AU2001241516A1 - Method of forming lead-free solder alloys by electrochemical deposition process - Google Patents

Method of forming lead-free solder alloys by electrochemical deposition process

Info

Publication number
AU2001241516A1
AU2001241516A1 AU2001241516A AU4151601A AU2001241516A1 AU 2001241516 A1 AU2001241516 A1 AU 2001241516A1 AU 2001241516 A AU2001241516 A AU 2001241516A AU 4151601 A AU4151601 A AU 4151601A AU 2001241516 A1 AU2001241516 A1 AU 2001241516A1
Authority
AU
Australia
Prior art keywords
deposition process
free solder
electrochemical deposition
solder alloys
forming lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001241516A
Inventor
William Hines Lytle
Jaynal Abedin Molla
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU2001241516A1 publication Critical patent/AU2001241516A1/en
Abandoned legal-status Critical Current

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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
AU2001241516A 2000-02-23 2001-02-15 Method of forming lead-free solder alloys by electrochemical deposition process Abandoned AU2001241516A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US51152500A 2000-02-23 2000-02-23
US09511525 2000-02-23
PCT/US2001/004956 WO2001063668A2 (en) 2000-02-23 2001-02-15 Method of forming lead-free solder alloys by electrochemical deposition process

Publications (1)

Publication Number Publication Date
AU2001241516A1 true AU2001241516A1 (en) 2001-09-03

Family

ID=24035263

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001241516A Abandoned AU2001241516A1 (en) 2000-02-23 2001-02-15 Method of forming lead-free solder alloys by electrochemical deposition process

Country Status (2)

Country Link
AU (1) AU2001241516A1 (en)
WO (1) WO2001063668A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6780751B2 (en) * 2002-10-09 2004-08-24 Freescale Semiconductor, Inc. Method for eliminating voiding in plated solder
DE102005053842B4 (en) 2005-11-09 2008-02-07 Infineon Technologies Ag Semiconductor device with connecting elements and method for producing the same
US9142520B2 (en) 2011-08-30 2015-09-22 Ati Technologies Ulc Methods of fabricating semiconductor chip solder structures
KR102233334B1 (en) * 2014-04-28 2021-03-29 삼성전자주식회사 Tin plating solution, Tin plating equipment and method for fabricating semiconductor device using the tin plating solution

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4399006A (en) * 1978-08-29 1983-08-16 Learonal, Inc. Silver plating
US5316205A (en) * 1993-04-05 1994-05-31 Motorola, Inc. Method for forming gold bump connection using tin-bismuth solder
KR100219806B1 (en) * 1997-05-27 1999-09-01 윤종용 Method for manufacturing flip chip mount type of semiconductor, and manufacture solder bump

Also Published As

Publication number Publication date
WO2001063668A3 (en) 2002-02-28
WO2001063668A2 (en) 2001-08-30

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