AU2001251177A1 - Methods for performing wafer preparation operations on vertically oriented semiconductor wafers - Google Patents

Methods for performing wafer preparation operations on vertically oriented semiconductor wafers

Info

Publication number
AU2001251177A1
AU2001251177A1 AU2001251177A AU5117701A AU2001251177A1 AU 2001251177 A1 AU2001251177 A1 AU 2001251177A1 AU 2001251177 A AU2001251177 A AU 2001251177A AU 5117701 A AU5117701 A AU 5117701A AU 2001251177 A1 AU2001251177 A1 AU 2001251177A1
Authority
AU
Australia
Prior art keywords
methods
semiconductor wafers
vertically oriented
preparation operations
wafer preparation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001251177A
Inventor
David T. Frost
Oliver David Jones
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/540,161 external-priority patent/US6616509B1/en
Priority claimed from US09/540,974 external-priority patent/US6461224B1/en
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2001251177A1 publication Critical patent/AU2001251177A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
AU2001251177A 2000-03-31 2001-03-29 Methods for performing wafer preparation operations on vertically oriented semiconductor wafers Abandoned AU2001251177A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09540161 2000-03-31
US09/540,161 US6616509B1 (en) 2000-03-31 2000-03-31 Method for performing two wafer preparation operations on vertically oriented semiconductor wafer in single enclosure
US09540974 2000-03-31
US09/540,974 US6461224B1 (en) 2000-03-31 2000-03-31 Off-diameter method for preparing semiconductor wafers
PCT/US2001/010438 WO2001074533A2 (en) 2000-03-31 2001-03-29 Methods for performing wafer preparation operations on vertically oriented semiconductor wafers

Publications (1)

Publication Number Publication Date
AU2001251177A1 true AU2001251177A1 (en) 2001-10-15

Family

ID=27066345

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001251177A Abandoned AU2001251177A1 (en) 2000-03-31 2001-03-29 Methods for performing wafer preparation operations on vertically oriented semiconductor wafers

Country Status (3)

Country Link
AU (1) AU2001251177A1 (en)
TW (1) TW480571B (en)
WO (1) WO2001074533A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8739806B2 (en) 2011-05-11 2014-06-03 Nanya Technology Corp. Chemical mechanical polishing system
JP6974116B2 (en) * 2017-10-27 2021-12-01 株式会社荏原製作所 A board processing device and a board processing method provided with a board holding device and a board holding device.

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012618A (en) * 1989-12-21 1991-05-07 Hmt Technology Corporation Magnetic disc surface treatment and apparatus
US5475889A (en) * 1994-07-15 1995-12-19 Ontrak Systems, Inc. Automatically adjustable brush assembly for cleaning semiconductor wafers
JPH1119609A (en) * 1997-07-08 1999-01-26 Syst Seiko Kk Method and device for treating surface of rotary disk
US5933902A (en) * 1997-11-18 1999-08-10 Frey; Bernhard M. Wafer cleaning system
US6070284A (en) * 1998-02-04 2000-06-06 Silikinetic Technology, Inc. Wafer cleaning method and system

Also Published As

Publication number Publication date
TW480571B (en) 2002-03-21
WO2001074533A3 (en) 2002-01-31
WO2001074533A2 (en) 2001-10-11

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