ATE518246T1 - Led-lampe - Google Patents

Led-lampe

Info

Publication number
ATE518246T1
ATE518246T1 AT01942891T AT01942891T ATE518246T1 AT E518246 T1 ATE518246 T1 AT E518246T1 AT 01942891 T AT01942891 T AT 01942891T AT 01942891 T AT01942891 T AT 01942891T AT E518246 T1 ATE518246 T1 AT E518246T1
Authority
AT
Austria
Prior art keywords
led lamp
junctions
semi
light emitting
accordance
Prior art date
Application number
AT01942891T
Other languages
English (en)
Inventor
Balu Jeganathan
John Montagnat
Original Assignee
Lednium Technology Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lednium Technology Pty Ltd filed Critical Lednium Technology Pty Ltd
Application granted granted Critical
Publication of ATE518246T1 publication Critical patent/ATE518246T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Devices (AREA)
AT01942891T 2000-06-15 2001-06-15 Led-lampe ATE518246T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AUPQ8181A AUPQ818100A0 (en) 2000-06-15 2000-06-15 Led lamp
PCT/AU2001/000717 WO2001097287A1 (en) 2000-06-15 2001-06-15 Led lamp

Publications (1)

Publication Number Publication Date
ATE518246T1 true ATE518246T1 (de) 2011-08-15

Family

ID=3822250

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01942891T ATE518246T1 (de) 2000-06-15 2001-06-15 Led-lampe

Country Status (13)

Country Link
US (2) US6809475B2 (de)
EP (1) EP1297572B1 (de)
JP (1) JP2004503120A (de)
KR (1) KR20030019426A (de)
CN (1) CN1460294A (de)
AT (1) ATE518246T1 (de)
AU (1) AUPQ818100A0 (de)
CA (1) CA2411219A1 (de)
HK (1) HK1054817A1 (de)
NZ (1) NZ512392A (de)
TW (1) TWI251350B (de)
WO (1) WO2001097287A1 (de)
ZA (1) ZA200209990B (de)

Families Citing this family (20)

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AUPQ818100A0 (en) * 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
US7320632B2 (en) * 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
CN1663044A (zh) * 2002-06-14 2005-08-31 莱尼股份有限公司 灯和制灯方法
US20080102726A2 (en) * 2003-03-12 2008-05-01 Balu Jeganathan Lamp and a process for producing a lamp
US7038370B2 (en) * 2003-03-17 2006-05-02 Lumileds Lighting, U.S., Llc Phosphor converted light emitting device
US7575030B2 (en) * 2003-12-10 2009-08-18 Hutchinson Runflat device for a motor vehicle, and a mounted assembly incorporating it
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CN101865375B (zh) 2005-06-28 2013-03-13 首尔Opto仪器股份有限公司 发光装置
US8896216B2 (en) 2005-06-28 2014-11-25 Seoul Viosys Co., Ltd. Illumination system
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US8067777B2 (en) * 2008-05-12 2011-11-29 Occam Portfolio Llc Light emitting diode package assembly
KR100889916B1 (ko) * 2008-09-09 2009-04-16 동광전자 주식회사 빛의 방사각이 편향된 발광다이오드 및 그 제조 방법
IT1399596B1 (it) 2009-09-29 2013-04-26 Zanotta Faro stradale a memorizzazione cromatica per la riduzione dei consumi energetici e relativo metodo di costruzione, utilizzo e controllo
EP2854187B1 (de) * 2010-01-29 2018-03-07 Japan Aviation Electronics Industry, Ltd. LED-Element, Verfahren zu seiner Herstellung und Licht emittierende Vorrichtung
EP2392850B1 (de) * 2010-06-04 2017-07-19 Ville de Geneve LED-Lampe
CN202091826U (zh) 2011-05-05 2011-12-28 厦门砺德光电科技有限公司 Led反射调节灯
KR102007403B1 (ko) * 2012-11-02 2019-08-05 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 유닛
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Also Published As

Publication number Publication date
WO2001097287A1 (en) 2001-12-20
US6809475B2 (en) 2004-10-26
JP2004503120A (ja) 2004-01-29
CA2411219A1 (en) 2001-12-20
HK1054817A1 (zh) 2003-12-12
ZA200209990B (en) 2003-10-20
US7352127B2 (en) 2008-04-01
EP1297572A1 (de) 2003-04-02
US20050104515A1 (en) 2005-05-19
AUPQ818100A0 (en) 2000-07-06
NZ512392A (en) 2002-12-20
KR20030019426A (ko) 2003-03-06
TWI251350B (en) 2006-03-11
CN1460294A (zh) 2003-12-03
EP1297572A4 (de) 2006-09-13
US20020145384A1 (en) 2002-10-10
EP1297572B1 (de) 2011-07-27

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