AU2001259745A1 - System and method for pneumatic diaphragm cmp head having separate retaining ring and multi-region wafer pressure control - Google Patents
System and method for pneumatic diaphragm cmp head having separate retaining ring and multi-region wafer pressure controlInfo
- Publication number
- AU2001259745A1 AU2001259745A1 AU2001259745A AU5974501A AU2001259745A1 AU 2001259745 A1 AU2001259745 A1 AU 2001259745A1 AU 2001259745 A AU2001259745 A AU 2001259745A AU 5974501 A AU5974501 A AU 5974501A AU 2001259745 A1 AU2001259745 A1 AU 2001259745A1
- Authority
- AU
- Australia
- Prior art keywords
- pressure control
- retaining ring
- pneumatic diaphragm
- separate retaining
- wafer pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20421200P | 2000-05-12 | 2000-05-12 | |
US09570370 | 2000-05-12 | ||
US09/570,369 US6558232B1 (en) | 2000-05-12 | 2000-05-12 | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
US60204212 | 2000-05-12 | ||
US09/570,370 US6506105B1 (en) | 2000-05-12 | 2000-05-12 | System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control |
US09570369 | 2000-05-12 | ||
PCT/US2001/015306 WO2001087541A2 (en) | 2000-05-12 | 2001-05-11 | Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001259745A1 true AU2001259745A1 (en) | 2001-11-26 |
Family
ID=27394636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001259745A Abandoned AU2001259745A1 (en) | 2000-05-12 | 2001-05-11 | System and method for pneumatic diaphragm cmp head having separate retaining ring and multi-region wafer pressure control |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1284840A2 (zh) |
JP (1) | JP2003533359A (zh) |
KR (1) | KR100811172B1 (zh) |
CN (2) | CN1179821C (zh) |
AU (1) | AU2001259745A1 (zh) |
WO (1) | WO2001087541A2 (zh) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6558232B1 (en) | 2000-05-12 | 2003-05-06 | Multi-Planar Technologies, Inc. | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
US6506105B1 (en) | 2000-05-12 | 2003-01-14 | Multi-Planar Technologies, Inc. | System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control |
TWI246448B (en) * | 2000-08-31 | 2006-01-01 | Multi Planar Technologies Inc | Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby |
US6540590B1 (en) | 2000-08-31 | 2003-04-01 | Multi-Planar Technologies, Inc. | Chemical mechanical polishing apparatus and method having a rotating retaining ring |
KR100470227B1 (ko) * | 2001-06-07 | 2005-02-05 | 두산디앤디 주식회사 | 화학기계적 연마장치의 캐리어 헤드 |
JP4353673B2 (ja) * | 2002-04-18 | 2009-10-28 | 株式会社荏原製作所 | ポリッシング方法 |
JP4490822B2 (ja) * | 2002-09-27 | 2010-06-30 | Sumco Techxiv株式会社 | 研磨装置およびウェーハ研磨方法 |
TWI238754B (en) * | 2002-11-07 | 2005-09-01 | Ebara Tech Inc | Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof |
CN104044057B (zh) * | 2004-11-01 | 2017-05-17 | 株式会社荏原制作所 | 抛光设备 |
US20080032603A1 (en) * | 2006-08-03 | 2008-02-07 | 3M Innovative Properties Company | Sanding tool |
JP5464820B2 (ja) * | 2007-10-29 | 2014-04-09 | 株式会社荏原製作所 | 研磨装置 |
US20090242125A1 (en) | 2008-03-25 | 2009-10-01 | Applied Materials, Inc. | Carrier Head Membrane |
DE102009030298B4 (de) | 2009-06-24 | 2012-07-12 | Siltronic Ag | Verfahren zur lokalen Politur einer Halbleiterscheibe |
US20120021673A1 (en) * | 2010-07-20 | 2012-01-26 | Applied Materials, Inc. | Substrate holder to reduce substrate edge stress during chemical mechanical polishing |
CN102172887B (zh) * | 2011-02-16 | 2013-01-30 | 清华大学 | 抛光头 |
KR101196652B1 (ko) * | 2011-05-31 | 2012-11-02 | 주식회사 케이씨텍 | 캐리어 헤드의 멤브레인 결합체 및 이를 구비한 캐리어 헤드 |
CN102922411B (zh) * | 2011-08-10 | 2015-12-16 | 无锡华润上华科技有限公司 | 防止晶片滑片的化学机械研磨方法 |
KR101902049B1 (ko) | 2012-01-25 | 2018-09-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 리테이닝 링 모니터링 및 압력 제어 |
US9050700B2 (en) * | 2012-01-27 | 2015-06-09 | Applied Materials, Inc. | Methods and apparatus for an improved polishing head retaining ring |
JP5807580B2 (ja) | 2012-02-15 | 2015-11-10 | 信越半導体株式会社 | 研磨ヘッド及び研磨装置 |
KR101301001B1 (ko) * | 2012-06-14 | 2013-08-28 | 에스엔유 프리시젼 주식회사 | 파손방지 기능을 구비한 기판처리 시스템 |
KR200465446Y1 (ko) | 2012-09-09 | 2013-02-19 | 전용준 | 캐리어 헤드 하우징과 보유 링 간의 결합 상태 점검 기능을 갖는 화학 기계적 연마 장치의 캐리어 헤드 |
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KR101494757B1 (ko) * | 2013-07-23 | 2015-02-25 | 에이피시스템 주식회사 | 기판 지지 모듈 및 이를 구비하는 기판 처리 장치 |
CN104347467A (zh) * | 2013-07-23 | 2015-02-11 | Ap系统股份有公司 | 衬底固持模块和包含所述衬底固持模块的衬底处理设备 |
KR101487414B1 (ko) * | 2013-09-11 | 2015-01-29 | 주식회사 엘지실트론 | 웨이퍼의 연마 장치 |
JP6232297B2 (ja) | 2014-01-21 | 2017-11-15 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
TWI656944B (zh) * | 2014-05-14 | 2019-04-21 | 日商荏原製作所股份有限公司 | 研磨裝置 |
KR101559282B1 (ko) | 2014-05-19 | 2015-10-19 | 주식회사 티에스시 | 웨이퍼연마장치용 멤브레인 및 이를 포함하는 화학기계식 웨이퍼연마장치 |
US9566687B2 (en) * | 2014-10-13 | 2017-02-14 | Sunedison Semiconductor Limited (Uen201334164H) | Center flex single side polishing head having recess and cap |
CN105856056B (zh) * | 2015-01-19 | 2018-03-02 | 大族激光科技产业集团股份有限公司 | 一种异形面自动抛光装置 |
CN105058225A (zh) * | 2015-07-07 | 2015-11-18 | 武汉新芯集成电路制造有限公司 | 研磨垫固定装置及化学机械研磨装置 |
US9744640B2 (en) * | 2015-10-16 | 2017-08-29 | Applied Materials, Inc. | Corrosion resistant retaining rings |
CN105397574B (zh) * | 2015-12-09 | 2017-08-25 | 浙江工业大学 | 一种加工间隙可调的液动压悬浮抛光装置 |
CN105538045B (zh) * | 2015-12-09 | 2018-06-26 | 浙江工业大学 | 基于自适应和固定加工间隙的液动压悬浮抛光方法及装置 |
CN105479325B (zh) * | 2015-12-30 | 2018-04-17 | 天通吉成机器技术有限公司 | 一种适用于大型单面研磨抛光设备的分区加压装置及方法 |
US9873179B2 (en) * | 2016-01-20 | 2018-01-23 | Applied Materials, Inc. | Carrier for small pad for chemical mechanical polishing |
US10654216B2 (en) * | 2016-03-30 | 2020-05-19 | Canon Kabushiki Kaisha | System and methods for nanoimprint lithography |
TWI572444B (zh) * | 2016-09-08 | 2017-03-01 | Vibration grinding machine structure | |
TWI568537B (zh) * | 2016-09-08 | 2017-02-01 | Vibration grinding machine structure | |
JP7162000B2 (ja) * | 2017-03-06 | 2022-10-27 | アプライド マテリアルズ インコーポレイテッド | Cmp位置特定研磨(lsp)用に設計された螺旋及び同心運動 |
JP6986930B2 (ja) * | 2017-11-07 | 2021-12-22 | 株式会社荏原製作所 | 基板研磨装置および研磨方法 |
CN108145586B (zh) * | 2018-01-03 | 2019-10-11 | 京东方科技集团股份有限公司 | 抛光设备及抛光方法 |
CN109202697A (zh) * | 2018-11-20 | 2019-01-15 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 抛光头、抛光设备以及抛光头的使用方法 |
US11676824B2 (en) * | 2018-12-10 | 2023-06-13 | Samsung Electronics Co., Ltd. | Chemical mechanical polishing apparatus for controlling polishing uniformity |
CN110142689B (zh) * | 2019-04-17 | 2021-09-14 | 杭州众硅电子科技有限公司 | 一种晶圆装载支架、晶圆装载系统及晶圆装片方法 |
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JP2023517454A (ja) * | 2020-06-24 | 2023-04-26 | アプライド マテリアルズ インコーポレイテッド | 圧電圧力制御によるキャリアヘッドの研磨 |
CN111823130A (zh) * | 2020-07-17 | 2020-10-27 | 中国科学院微电子研究所 | 一种抛光头及抛光装置 |
CN111922888B (zh) * | 2020-08-11 | 2022-04-29 | 西安奕斯伟材料科技有限公司 | 边缘抛光装置和抛光方法 |
JP2023516875A (ja) * | 2020-11-10 | 2023-04-21 | アプライド マテリアルズ インコーポレイテッド | 局所的なウエハ圧力を有する研磨ヘッド |
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CN114505782B (zh) * | 2020-11-17 | 2023-08-04 | 长鑫存储技术有限公司 | 固定装置及检测系统 |
CN112605848A (zh) * | 2020-11-29 | 2021-04-06 | 厦门理工学院 | 电磁式重心可调抛光盘机构及抛光方法 |
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JP7296173B2 (ja) * | 2021-03-17 | 2023-06-22 | ミクロ技研株式会社 | 研磨ヘッド及び研磨処理装置 |
CN113290426B (zh) * | 2021-04-15 | 2022-10-21 | 金华博蓝特新材料有限公司 | 提高晶片抛光厚度均匀性的方法 |
CN113878488B (zh) * | 2021-10-18 | 2022-09-06 | 华海清科(北京)科技有限公司 | 一种化学机械抛光头和抛光系统 |
CN114310652A (zh) * | 2021-12-30 | 2022-04-12 | 金陵科技学院 | 一种软脆材料柔性研磨装置 |
CN114700871B (zh) * | 2022-03-11 | 2023-11-24 | 上海致领半导体科技发展有限公司 | 一种第三代半导体化学机械抛光装置 |
CN115091359B (zh) * | 2022-05-26 | 2023-09-05 | 浙江晶盛机电股份有限公司 | 抛光载体 |
CN115008342B (zh) * | 2022-06-15 | 2023-08-25 | 安徽禾臣新材料有限公司 | 一种晶片抛光用防崩角的无蜡垫及其生产工艺 |
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CN116372786B (zh) * | 2023-06-05 | 2023-08-18 | 北京特思迪半导体设备有限公司 | 一种晶圆抛光设备 |
CN116442103B (zh) * | 2023-06-13 | 2023-08-29 | 深圳市鲁光电子科技有限公司 | 一种第三代半导体精密加工装置 |
CN117245542B (zh) * | 2023-11-17 | 2024-01-23 | 苏州博宏源机械制造有限公司 | 晶圆双面抛光设备及工艺 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0169932B1 (de) * | 1984-08-03 | 1987-04-22 | Wilhelm Loh Wetzlar Optikmaschinen GmbH & Co. KG | Vorrichtung zum Halten von empfindlichen Werkstücken, insbesondere von optischen Linsen und anderen optischen Bauelementen |
US4918869A (en) * | 1987-10-28 | 1990-04-24 | Fujikoshi Machinery Corporation | Method for lapping a wafer material and an apparatus therefor |
JP3311116B2 (ja) * | 1993-10-28 | 2002-08-05 | 株式会社東芝 | 半導体製造装置 |
US5820448A (en) * | 1993-12-27 | 1998-10-13 | Applied Materials, Inc. | Carrier head with a layer of conformable material for a chemical mechanical polishing system |
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
JP3552845B2 (ja) * | 1996-04-25 | 2004-08-11 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
US6183354B1 (en) * | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US5941758A (en) * | 1996-11-13 | 1999-08-24 | Intel Corporation | Method and apparatus for chemical-mechanical polishing |
DE19651761A1 (de) * | 1996-12-12 | 1998-06-18 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben |
US6056632A (en) * | 1997-02-13 | 2000-05-02 | Speedfam-Ipec Corp. | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
KR100475845B1 (ko) * | 1997-04-04 | 2005-06-17 | 도쿄 세이미츄 코퍼레이션 리미티드 | 연마장치 |
US5957751A (en) * | 1997-05-23 | 1999-09-28 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
US6107203A (en) * | 1997-11-03 | 2000-08-22 | Motorola, Inc. | Chemical mechanical polishing system and method therefor |
FR2778129B1 (fr) * | 1998-05-04 | 2000-07-21 | St Microelectronics Sa | Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine |
US6251215B1 (en) * | 1998-06-03 | 2001-06-26 | Applied Materials, Inc. | Carrier head with a multilayer retaining ring for chemical mechanical polishing |
US6422927B1 (en) * | 1998-12-30 | 2002-07-23 | Applied Materials, Inc. | Carrier head with controllable pressure and loading area for chemical mechanical polishing |
US6093089A (en) * | 1999-01-25 | 2000-07-25 | United Microelectronics Corp. | Apparatus for controlling uniformity of polished material |
DE19941903A1 (de) * | 1999-09-02 | 2001-03-15 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Polieren einer Halbleiterscheibe |
-
2001
- 2001-05-11 CN CNB018121713A patent/CN1179821C/zh not_active Expired - Fee Related
- 2001-05-11 WO PCT/US2001/015306 patent/WO2001087541A2/en active Application Filing
- 2001-05-11 KR KR1020027015207A patent/KR100811172B1/ko not_active IP Right Cessation
- 2001-05-11 EP EP01933311A patent/EP1284840A2/en not_active Withdrawn
- 2001-05-11 CN CNB2004100881994A patent/CN100433269C/zh not_active Expired - Fee Related
- 2001-05-11 AU AU2001259745A patent/AU2001259745A1/en not_active Abandoned
- 2001-05-11 JP JP2001583983A patent/JP2003533359A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1284840A2 (en) | 2003-02-26 |
KR100811172B1 (ko) | 2008-03-10 |
CN1440321A (zh) | 2003-09-03 |
KR20030010621A (ko) | 2003-02-05 |
JP2003533359A (ja) | 2003-11-11 |
CN1638057A (zh) | 2005-07-13 |
CN1179821C (zh) | 2004-12-15 |
WO2001087541A2 (en) | 2001-11-22 |
CN100433269C (zh) | 2008-11-12 |
WO2001087541A3 (en) | 2002-03-28 |
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