缘橡胶及其制备方法 |
JP7457450B2 (ja) | 2017-10-20 | 2024-03-28 | 信越化学工業株式会社 | シリコーン組成物、シリコーンゴム硬化物、及び電力ケーブル |
CN114752223B (zh) * | 2022-05-13 | 2023-06-30 | 成都拓利科技股份有限公司 | 一种高强度耐漏电起痕液体硅橡胶及其制备方法 |
CN116875057B (zh) * | 2023-08-04 | 2024-04-05 | 浙江凌志新能源科技有限公司 | 一种低密度硅橡胶发泡材料的制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62290754A (ja) * | 1986-06-11 | 1987-12-17 | Toshiba Silicone Co Ltd | 硬化阻害を防止する方法 |
JPH01313565A (ja) * | 1988-06-10 | 1989-12-19 | Toray Dow Corning Silicone Co Ltd | 硬化性オルガノポリシロキサン組成物 |
JP3270489B2 (ja) * | 1991-01-30 | 2002-04-02 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性オルガノポリシロキサン組成物 |
EP0649885A1 (de) * | 1993-10-25 | 1995-04-26 | Wacker-Chemie GmbH | Übergangsmetallhaltige hydrophobe Kieselsäure |
JPH1046029A (ja) * | 1996-07-30 | 1998-02-17 | Toray Dow Corning Silicone Co Ltd | シリコーンゴム組成物およびその製造方法 |
JP3488345B2 (ja) * | 1996-08-20 | 2004-01-19 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物、その硬化物及びそれにより封止された樹脂封止型半導体装置 |
JPH1112470A (ja) * | 1997-06-25 | 1999-01-19 | Toray Dow Corning Silicone Co Ltd | 高電圧電気絶縁部品用液状シリコーンゴム組成物 |
JP3354104B2 (ja) * | 1998-08-04 | 2002-12-09 | ソニー株式会社 | 陰極線管の絶縁方法 |
-
2000
- 2000-09-25 DE DE10047276A patent/DE10047276A1/de not_active Ceased
-
2001
- 2001-09-25 EP EP01985262A patent/EP1337588B1/de not_active Expired - Lifetime
- 2001-09-25 AT AT01985262T patent/ATE420925T1/de not_active IP Right Cessation
- 2001-09-25 JP JP2002529214A patent/JP5148042B2/ja not_active Expired - Lifetime
- 2001-09-25 US US10/381,454 patent/US20040092643A1/en not_active Abandoned
- 2001-09-25 KR KR1020037004214A patent/KR100852028B1/ko active IP Right Grant
- 2001-09-25 CN CNB01816157XA patent/CN100349980C/zh not_active Expired - Lifetime
- 2001-09-25 CA CA2423418A patent/CA2423418C/en not_active Expired - Fee Related
- 2001-09-25 BR BR0113993-2A patent/BR0113993A/pt not_active Application Discontinuation
- 2001-09-25 AU AU2002218195A patent/AU2002218195A1/en not_active Abandoned
- 2001-09-25 WO PCT/EP2001/011092 patent/WO2002024813A1/de active Application Filing
- 2001-09-25 DE DE50114664T patent/DE50114664D1/de not_active Expired - Lifetime
-
2005
- 2005-05-05 HK HK05103807A patent/HK1071152A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1553937A (zh) | 2004-12-08 |
CA2423418C (en) | 2010-04-06 |
EP1337588A1 (de) | 2003-08-27 |
EP1337588B1 (de) | 2009-01-14 |
CA2423418A1 (en) | 2003-03-24 |
CN100349980C (zh) | 2007-11-21 |
JP2004510010A (ja) | 2004-04-02 |
DE10047276A1 (de) | 2002-04-18 |
ATE420925T1 (de) | 2009-01-15 |
AU2002218195A1 (en) | 2002-04-02 |
KR20030045812A (ko) | 2003-06-11 |
KR100852028B1 (ko) | 2008-08-13 |
HK1071152A1 (en) | 2005-07-08 |
DE50114664D1 (de) | 2009-03-05 |
US20040092643A1 (en) | 2004-05-13 |
JP5148042B2 (ja) | 2013-02-20 |
WO2002024813A1 (de) | 2002-03-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |