AT513309T - Exposure device and method for manufacturing components - Google Patents

Exposure device and method for manufacturing components

Info

Publication number
AT513309T
AT513309T AT04747523T AT04747523T AT513309T AT 513309 T AT513309 T AT 513309T AT 04747523 T AT04747523 T AT 04747523T AT 04747523 T AT04747523 T AT 04747523T AT 513309 T AT513309 T AT 513309T
Authority
AT
Austria
Prior art keywords
method
exposure device
manufacturing components
manufacturing
components
Prior art date
Application number
AT04747523T
Other languages
German (de)
Inventor
Hiroyuki Nagasaka
Takeshi Okuyama
Original Assignee
Nikon Corp
Nikon Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2003272617 priority Critical
Application filed by Nikon Corp, Nikon Engineering Co Ltd filed Critical Nikon Corp
Priority to PCT/JP2004/010057 priority patent/WO2005006415A1/en
Publication of AT513309T publication Critical patent/AT513309T/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70341Immersion
AT04747523T 2003-07-09 2004-07-08 Exposure device and method for manufacturing components AT513309T (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003272617 2003-07-09
PCT/JP2004/010057 WO2005006415A1 (en) 2003-07-09 2004-07-08 Exposure apparatus and method for manufacturing device

Publications (1)

Publication Number Publication Date
AT513309T true AT513309T (en) 2011-07-15

Family

ID=34055983

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04747523T AT513309T (en) 2003-07-09 2004-07-08 Exposure device and method for manufacturing components

Country Status (5)

Country Link
US (7) US7508490B2 (en)
EP (3) EP2264532B1 (en)
JP (11) JP4515385B2 (en)
AT (1) AT513309T (en)
WO (1) WO2005006415A1 (en)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2945184B1 (en) 2003-02-26 2017-06-28 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
KR101163435B1 (en) 2003-04-09 2012-07-13 가부시키가이샤 니콘 Exposure method and apparatus, and device manufacturing method
DE60308161T2 (en) 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographic apparatus and method for making an article
EP2264532B1 (en) * 2003-07-09 2012-10-31 Nikon Corporation Exposure apparatus and device manufacturing method
TWI245163B (en) * 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
WO2005024517A2 (en) * 2003-09-03 2005-03-17 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US8054448B2 (en) 2004-05-04 2011-11-08 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
AT493754T (en) * 2003-10-22 2011-01-15 Nikon Corp Exposure device, exposure method and method for producing a device
TWI569308B (en) 2003-10-28 2017-02-01 尼康股份有限公司 Optical illumination device, exposure device, exposure method and device manufacturing method
US7528929B2 (en) 2003-11-14 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI519819B (en) 2003-11-20 2016-02-01 尼康股份有限公司 Beam transforming element, illumination optical apparatus, exposure apparatus and exposure method
TWI366219B (en) 2004-02-06 2012-06-11 Nikon Corp Polarization changing device, optical illumination apparatus, light-exposure apparatus and light-exposure method
US20070103661A1 (en) * 2004-06-04 2007-05-10 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP1768169B9 (en) * 2004-06-04 2013-03-06 Nikon Corporation Exposure apparatus, exposure method, and device producing method
JP4517341B2 (en) * 2004-06-04 2010-08-04 株式会社ニコン Exposure apparatus, nozzle member, and device manufacturing method
US20070222959A1 (en) * 2004-06-10 2007-09-27 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8717533B2 (en) 2004-06-10 2014-05-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US20070139628A1 (en) * 2004-06-10 2007-06-21 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
KR101700546B1 (en) * 2004-06-10 2017-01-26 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device producing method
US8373843B2 (en) 2004-06-10 2013-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
KR101699965B1 (en) 2004-06-10 2017-01-25 가부시키가이샤 니콘 Exposure equipment, exposure method and device manufacturing method
US8508713B2 (en) 2004-06-10 2013-08-13 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7481867B2 (en) 2004-06-16 2009-01-27 Edwards Limited Vacuum system for immersion photolithography
WO2005124835A1 (en) * 2004-06-21 2005-12-29 Nikon Corporation Exposure equipment and device manufacturing method
US7379155B2 (en) 2004-10-18 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2006078292A1 (en) 2005-01-21 2006-07-27 Nikon Corporation Offset partial ring seal in immersion lithographic system
JP2007019463A (en) * 2005-03-31 2007-01-25 Nikon Corp Exposure device, exposure method, and method of manufacturing device
TW200705110A (en) * 2005-03-31 2007-02-01 Nikon Corp Exposure apparatus, exposure method, and device production method
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101452145B1 (en) 2005-05-12 2014-10-16 가부시키가이샤 니콘 Projection optical system, exposure apparatus and exposure method
JP2007012954A (en) * 2005-07-01 2007-01-18 Canon Inc Exposure device
US7812926B2 (en) * 2005-08-31 2010-10-12 Nikon Corporation Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice
JP2007096254A (en) * 2005-08-31 2007-04-12 Nikon Corp Exposing apparatus and micro device manufacturing method
US7411658B2 (en) 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007133077A (en) * 2005-11-09 2007-05-31 Nikon Corp Immersion objective lens-barrel and liquid immersion microscope
US7773195B2 (en) * 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
JP5645406B2 (en) * 2006-09-12 2014-12-24 カール・ツァイス・エスエムティー・ゲーエムベーハー Optical arrangement with hydrophobic coating for immersion lithography and projection exposure apparatus comprising the same
US20090122282A1 (en) * 2007-05-21 2009-05-14 Nikon Corporation Exposure apparatus, liquid immersion system, exposing method, and device fabricating method
NL1035757A1 (en) * 2007-08-02 2009-02-03 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US7924404B2 (en) * 2007-08-16 2011-04-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8681308B2 (en) 2007-09-13 2014-03-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
NL1035908A1 (en) 2007-09-25 2009-03-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP5267029B2 (en) 2007-10-12 2013-08-21 株式会社ニコン Illumination optical apparatus, exposure apparatus, and device manufacturing method
SG185313A1 (en) 2007-10-16 2012-11-29 Nikon Corp Illumination optical system, exposure apparatus, and device manufacturing method
KR101562073B1 (en) 2007-10-16 2015-10-21 가부시키가이샤 니콘 Illumination optical system, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
NL1036194A1 (en) * 2007-12-03 2009-06-04 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US8289497B2 (en) * 2008-03-18 2012-10-16 Nikon Corporation Apparatus and methods for recovering fluid in immersion lithography
KR101695034B1 (en) 2008-05-28 2017-01-10 가부시키가이샤 니콘 Inspection device for spatial light modulator, illuminating optical system, exposure device, inspecting method, method for adjusting illuminating optical system, illuminating method, exposure method, and device manufacturing method
NL2003392A (en) 2008-09-17 2010-03-18 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
JP5001343B2 (en) * 2008-12-11 2012-08-15 エーエスエムエル ネザーランズ ビー.ブイ. Fluid extraction system, immersion lithographic apparatus, and method for reducing pressure fluctuations of an immersion liquid used in an immersion lithographic apparatus
US8896806B2 (en) 2008-12-29 2014-11-25 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
NL2006389A (en) * 2010-04-15 2011-10-18 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and a device manufacturing method.
US9158207B2 (en) 2011-08-09 2015-10-13 Carl Zeiss Smt Gmbh Optical component comprising radiation protective layer
US20140071511A1 (en) * 2012-09-13 2014-03-13 Sumitomo Electric Industries, Ltd. Wavelength selective switch

Family Cites Families (196)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE221563C (en)
DE224448C (en)
GB1242527A (en) * 1967-10-20 1971-08-11 Kodak Ltd Optical instruments
JPS5919912Y2 (en) 1978-08-21 1984-06-08
US4509852A (en) * 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
US4346164A (en) 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS6349893B2 (en) 1981-03-18 1988-10-06 Hitachi Ltd
JPS58202448A (en) 1982-05-21 1983-11-25 Hitachi Ltd Exposing device
JPS5919912A (en) * 1982-07-26 1984-02-01 Hitachi Ltd Immersion distance holding device
DD221563A1 (en) * 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersions objective for the step-by-step projection imaging of a mask structure
DD224448A1 (en) 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Device for photolithographic structural transmission
FI73950C (en) * 1985-02-15 1987-12-10 Hackman Ab Oy Foerfarande and the device at the pumpning Science volymmaetning of livsmedelsvaetskor.
JPS6265326A (en) 1985-09-18 1987-03-24 Hitachi Ltd Exposure device
JPS6265326U (en) 1985-10-16 1987-04-23
JPS63157419A (en) 1986-12-22 1988-06-30 Toshiba Corp Fine pattern transfer apparatus
JPS63157419U (en) 1987-03-31 1988-10-14
JPH04305917A (en) 1991-04-02 1992-10-28 Nikon Corp Adhesion type exposure device
JPH04305915A (en) 1991-04-02 1992-10-28 Nikon Corp Adhesion type exposure device
JPH0562877A (en) 1991-09-02 1993-03-12 Yasuko Shinohara Optical system for lsi manufacturing contraction projection aligner by light
JPH06124873A (en) * 1992-10-09 1994-05-06 Canon Inc Liquid-soaking type projection exposure apparatus
JP2753930B2 (en) * 1992-11-27 1998-05-20 キヤノン株式会社 Immersion-type projection exposure apparatus
US5312552A (en) * 1993-02-02 1994-05-17 Norman J M Method and apparatus for removing BTX-type gases from a liquid
JPH07220990A (en) 1994-01-28 1995-08-18 Hitachi Ltd Pattern forming method and exposure apparatus therefor
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
JPH08905A (en) * 1994-06-20 1996-01-09 Fujitsu Ltd Washing apparatus and method having defoaming function
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
JPH08316124A (en) 1995-05-19 1996-11-29 Hitachi Ltd Method and apparatus for projection exposing
JPH08316125A (en) 1995-05-19 1996-11-29 Hitachi Ltd Method and apparatus for projection exposing
US5825043A (en) 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
AT404906T (en) 1996-11-28 2008-08-15 Nikon Corp Alignment device and exposure method
JP4029182B2 (en) 1996-11-28 2008-01-09 株式会社ニコン Exposure method
JP4029183B2 (en) 1996-11-28 2008-01-09 株式会社ニコン Projection exposure apparatus and the projection exposure method
EP1197801B1 (en) 1996-12-24 2005-12-28 ASML Netherlands B.V. Lithographic device with two object holders
JPH10255319A (en) * 1997-03-12 1998-09-25 Hitachi Maxell Ltd Master disk exposure device and method therefor
JP3747566B2 (en) * 1997-04-23 2006-02-22 株式会社ニコン The liquid immersion type exposure apparatus
JPH10314503A (en) * 1997-05-15 1998-12-02 Sony Corp Apparatus fordegassing fluid
JP3817836B2 (en) * 1997-06-10 2006-09-06 株式会社ニコン An exposure apparatus and a manufacturing method and an exposure method and device manufacturing method thereof
US5938922A (en) * 1997-08-19 1999-08-17 Celgard Llc Contactor for degassing liquids
JPH11176727A (en) 1997-12-11 1999-07-02 Nikon Corp Projection aligner
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
US6400411B1 (en) * 1998-01-13 2002-06-04 Avid Technology, Inc. System and process for maintaining consistent video levels when digitizing video signals using different video capture devices
WO1999049504A1 (en) 1998-03-26 1999-09-30 Nikon Corporation Projection exposure method and system
JP2000058436A (en) 1998-08-11 2000-02-25 Nikon Corp Projection aligner and exposure method
US6612619B2 (en) * 1999-01-05 2003-09-02 Martin H. Wieder Quick coupler retention clip and method
WO2001022480A1 (en) 1999-09-20 2001-03-29 Nikon Corporation Parallel link mechanism, exposure system and method of manufacturing the same, and method of manufacturing devices
JP2001179252A (en) * 1999-12-22 2001-07-03 Japan Organo Co Ltd Method and apparatus for making pure water reduced in content of oxidizing substance
JP3548976B2 (en) * 1999-12-28 2004-08-04 柏田 昌男 Etching method and apparatus of a semiconductor wafer using a vacuum state
US7187503B2 (en) 1999-12-29 2007-03-06 Carl Zeiss Smt Ag Refractive projection objective for immersion lithography
KR100965330B1 (en) 2003-12-15 2010-06-22 칼 짜이스 에스엠티 아게 Objective as a microlithography projection objective with at least one liquid lens
US6995930B2 (en) 1999-12-29 2006-02-07 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
EP1697798A2 (en) 2003-12-15 2006-09-06 Carl Zeiss SMT AG Projection objective having a high aperture and a planar end surface
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US6988326B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Phobic barrier meniscus separation and containment
US7383843B2 (en) 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
JP4504537B2 (en) * 2000-08-29 2010-07-14 芝浦メカトロニクス株式会社 Spin processing equipment
KR100866818B1 (en) 2000-12-11 2008-11-04 가부시키가이샤 니콘 Projection optical system and exposure apparatus comprising the same
WO2002091078A1 (en) 2001-05-07 2002-11-14 Massachusetts Institute Of Technology Methods and apparatus employing an index matching medium
EP2017675A1 (en) 2001-07-09 2009-01-21 Canon Kabushiki Kaisha Exposure apparatus
US6700688B2 (en) * 2001-08-24 2004-03-02 Megasense, Inc. Rolling mirror apparatus and method of use
JP2003086486A (en) * 2001-09-11 2003-03-20 Canon Inc Aligner
JP3956671B2 (en) * 2001-11-02 2007-08-08 栗田工業株式会社 Pure water manufacturing equipment for semiconductor product manufacturing process
DE10210899A1 (en) 2002-03-08 2003-09-18 Zeiss Carl Smt Ag Refractive projection objective for immersion lithography
US7092069B2 (en) 2002-03-08 2006-08-15 Carl Zeiss Smt Ag Projection exposure method and projection exposure system
DE10229818A1 (en) 2002-06-28 2004-01-15 Carl Zeiss Smt Ag A method for focus detection and imaging system with a focus detection system
US7362508B2 (en) 2002-08-23 2008-04-22 Nikon Corporation Projection optical system and method for photolithography and exposure apparatus and method using same
US6788477B2 (en) 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
DE60335595D1 (en) 2002-11-12 2011-02-17 Asml Netherlands Bv Immersion lithographic apparatus and method of making a device
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN101382738B (en) 2002-11-12 2011-01-12 Asml荷兰有限公司 Lithographic projection apparatus
SG121822A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI232357B (en) 2002-11-12 2005-05-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG121819A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG131766A1 (en) 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE10253679A1 (en) 2002-11-18 2004-06-03 Infineon Technologies Ag Optical arrangement used in the production of semiconductor components comprises a lens system arranged behind a mask, and a medium having a specified refractive index lying between the mask and the lens system
DE10258718A1 (en) 2002-12-09 2004-06-24 Carl Zeiss Smt Ag Projection objective, in particular for microlithography, and methods for tuning of a projection lens
US6992750B2 (en) 2002-12-10 2006-01-31 Canon Kabushiki Kaisha Exposure apparatus and method
EP1571695A4 (en) * 2002-12-10 2008-10-15 Nikon Corp Exposure apparatus and method for manufacturing device
JP4529433B2 (en) * 2002-12-10 2010-08-25 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
EP1571701A4 (en) * 2002-12-10 2008-04-09 Nikon Corp Exposure apparatus and method for manufacturing device
US7948604B2 (en) * 2002-12-10 2011-05-24 Nikon Corporation Exposure apparatus and method for producing device
KR101101737B1 (en) 2002-12-10 2012-01-05 가부시키가이샤 니콘 Exposure apparatus, exposure method and method for manufacturing device
JP4608876B2 (en) * 2002-12-10 2011-01-12 株式会社ニコン Exposure apparatus and device manufacturing method
JP4184346B2 (en) * 2002-12-13 2008-11-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Liquid removal in a method and apparatus for irradiating a spot on a layer
EP1579435B1 (en) 2002-12-19 2007-06-27 Philips Electronics N.V. Method and device for irradiating spots on a layer
EP1584089B1 (en) 2002-12-19 2006-08-02 Philips Electronics N.V. Method and device for irradiating spots on a layer
US7010958B2 (en) 2002-12-19 2006-03-14 Asml Holding N.V. High-resolution gas gauge proximity sensor
US6781670B2 (en) 2002-12-30 2004-08-24 Intel Corporation Immersion lithography
US7090964B2 (en) 2003-02-21 2006-08-15 Asml Holding N.V. Lithographic printing with polarized light
EP2945184B1 (en) * 2003-02-26 2017-06-28 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US6943941B2 (en) 2003-02-27 2005-09-13 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7206059B2 (en) 2003-02-27 2007-04-17 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7029832B2 (en) 2003-03-11 2006-04-18 Samsung Electronics Co., Ltd. Immersion lithography methods using carbon dioxide
US20050164522A1 (en) 2003-03-24 2005-07-28 Kunz Roderick R. Optical fluids, and systems and methods of making and using the same
JP4347105B2 (en) * 2003-04-03 2009-10-21 富士フイルム株式会社 Image processing method and apparatus, database and program
JP4902201B2 (en) * 2003-04-07 2012-03-21 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
KR20110104084A (en) 2003-04-09 2011-09-21 가부시키가이샤 니콘 Immersion lithography fluid control system
KR101238142B1 (en) 2003-04-10 2013-02-28 가부시키가이샤 니콘 Environmental system including a transport region for an immersion lithography apparatus
WO2004090633A2 (en) 2003-04-10 2004-10-21 Nikon Corporation An electro-osmotic element for an immersion lithography apparatus
CN103439864B (en) * 2003-04-10 2016-05-11 株式会社尼康 The system comprises a vacuum environment immersion lithography apparatus Clear
KR101129213B1 (en) 2003-04-10 2012-03-27 가부시키가이샤 니콘 Run-off path to collect liquid for an immersion lithography apparatus
WO2004092830A2 (en) 2003-04-11 2004-10-28 Nikon Corporation Liquid jet and recovery system for immersion lithography
KR101697896B1 (en) 2003-04-11 2017-01-18 가부시키가이샤 니콘 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
SG2013077797A (en) 2003-04-11 2017-02-27 Nippon Kogaku Kk Cleanup method for optics in immersion lithography
CN1774667A (en) 2003-04-17 2006-05-17 株式会社尼康 Optical arrangement of autofocus elements for use with immersion lithography
JP4146755B2 (en) 2003-05-09 2008-09-10 松下電器産業株式会社 Pattern formation method
JP4025683B2 (en) 2003-05-09 2007-12-26 松下電器産業株式会社 Pattern forming method and exposure apparatus
TWI295414B (en) 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN1307456C (en) 2003-05-23 2007-03-28 佳能株式会社 Projection optical system, exposure apparatus, and device manufacturing method
JP2004349645A (en) * 2003-05-26 2004-12-09 Sony Corp Liquid-immersed differential liquid-drainage static-pressure floating pad, master-disk exposure apparatus, and method of exposure using liquid-immersed differential liquid-drainage
TWI347741B (en) 2003-05-30 2011-08-21 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1486827B1 (en) * 2003-06-11 2011-11-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4084710B2 (en) 2003-06-12 2008-04-30 松下電器産業株式会社 Pattern formation method
JP4054285B2 (en) 2003-06-12 2008-02-27 松下電器産業株式会社 Pattern formation method
EP3401946A1 (en) * 2003-06-13 2018-11-14 Nikon Corporation Exposure apparatus and device manufacturing method
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
JP4029064B2 (en) 2003-06-23 2008-01-09 松下電器産業株式会社 Pattern formation method
JP4084712B2 (en) 2003-06-23 2008-04-30 松下電器産業株式会社 Pattern formation method
JP4343597B2 (en) 2003-06-25 2009-10-14 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP2005019616A (en) 2003-06-25 2005-01-20 Canon Inc Immersion type exposure apparatus
JP3862678B2 (en) 2003-06-27 2006-12-27 キヤノン株式会社 Exposure apparatus and device manufacturing method
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
DE60308161T2 (en) 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographic apparatus and method for making an article
EP1498778A1 (en) 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1494074A1 (en) 2003-06-30 2005-01-05 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005006026A2 (en) 2003-07-01 2005-01-20 Nikon Corporation Using isotopically specified fluids as optical elements
EP2264532B1 (en) * 2003-07-09 2012-10-31 Nikon Corporation Exposure apparatus and device manufacturing method
US7384149B2 (en) 2003-07-21 2008-06-10 Asml Netherlands B.V. Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system
US7006209B2 (en) 2003-07-25 2006-02-28 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
EP1503244A1 (en) 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
US7579135B2 (en) 2003-08-11 2009-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus for manufacture of integrated circuits
US7700267B2 (en) 2003-08-11 2010-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion fluid for immersion lithography, and method of performing immersion lithography
US7061578B2 (en) 2003-08-11 2006-06-13 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7085075B2 (en) 2003-08-12 2006-08-01 Carl Zeiss Smt Ag Projection objectives including a plurality of mirrors with lenses ahead of mirror M3
US6844206B1 (en) 2003-08-21 2005-01-18 Advanced Micro Devices, Llp Refractive index system monitor and control for immersion lithography
US7070915B2 (en) 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate
US6954256B2 (en) 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
US7014966B2 (en) 2003-09-02 2006-03-21 Advanced Micro Devices, Inc. Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems
WO2005024517A2 (en) 2003-09-03 2005-03-17 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US8054448B2 (en) 2004-05-04 2011-11-08 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US6961186B2 (en) 2003-09-26 2005-11-01 Takumi Technology Corp. Contact printing using a magnified mask image
US7369217B2 (en) 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
US7678527B2 (en) 2003-10-16 2010-03-16 Intel Corporation Methods and compositions for providing photoresist with improved properties for contacting liquids
EP1685446A2 (en) 2003-11-05 2006-08-02 DSM IP Assets B.V. A method and apparatus for producing microchips
US7924397B2 (en) 2003-11-06 2011-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-corrosion layer on objective lens for liquid immersion lithography applications
US8854602B2 (en) 2003-11-24 2014-10-07 Asml Netherlands B.V. Holding device for an optical element in an objective
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7125652B2 (en) 2003-12-03 2006-10-24 Advanced Micro Devices, Inc. Immersion lithographic process using a conforming immersion medium
JP5102492B2 (en) 2003-12-19 2012-12-19 カール・ツァイス・エスエムティー・ゲーエムベーハー Objective lens for microlithography projection with crystal elements
US20050185269A1 (en) 2003-12-19 2005-08-25 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
US7460206B2 (en) 2003-12-19 2008-12-02 Carl Zeiss Smt Ag Projection objective for immersion lithography
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119884B2 (en) 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050147920A1 (en) 2003-12-30 2005-07-07 Chia-Hui Lin Method and system for immersion lithography
US7088422B2 (en) 2003-12-31 2006-08-08 International Business Machines Corporation Moving lens for immersion optical lithography
JP4371822B2 (en) 2004-01-06 2009-11-25 キヤノン株式会社 Exposure equipment
JP4429023B2 (en) 2004-01-07 2010-03-10 キヤノン株式会社 Exposure apparatus and device manufacturing method
US20050153424A1 (en) 2004-01-08 2005-07-14 Derek Coon Fluid barrier with transparent areas for immersion lithography
DE602005008707D1 (en) 2004-01-14 2008-09-18 Zeiss Carl Smt Ag Catadiopric projection lens
CN101793993B (en) 2004-01-16 2013-04-03 卡尔蔡司Smt有限责任公司 Optical elements, optical arrangement and system
WO2005069078A1 (en) 2004-01-19 2005-07-28 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus with immersion projection lens
CN1938646B (en) 2004-01-20 2010-12-15 卡尔蔡司Smt股份公司 Microlithographic projection exposure apparatus and measuring device for a projection lens
US7026259B2 (en) 2004-01-21 2006-04-11 International Business Machines Corporation Liquid-filled balloons for immersion lithography
US7391501B2 (en) 2004-01-22 2008-06-24 Intel Corporation Immersion liquids with siloxane polymer for immersion lithography
KR20070039869A (en) 2004-02-03 2007-04-13 브루스 더블유. 스미스 Method of photolithography using a fluid and a system thereof
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1716454A1 (en) 2004-02-09 2006-11-02 Carl Zeiss SMT AG Projection objective for a microlithographic projection exposure apparatus
US7326522B2 (en) 2004-02-11 2008-02-05 Asml Netherlands B.V. Device manufacturing method and a substrate
EP1714192A1 (en) 2004-02-13 2006-10-25 Carl Zeiss SMT AG Projection objective for a microlithographic projection exposure apparatus
WO2005081030A1 (en) 2004-02-18 2005-09-01 Corning Incorporated Catadioptric imaging system for high numerical aperture imaging with deep ultraviolet light
US20050205108A1 (en) 2004-03-16 2005-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for immersion lithography lens cleaning
US7027125B2 (en) 2004-03-25 2006-04-11 International Business Machines Corporation System and apparatus for photolithography
US7084960B2 (en) 2004-03-29 2006-08-01 Intel Corporation Lithography using controlled polarization
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7295283B2 (en) 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7712905B2 (en) 2004-04-08 2010-05-11 Carl Zeiss Smt Ag Imaging system with mirror group
US7317504B2 (en) * 2004-04-08 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7898642B2 (en) 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7271878B2 (en) * 2004-04-22 2007-09-18 International Business Machines Corporation Wafer cell for immersion lithography
US7244665B2 (en) * 2004-04-29 2007-07-17 Micron Technology, Inc. Wafer edge ring structures and methods of formation
US7379159B2 (en) * 2004-05-03 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005106589A1 (en) 2004-05-04 2005-11-10 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus and immersion liquid therefore
US7091502B2 (en) * 2004-05-12 2006-08-15 Taiwan Semiconductor Manufacturing, Co., Ltd. Apparatus and method for immersion lithography
KR101391470B1 (en) 2004-05-17 2014-05-07 칼 짜이스 에스엠티 게엠베하 Catadioptric projection objective with intermediate images
US7616383B2 (en) * 2004-05-18 2009-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7486381B2 (en) * 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101248328B1 (en) 2004-06-04 2013-04-01 칼 짜이스 에스엠티 게엠베하 Projection system with compensation of intensity variations and compensation element therefor
CN100594430C (en) 2004-06-04 2010-03-17 卡尔蔡司Smt股份公司 System for measuring the image quality of an optical imaging system
US7481867B2 (en) 2004-06-16 2009-01-27 Edwards Limited Vacuum system for immersion photolithography
US7379155B2 (en) * 2004-10-18 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

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