AU2001236863A1 - Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby - Google Patents

Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby

Info

Publication number
AU2001236863A1
AU2001236863A1 AU2001236863A AU3686301A AU2001236863A1 AU 2001236863 A1 AU2001236863 A1 AU 2001236863A1 AU 2001236863 A AU2001236863 A AU 2001236863A AU 3686301 A AU3686301 A AU 3686301A AU 2001236863 A1 AU2001236863 A1 AU 2001236863A1
Authority
AU
Australia
Prior art keywords
fluid control
attaching
manifold
control system
system produced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001236863A
Inventor
James M. Harris
Michael J. Selser
Walter A. Weber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Redwood Microsystems Inc
Original Assignee
Redwood Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Redwood Microsystems Inc filed Critical Redwood Microsystems Inc
Publication of AU2001236863A1 publication Critical patent/AU2001236863A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0041—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
    • F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F16K99/0003—Constructional types of microvalves; Details of the cutting-off member
    • F16K99/0015—Diaphragm or membrane valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F16K99/0034—Operating means specially adapted for microvalves
    • F16K99/0036—Operating means specially adapted for microvalves operated by temperature variations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0402—Cleaning, repairing, or assembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87676—With flow control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/877—With flow control means for branched passages
    • Y10T137/87885—Sectional block structure

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Organic Chemistry (AREA)
  • Micromachines (AREA)
  • Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Fluid-Pressure Circuits (AREA)
  • Valve Housings (AREA)

Abstract

A method of attaching a micromechanical fluid control device to a substrate includes the steps of forming a first ring of a first adhesive around an aperture defined between a micromechanical fluid control device and a substrate. The first adhesive forms a first interface between the micromechanical fluid control device and the substrate that is clean and corrosion resistant. A second ring of a second adhesive is applied around the first ring. The second adhesive forms a second interface between the micromechanical fluid control device and the substrate that is hermetic.
AU2001236863A 2000-02-14 2001-02-12 Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby Abandoned AU2001236863A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/503,443 US6325886B1 (en) 2000-02-14 2000-02-14 Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby
US09503443 2000-02-14
PCT/US2001/004309 WO2001060614A1 (en) 2000-02-14 2001-02-12 Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby

Publications (1)

Publication Number Publication Date
AU2001236863A1 true AU2001236863A1 (en) 2001-08-27

Family

ID=24002112

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001236863A Abandoned AU2001236863A1 (en) 2000-02-14 2001-02-12 Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby

Country Status (10)

Country Link
US (1) US6325886B1 (en)
EP (1) EP1255642B1 (en)
JP (1) JP5019277B2 (en)
KR (1) KR100808346B1 (en)
CN (1) CN1173827C (en)
AT (1) ATE478930T1 (en)
AU (1) AU2001236863A1 (en)
CA (1) CA2400025C (en)
DE (1) DE60142889D1 (en)
WO (1) WO2001060614A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000511570A (en) * 1996-05-28 2000-09-05 アーベーベー ダイムラー―ベンツ トランスポーテイシヨン（ドイツチユランド）ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Method of joining railway vehicle members and structural parts by bonding
US6869818B2 (en) * 2002-11-18 2005-03-22 Redwood Microsystems, Inc. Method for producing and testing a corrosion-resistant channel in a silicon device
US6907904B2 (en) * 2003-03-03 2005-06-21 Redwood Microsystems, Inc. Fluid delivery system and mounting panel therefor
US7514283B2 (en) * 2003-03-20 2009-04-07 Robert Bosch Gmbh Method of fabricating electromechanical device having a controlled atmosphere
US20070055282A1 (en) * 2003-03-31 2007-03-08 The Cleveland Clinic Foundation Apparatus and method for harvesting bone marrow
US7075160B2 (en) 2003-06-04 2006-07-11 Robert Bosch Gmbh Microelectromechanical systems and devices having thin film encapsulated mechanical structures
US7044147B2 (en) * 2004-03-15 2006-05-16 Atmel Corporation System, apparatus and method for contaminant reduction in semiconductor device fabrication equipment components
US7439558B2 (en) 2005-11-04 2008-10-21 Atmel Corporation Method and system for controlled oxygen incorporation in compound semiconductor films for device performance enhancement
US7300849B2 (en) * 2005-11-04 2007-11-27 Atmel Corporation Bandgap engineered mono-crystalline silicon cap layers for SiGe HBT performance enhancement
US7651919B2 (en) * 2005-11-04 2010-01-26 Atmel Corporation Bandgap and recombination engineered emitter layers for SiGe HBT performance optimization
US20070102729A1 (en) * 2005-11-04 2007-05-10 Enicks Darwin G Method and system for providing a heterojunction bipolar transistor having SiGe extensions
US20070170528A1 (en) 2006-01-20 2007-07-26 Aaron Partridge Wafer encapsulated microelectromechanical structure and method of manufacturing same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051286A (en) * 1974-12-20 1977-09-27 Fruehauf Corporation Dual adhesive method and article
US4110140A (en) * 1976-12-15 1978-08-29 Johnson Controls, Inc. Method of making fluid system circuit board
US4793886A (en) * 1986-07-02 1988-12-27 Cemedine Co., Ltd. Bonding method and adhesive useful for the method
JPH03135051A (en) * 1989-10-20 1991-06-10 Fujitsu Ltd Sealing of semiconductor device
JPH0487354A (en) * 1990-07-30 1992-03-19 Hitachi Ltd Semiconductor device
US5084119A (en) * 1990-10-17 1992-01-28 Bridgestone/Firestone, Inc. Lap seam and method forming same
JPH11284097A (en) * 1998-03-30 1999-10-15 Fujitsu Ltd Semiconductor device
JP3658067B2 (en) * 1995-12-26 2005-06-08 キヤノン株式会社 Micromachine, liquid jet recording head using the same, and liquid jet recording apparatus equipped with the liquid jet recording head
US5568713A (en) * 1996-01-24 1996-10-29 The Stanley Works Mirror door and method of making same
US5964239A (en) * 1996-05-23 1999-10-12 Hewlett-Packard Company Housing assembly for micromachined fluid handling structure
JP3552854B2 (en) * 1996-09-12 2004-08-11 株式会社リコー Ink jet recording head and method of manufacturing the same
JP3042431B2 (en) * 1996-12-03 2000-05-15 株式会社村田製作所 Electronic component sealing structure and sealing method
DE19743409A1 (en) * 1997-10-01 1999-04-08 Bosch Gmbh Robert System for measuring suction air mass flow in IC engine
JP2000058692A (en) * 1998-08-14 2000-02-25 Toyo Commun Equip Co Ltd Package for electronic components
US6123107A (en) * 1999-07-09 2000-09-26 Redwood Microsystems, Inc. Apparatus and method for mounting micromechanical fluid control components

Also Published As

Publication number Publication date
KR20020081686A (en) 2002-10-30
CA2400025C (en) 2009-01-06
US6325886B1 (en) 2001-12-04
CN1173827C (en) 2004-11-03
CA2400025A1 (en) 2001-08-23
DE60142889D1 (en) 2010-10-07
JP2004500249A (en) 2004-01-08
CN1426352A (en) 2003-06-25
ATE478930T1 (en) 2010-09-15
EP1255642B1 (en) 2010-08-25
JP5019277B2 (en) 2012-09-05
EP1255642A1 (en) 2002-11-13
WO2001060614A1 (en) 2001-08-23
KR100808346B1 (en) 2008-02-27
EP1255642A4 (en) 2003-03-19

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