BE483459A - - Google Patents
Info
- Publication number
- BE483459A BE483459A BE483459DA BE483459A BE 483459 A BE483459 A BE 483459A BE 483459D A BE483459D A BE 483459DA BE 483459 A BE483459 A BE 483459A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB284905X | 1947-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE483459A true BE483459A (US20080293856A1-20081127-C00150.png) |
Family
ID=10276468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE483459D BE483459A (US20080293856A1-20081127-C00150.png) | 1947-06-25 |
Country Status (4)
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2641672A (en) * | 1950-05-08 | 1953-06-09 | Northrop Aircraft Inc | Electrical conductor |
| US2736677A (en) * | 1950-12-01 | 1956-02-28 | Technograph Printed Circuits L | Metallized insulators |
| BE514138A (US20080293856A1-20081127-C00150.png) * | 1951-09-14 | |||
| US2862992A (en) * | 1954-05-03 | 1958-12-02 | Bell Telephone Labor Inc | Electrical network assembly |
| US2913632A (en) * | 1955-08-08 | 1959-11-17 | Austin N Stanton | Micro-circuits, electric devices there-for, and methods for making same |
| DE1069235B (US20080293856A1-20081127-C00150.png) * | 1955-09-28 | 1959-11-19 | ||
| US2876393A (en) * | 1956-05-15 | 1959-03-03 | Sanders Associates Inc | Printed circuit baseboard |
| BE562405A (US20080293856A1-20081127-C00150.png) * | 1956-11-15 | |||
| US2926326A (en) * | 1957-03-05 | 1960-02-23 | Engelhard Ind Inc | Collector ring assembly |
| US2921263A (en) * | 1957-11-26 | 1960-01-12 | Polarad Electronics Corp | Card-type thermistor mount |
| US2954540A (en) * | 1957-12-12 | 1960-09-27 | Gen Precision Inc | Brush block |
| US3219749A (en) * | 1961-04-21 | 1965-11-23 | Litton Systems Inc | Multilayer printed circuit board with solder access apertures |
| US3316619A (en) * | 1963-12-09 | 1967-05-02 | Rca Corp | Method of making connections to stacked printed circuit boards |
| US3289045A (en) * | 1964-03-02 | 1966-11-29 | Intellux Inc | Circuit module |
| DE1265256B (de) * | 1965-11-04 | 1968-04-04 | Siemens Ag | Verfahren zur Herstellung einer Duennschichtbaugruppe der Elektronik |
| US3424854A (en) * | 1967-07-20 | 1969-01-28 | Motorola Inc | Multilayer printed circuit with soldered eyelets forming the sole means joining the same |
| JPS5278069A (en) * | 1975-12-24 | 1977-07-01 | Fuji Kinzoku Kakou Kk | Printed circuit board |
| NL8202285A (nl) * | 1982-06-07 | 1984-01-02 | Philips Nv | Inrichting met een electrische schakeling op een printplaat. |
| DE102007022337A1 (de) * | 2007-05-12 | 2008-11-20 | Semikron Elektronik Gmbh & Co. Kg | Gesintertes Leistungshalbleitersubstrat sowie Herstellungsverfahren hierzu |
| DE102012025409A1 (de) * | 2012-12-20 | 2014-06-26 | Thomas Hofmann | Leiterplatte mit echtholzlagenverbundwerkstoff |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1647474A (en) * | 1923-10-25 | 1927-11-01 | Frederick W Seymour | Variable pathway |
| US2066876A (en) * | 1934-07-02 | 1937-01-05 | Rca Corp | Wiring system for electrical apparatus |
-
0
- BE BE483459D patent/BE483459A/xx unknown
-
1948
- 1948-06-14 US US32923A patent/US2547022A/en not_active Expired - Lifetime
- 1948-06-21 CH CH284905D patent/CH284905A/de unknown
- 1948-06-24 FR FR968196D patent/FR968196A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR968196A (fr) | 1950-11-21 |
| CH284905A (de) | 1952-08-15 |
| US2547022A (en) | 1951-04-03 |
