AT445028T - Method for producing a sputter film - Google Patents

Method for producing a sputter film

Info

Publication number
AT445028T
AT445028T AT02711344T AT02711344T AT445028T AT 445028 T AT445028 T AT 445028T AT 02711344 T AT02711344 T AT 02711344T AT 02711344 T AT02711344 T AT 02711344T AT 445028 T AT445028 T AT 445028T
Authority
AT
Austria
Prior art keywords
producing
method
sputter film
sputter
film
Prior art date
Application number
AT02711344T
Other languages
German (de)
Inventor
Eiji Shidoji
Eiichi Ando
Tomohiro Yamada
Takahiro Mashimo
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2001031004 priority Critical
Priority to JP2001220942 priority
Priority to JP2001383069 priority
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to PCT/JP2002/000982 priority patent/WO2002063064A1/en
Publication of AT445028T publication Critical patent/AT445028T/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • C23C14/505Substrate holders for rotation of the substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • C23C14/545Controlling the film thickness or evaporation rate using measurement on deposited material
    • C23C14/547Controlling the film thickness or evaporation rate using measurement on deposited material using optical methods
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568Transferring the substrates through a series of coating stations
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32431Constructional details of the reactor
    • H01J37/32733Means for moving the material to be treated
    • H01J37/32752Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761Continuous moving
    • H01J37/32779Continuous moving of batches of workpieces
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/34Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
AT02711344T 2001-02-07 2002-02-06 Method for producing a sputter film AT445028T (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001031004 2001-02-07
JP2001220942 2001-07-23
JP2001383069 2001-12-17
PCT/JP2002/000982 WO2002063064A1 (en) 2001-02-07 2002-02-06 Spatter device and spatter film forming method

Publications (1)

Publication Number Publication Date
AT445028T true AT445028T (en) 2009-10-15

Family

ID=27345932

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02711344T AT445028T (en) 2001-02-07 2002-02-06 Method for producing a sputter film

Country Status (7)

Country Link
US (2) US6863785B2 (en)
EP (1) EP1359236B1 (en)
JP (1) JPWO2002063064A1 (en)
CN (1) CN1258616C (en)
AT (1) AT445028T (en)
DE (1) DE60233931D1 (en)
WO (1) WO2002063064A1 (en)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT445028T (en) * 2001-02-07 2009-10-15 Asahi Glass Co Ltd Method for producing a sputter film
US7749622B2 (en) * 2002-10-22 2010-07-06 Asahi Glass Company, Limited Multilayer film-coated substrate and process for its production
US20040182701A1 (en) * 2003-01-29 2004-09-23 Aashi Glass Company, Limited Sputtering apparatus, a mixed film produced by the sputtering apparatus and a multilayer film including the mixed film
JP4547489B2 (en) * 2003-05-01 2010-09-22 株式会社昭和真空 Optical thin film forming apparatus equipped with film thickness measuring device and optical thin film forming method
US7008518B2 (en) * 2004-01-15 2006-03-07 Deposition Sciences, Inc. Method and apparatus for monitoring optical characteristics of thin films in a deposition process
US7301149B2 (en) * 2004-05-06 2007-11-27 The Board Of Trustees Of The University Of Illinois Apparatus and method for determining a thickness of a deposited material
DE502004002296D1 (en) * 2004-05-22 2007-01-25 Applied Materials Gmbh & Co Kg Coating plant with a measuring device for the measurement of optical properties of coated substrates
JP4547612B2 (en) * 2004-06-25 2010-09-22 旭硝子株式会社 Film thickness control method and apparatus, and optical multilayer film manufacturing method
GB0421389D0 (en) * 2004-09-25 2004-10-27 Applied Multilayers Ltd Material deposition apparatus and method
DE102005008889B4 (en) * 2005-02-26 2016-07-07 Leybold Optics Gmbh Optical monitoring system for coating processes
DE102005010681B4 (en) 2005-03-09 2016-05-04 Leybold Optics Gmbh Measuring arrangement for optical monitoring of coating processes
US7696696B2 (en) * 2005-08-04 2010-04-13 Stc.Unm Magnetron having a transparent cathode and related methods of generating high power microwaves
AT552918T (en) 2005-08-24 2012-04-15 Brother Ind Ltd Device and method for producing layers and method of manufacturing a piezoelectric actuator
JP4800734B2 (en) * 2005-10-13 2011-10-26 中国科学技▲術▼大学 Thin film forming apparatus and thin film forming method
JP2007154242A (en) * 2005-12-02 2007-06-21 Asahi Glass Co Ltd Method for producing mixture film of oxides
JP2007291420A (en) * 2006-04-21 2007-11-08 Canon Inc Sputtering system
DK1970465T3 (en) 2007-03-13 2013-10-07 Jds Uniphase Corp METHOD AND cathode atomization method for depositing a layer consisting of a mixture of materials and having a pre-defined refractive index
JP2009007636A (en) * 2007-06-28 2009-01-15 Sony Corp Low refractive index film and method for depositing the same, and antireflection film
US9039871B2 (en) 2007-11-16 2015-05-26 Advanced Energy Industries, Inc. Methods and apparatus for applying periodic voltage using direct current
US8133359B2 (en) * 2007-11-16 2012-03-13 Advanced Energy Industries, Inc. Methods and apparatus for sputtering deposition using direct current
US20100047594A1 (en) * 2008-08-20 2010-02-25 Aharon Inspektor Equipment and method for physical vapor deposition
JP5163422B2 (en) * 2008-10-23 2013-03-13 株式会社ニコン Film forming apparatus and film forming method
CN101899642B (en) * 2009-05-25 2013-03-20 鸿富锦精密工业(深圳)有限公司 Film-coating device
JP4878632B2 (en) 2009-07-03 2012-02-15 株式会社シンクロン Optical film thickness meter and thin film forming apparatus equipped with optical film thickness meter
WO2011090717A1 (en) * 2009-12-28 2011-07-28 Gvd Corporation Coating methods, systems, and related articles
WO2011093334A1 (en) 2010-01-26 2011-08-04 キヤノンアネルバ株式会社 Film-forming method, film-forming apparatus, and apparatus for controlling the film-forming apparatus
US8758580B2 (en) * 2010-08-23 2014-06-24 Vaeco Inc. Deposition system with a rotating drum
JP5800414B2 (en) * 2011-06-01 2015-10-28 株式会社アルバック Deposition method
EP2718959B1 (en) * 2011-06-07 2018-10-31 Vision Ease LP Improvements to the application of coating materials
CN102978577A (en) * 2011-09-06 2013-03-20 鸿富锦精密工业(深圳)有限公司 Intermediate-frequency magnetron sputtering coating device
US8785235B2 (en) * 2012-02-10 2014-07-22 Tsmc Solar Ltd. Apparatus and method for producing solar cells
US20140131198A1 (en) * 2012-11-09 2014-05-15 Tsmc Solar Ltd. Solar cell formation apparatus and method
TWI495751B (en) * 2013-07-15 2015-08-11
JP6218566B2 (en) * 2013-11-15 2017-10-25 株式会社オプトラン Thin film forming apparatus and thin film forming method
TW201540858A (en) * 2014-02-17 2015-11-01 Gtat Corp Systems and methods for generating metal oxide coatings
US20170074534A1 (en) * 2015-01-30 2017-03-16 Larry A. Turner Interior Volume Thermal Modeling And Control Apparatuses, Methods And Systems
EP3289113A1 (en) * 2015-03-31 2018-03-07 Bühler Alzenau GmbH Method for producing coated substrates
CN105274487B (en) * 2015-11-30 2018-01-23 深圳市美思先端电子有限公司 Process, device and the obtained infrared fileter of infrared fileter plated film
TW201827633A (en) * 2016-09-27 2018-08-01 美商康寧公司 Apparatus and methods for reduced-arc sputtering
GB2561865A (en) * 2017-04-25 2018-10-31 Univ Of The West Of Scotland Apparatus and methods for depositing durable optical coatings
CN106995916A (en) * 2017-06-01 2017-08-01 南京沪友冶金机械制造有限公司 Flexible magnetron sputtering plating horizontal homogeneity control device
CN107354443B (en) * 2017-07-26 2019-10-11 中国电子科技集团公司第五十五研究所 A kind of device adjusting magnetron sputtering film uniformity
RU182457U1 (en) * 2017-12-27 2018-08-17 Общество с ограниченной ответственностью "Накопители Энергии Супер Конденсаторы" (ООО "НЭСК") Installation for vacuum magnetron sputtering of thin films

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303117A (en) * 1964-12-23 1967-02-07 Ibm Process for cathodically sputtering a ferromagnetic thin film of a nickeliron-molybdenum alloy
JPS5539625B2 (en) 1973-03-07 1980-10-13
JPS55500588A (en) * 1978-08-18 1980-09-04
US4294678A (en) * 1979-11-28 1981-10-13 Coulter Systems Corporation Apparatus and method for preventing contamination of sputtering targets
US4591418A (en) * 1984-10-26 1986-05-27 The Parker Pen Company Microlaminated coating
JPH0768614B2 (en) 1990-03-05 1995-07-26 宇部興産株式会社 It carousel type Supatsutaringu device and Supatsutaringu METHOD
JPH04173971A (en) * 1990-11-02 1992-06-22 Nec Corp Magnetron type sputtering device
US5154810A (en) * 1991-01-29 1992-10-13 Optical Coating Laboratory, Inc. Thin film coating and method
JPH0521347A (en) * 1991-07-11 1993-01-29 Canon Inc Sputtering device
DE4138794A1 (en) 1991-11-26 1993-05-27 Leybold Ag Process and appts. for coating substrate - uses current source connected to cathodes in evacuated coating chamber
DE4204999A1 (en) 1991-11-26 1993-08-26 Leybold Ag Method and apparatus for coating a substrate, especially with non-conductive layers
DE4237517A1 (en) 1992-11-06 1994-05-11 Leybold Ag Reactive magnetron sputtering appts. - esp. for coating substrate with electrically non-conductibe layers
JPH06207269A (en) * 1993-01-11 1994-07-26 Hitachi Ltd Formation of thin film and sputtering device
JPH07109569A (en) * 1993-10-08 1995-04-25 Shincron:Kk Formation of thin film
JPH08325725A (en) * 1995-05-26 1996-12-10 Sony Corp Sputtering device and sputtring method
US6217720B1 (en) * 1997-06-03 2001-04-17 National Research Council Of Canada Multi-layer reactive sputtering method with reduced stabilization time
JPH1174176A (en) * 1997-08-29 1999-03-16 Sony Corp Manufacture of semiconductor device, film thickness optimization device and film thickness optimization method
GB2331764B (en) * 1997-12-01 2002-06-26 Ca Nat Research Council Sputtering method and apparatus with optical monitoring
DE19836125C2 (en) * 1998-08-10 2001-12-06 Leybold Systems Gmbh Sputtering apparatus comprising a cathode with the permanent magnet assembly
US6338777B1 (en) * 1998-10-23 2002-01-15 International Business Machines Corporation Method and apparatus for sputtering thin films
JP2001003166A (en) 1999-04-23 2001-01-09 Nippon Sheet Glass Co Ltd Method for coating surface of substrate with coating film and substrate by using the method
US6440280B1 (en) * 2000-06-28 2002-08-27 Sola International, Inc. Multi-anode device and methods for sputter deposition
AT445028T (en) * 2001-02-07 2009-10-15 Asahi Glass Co Ltd Method for producing a sputter film
US6563578B2 (en) * 2001-04-02 2003-05-13 Advanced Micro Devices, Inc. In-situ thickness measurement for use in semiconductor processing

Also Published As

Publication number Publication date
JPWO2002063064A1 (en) 2004-06-10
EP1359236A1 (en) 2003-11-05
EP1359236B1 (en) 2009-10-07
DE60233931D1 (en) 2009-11-19
CN1491293A (en) 2004-04-21
EP1359236A4 (en) 2006-08-09
WO2002063064A1 (en) 2002-08-15
US20050121311A1 (en) 2005-06-09
CN1258616C (en) 2006-06-07
US6863785B2 (en) 2005-03-08
US20040026240A1 (en) 2004-02-12

Similar Documents

Publication Publication Date Title
DE60222741D1 (en) Process for producing coated polymer film
DE50114283D1 (en) Method for producing a photovoltaic thin film module
DE60209573D1 (en) Method for producing a grinding object
DE60140599D1 (en) Method for controlling a plasma display
DE60118377D1 (en) Method for producing a multilayer blast-molded container
DE50309009D1 (en) Method for producing a three-dimensional object
DE50213706D1 (en) Method for producing a nanostructured coating
DE69940981D1 (en) Method for producing a semipermeablen compound membrane
DE60323872D1 (en) Recarculating target and method for producing a radionuclic
DE60120003D1 (en) Method for producing a mask
DE50107674D1 (en) Method for producing a tube target
DE60230644D1 (en) Method for manufacturing a use
DE60034513D1 (en) Method for producing a sputtering target
DE60221337D1 (en) Method for controlling a MittelBox
DE60125755D1 (en) Method for producing a flexodruck plate
DE60027026D1 (en) Method for producing a ultrarein fluoropolymer
DE60221399D1 (en) Method for producing medium-distillates
DE60201869D1 (en) Process for making a structure
DE60323953D1 (en) Method for producing a fine self-preservable pharmaceutical composition
DE60321883D1 (en) Method for producing a device
DE60223615D1 (en) A curable coating composition and method for producing a coating film
DE60201421D1 (en) Method for producing a waxy refinate
DE60223196D1 (en) Process for producing a cellulose ester film
DE60039257D1 (en) Method for producing a copper film with au
DE60326573D1 (en) Method for producing a coated plate

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties