AU2001249530A1 - Fixed abrasive linear polishing belt and system using the same - Google Patents

Fixed abrasive linear polishing belt and system using the same

Info

Publication number
AU2001249530A1
AU2001249530A1 AU2001249530A AU4953001A AU2001249530A1 AU 2001249530 A1 AU2001249530 A1 AU 2001249530A1 AU 2001249530 A AU2001249530 A AU 2001249530A AU 4953001 A AU4953001 A AU 4953001A AU 2001249530 A1 AU2001249530 A1 AU 2001249530A1
Authority
AU
Australia
Prior art keywords
same
fixed abrasive
polishing belt
linear polishing
abrasive linear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001249530A
Inventor
John M. Boyd
Aleksander Owczarz
Cangshan Xu
Yuexing Zhao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research AG
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research AG, Lam Research Corp filed Critical Lam Research AG
Publication of AU2001249530A1 publication Critical patent/AU2001249530A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AU2001249530A 2000-03-31 2001-03-28 Fixed abrasive linear polishing belt and system using the same Abandoned AU2001249530A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US54081000A 2000-03-31 2000-03-31
US09/540,810 2000-03-31
PCT/US2001/009870 WO2001074535A1 (en) 2000-03-31 2001-03-28 Fixed abrasive linear polishing belt and system using the same

Publications (1)

Publication Number Publication Date
AU2001249530A1 true AU2001249530A1 (en) 2001-10-15

Family

ID=24157029

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001249530A Abandoned AU2001249530A1 (en) 2000-03-31 2001-03-28 Fixed abrasive linear polishing belt and system using the same

Country Status (5)

Country Link
EP (1) EP1268130A1 (en)
JP (1) JP2003529456A (en)
KR (1) KR20020086707A (en)
AU (1) AU2001249530A1 (en)
WO (1) WO2001074535A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7066801B2 (en) 2003-02-21 2006-06-27 Dow Global Technologies, Inc. Method of manufacturing a fixed abrasive material
JP2005059159A (en) * 2003-08-15 2005-03-10 Tkx:Kk Polishing belt
JP4939129B2 (en) * 2006-07-05 2012-05-23 東京エレクトロン株式会社 Probe polishing member, probe polishing method, probe card, and probe apparatus
CN103381573B (en) * 2013-05-27 2016-08-10 河南科技学院 A kind of SiC single crystal slice lapping operation concretion abrasive cmp dish
KR101942251B1 (en) * 2016-11-25 2019-04-11 주식회사 케이씨텍 Substrate procesing apparatus
GB2557952B (en) * 2016-12-16 2022-06-15 Zeeko Innovations Ltd Methods and apparatus for shaping workpieces
KR102355116B1 (en) * 2017-04-03 2022-01-26 주식회사 케이씨텍 Slurry dispensing nozzle and apparatus for polishing substrate having the nozzle
KR102532246B1 (en) * 2017-11-21 2023-05-15 주식회사 케이씨텍 Substrate procesing apparatus
KR102100130B1 (en) * 2018-04-02 2020-04-20 주식회사 케이씨텍 Substrate processing apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US6736714B2 (en) * 1997-07-30 2004-05-18 Praxair S.T. Technology, Inc. Polishing silicon wafers
US6039633A (en) * 1998-10-01 2000-03-21 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
US6634929B1 (en) * 1999-04-23 2003-10-21 3M Innovative Properties Company Method for grinding glass
US20020090819A1 (en) * 1999-08-31 2002-07-11 Cangshan Xu Windowless belt and method for improved in-situ wafer monitoring

Also Published As

Publication number Publication date
WO2001074535A9 (en) 2003-10-23
KR20020086707A (en) 2002-11-18
JP2003529456A (en) 2003-10-07
WO2001074535A1 (en) 2001-10-11
EP1268130A1 (en) 2003-01-02

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