AT510307T - Translucent coating for luminous diodes and fluorescent lighting source - Google Patents

Translucent coating for luminous diodes and fluorescent lighting source

Info

Publication number
AT510307T
AT510307T AT06021272T AT06021272T AT510307T AT 510307 T AT510307 T AT 510307T AT 06021272 T AT06021272 T AT 06021272T AT 06021272 T AT06021272 T AT 06021272T AT 510307 T AT510307 T AT 510307T
Authority
AT
Austria
Prior art keywords
lighting source
fluorescent lighting
translucent coating
luminous diodes
luminous
Prior art date
Application number
AT06021272T
Other languages
German (de)
Inventor
Masutsugu Tasaki
Akira Ichikawa
Tsutomu Odaki
Kazuhisa Takagi
Original Assignee
Asahi Rubber Inc
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP18103597 priority Critical
Application filed by Asahi Rubber Inc, Sanken Electric Co Ltd filed Critical Asahi Rubber Inc
Publication of AT510307T publication Critical patent/AT510307T/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/04Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • F21Y2115/15Organic light-emitting diodes [OLED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0041Processes relating to wavelength conversion elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
AT06021272T 1997-07-07 1998-07-07 Translucent coating for luminous diodes and fluorescent lighting source AT510307T (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18103597 1997-07-07

Publications (1)

Publication Number Publication Date
AT510307T true AT510307T (en) 2011-06-15

Family

ID=16093633

Family Applications (2)

Application Number Title Priority Date Filing Date
AT06021272T AT510307T (en) 1997-07-07 1998-07-07 Translucent coating for luminous diodes and fluorescent lighting source
AT98112602T AT343853T (en) 1997-07-07 1998-07-07 Translucent coating for luminous diodes and fluorescent light sources

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT98112602T AT343853T (en) 1997-07-07 1998-07-07 Translucent coating for luminous diodes and fluorescent light sources

Country Status (5)

Country Link
EP (3) EP0890996B1 (en)
JP (4) JP4271747B2 (en)
AT (2) AT510307T (en)
DE (1) DE69836245T2 (en)
HK (1) HK1099963A1 (en)

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US7344952B2 (en) 2005-10-28 2008-03-18 Philips Lumileds Lighting Company, Llc Laminating encapsulant film containing phosphor over LEDs
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US7942556B2 (en) 2007-06-18 2011-05-17 Xicato, Inc. Solid state illumination device
JP4807522B2 (en) * 2007-09-18 2011-11-02 株式会社朝日ラバー Semiconductor optical element component soldering method and semiconductor optical element component
JP5128888B2 (en) * 2007-10-01 2013-01-23 株式会社朝日ラバー Light emitting device and lighting device using the same
US7984999B2 (en) 2007-10-17 2011-07-26 Xicato, Inc. Illumination device with light emitting diodes and moveable light adjustment member
US9086213B2 (en) 2007-10-17 2015-07-21 Xicato, Inc. Illumination device with light emitting diodes
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US8220971B2 (en) 2008-11-21 2012-07-17 Xicato, Inc. Light emitting diode module with three part color matching
KR101102237B1 (en) * 2008-12-23 2012-01-03 (주) 아모엘이디 LED package, method of manufacturing LED package, back light unit and lighting device
JP2010171342A (en) 2009-01-26 2010-08-05 Sony Corp Color conversion member, method of manufacturing the same, light-emitting device, and display
US20120091495A1 (en) 2009-06-26 2012-04-19 Fujifilm Corporation Light reflecting substrate and process for manufacture thereof
JP5342368B2 (en) * 2009-08-06 2013-11-13 株式会社朝日ラバー Light emitting diode
FR2949165B1 (en) * 2009-08-11 2011-10-07 Oberthur Technologies Microcircuit card comprising a light emitting diode
EP2518190A1 (en) 2009-12-25 2012-10-31 FUJIFILM Corporation Insulated substrate, process for production of insulated substrate, process for formation of wiring line, wiring substrate, and light-emitting element
EP2362207A1 (en) * 2010-01-28 2011-08-31 F. Hoffmann-La Roche AG Measuring system and method, in particular for determining blood sugar
US8104908B2 (en) 2010-03-04 2012-01-31 Xicato, Inc. Efficient LED-based illumination module with high color rendering index
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Also Published As

Publication number Publication date
JP4937966B2 (en) 2012-05-23
EP2270885A3 (en) 2012-12-12
EP2270885A2 (en) 2011-01-05
EP1753037B1 (en) 2011-05-18
JP2008252119A (en) 2008-10-16
EP0890996A2 (en) 1999-01-13
JPH1187784A (en) 1999-03-30
JP2008211262A (en) 2008-09-11
AT343853T (en) 2006-11-15
EP1753037A1 (en) 2007-02-14
DE69836245T2 (en) 2007-04-19
JP2008270831A (en) 2008-11-06
JP4937965B2 (en) 2012-05-23
DE69836245D1 (en) 2006-12-07
EP0890996A3 (en) 2000-05-10
JP4937964B2 (en) 2012-05-23
HK1099963A1 (en) 2011-12-16
EP0890996B1 (en) 2006-10-25
JP4271747B2 (en) 2009-06-03

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties