AT66969T - Electroplating for plattenfoermige workpieces, in particular printed circuit boards. - Google Patents

Electroplating for plattenfoermige workpieces, in particular printed circuit boards.

Info

Publication number
AT66969T
AT66969T AT88100684T AT88100684T AT66969T AT 66969 T AT66969 T AT 66969T AT 88100684 T AT88100684 T AT 88100684T AT 88100684 T AT88100684 T AT 88100684T AT 66969 T AT66969 T AT 66969T
Authority
AT
Austria
Prior art keywords
plattenfoermige
electroplating
workpieces
printed circuit
circuit boards
Prior art date
Application number
AT88100684T
Other languages
German (de)
Inventor
Daniel Hosten
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE3702229 priority Critical
Application filed by Siemens Ag filed Critical Siemens Ag
Priority to EP88100684A priority patent/EP0276725B1/en
Priority to DE19883823072 priority patent/DE3823072A1/en
Publication of AT66969T publication Critical patent/AT66969T/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
AT88100684T 1987-01-26 1988-01-19 Electroplating for plattenfoermige workpieces, in particular printed circuit boards. AT66969T (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE3702229 1987-01-26
EP88100684A EP0276725B1 (en) 1987-01-26 1988-01-19 Apparatus for electroplating plate-like work pieces, particularly circuit boards
DE19883823072 DE3823072A1 (en) 1987-01-26 1988-07-07 Electroplating device for plate-shaped workpieces, especially printed circuit boards

Publications (1)

Publication Number Publication Date
AT66969T true AT66969T (en) 1991-09-15

Family

ID=39387448

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88100684T AT66969T (en) 1987-01-26 1988-01-19 Electroplating for plattenfoermige workpieces, in particular printed circuit boards.

Country Status (2)

Country Link
AT (1) AT66969T (en)
DE (1) DE3823072A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4437848C1 (en) * 1994-10-22 1996-01-18 Bosch Gmbh Robert Appts. for continuously electroplating plane workpieces
DE19717512C3 (en) 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Device for electroplating circuit boards under constant conditions in continuous systems
DE10206660C1 (en) * 2002-02-12 2003-07-24 Atotech Deutschland Gmbh Flat material transport device in wet chemical treatment plant e.g. for circuit boards or conductor foils, uses cooperating transport rollers with offset rounded peripheral beads
DE102012221012A1 (en) * 2012-11-16 2014-05-22 Atotech Deutschland Gmbh Device and method for the treatment of flat items to be treated

Also Published As

Publication number Publication date
DE3823072A1 (en) 1990-01-11

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee