AU2003227256A1 - Flame retardant epoxy resin compositions, prepregs and metal-clad laminates - Google Patents

Flame retardant epoxy resin compositions, prepregs and metal-clad laminates

Info

Publication number
AU2003227256A1
AU2003227256A1 AU2003227256A AU2003227256A AU2003227256A1 AU 2003227256 A1 AU2003227256 A1 AU 2003227256A1 AU 2003227256 A AU2003227256 A AU 2003227256A AU 2003227256 A AU2003227256 A AU 2003227256A AU 2003227256 A1 AU2003227256 A1 AU 2003227256A1
Authority
AU
Australia
Prior art keywords
prepregs
metal
epoxy resin
flame retardant
resin compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003227256A
Inventor
Keiko Kashihara
Takeshi Koizumi
Kenji Ogasawara
Mao Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of AU2003227256A1 publication Critical patent/AU2003227256A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AU2003227256A 2003-03-27 2003-03-27 Flame retardant epoxy resin compositions, prepregs and metal-clad laminates Abandoned AU2003227256A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/003811 WO2004087811A1 (en) 2003-03-27 2003-03-27 Flame retardant epoxy resin compositions, prepregs and metal-clad laminates

Publications (1)

Publication Number Publication Date
AU2003227256A1 true AU2003227256A1 (en) 2004-10-25

Family

ID=33105300

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003227256A Abandoned AU2003227256A1 (en) 2003-03-27 2003-03-27 Flame retardant epoxy resin compositions, prepregs and metal-clad laminates

Country Status (2)

Country Link
AU (1) AU2003227256A1 (en)
WO (1) WO2004087811A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102582183B (en) * 2011-12-29 2014-11-05 铜陵浩荣电子科技有限公司 Preparation method of halogen-free flame-retardant paper-based copper-clad plate
CN103525086B (en) * 2012-07-04 2015-12-16 合正科技股份有限公司 High heat-resisting, low rigidity, nonflammable resin and composition thereof
CN102732096B (en) * 2012-07-10 2013-11-13 依利安达电子（昆山）有限公司 Halogen-free flame-retardant solvent-free double-curing ink composition and preparation method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11343382A (en) * 1998-04-01 1999-12-14 Daihachi Chemical Industry Co Ltd Flame-retardant resin composition
JP2002179887A (en) * 2000-12-19 2002-06-26 Toshiba Chem Corp Halogen-free flame-retardant epoxy resin composition and prepreg, laminate, copper-clad laminate and printed wiring board comprising the same
JP2003049051A (en) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd Flame-retardant resin composition and application thereof

Also Published As

Publication number Publication date
WO2004087811A1 (en) 2004-10-14

Similar Documents

Publication Publication Date Title
HK1105424A1 (en) Epoxy resin composition for prepreg, prepreg, and multilayeredprinted wiring board
SG92734A1 (en) Flame-retardant resin composition, and prepregs and laminates using such composition
AU2003292608A1 (en) Flame-retardant resin composition
AU2002349761A1 (en) Flame retardant thermoplastic resin composition
AU2003235170A1 (en) Thermosetting resin composition and prepreg and laminated sheet using the same
HK1163725A1 (en) Thermosetting resin composition, and varnish, prepreg and metal clad laminated board using the same
EP2194098A4 (en) Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
AU2003211733A1 (en) Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board
AU2003244110A1 (en) Flame retarder composition and flame retardant resin composition containing the composition
EP1775321A4 (en) Flame-retardant epoxy resin composition
AU2003283036A1 (en) Outdoor electronic equipment cabinet
AU2003210409A1 (en) Flame retardant compositions
EP1828305A4 (en) Low loss prepregs, compositions useful for the preparation thereof and uses therefor
AU2003234990A1 (en) Flame-retardant thermoplastic resin composition
AU2003244100A1 (en) Acrylic resin composition, organosiloxane resin composition and laminates made by using them
EP1903840A4 (en) Wiring board, wiring material, copper-clad laminate, and wiring board fabrication method
TW200628549A (en) Flame retardant compositions
AU2003270264A1 (en) Flame retardant compositions
AU2003242007A1 (en) Resin composition for printed wiring board, prepreg, and laminate obtained with the same
AU2003232142A1 (en) Flame retardant compositions
EP1659148A4 (en) Reactive flame retardant and flame-retardant processed resin obtained with the same
EP1669398A4 (en) Reactive flame retardant and flame-retardant processed resin obtained with the same
AU2003227256A1 (en) Flame retardant epoxy resin compositions, prepregs and metal-clad laminates
AU2003903495A0 (en) Sports board
AU2003284604A1 (en) Thermosetting resin composition

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase