AU2017100321A4

AU2017100321A4 - Down lamp

Info

Publication number: AU2017100321A4
Application number: AU2017100321A
Authority: AU
Inventors: Wangda CHEN; Lufan Yu
Original assignee: Xiamen Yankon Energetic Lighting Co Ltd
Current assignee: Xiamen Yankon Energetic Lighting Co Ltd
Priority date: 2016-07-05
Filing date: 2017-03-20
Publication date: 2017-04-20
Anticipated expiration: 2025-03-20
Also published as: CN106151978B; CN106151978A

Abstract

Abstract The present invention provides a down lamp comprising a back cover, a front ring, a light-passing board, a light source board and a power device, the back cover is a shell having bottom opening, the front ring in provided with a through hole in the middle, the light-passing board is disposed in the through hole of the front ring, the front ring is disposed to cover the bottom opening of the back cover to form a assembling room, the light source board and the power device are disposed in the assembling room and in electric connection, wherein: the down lamp further comprising a supporting element disposed in the assembling room, the supporting element is connected with the front ring while separated from sidewall and top surface of the back cover, the light source board is configured on the supporting element, the light source board is disposed closing to the front ring and separating from the back cover, heat of the light source is transmitted to the front ring via the supporting element and emitted to atmosphere from the front ring. The supporting element and the light source board are separated from sidewall and top surface of the back cover, heat of the light source is emitted to atmosphere via the supporting element and the front ring, which minimizing the heat transmitting to the back cover, so that prevent the back cover from being overheated.

Description

2017100321 20 Mar 2017 PI/00/011 Regulation 3.2 AUSTRALIA Patents Act 1990

COMPLETE SPECIFICATION

FOR AN INNOVATION PATENT

ORIGINAL

Name of Applicant: Xiamen Yankon Energetic Lighting Co., Ltd. Actual Inventors: Wangda CHEN, Kufan YU Address for Service: Houlihan , Level 1, 70 Doncaster Road, Balwyn North, Victoria 3104, Australia Invention Title: Down Lamp

The following statement is a full description of this invention, including the best method of performing it known to the Applicant:- 1

Down Lamp 2017100321 20 Mar 2017

Field of the invention

The present invention relates to down lamp, and especially to a ceiling down lamp.

Background of the invention

In order to improve the working performance and working life of down lamp, radiating structure is designed. Traditional heat radiating method is to configure light source board on lower surface of shell, and heating of source board is emitted through shell (also known as back cover) of light lamp, and afterward, through hole is disposed on shell to speed up the heat dissipation, which further improves the heat dissipation rate of down lamp.

However, floor should be padded with fire resistant cotton according to state regulations of some countries, and the surface temperature of down lamp shell should be below 80°C. In actual installation and use, fire resistant cotton of floor covers down lamp shell, which may enormously decrease heat convection of the back of down lamp. The temperature of the surface is very high, which could not meet the requirement and leads to safety problem.

Summary of the invention

The objective of present invention is to provide a down lamp, which overcome the disadvantages of the existing technology.

The technical proposal of the present invention is that: A down lamp comprises a back cover, a front ring, a light-passing board, a light source board and a power device, the back cover is a shell having bottom opening, the front ring in provided with a through hole in the middle, the light-passing board is disposed in the through hole of the front ring, the front ring is disposed to cover the bottom opening of the back cover to form a assembling room, the light source board and the power device are disposed in the assembling room and in electric connection. 2 the down lamp further comprising a supporting element disposed in the assembling room, the supporting element is connected with the front ring while separated from sidewall and top surface of the back cover, the light source board is configured on the supporting element, the light source board is disposed closing to the front ring and separating from the back cover, heat of the light source is transmitted to the front ring via the supporting element and emitted to atmosphere from the front ring. 2017100321 20 Mar 2017

Comparing to the existing technology, the present invention has advantages as follows:

The light source board is disposed closing to the front ring and separating from sidewall and top surface of the back cover, heat of the light source is emitted to atmosphere via the supporting element and the front ring, which avoid heat transmitting of heat to the back cover and thereby prevent the back cover from being overheated and improve safety in state of using fire resistant cotton.

Brief description of the drawings

The present invention will be further described with the drawings and the embodiments. FIG.1 illustrates an exploded schematic diagram of the down lamp. FIG.2 illustrates another exploded schematic diagram of the down lamp. FIG.3 illustrates a perspective schematic diagram of the down lamp. F1G4 illustrates a cross-section schematic diagram of the down lamp.

Detailed description of the embodiments

Please refer to Fig.l to Fig.4 showing a down lamp comprising a back cover 10, a front ring 20, a light-passing board 30, a light source board 40 and a power device 50. The back cover 10 is a shell having bottom opening, sidewall 12 and top surface 14. The front ring 20 in provided with a through hole 22 in the middle, the light-passing board 30 is disposed in the through hole 22 of the front ring. The front ring 20 is disposed to cover the bottom opening of the back cover 10 to form an 3 assembling room 60. The light source board 40 and the power device 50 are disposed in the assembling room 60 and in electric connection. The down lamp further comprises a supporting element 70 disposed in the assembling room 60, the supporting element 70 is connected with the front ring 20 while separated from sidewall 12 and top surface 14 of the back cover. The light source board 40 is configured on the supporting element 50, the light source board 40 is disposed closing to the front ring 20 and separating from the back cover 10, and heat of the light source is transmitted to the front ring 20 via the supporting element 70 and emitted to atmosphere from the front ring 20. 2017100321 20 Mar 2017

Since the light source board 40 is disposed closing to the light-passing board 30 and does not contact with the back cover 10, the supporting element 70 does not contact with the sidewall 12 and top surface 14 of the back cover 10 either, in other words, the supporting element 70 and the light source board 40 are separated from sidewall 12 and top surface 14 of the back cover, and the light source board 40 is far away from the top surface 14 of the back cover 10, heat of the light source board 40 and the supporting element 70 is emitted to atmosphere via the front ring 20 and the light-passing board 30 to avoid transmission of heat from the light source board 40 and the supporting element 70 to sidewall 12 and top surface 14 of the back cover furthest, and thereby lower the temperature of the sidewall 12 and top surface 14 of the back cover 10.

Preferably, the front ring 20 is disposed with a locating ring 24 extending into the bottom opening of the back cover 10 to form the through hole 22, and the upper end surface of the locating ring 24 is disposed with a slot 26. The supporting element 70 comprises a bottom plate 72 and sidewall 74 connecting to the edge of the bottom plate. The light source board 40 is connected to the lower surface of the bottom plate 72, and the sidewall 74 is inserted into the slot 26. Heat of the light source board 40 is transmitted to the locating ring 24 through the supporting element 70, and inner and outer circumferential surfaces of the slot 26 could be used for radiating heat effectively, thus the larger contact area between the slot 26 and the sidewall 74, the better the effect is. 4

Preferably, the supporting element 70 is A1 alloy which can be considered as a radiating element itself since thermal conductivity of supporting element 70 is good. 2017100321 20 Mar 2017

Preferably, the light-passing board 30 is disposed in the through hole 22 in retraction, and the light-passing board 30 and the inner surface of the locating ring 24 are in locking connection. A space H exists between the light-passing board 30 and the lower surface of the front ring 20. The bigger space H leads to faster heat dissipation.

Preferably, the power device 50 is connected above the bottom plate 72 and separated from the back cover 10. The down lamp further comprises a power separator 80 configured in the assembling room and connected between the supporting element 70 and the power device 50. The power device 50 does not contact with the back cover 10, that is, the power device 50 is also separated from sidewall 12 and top surface 14 of the back cover to avoid transmission of heat from the power device 50 to the back cover 10.

Preferably, the down lamp further comprises a thermal insulator 90 configured in the assembling room and located between the power device 50 and the upper surface of the back cover 10. The thermal insulator 90 comprises a baffle 91 and a sidewall 92 connecting to the edge of the baffle 91. Since hot air flows upwardly, the power device 50 and the top surface 14 of the back cover 10 is separated by the thermal insulator 90 to lower the temperature of the top surface 14 of the back cover 10. The greater the distance between the baffle 91 of the thermal insulator 90 and the top surface 14 of the back cover 10, the better the effect is.

After installation of the down lamp, the surface of the back cover 10 is coated with fire resistant cotton, and the temperature of the outer surface of the back cover 10 is below 80 °C when the light source board in the state of work.

Although the present invention has been described with reference to the preferred embodiments thereof for carrying out the patent for invention, it is apparent to those skilled in the art that a variety of modifications and changes may be made without departing from the scope of the patent for invention which is intended to be defined by the appended claims. 5

Where the terms “comprise”, “comprises”, “comprised” or “comprising” are used in this specification, they are to be interpreted as specifying the presence of the stated features, integers, steps or components referred to, but not to preclude the presence or addition of one or more other feature, integer, step, component or group thereof. 2017100321 20 Mar 2017 6

Claims

The Claims defining the invention are as follows:

1. A down lamp comprising a back cover, a front ring, a light-passing board, a light source board and a power device, the back cover is a shell having bottom opening, the front ring in provided with a through hole in the middle, the light-passing board is disposed in the through hole of the front ring, the front ring is disposed to cover the bottom opening of the back cover to form a assembling room, the light source board and the power device are disposed in the assembling room and in electric connection, wherein: the down lamp further comprising a supporting element disposed in the assembling room, the supporting element is connected with the front ring while separated from sidewall and top surface of the back cover, the light source board is configured on the supporting element, the light source board is disposed closing to the front ring and separating from the back cover, heat of the light source is transmitted to the front ring via the supporting element and emitted to atmosphere from the front ring.
2. The down lamp according to claim 1, wherein the front ring is disposed with a locating ring extending into the bottom opening to form the through hole, the upper end surface of the locating ring is disposed with a slot; the supporting element comprises a bottom plate and a sidewall connecting to the edge of the bottom plate; the light source board is connected to the lower surface of the bottom plate, and the sidewall is inserted into the slot.
3. The down lamp according to claim 2, wherein the power device is connected above the bottom plate.
4. The down lamp according to claim 1 or claim 2 or claim 3, wherein the supporting element is A1 alloy.
5. The down lamp according to claim 2, wherein the light-passing board is disposed in the through hole in retraction, and a space exists between the light-passing board and the lower surface of the front ring.
6. The down lamp according to claim 5, wherein the light-passing board and the inner surface of the locating ring are in locking connection.
7. The down lamp according to claim 3, wherein the power device is separated from the back cover.
8. The down lamp according to claim 7, wherein further comprising a power separator configured in the assembling room and connected between the supporting element and the power device.
9. The down lamp according to claim 8, wherein further comprising a thermal insulator configured in the assembling room and located between the power device and the upper surface of the back cover.
10. The down lamp according to claim 1, wherein the back cover is coated with fire resistant cotton, and the temperature of the outer surface of the back cover is below 80 °C when the light source board in the state of work.