AT544878T - Device and method for the production of substitutes for gas-purging layers - Google Patents

Device and method for the production of substitutes for gas-purging layers

Info

Publication number
AT544878T
AT544878T AT04018645T AT04018645T AT544878T AT 544878 T AT544878 T AT 544878T AT 04018645 T AT04018645 T AT 04018645T AT 04018645 T AT04018645 T AT 04018645T AT 544878 T AT544878 T AT 544878T
Authority
AT
Austria
Prior art keywords
purging
substitutes
layers
gas
production
Prior art date
Application number
AT04018645T
Other languages
German (de)
Inventor
Thomas Hegemann
Elisabeth Sommer
Original Assignee
Applied Materials Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Gmbh & Co Kg filed Critical Applied Materials Gmbh & Co Kg
Priority to EP20040018645 priority Critical patent/EP1624086B1/en
Publication of AT544878T publication Critical patent/AT544878T/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/34Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0676Oxynitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/081Oxides of aluminium, magnesium or beryllium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/20Metallic material, boron or silicon on organic substrates
    • C23C14/205Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/13Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1328Shrinkable or shrunk [e.g., due to heat, solvent, volatile agent, restraint removal, etc.]
    • Y10T428/1331Single layer [continuous layer]
AT04018645T 2004-08-06 2004-08-06 Device and method for the production of substitutes for gas-purging layers AT544878T (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20040018645 EP1624086B1 (en) 2004-08-06 2004-08-06 Device and method for producing gas barrier layers

Publications (1)

Publication Number Publication Date
AT544878T true AT544878T (en) 2012-02-15

Family

ID=34926075

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04018645T AT544878T (en) 2004-08-06 2004-08-06 Device and method for the production of substitutes for gas-purging layers

Country Status (5)

Country Link
US (1) US20060027450A1 (en)
EP (1) EP1624086B1 (en)
JP (1) JP2006045658A (en)
CN (1) CN1730717A (en)
AT (1) AT544878T (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITGE20070021A1 (en) * 2007-02-28 2008-09-01 Nantech S R L Container for food.
GB0805328D0 (en) * 2008-03-25 2008-04-30 Aviza Technologies Ltd Deposition of an amorphous layer
US9022715B2 (en) 2012-09-18 2015-05-05 Applied Materials, Inc. Load lock chamber designs for high-throughput processing system

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5869743A (en) * 1981-10-21 1983-04-26 Toyota Motor Corp Electrically conductive glass and its production
DE3642161A1 (en) * 1986-12-10 1988-06-23 Philips Patentverwaltung Process for the production of a magneto-optical storage medium
US4842941A (en) * 1987-04-06 1989-06-27 General Electric Company Method for forming abrasion-resistant polycarbonate articles, and articles of manufacture produced thereby
EP0394658A1 (en) * 1989-04-24 1990-10-31 Siemens Aktiengesellschaft Process for manufacturing thin, resistant coatings
US5156912A (en) * 1989-12-20 1992-10-20 The Standard Oil Company Multi-layer coatings for reinforcements in high temperature composites
CA2081912A1 (en) * 1990-05-01 1991-11-02 Chong T. Wan Vacuum deposited dark coating on a substrate
EP0564709B1 (en) * 1991-12-13 1996-01-24 Balzers Aktiengesellschaft Coated transparent substrate, use thereof, method and apparatus of manufacturing such coatings, and hafnium-oxynitride HfOxNy with 1.5 x/y 3 and 2.6 n 2.8
US5400317A (en) * 1993-04-01 1995-03-21 Balzers Aktiengesellschaft Method of coating a workpiece of a plastic material by a metal layer
DE69418542T2 (en) * 1993-07-28 1999-09-16 Asahi Glass Co Ltd Process for the production of functional coatings
JP3101682B2 (en) * 1993-10-04 2000-10-23 プレステック,インコーポレイティド Crosslinked acrylate coating materials useful for forming dielectric and oxygen barriers in capacitors
US5763033A (en) * 1996-01-30 1998-06-09 Becton, Dickinson And Company Blood collection tube assembly
JP3689524B2 (en) * 1996-03-22 2005-08-31 キヤノン株式会社 Aluminum oxide film and method for forming the same
JP3782608B2 (en) * 1998-05-22 2006-06-07 キヤノン株式会社 Thin film material and thin film preparation method
US6517687B1 (en) * 1999-03-17 2003-02-11 General Electric Company Ultraviolet filters with enhanced weatherability and method of making
JP4024510B2 (en) * 2001-10-10 2007-12-19 株式会社半導体エネルギー研究所 Recording medium and substrate
DE10252543A1 (en) * 2002-11-08 2004-05-27 Applied Films Gmbh & Co. Kg Coating for a plastic substrate

Also Published As

Publication number Publication date
EP1624086A1 (en) 2006-02-08
EP1624086B1 (en) 2012-02-08
JP2006045658A (en) 2006-02-16
CN1730717A (en) 2006-02-08
US20060027450A1 (en) 2006-02-09

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