ATE345664T1 - Verfahren und vorrichtung zur kühlung eines bauteiles - Google Patents
Verfahren und vorrichtung zur kühlung eines bauteilesInfo
- Publication number
- ATE345664T1 ATE345664T1 AT02019564T AT02019564T ATE345664T1 AT E345664 T1 ATE345664 T1 AT E345664T1 AT 02019564 T AT02019564 T AT 02019564T AT 02019564 T AT02019564 T AT 02019564T AT E345664 T1 ATE345664 T1 AT E345664T1
- Authority
- AT
- Austria
- Prior art keywords
- heat
- component
- electronics module
- removal device
- cooling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/960,017 US6538884B1 (en) | 2001-09-21 | 2001-09-21 | Method and apparatus for removing heat from a component |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE345664T1 true ATE345664T1 (de) | 2006-12-15 |
Family
ID=25502690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02019564T ATE345664T1 (de) | 2001-09-21 | 2002-09-02 | Verfahren und vorrichtung zur kühlung eines bauteiles |
Country Status (6)
Country | Link |
---|---|
US (1) | US6538884B1 (de) |
EP (1) | EP1303174B1 (de) |
JP (1) | JP4206435B2 (de) |
AT (1) | ATE345664T1 (de) |
CA (1) | CA2399898A1 (de) |
DE (1) | DE60216033T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3651677B2 (ja) * | 2002-07-12 | 2005-05-25 | 株式会社東芝 | 発熱素子冷却装置及び電子機器 |
US6721182B1 (en) * | 2002-10-10 | 2004-04-13 | Harris Corporation | Circuit card module including mezzanine card heat sink and related methods |
US6768642B2 (en) * | 2002-12-16 | 2004-07-27 | Lockheed Martin Corporation | VME circuit host card with triple mezzanine configuration |
TW200537279A (en) * | 2004-05-13 | 2005-11-16 | Mitac Technology Corp | Heat sink module having heat conduction cover plate |
US7369412B2 (en) * | 2006-05-02 | 2008-05-06 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7391610B2 (en) | 2006-09-29 | 2008-06-24 | Rockwell Automation Technologies, Inc. | Thermal cooling of industrial electronic module by conductive structure |
US7444209B2 (en) * | 2006-10-26 | 2008-10-28 | Honeywell International Inc. | Miniature cooling device |
CN101315176A (zh) * | 2007-06-01 | 2008-12-03 | 富士迈半导体精密工业(上海)有限公司 | 具较佳散热效率的光源模组 |
TW200910070A (en) * | 2007-08-28 | 2009-03-01 | Inventec Corp | Heat dissipation module |
US20090323286A1 (en) * | 2008-06-13 | 2009-12-31 | Evga Corporation | Apparatus for removing heat from pc circuit board devices such as graphics cards and the like |
TWI476575B (zh) * | 2012-05-04 | 2015-03-11 | Inventec Corp | 電子裝置及其散熱結構 |
US9013874B2 (en) * | 2012-09-12 | 2015-04-21 | Sk Hynix Memory Solutions Inc. | Heat dissipation device |
US9497888B2 (en) * | 2013-02-27 | 2016-11-15 | International Business Machines Corporation | Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s) |
JP6456891B2 (ja) * | 2016-09-23 | 2019-01-23 | レノボ・シンガポール・プライベート・リミテッド | 電子機器 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2024412B3 (es) * | 1985-12-13 | 1992-03-01 | Hasler Ag Ascom | Procedimiento y dispositivo para la evacuacion de calor perdido de por lo menos un grupo de construccion de elementos electricos |
US4931904A (en) | 1989-05-30 | 1990-06-05 | Motorola, Inc. | Localized circuit card cooling device |
JPH0629683A (ja) * | 1992-03-31 | 1994-02-04 | Furukawa Electric Co Ltd:The | 電子機器用ヒートパイプ式放熱ユニット |
US5343940A (en) * | 1992-10-29 | 1994-09-06 | Amigo Jean | Flexible heat transfer device |
US5390734A (en) * | 1993-05-28 | 1995-02-21 | Lytron Incorporated | Heat sink |
US5472043A (en) * | 1994-03-22 | 1995-12-05 | Aavid Laboratories, Inc. | Two-phase component cooler with radioactive initiator |
US5613906A (en) | 1995-07-20 | 1997-03-25 | Elonex I.P. Holdings, Ltd. | Method and apparatus for waste heat removal from a computer enclosure |
US5986887A (en) | 1998-10-28 | 1999-11-16 | Unisys Corporation | Stacked circuit board assembly adapted for heat dissipation |
US6246582B1 (en) * | 1998-12-30 | 2001-06-12 | Honeywell Inc. | Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module |
TW448711B (en) * | 1999-07-22 | 2001-08-01 | Foxconn Prec Components Co Ltd | Heat dissipation device |
US6407916B1 (en) * | 2000-06-12 | 2002-06-18 | Intel Corporation | Computer assembly for cooling high powered microprocessors |
US6377459B1 (en) * | 2000-08-04 | 2002-04-23 | Sun Microsystems, Inc. | Chip cooling management |
-
2001
- 2001-09-21 US US09/960,017 patent/US6538884B1/en not_active Expired - Lifetime
-
2002
- 2002-08-27 CA CA002399898A patent/CA2399898A1/en not_active Abandoned
- 2002-09-02 DE DE60216033T patent/DE60216033T2/de not_active Expired - Lifetime
- 2002-09-02 EP EP02019564A patent/EP1303174B1/de not_active Expired - Lifetime
- 2002-09-02 AT AT02019564T patent/ATE345664T1/de not_active IP Right Cessation
- 2002-09-18 JP JP2002271249A patent/JP4206435B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2399898A1 (en) | 2003-03-21 |
JP4206435B2 (ja) | 2009-01-14 |
US20030058616A1 (en) | 2003-03-27 |
JP2003179372A (ja) | 2003-06-27 |
EP1303174B1 (de) | 2006-11-15 |
DE60216033T2 (de) | 2007-06-21 |
EP1303174A3 (de) | 2005-01-12 |
DE60216033D1 (de) | 2006-12-28 |
EP1303174A2 (de) | 2003-04-16 |
US6538884B1 (en) | 2003-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |