AU2003291313A1 - Dynamic adaptive sampling rate for model prediction - Google Patents

Dynamic adaptive sampling rate for model prediction

Info

Publication number
AU2003291313A1
AU2003291313A1 AU2003291313A AU2003291313A AU2003291313A1 AU 2003291313 A1 AU2003291313 A1 AU 2003291313A1 AU 2003291313 A AU2003291313 A AU 2003291313A AU 2003291313 A AU2003291313 A AU 2003291313A AU 2003291313 A1 AU2003291313 A1 AU 2003291313A1
Authority
AU
Australia
Prior art keywords
prediction
sampling rate
dynamic adaptive
adaptive sampling
dynamic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003291313A
Inventor
Gregory A. Cherry
Alexander J. Pasadyn
Thomas J. Sonderman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US10/323,530 priority Critical
Priority to US10/323,530 priority patent/US8017411B2/en
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Priority to PCT/US2003/035327 priority patent/WO2004061938A1/en
Publication of AU2003291313A1 publication Critical patent/AU2003291313A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54453Marks applied to semiconductor devices or parts for use prior to dicing
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU2003291313A 2002-12-18 2003-11-06 Dynamic adaptive sampling rate for model prediction Abandoned AU2003291313A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/323,530 2002-12-18
US10/323,530 US8017411B2 (en) 2002-12-18 2002-12-18 Dynamic adaptive sampling rate for model prediction
PCT/US2003/035327 WO2004061938A1 (en) 2002-12-18 2003-11-06 Dynamic adaptive sampling rate for model prediction

Publications (1)

Publication Number Publication Date
AU2003291313A1 true AU2003291313A1 (en) 2004-07-29

Family

ID=32593244

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003291313A Abandoned AU2003291313A1 (en) 2002-12-18 2003-11-06 Dynamic adaptive sampling rate for model prediction

Country Status (9)

Country Link
US (1) US8017411B2 (en)
JP (1) JP2006511958A (en)
KR (1) KR101166209B1 (en)
CN (1) CN100578747C (en)
AU (1) AU2003291313A1 (en)
DE (1) DE10393903T5 (en)
GB (1) GB2412975B (en)
TW (1) TWI352883B (en)
WO (1) WO2004061938A1 (en)

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US6766214B1 (en) * 2003-04-03 2004-07-20 Advanced Micro Devices, Inc. Adjusting a sampling rate based on state estimation results
US6859746B1 (en) * 2003-05-01 2005-02-22 Advanced Micro Devices, Inc. Methods of using adaptive sampling techniques based upon categorization of process variations, and system for performing same
US7155689B2 (en) * 2003-10-07 2006-12-26 Magma Design Automation, Inc. Design-manufacturing interface via a unified model
US7076321B2 (en) * 2004-10-05 2006-07-11 Advanced Micro Devices, Inc. Method and system for dynamically adjusting metrology sampling based upon available metrology capacity
JP4693464B2 (en) * 2005-04-05 2011-06-01 株式会社東芝 Quality control system, quality control method and lot-by-lot wafer processing method
US7650199B1 (en) * 2005-08-03 2010-01-19 Daniel Kadosh End of line performance prediction
US7502702B1 (en) * 2005-09-07 2009-03-10 Advanced Micro Devices, Inc. Method and apparatus for dynamic adjustment of sensor and/or metrology sensitivities
US8175831B2 (en) * 2007-04-23 2012-05-08 Kla-Tencor Corp. Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers
JP5634864B2 (en) 2007-05-30 2014-12-03 ケーエルエー−テンカー・コーポレーションKla−Tencor Corporation Process control method and process control apparatus in lithographic process
US9768082B2 (en) 2009-02-13 2017-09-19 Hermes Microvision Inc. Method and machine for examining wafers
US20100211202A1 (en) * 2009-02-13 2010-08-19 Hermes Microvision, Inc. Method and machine for examining wafers
US8392009B2 (en) * 2009-03-31 2013-03-05 Taiwan Semiconductor Manufacturing Company, Ltd. Advanced process control with novel sampling policy
CN101872714B (en) * 2009-04-24 2012-06-20 中芯国际集成电路制造(上海)有限公司 On-line detection method and system for wafer
US8565910B2 (en) 2011-02-04 2013-10-22 International Business Machines Corporation Manufacturing execution system (MES) including a wafer sampling engine (WSE) for a semiconductor manufacturing process
US8656323B2 (en) * 2011-02-22 2014-02-18 Kla-Tencor Corporation Based device risk assessment
CN102354108B (en) * 2011-06-09 2013-07-17 国网电力科学研究院 Method for realizing dynamic sampling rate adjustment by oversampling
US9652729B2 (en) 2011-10-27 2017-05-16 International Business Machines Corporation Metrology management
CN102437072A (en) * 2011-11-28 2012-05-02 上海华力微电子有限公司 Method and system for scanning and scheduling wafer defects
JP5765222B2 (en) * 2011-12-28 2015-08-19 トヨタ自動車株式会社 model predictive control method and model predictive control program
US9002498B2 (en) * 2012-02-02 2015-04-07 Taiwan Semiconductor Manufacturing Co., Ltd. Tool function to improve fab process in semiconductor manufacturing
US9588441B2 (en) 2012-05-18 2017-03-07 Kla-Tencor Corporation Method and device for using substrate geometry to determine optimum substrate analysis sampling
US9816370B2 (en) * 2012-09-19 2017-11-14 Honeywell International Inc. System and method for optimizing an operation of a sensor used with wellbore equipment
US9245067B2 (en) 2013-03-15 2016-01-26 General Electric Company Probabilistic method and system for testing a material
US9306828B2 (en) * 2013-07-12 2016-04-05 Xyratex Technology Limited-A Seagate Company Method of, and apparatus for, adaptive sampling
CN103646886B (en) * 2013-11-22 2016-06-08 上海华力微电子有限公司 The wafer operational method of monitoring apparatus defect condition
US9087176B1 (en) * 2014-03-06 2015-07-21 Kla-Tencor Corporation Statistical overlay error prediction for feed forward and feedback correction of overlay errors, root cause analysis and process control
KR20150114795A (en) 2014-04-02 2015-10-13 삼성전자주식회사 A method of testing a semiconductor memory device, a test device, and compurter readable recording media recording test program for a semiconductor memory device
CN104103544B (en) * 2014-08-01 2020-03-31 上海华力微电子有限公司 Wafer defect monitoring method
US10133263B1 (en) 2014-08-18 2018-11-20 Kla-Tencor Corporation Process condition based dynamic defect inspection
US20160055434A1 (en) * 2014-08-21 2016-02-25 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Dynamic risk assessment based product sampling
US9471452B2 (en) * 2014-12-01 2016-10-18 Uptake Technologies, Inc. Adaptive handling of operating data
CN104701211B (en) * 2015-03-30 2017-09-22 上海华力微电子有限公司 Inspect the method for measurement of frequency by random samples according to integrated circuit manufacture process Capability index adjust automatically
KR20170124578A (en) * 2015-04-10 2017-11-10 에이에스엠엘 네델란즈 비.브이. Method and apparatus for inspection and measurement
US10754260B2 (en) 2015-06-18 2020-08-25 Kla-Tencor Corporation Method and system for process control with flexible sampling
US20190025705A1 (en) * 2015-12-31 2019-01-24 Asml Netherlands B.V. Selection of measurement locations for patterning processes
JP6476370B2 (en) * 2016-09-26 2019-03-06 株式会社Kokusai Electric Recording medium, program, semiconductor device manufacturing method, and substrate processing apparatus.
TWI607825B (en) * 2016-11-29 2017-12-11 財團法人工業技術研究院 System and method for optimizing machining process of nc program

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US4663628A (en) * 1985-05-06 1987-05-05 Halliburton Company Method of sampling environmental conditions with a self-contained downhole gauge system
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US5519605A (en) * 1994-10-24 1996-05-21 Olin Corporation Model predictive control apparatus and method
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JP3699776B2 (en) * 1996-04-02 2005-09-28 株式会社日立ハイテクノロジーズ Manufacturing method of electronic parts
JP3751680B2 (en) * 1996-06-10 2006-03-01 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
US5895596A (en) * 1997-01-27 1999-04-20 Semitool Thermal Model based temperature controller for semiconductor thermal processors
US5896294A (en) * 1997-03-11 1999-04-20 Advanced Micro Devices, Inc. Method and apparatus for inspecting manufactured products for defects in response to in-situ monitoring
JP3926478B2 (en) * 1998-06-01 2007-06-06 株式会社ルネサステクノロジ Semiconductor manufacturing method
US6278898B1 (en) * 1999-04-07 2001-08-21 Voyan Technology Model error bounds for identification of stochastic models for control design
US6477432B1 (en) * 2000-01-11 2002-11-05 Taiwan Semiconductor Manufacturing Company Statistical in-process quality control sampling based on product stability through a systematic operation system and method
US6381019B1 (en) * 2000-06-30 2002-04-30 Brown University Research Foundation Ultrasonic generator and detector using an optical mask having a grating for launching a plurality of spatially distributed, time varying strain pulses in a sample
US6442496B1 (en) * 2000-08-08 2002-08-27 Advanced Micro Devices, Inc. Method and apparatus for dynamic sampling of a production line
AU8885601A (en) * 2000-09-15 2002-03-26 Advanced Micro Devices Inc Adaptive sampling method for improved control in semiconductor manufacturing
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US6912435B2 (en) * 2002-08-28 2005-06-28 Inficon Lt Inc. Methods and systems for controlling reticle-induced errors
US6766214B1 (en) * 2003-04-03 2004-07-20 Advanced Micro Devices, Inc. Adjusting a sampling rate based on state estimation results

Also Published As

Publication number Publication date
KR20050085716A (en) 2005-08-29
GB2412975A (en) 2005-10-12
US20040121495A1 (en) 2004-06-24
CN100578747C (en) 2010-01-06
GB2412975B (en) 2006-08-09
WO2004061938A1 (en) 2004-07-22
JP2006511958A (en) 2006-04-06
DE10393903T5 (en) 2005-12-22
TWI352883B (en) 2011-11-21
GB0511434D0 (en) 2005-07-13
TW200416504A (en) 2004-09-01
US8017411B2 (en) 2011-09-13
KR101166209B1 (en) 2012-07-18
CN1729560A (en) 2006-02-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase