ATE191311T1 - Ätzresistzusammensetzung, verfahren zur bildung eines musters unter ihrer verwendung und leiterplatte und ihre herstellung - Google Patents

Ätzresistzusammensetzung, verfahren zur bildung eines musters unter ihrer verwendung und leiterplatte und ihre herstellung

Info

Publication number
ATE191311T1
ATE191311T1 AT94119667T AT94119667T ATE191311T1 AT E191311 T1 ATE191311 T1 AT E191311T1 AT 94119667 T AT94119667 T AT 94119667T AT 94119667 T AT94119667 T AT 94119667T AT E191311 T1 ATE191311 T1 AT E191311T1
Authority
AT
Austria
Prior art keywords
etchresist
pattern
composition
production
forming
Prior art date
Application number
AT94119667T
Other languages
English (en)
Inventor
Hiromichi Noguchi
Hiroshi Sugitani
Yutaka Koizumi
Tadayoshi Inamoto
Kiyomi Aono
Yoshie Nakata
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE191311T1 publication Critical patent/ATE191311T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
AT94119667T 1993-12-14 1994-12-13 Ätzresistzusammensetzung, verfahren zur bildung eines musters unter ihrer verwendung und leiterplatte und ihre herstellung ATE191311T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31361293A JP3799069B2 (ja) 1993-12-14 1993-12-14 エッチングレジスト性組成物、これを用いたパターン形成方法及び配線基板の製造方法

Publications (1)

Publication Number Publication Date
ATE191311T1 true ATE191311T1 (de) 2000-04-15

Family

ID=18043419

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94119667T ATE191311T1 (de) 1993-12-14 1994-12-13 Ätzresistzusammensetzung, verfahren zur bildung eines musters unter ihrer verwendung und leiterplatte und ihre herstellung

Country Status (5)

Country Link
US (1) US6040002A (de)
EP (1) EP0659038B1 (de)
JP (1) JP3799069B2 (de)
AT (1) ATE191311T1 (de)
DE (1) DE69423709T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5596027A (en) * 1995-07-13 1997-01-21 Videojet Systems International, Inc. Condensation and water resistant jet ink
JP3922763B2 (ja) * 1997-06-11 2007-05-30 株式会社サクラクレパス 熱履歴表示インク組成物
JP3922793B2 (ja) * 1998-03-19 2007-05-30 株式会社サクラクレパス 熱履歴表示インク組成物
US6872320B2 (en) * 2001-04-19 2005-03-29 Xerox Corporation Method for printing etch masks using phase-change materials
US8119327B2 (en) * 2002-03-28 2012-02-21 Huntsman Advanced Materials Americas Llc Polymerisable composition
JP2003309346A (ja) * 2002-04-15 2003-10-31 National Institute Of Advanced Industrial & Technology プリント基板高速作成方法
GB0221892D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Process
JP2005118769A (ja) * 2003-10-15 2005-05-12 Rohm & Haas Electronic Materials Llc パターン形成
GB0324947D0 (en) 2003-10-25 2003-11-26 Avecia Ltd Process
KR100733920B1 (ko) 2004-09-17 2007-07-02 주식회사 엘지화학 에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법
US7271099B2 (en) * 2005-06-06 2007-09-18 Ffei Limited Forming a conductive pattern on a substrate
KR20090101943A (ko) * 2006-12-18 2009-09-29 노쓰웨스턴유니버시티 에칭 레지스트를 이용한 미세구조 및 나노구조의 제조
JP5223229B2 (ja) * 2007-04-24 2013-06-26 コニカミノルタホールディングス株式会社 サンドブラスト用マスクを形成するためのインクジェットインクとそれを用いた凹凸画像形成方法
JP2009076814A (ja) * 2007-09-25 2009-04-09 The Inctec Inc 金属箔エッチッング用レジスト、及び金属箔パターン形成方法
JP2010069817A (ja) * 2008-09-22 2010-04-02 Konica Minolta Ij Technologies Inc インクジェット記録方法
JP5740209B2 (ja) * 2011-05-31 2015-06-24 大日精化工業株式会社 エッチングレジスト用水性インクジェットインク組成物
CN102807783A (zh) * 2011-06-02 2012-12-05 中国科学院化学研究所 用于纳米材料打印直接制版的墨水及其制备方法
JP6813267B2 (ja) * 2015-06-03 2021-01-13 太陽インキ製造株式会社 エッチングレジスト組成物およびドライフィルム
CN108165092A (zh) * 2018-01-10 2018-06-15 东莞智炜新材料股份有限公司 一种水性pcb线路碱性蚀刻保护油墨及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2073609B (en) * 1980-04-14 1984-05-02 Ici Ltd Coating process
US4880667A (en) * 1985-09-24 1989-11-14 Ppg Industries, Inc. Photochromic plastic article and method for preparing same
US4717639A (en) * 1985-12-06 1988-01-05 E. I. Du Pont De Nemours And Company Process for preparation of a stencil or resist image
US4940628A (en) * 1986-09-15 1990-07-10 The Gillette Company Erasable system including marking surface and erasable ink composition
DE3740149A1 (de) * 1987-11-26 1989-06-08 Herbert Dr Strohwald Verfahren zum herstellen eines leitermusters auf einem substrat
US5368891A (en) * 1988-05-26 1994-11-29 Sakata Inkusu Kabushikikaisha Method and apparatus for producing glossy printed matter
US4921899A (en) * 1988-10-11 1990-05-01 Eastman Kodak Company Ink composition containing a blend of a polyester, an acrylic polymer and a vinyl polymer
JPH0819361B2 (ja) * 1988-12-27 1996-02-28 キヤノン株式会社 記録液及びこれを用いたインクジェット記録方法
DE59009466D1 (de) * 1989-10-26 1995-09-07 Ciba Geigy Ag Wässerige Drucktinten für den Tintenstrahldruck.
US5196485A (en) * 1991-04-29 1993-03-23 Ppg Industries, Inc. One package stable etch resistant coating
US5250758A (en) * 1991-05-21 1993-10-05 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
US5369178A (en) * 1991-07-05 1994-11-29 Mitsui Toatsu Chemicals, Inc. Resin composition for thermosetting coating
US5270078A (en) * 1992-08-14 1993-12-14 E. I. Du Pont De Nemours And Company Method for preparing high resolution wash-off images
US5290602A (en) * 1992-10-19 1994-03-01 Union Carbide Chemicals & Plastics Technology Corporation Hindered-hydroxyl functional (meth) acrylate-containing copolymers particularly suitable for use in coating compositions which are sprayed with compressed fluids as viscosity reducing diluents
US5288589A (en) * 1992-12-03 1994-02-22 Mckeever Mark R Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
JPH07170054A (ja) * 1993-12-14 1995-07-04 Canon Inc 紫外線硬化性組成物、これを用いたパターン形成方法及び配線基板の製造方法
US5466653A (en) * 1994-06-29 1995-11-14 E. I. Du Pont De Nemours And Company Method for preparing negative-working wash-off relief images and non-photosensitive elements for use therein

Also Published As

Publication number Publication date
JP3799069B2 (ja) 2006-07-19
DE69423709D1 (de) 2000-05-04
EP0659038A3 (de) 1996-07-17
DE69423709T2 (de) 2000-09-07
EP0659038A2 (de) 1995-06-21
JPH07170053A (ja) 1995-07-04
EP0659038B1 (de) 2000-03-29
US6040002A (en) 2000-03-21

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