AU2001279280A1 - Component source interchange gantry - Google Patents

Component source interchange gantry

Info

Publication number
AU2001279280A1
AU2001279280A1 AU2001279280A AU7928001A AU2001279280A1 AU 2001279280 A1 AU2001279280 A1 AU 2001279280A1 AU 2001279280 A AU2001279280 A AU 2001279280A AU 7928001 A AU7928001 A AU 7928001A AU 2001279280 A1 AU2001279280 A1 AU 2001279280A1
Authority
AU
Australia
Prior art keywords
gantry
component source
interchange
source interchange
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001279280A
Inventor
Peter Davis
Michael A. Summers
Dean Tarrant
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hover-Davis Inc
Original Assignee
Hover-Davis Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hover-Davis Inc filed Critical Hover-Davis Inc
Publication of AU2001279280A1 publication Critical patent/AU2001279280A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
AU2001279280A 2000-07-07 2001-07-02 Component source interchange gantry Abandoned AU2001279280A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21685500P 2000-07-07 2000-07-07
US60216855 2000-07-07
PCT/US2001/041221 WO2002005319A2 (en) 2000-07-07 2001-07-02 Component source interchange gantry

Publications (1)

Publication Number Publication Date
AU2001279280A1 true AU2001279280A1 (en) 2002-01-21

Family

ID=22808763

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001279280A Abandoned AU2001279280A1 (en) 2000-07-07 2001-07-02 Component source interchange gantry

Country Status (3)

Country Link
US (1) US20020003994A1 (en)
AU (1) AU2001279280A1 (en)
WO (1) WO2002005319A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100541183B1 (en) * 2003-03-04 2006-01-11 삼성전자주식회사 Stocker and transfer system having the same
JP4045451B2 (en) * 2003-12-26 2008-02-13 村田機械株式会社 Overhead traveling vehicle system
US20100076634A1 (en) * 2008-09-22 2010-03-25 Ford Global Technologies, Llc Method for Controlling a Micro-Hybrid Electric Vehicle with an Automatic Transmission
US20150201587A1 (en) * 2012-08-18 2015-07-23 Scr Engineers Ltd Cow retrieval system
CN107006140B (en) * 2014-11-17 2019-07-26 株式会社富士 Tape feeder and component mounter
KR20180133933A (en) * 2016-05-06 2018-12-17 어플라이드 머티어리얼스, 인코포레이티드 SYSTEMS, APPARATUS AND METHODS FOR IMPROVED SUBSTRATE HANDLING ASSEMBLY
SG11201900196PA (en) * 2016-07-13 2019-02-27 Universal Instruments Corp Modular die handling system
WO2018094679A1 (en) * 2016-11-25 2018-05-31 苏州富强科技有限公司 Automatic pick-up mechanism
WO2020165972A1 (en) * 2019-02-13 2020-08-20 株式会社Ｆｕｊｉ Feeder state display system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4815202A (en) * 1988-05-02 1989-03-28 Emhart Industries, Inc. Electronic component insertion machine
US4604027A (en) * 1984-06-21 1986-08-05 At&T Technologies, Inc. Manipulator of articles and methods of moving articles over an extended distance
GB2202768B (en) * 1987-03-30 1991-04-03 Honda Motor Co Ltd Workpiece transferring, positioning and machining system.
JPH06156614A (en) * 1992-11-20 1994-06-03 Sony Corp Receiving method for semiconductor wafer and stocker thereof
JPH0964148A (en) * 1995-08-18 1997-03-07 Shinkawa Ltd Feeding-return device for wafer ring
US5976306A (en) * 1998-02-18 1999-11-02 Hover-Davis, Inc. Method and apparatus for removing die from an expanded wafer and conveying die to a pickup location

Also Published As

Publication number Publication date
WO2002005319A2 (en) 2002-01-17
US20020003994A1 (en) 2002-01-10
WO2002005319A3 (en) 2002-06-20

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