AU2003302261A1 - Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent cmp process - Google Patents
Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent cmp processInfo
- Publication number
- AU2003302261A1 AU2003302261A1 AU2003302261A AU2003302261A AU2003302261A1 AU 2003302261 A1 AU2003302261 A1 AU 2003302261A1 AU 2003302261 A AU2003302261 A AU 2003302261A AU 2003302261 A AU2003302261 A AU 2003302261A AU 2003302261 A1 AU2003302261 A1 AU 2003302261A1
- Authority
- AU
- Australia
- Prior art keywords
- dielectric layer
- patterned dielectric
- electroplating copper
- copper over
- subsequent cmp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 238000009713 electroplating Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10319135.6 | 2003-04-28 | ||
DE10319135A DE10319135B4 (de) | 2003-04-28 | 2003-04-28 | Verfahren zum Elektroplattieren von Kupfer über einer strukturierten dielektrischen Schicht, um die Prozess-Gleichförmigkeit eines nachfolgenden CMP-Prozesses zu verbessern |
US10/666,195 | 2003-09-19 | ||
US10/666,195 US6958247B2 (en) | 2003-04-28 | 2003-09-19 | Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process |
PCT/US2003/041181 WO2004097932A2 (en) | 2003-04-28 | 2003-12-22 | Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent cmp process |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003302261A1 true AU2003302261A1 (en) | 2004-11-23 |
Family
ID=33419999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003302261A Abandoned AU2003302261A1 (en) | 2003-04-28 | 2003-12-22 | Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent cmp process |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2006515467A (ko) |
KR (1) | KR101136139B1 (ko) |
AU (1) | AU2003302261A1 (ko) |
GB (1) | GB2418067B (ko) |
WO (1) | WO2004097932A2 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100761360B1 (ko) * | 2006-03-29 | 2007-09-27 | 주식회사 하이닉스반도체 | 플래쉬 메모리 소자의 메탈 배선 제조 방법 |
WO2012103357A1 (en) * | 2011-01-26 | 2012-08-02 | Enthone Inc. | Process for filling vias in the microelectronics |
US20230279576A1 (en) * | 2022-03-03 | 2023-09-07 | Applied Materials, Inc. | Plating and deplating currents for material co-planarity in semiconductor plating processes |
US20230304183A1 (en) * | 2022-03-22 | 2023-09-28 | Applied Materials, Inc. | Methods and apparatus for altering lithographic patterns to adjust plating uniformity |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2891161B2 (ja) | 1996-02-15 | 1999-05-17 | 日本電気株式会社 | 配線形成方法 |
KR20000043909A (ko) * | 1998-12-29 | 2000-07-15 | 김영환 | 반도체 소자의 금속배선 형성 방법 |
KR20000056852A (ko) * | 1999-02-26 | 2000-09-15 | 로버트 에이치. 씨. 챠오 | 집적회로 내의 금속 상호연결 구조의 제조 방법 |
US6179691B1 (en) * | 1999-08-06 | 2001-01-30 | Taiwan Semiconductor Manufacturing Company | Method for endpoint detection for copper CMP |
US6350364B1 (en) * | 2000-02-18 | 2002-02-26 | Taiwan Semiconductor Manufacturing Company | Method for improvement of planarity of electroplated copper |
JP3797860B2 (ja) * | 2000-09-27 | 2006-07-19 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
US6746589B2 (en) * | 2000-09-20 | 2004-06-08 | Ebara Corporation | Plating method and plating apparatus |
JP3725054B2 (ja) * | 2000-09-20 | 2005-12-07 | 株式会社荏原製作所 | 基板の電解めっき方法および電解めっき装置 |
US6863795B2 (en) * | 2001-03-23 | 2005-03-08 | Interuniversitair Microelektronica Centrum (Imec) | Multi-step method for metal deposition |
JP2003068689A (ja) * | 2001-08-22 | 2003-03-07 | Tokyo Seimitsu Co Ltd | フィードバック式研磨装置及び研磨方法 |
JP3807295B2 (ja) * | 2001-11-30 | 2006-08-09 | ソニー株式会社 | 研磨方法 |
JP2003277985A (ja) * | 2002-03-20 | 2003-10-02 | Fujitsu Ltd | メッキ成膜方法及びメッキ成膜装置 |
-
2003
- 2003-12-22 KR KR1020057020605A patent/KR101136139B1/ko not_active IP Right Cessation
- 2003-12-22 GB GB0521254A patent/GB2418067B/en not_active Expired - Fee Related
- 2003-12-22 AU AU2003302261A patent/AU2003302261A1/en not_active Abandoned
- 2003-12-22 WO PCT/US2003/041181 patent/WO2004097932A2/en active Application Filing
- 2003-12-22 JP JP2004571478A patent/JP2006515467A/ja not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
WO2004097932A2 (en) | 2004-11-11 |
JP2006515467A (ja) | 2006-05-25 |
GB2418067B (en) | 2007-02-14 |
KR101136139B1 (ko) | 2012-04-20 |
GB2418067A (en) | 2006-03-15 |
GB0521254D0 (en) | 2005-11-30 |
WO2004097932A3 (en) | 2004-12-16 |
KR20060008946A (ko) | 2006-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |